MCP401XEV Evaluation Board User’s Guide © 2010 Microchip Technology Inc. DS51888A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51888A-page 2 © 2010 Microchip Technology Inc. MCP401XEV EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Chapter 1. Product Overview 1.1 Introduction ..................................................................................................... 5 1.2 What is the MCP401XEV Evaluation Board? ................................................. 5 1.3 What the MCP401XEV Evaluation Board Kit Includes ................................... 6 Chapter 2. Installation and Operation 2.1 Introduction ..................................................................................................... 7 2.2 Features ......................................................................................................... 8 2.3 Getting Started ............................................................................................... 9 2.4 MCP401XEV Evaluation Board Description ................................................... 9 2.5 Configuring The PICkit Serial Analyzer ........................................................ 13 2.6 MCP40D18EV Demo Steps ......................................................................... 23 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 27 A.2 Schematics and PCB Layout ....................................................................... 27 A.3 Board - Schematic ....................................................................................... 28 A.4 Board - Top Trace, Silk and Pads ............................................................... 29 A.5 Board - Bottom Trace & Pads ...................................................................... 30 A.6 Board - Layer 2 Ground Plane .................................................................... 31 A.7 Board - Layer 3 Power Plane ....................................................................... 32 A.8 Board - Bottom Silk, Trace and Pads ......................................................... 33 Appendix B. Bill of Materials (BOM) Worldwide Sales and Service .................................................................................... 36 © 2010 Microchip Technology Inc. DS51888A-page 3 MCP401XEV Evaluation Board User’s Guide NOTES: DS51888A-page 4 © 2010 Microchip Technology Inc. MCP401XEV EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP401XEV Evaluation Board. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide The Microchip Web Site The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP401XEV Evaluation Board as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the MCP401XEV Evaluation Board. • Chapter 2. “Installation and Operation” – Includes instructions on how to get started with this evaluation board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the MCP401XEV Evaluation Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MCP401XEV Evaluation Board. © 2010 Microchip Technology Inc. DS51888A-page 5 MCP401XEV Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > DS51888A-page 6 Represents Examples Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 File>Save Press <Enter>, <F1> © 2010 Microchip Technology Inc. Preface RECOMMENDED READING This user’s guide describes how to use the MCP401XEV Evaluation Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources. AN1080 Application Note, “Understanding Digital Potentiometer Resistor Variations”, DS01080 These data sheets provide detailed information regarding the MCP401X and MCP40D1X product families: MCP4017/18/19 Data Sheet, “7-bit Single I2C Digital POT with Volatile Memory in SC70”, DS22147 MCP40D17/18/19 Data Sheet, “7-bit Single I2C (with Command Code) Digital POT with Volatile Memory in SC70”, DS22152 THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com In addition, there is a Development Systems Information Line which lists the latest versions of Microchip's development systems software products. This line also provides information on how customers can receive currently available upgrade kits. The Development Systems Information Line numbers are: 1-800-755-2345 – United States and most of Canada 1-480-792-7302 – Other International Locations © 2010 Microchip Technology Inc. DS51888A-page 7 MCP401XEV Evaluation Board User’s Guide DOCUMENT REVISION HISTORY Revision A (January 2010) • Initial Release of this Document. DS51888A-page 8 © 2010 Microchip Technology Inc. MCP401XEV EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP401XEV Evaluation Board and covers the following topics: • What is the MCP401XEV Evaluation Board? • What the MCP401XEV Evaluation Board kit includes 1.2 WHAT IS THE MCP401XEV EVALUATION BOARD? The MCP401XEV Evaluation Board allows the system designer to quickly evaluate the operation of Microchip Technology’s MCP40D18 Digital Potentiometer device. This device is similar to the following devices: • • • • • MCP40D17 MCP40D19 MCP4017 MCP4018 MCP4019 The board uses the SC70EV Generic PCB and has been populated for the MCP40D18. The 6-pin header (PICkit Serial) has been jumpered to the MCP40D18’s appropriate pins. This allows the PICkit Serial to communicate with the device. Additional blank PCBs may be ordered by using the order number: SC70EV. Each SC70EV kit contains 5 PCBs. Figure 1-1 shows the top view of the PCB. © 2010 Microchip Technology Inc. DS51888A-page 9 MCP401XEV Evaluation Board User’s Guide 0Ω 0Ω MCP 0Ω FIGURE 1-1: installed in U1). 1.3 MCP401XEV Evaluation Board Using the SC70EV Evaluation Board (MCP40D18 WHAT THE MCP401XEV EVALUATION BOARD KIT INCLUDES This MCP401XEV Evaluation Board kit includes: • MCP401XEV Evaluation Board • One SC70EV Blank PCB, 102-00273. Extra blank PCBs can be ordered (order #: SC70EV) • Important Information Sheet DS51888A-page 10 © 2010 Microchip Technology Inc. MCP401XEV EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION The MCP401XEV Evaluation Board allows the system designer to quickly evaluate the operation of the MCP40D18 10 kΩ (-103) Digital Potentiometer device using the PICkit Serial Analyzer. The PICkit Serial Analyzer is available separately (order number: DV164122). The MCP401XEV Evaluation Board is a minimum configuration for the device. As well as the device, other desired passive components (resistors and capacitors) and connection posts may be installed. The MCP401XEV Evaluation Board can also be very easily jumpered into a customers existing circuit. This gives an indication of the MCP40D18 device performance, but is affected by the jumper lead length and the EM noise that the jumpers pick up. The MCP401XEV Evaluation board uses the generic SC70EV Evaluation Board PCB, and includes a second blank PCB. Additional PCB may be ordered (order number: SC70EV). The SC70EV kit includes 5 blank PCBs. Other boards can be easily built up using the SC70EV PCB to allow evaluation of other resistance options (5 kΩ, 50 kΩ, or 100 kΩ) or any of the other devices in the following packages: • SC70 package (uses I2C interface) - MCP4017, MCP4018, MCP4019, MCP40D17, or MCP40D19 • SOT-23 package (uses Up/Down interface) - MCP4012, MCP4013, MCP4014, MCP4022, MCP4023, or MCP4024 • DIP-8 Package (uses SPI interface) - MCP4131, MCP4141, MCP4151, or MCP4161 The MCP401XEV Evaluation Board also has a 6-pin interface (PICkit Serial, ICSP, etc.) whose signals can easily be jumpered to any of the device’s pins. Additional information on using the SC70EV Evaluation Board PCB or for modifying the MCP401XEV board is available in the SC70EV User’s Guide (DS51874). Appendix A. “Schematic and Layouts” has information on the PCB schematic and layout while Figure 2-2 shows components that are installed on the PCB. © 2010 Microchip Technology Inc. DS51888A-page 11 MCP401XEV Evaluation Board User’s Guide 2.2 FEATURES The MCP401XEV Evaluation Board has the following features: • MCP40D18-103AE/LT is installed (I2C address of 7Ch) • 0Ω resistors connect MCP40D18 VDD and VSS signals to the appropiate Power or Ground plane (see Figure 2-2) • 0Ω resistors connect MCP40D18 A terminal signal to Power plane, Resistor Network is in a voltage divider configuration (see Figure 2-2) • Through-hole connection terminal (Orange) for the Wiper pin • Connection terminals for all device pins (either through-hole or surface-mount) • Footprints for optional passive components (SMT 805 footprint) for: - Power supply filtering (C1 and C2 footprints) - Device bypass capacitor (RxD footprint for device pin connected to VDD) • Silk-screen area to write specifics of implemented circuit (on back of PCB), such as MCP4018 10 kΩ • PICkit Serial Analyzer Header The included SC70EV Board has the following features: • Connection terminals may be either through-hole or surface-mount • Three package type footprints supported: - SC70-6 - SC70-5 - SC70-3 - SOT-23-8 - SOT-23-6 - SOT-23-5 - SOT-23-3 - DIP-8 (300 millimeter spacing) • Footprints for optional passive components (SMD 805 footprint) for: - Power supply filtering (C1 and C2 footprints) - Device bypass capacitor (RxD footprint for device pin connected to VDD) - Output filtering (RxD footprint) - Output pull-up resistor (RxU footprint) - Output pull-down resistor (RxD footprint) - Output loading resistor (RxD footprint) • Silk-screen area to write specifics of implemented circuit (on back of PCB), such as MCP4018 10 kΩ • Can be used for SC70 or SOT-23 to DIP-8 converter • PICkit Serial Analyzer / PICkit 2 Programming (ICSP) Header DS51888A-page 12 © 2010 Microchip Technology Inc. Installation and Operation 2.3 GETTING STARTED The MCP401XEV Evaluation Board allows quick evaluation of the MCP40D18-103AE/LT device. This device is in the potentiometer configuration with terminal B internally tied to ground. This devices has an RAB resistance that is typically 10 kΩ and has a slave I2C device address of 7Ch. Evaluation can be done by: • Using the PICkit Serial Analyzer for interface communication • Jumpering the MCP401XEV Evaluation Board into your application circuit to control the MCP40D18-103A device This user guide will discuss the steps needed to evaluate the MCP40D18-103AE/LT device using the PICkit Serial Analyzer (order number: DV164122). Section 2.5 “Configuring The PICkit Serial Analyzer” shows the steps to configure the PICkit Serial Analyzer as well as create User Script files which are used to communicate with the MCP40D18, based on the devices I2C communication protocol format. 2.4 MCP401XEV EVALUATION BOARD DESCRIPTION The MCP401XEV Evaluation Board uses the flexible SC70EV Evaluation Board PCB. This simple Evaluation Board allows the system designer to quickly evaluate the operation of the MCP40D18-103A device (RAB(TYP) = 10 kΩ and has a device slave I2C address = 7Ch) using the PICkit Serial Analyzer or by jumpering the board into their application system. The PICkit Serial Analyzer is available separately (order number: DV164122). 2.4.1 The Hardware Figure 2-2 shows the component layout of the MCP401XEV Evaluation Board. This is a small four-layer board (1.43" x 1.255" (36.322 mm x 31.877 mm)). There are ten connection points/pads that can use either through-hole or surface-mount connector posts. The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane. All the passive components that are connected to VDD or VSS are connected to either the power plane or ground plane. The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to pin 1). Each pad has two passive components associated with them: a pull-up resistor and a pull-down resistor. The pull-up resistor is always RXU and the pull-down resistor is RXD. The “X” is a numeric value that corresponds to a particular pad (1 to 8). As an example, Pad 5’s pull-up resistor is R5U. Capacitor C1 and C2 are the power supply filtering capacitors. For whichever pin is the device’s VDD, the RxD component footprint can be used for the device’s bypass capacitor. Table 2-2 describes the components. A 6-pin header interface is available to support the PICkit Serial or the PICmicro In-Circuit Serial Programming (ICSP) interface. © 2010 Microchip Technology Inc. DS51888A-page 13 MCP401XEV Evaluation Board User’s Guide P1 DIP-8 (1) P3 PICkit Serial Interface H1 1 P8 SC70-6 (1, 2) 8 1 P7 NC VDD VSS SDA SCL NC 2 7 2 P6 3 MCP40D18 P2 3 6 5 4 6 P5 5 4 SOT-23-8 (1, 2) Requires blue wire jumpering to connect the PICkit Interface to the selected device. P4 1 8 2 7 3 6 4 5 R1U = 0Ω P1 VDD R1D R2U VSS C1 SOT-23-6 (1, 2) C2 P1 1 6 P8 P2 2 5 P7 P3 3 4 P6 P2 R2D = 0Ω R7U Magenta text indicates installed components. Does not include two “blue wire” jumpers from PICkit Serial interface vias to device pin vias. P7 R7D R8U = 0Ω P8 R8D Note 1: The SC70 VDD (SOT-23 VSS) signal is connected to the DIP-8 VDD/VSS signal, and the SC70 VSS (SOT-23 VDD) signal is connected to the DIP-8 VSS/VDD signal. 2: Only one of the SC70 or SOT-23 footprints may be populated at a give time. 3: The SC70-6 and SOT-23-8 footprints are superimposed on the PCB due to the similarity of the package lead width and lead pitch dimensions. FIGURE 2-1: DS51888A-page 14 SC70EV Evaluation Board Circuit. © 2010 Microchip Technology Inc. Installation and Operation MCP40D18-103AE/LT installed in U1 (SC70-6 footprint) Connected to Ground Plane Connected to Power Plane Through hole Test Point (Orange) 0Ω 0Ω 40D18 0Ω Two Blue Wire Jumpers to connect PICkit Serial interface to device pins 1x6 Male Header, with 90° right angle FIGURE 2-2: Board (Top). MCP401XEV Evaluation Board Component Placement Using the SC70EV Evaluation © 2010 Microchip Technology Inc. DS51888A-page 15 MCP401XEV Evaluation Board User’s Guide TABLE 2-1: INSTALLED PASSIVE COMPONENTS (2) Component Description Comment R1U, R8U 0Ω SMT 805 Pull-up resistor R2D 0Ω SMT 805 Pull-down resistor (1) U1 MCP40D18-103AE/LT 10 kΩ, Device I2C Slave Address = 7Ch P7 Test Point - through hole connector (Orange) J1 1x6 Male Header, 100 mil spacing 90° angle. 1 x 6 male Header — Blue Wire: See Figure 2-2 J1 SCL via to P3 via J1 SDA via to P6 via Note 1: 2: Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then install the bypass capacitor in the R8D footprint. All passive components use the surface mount 805 footprint. TABLE 2-2: OPTIONAL PASSIVE COMPONENTS - NOT INSTALLED (2) Component Comment C1, C2 Power supply bypass capacitors (3) R2U, R3U, R4U, R5U, R6U, R7U Pull-up resistor R1D, R3D, R4D, R5D, R6D, R7D, R8D Pull-down resistor (1) U2, U3, U4 Alternate package footprints VDD, GND Power and Ground plane connection points P1, P2, P3, P4, P5, P6, P8 Test Point connectors Note 1: 2: 3: Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then install the bypass capacitor in the R8D footprint. All passive components use the surface mount 805 footprint. If board is powered via the VDD and GND connection points, the use of bypass capacitors on C1 and C2 may improve performance. The benefit is reduced if the board is powered via the PICkit Serial interface. DS51888A-page 16 © 2010 Microchip Technology Inc. Installation and Operation 2.5 CONFIGURING THE PICKIT SERIAL ANALYZER Figure 2-3 shows the PICkit Serial Window after the program has started. The Transaction window indicates if the PICkit Serial GUI located the PICkit Serial Analyzer Hardware. When starting the PICkit Serial Analyzer for the 1st time, some setup questions may be asked. If you have any questions, please refer to the PICkit Serial Analyzer documentation, available at www.Microchip.com/PICkitSerial. FIGURE 2-3: PICkit Serial Main Window at Startup. © 2010 Microchip Technology Inc. DS51888A-page 17 MCP401XEV Evaluation Board User’s Guide We need to select the PICkit Serial Analyzer GUI to be in I2C Master mode. Figure 2-4 shows how to select the proper mode. Select PICkit Serial Analyzer -> Select Communications Mode -> I2C Master menu item (make sure the I2C Master item is checked). FIGURE 2-4: DS51888A-page 18 PICkit Serial Selecting Communications Mode. © 2010 Microchip Technology Inc. Installation and Operation Now we need to configure the mode that we have selected. Figure 2-5 shows how to select the communications mode. Select PICkit Serial Analyzer -> Configure Communications Mode menu item. This will open a new window. FIGURE 2-5: PICkit Serial Main Window at Startup. © 2010 Microchip Technology Inc. DS51888A-page 19 MCP401XEV Evaluation Board User’s Guide Figure 2-6 shows the Configure Communications Mode window. Ensure that your window options and settings are the same as in this window, and then select the “Save Changes” button. FIGURE 2-6: DS51888A-page 20 PICkit Serial Configure Communications Mode Window. © 2010 Microchip Technology Inc. Installation and Operation Now we are going to create some custom scripts to match the MCP40D18 read and write commands. To open the Script Builder window, select the Communications -> Script -> Script Builder menu item (see Figure 2-7). FIGURE 2-7: PICkit Serial - Script Bulider Menu Selection. © 2010 Microchip Technology Inc. DS51888A-page 21 MCP401XEV Evaluation Board User’s Guide This will open the Script Builder window (Figure 2-8). In this window we see five Example I2C Master Scripts. We will use the ReadAddrA8 and WriteAddrA8 Example Script Files to create our User I2C Master Scripts. FIGURE 2-8: DS51888A-page 22 PICkit Serial Main Window at Startup. © 2010 Microchip Technology Inc. Installation and Operation Double clicking on the WriteAddrA8 Example I2CM Script will load the Script Details. Figure 2-9 shows what the values mean in the Script Details. These values are hex numbers. The first value (03h), is the number of bytes that will be written. The second byte is the I2C Slave address (A8h) of the device with the Read/Write bit forced to ‘0’ (an I2C write). The next two bytes (02h and 33h) are data bytes, and these value will be dependent on the slave I2C device protocol format and the desired operation. I2C Slave Address + Read/Write bit (R/W bit = 0) Data Byte #1 (1) Number of Bytes that will be written Data Byte #2 (1) Note 1: Function depends on devices I2C Protocol Format. FIGURE 2-9: © 2010 Microchip Technology Inc. Example Write Script. DS51888A-page 23 MCP401XEV Evaluation Board User’s Guide Double clicking on the ReadAddrA8 Example I2CM Script will load the Script Details. Figure 2-10 shows what the values mean in the Script Details. These values are hex numbers. The first value (02h) is the number of bytes that will be written. The second byte is the I2C Slave address (A8h) of the device with the Read/Write bit forced to ‘0’ (an I2C write). The next byte (00h) is a data byte, and the value will be dependent on the slave I2C device protocol format and the desired operation. Now a I2C Restart bit is forced onto the I2C bus. The next byte (01h) indicates how many bytes will be written. The next bit (A9h) is the I2C Slave address (A8h) of the device with the Read/Write bit forced to ‘1’ (an I2C read). The last byte (10h) is the number of bytes that will be read from the I2C Slave Device. The value will be dependent on the slave I2C device protocol format and the desired operation. Data Byte #1 (1) I2C Slave Address + Read/Write bit (R/W bit = 0) Number of Bytes that will be written I2C Slave Address + Read/Write bit (R/W bit = 1) Number of Bytes that will be written # of Data Bytes to Read (1) Note 1: Function depends on devices I2C Protocol Format. FIGURE 2-10: DS51888A-page 24 Example Read Script. © 2010 Microchip Technology Inc. Installation and Operation To create the write script for the MCP40D18, double click on the WriteAddrA8 script in the “Example I2CM Scripts” column. This loads the script (see Figure 2-9) into the “Script Detail” column. Modify the script details so that it looks like Figure 2-11. Then, in the “Script Name” write the name that you would like to call the script. We chose “MCP40D18_Write” (see Figure 2-11). Then click on the “Save Script” button. This will save the script, which can then be accessed under the “User I2CM Script” column (see Figure 2-11). This script will be available when the GUI is opened in the future (unless the script has been cleared or deleted). Note: The saved User Scripts are saved to a text file. The file is saved in the PICkit Serial Analyzer directory. This User Scripts file is called: CommScripts.txt The default install location of the file is: C:\Program Files\Microchip\PICkit Serial Analyzer Device I2C Address + Read/Write bit (= ‘0’) FIGURE 2-11: © 2010 Microchip Technology Inc. Command Code = “00” (in Hex) Data value to write to Wiper = 7F (in hex) MCP40D18 Write Script File. DS51888A-page 25 MCP401XEV Evaluation Board User’s Guide To create the read script for the MCP40D18, double click on the ReadAddrA8 script in the “Example I2CM Scripts” column. This loads the script (see Figure 2-10) into the “Script Detail” column. Modify the script details so that it looks like Figure 2-12. Then, in the “Script Name” write the name that you would like to call the script. We chose “MCP40D18_Read” (see Figure 2-12). Then click on the “Save Script” button. This will save the script, which can then be accessed under the “User I2CM Script” column (see Figure 2-11). This script will be available when the GUI is opened in the future (unless the script has been cleared or deleted). Note: The saved User Scripts are saved to a text file. The file is saved in the PICkit Serial Analyzer directory. This User Scripts file is called: CommScripts.txt The default install location of the file is: C:\Program Files\Microchip\PICkit Serial Analyzer Device I2C Address + Read/Write bit (= ‘1’) Device I2C Address + Read/Write bit (= ‘0’) Command Code = “00” (in Hex) FIGURE 2-12: DS51888A-page 26 # of Data bytes to read MCP40D18 Read Script File. © 2010 Microchip Technology Inc. Installation and Operation 2.6 MCP40D18EV DEMO STEPS This demo assumes that you know how to configure the PICkit Serial Analyzer for Master I2C operation. See Section 2.5 “Configuring The PICkit Serial Analyzer” or the PICkit Serial Analyzer User’s Guide (DS51647) for additional information. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. Plug the PICkit Serial device into the PC’s USB port. Plug the MCP40D18EV board into the PICkit Serial. Start the PICkit Serial GUI. Ensure the GUI is in Master I2C communication mode (see Figure 2-4). Ensure that the Master I2C configuration is appropriately configured (see Figure 2-6). Measure the wiper voltage on the MCP40D18EV board using an oscilliscope or digital multimeter. Measure voltage from the ground plane (GND) to the Wiper (P7). The voltage on the wiper should be ~ VDD/2 (~2.5V). Open the Script Builder window (see Figure 2-7). Double click on the “WriteAddrA8” script in the “Example I2CM Scripts column. This loads the Script Detail column (see Figure 2-9). Modify the “Script Detail” so that it is like that shown in Figure 2-13. Click on the “Execute Script” button. This executes the script shown in the script detail column, which will update the wiper value to 7Fh. The Wiper voltage will now be ~VDD (~5V). The Transaction window (see Figure 2-15) will be updated to indicate the execution of the script. Select the “MCP40D18_Read” script in the User I2CM Scripts column. It should look like Figure 2-14. Click on the “Execute Script” button. This executes the script shown in the script detail column. The Transaction window (see Figure 2-15) will be updated to indicate the execution of the script. The Data read is shown in the last line. Select the “MCP40D18_Write” script in the User I2CM Scripts column. It should look like Figure 2-13. Modify the data value to write to the wiper (see Figure 2-13) to 1Fh. Click on the “Execute Script” button. This executes the script shown in the script detail column, which will update the wiper value to 1Fh (from 7Fh). The Wiper voltage will now be ~1/4*VDD (~1.25V). The Transaction window (see Figure 2-16) will be updated to indicate the execution of the script. Select the “MCP40D18_Read” script in the User I2CM Scripts column. It should look like Figure 2-14. Click on the “Execute Script” button. This executes the script shown in the script detail column. The Transaction window (see Figure 2-16) will be updated to indicate the execution of the script. The Data read is shown in the last line. You can repeate the sequence of writing values to the wiper register or Writing then reading the values back. NOTICE If at any time during script execution, an error message is generated in the transaction window, it is good practice to reset the PICkit Serial Analyzer (PKSA). The PKSA can be reset using the “Reset” toolbar icon. Verify that subsequent script operations do not generate errors. © 2010 Microchip Technology Inc. DS51888A-page 27 MCP401XEV Evaluation Board User’s Guide Data value to write to Wiper DS51888A-page 28 FIGURE 2-13: MCP40D18 Write Script File - Updating Wiper Value. FIGURE 2-14: MCP40D18 Read Script File. © 2010 Microchip Technology Inc. Installation and Operation Data value writen to Wiper register FIGURE 2-15: MCP40D18 Transaction Windows 1 and 2. Data value written to Wiper register FIGURE 2-16: Data value read from Wiper register Data value read from Wiper register MCP40D18 Transaction Windows 3 and 4. © 2010 Microchip Technology Inc. DS51888A-page 29 MCP401XEV Evaluation Board User’s Guide 2.6.1 The SC70EV PCB and Supported Digital Potentiometers Table 2-3 shows the current Digital Potentiomers that are supported by the SC70EV PCB. TABLE 2-3: Device DS51888A-page 30 SC70EV PCB SUPPORTED DIGITAL POTENTIOMETERS SC70 SOT-23 DIP Comment MCP4012 — Yes — SOT-23-6, uses Up/Down interface MCP4013 — Yes — SOT-23-6, uses Up/Down interface MCP4014 — Yes — SOT-23-5, uses Up/Down interface MCP4017 Yes — — MCP40D17 Yes — — MCP4018 Yes — — MCP40D18 Yes — — MCP4019 Yes — — MCP40D19 Yes — — MCP4022 — Yes — SOT-23-6, uses Up/Down interface MCP4023 — Yes — SOT-23-6, uses Up/Down interface MCP4024 — Yes — SOT-23-5, uses Up/Down interface MCP4131 — — Yes MCP4132 — — Yes MCP4141 — — Yes MCP4142 — — Yes MCP4151 — — Yes MCP4152 — — Yes MCP4161 — — Yes MCP4162 — — Yes MCP41010 — — Yes MCP41050 — — Yes MCP41100 — — Yes Has multiplexed SDI/SDO Has multiplexed SDI/SDO Has multiplexed SDI/SDO Has multiplexed SDI/SDO © 2010 Microchip Technology Inc. MCP401XEV EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the schematics and layouts for the MCP401XEV Evaluation Board. Diagrams included in this appendix: • • • • • • A.2 Board - Schematic Board - Top Trace, Silk and Pads Board - Bottom Trace & Pads Board - Layer 2 Ground Plane Board - Layer 3 Power Plane Board - Bottom Silk, Trace and Pads SCHEMATICS AND PCB LAYOUT Board - Schematic shows the schematic of the MCP401XEV Evaluation Board. The layer order is shown in Figure A-1. Top Layer Ground Layer Power Layer Bottom Layer FIGURE A-1: © 2010 Microchip Technology Inc. Layer Order. DS51888A-page 31 MCP401XEV Evaluation Board User’s Guide BOARD - SCHEMATIC M A.3 DS51888A-page 32 © 2010 Microchip Technology Inc. Schematic and Layouts A.4 BOARD - TOP TRACE, SILK AND PADS © 2010 Microchip Technology Inc. DS51888A-page 33 MCP401XEV Evaluation Board User’s Guide A.5 BOARD - BOTTOM TRACE & PADS DS51888A-page 34 © 2010 Microchip Technology Inc. Schematic and Layouts A.6 BOARD - LAYER 2 GROUND PLANE © 2010 Microchip Technology Inc. DS51888A-page 35 MCP401XEV Evaluation Board User’s Guide A.7 BOARD - LAYER 3 POWER PLANE DS51888A-page 36 © 2010 Microchip Technology Inc. Schematic and Layouts A.8 BOARD - BOTTOM SILK, TRACE AND PADS © 2010 Microchip Technology Inc. DS51888A-page 37 MCP401XEV Evaluation Board User’s Guide NOTES: DS51888A-page 38 © 2010 Microchip Technology Inc. MCP401XEV EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty BILL OF MATERIALS Reference Description 1 J1 CONN HEADER 6POS .100 R/A GOLD 1 2 3 P7 PCB R1U, R8U, R2D U1 TEST POINT PC MULTI PURPOSE ORG Note 1 RES 0.0 OHM 1/8W 5% 0805 SMD 1 Manufacturer Molex/Waldom Electronics Corp Keystone Electronics® Microchip Technology Inc. Panasonic® - ECG Part Number 22-28-8062 5013 104-00273 (Note 3) ERJ-6GEY0R00V 7-Bit Single I2C™ (with Command Code) Microchip Technology Inc. MCP40D18-103AE/LT Digital POT with Volatile Memory in SC70 — Blue Wire: See Figure 2-2 — 1 J1 SCL via to P3 via J1 SDA via to P6 via Note 1: This assembly uses RoHS Compliant SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. 2: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 3: This part number is an internal Microchip number; if a customer wants to order, the SC70EV order number needs to be used. © 2010 Microchip Technology Inc. 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