MCP4017 DATA SHEET (04/01/2009) DOWNLOAD

MCP4017/18/19
7-Bit Single I2C™ Digital POT with Volatile Memory in
SC70
Package Types
Features
• Potentiometer or Rheostat configuration options
• 7-bit: Resistor Network Resolution
- 127 Resistors (128 Steps)
• Zero Scale to Full Scale Wiper operation
• RAB Resistances: 5 kΩ, 10 kΩ, 50 kΩ, or 100 kΩ
• Low Wiper Resistance: 100Ω (typical)
• Low Tempco:
- Absolute (Rheostat): 50 ppm typical
(0°C to 70°C)
- Ratiometric (Potentiometer): 10 ppm typical
• Simple I2C Protocol with read & write commands
• Brown-out reset protection (1.5V typical)
• Power-on Default Wiper Setting (Mid-scale)
• Low-Power Operation:
- 2.5 µA Static Current (typical)
• Wide Operating Voltage Range:
- 2.7V to 5.5V - Device Characteristics
Specified
- 1.8V to 5.5V - Device Operation
Rheostat
Potentiometer
MCP4017
SC70-6
MCP4018
SC70-6
VDD 1
VSS 2
SCL 3
B
VDD 1
6 A
A
W
5 W
VSS 2
4 SDA
SCL 3
W
A
B
6 W
5 B
4 SDA
MCP4019
SC70-5
VDD 1
VSS 2
SCL 3
5 W
W
B
A
4 SDA
• Wide Bandwidth (-3 dB) Operation:
- 2 MHz (typical) for 5.0 kΩ device
• Extended temperature range (-40°C to +125°C)
• Very small package (SC70)
• Lead free (Pb-free) package
Control
Interface
# of Steps
Wiper
Configuration
Memory
Type
Device Features
Options (kΩ)
MCP4017
I2C
128
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
75
1.8V to 5.5V
SC70-6
MCP4018
I2C
128
Potentiometer
RAM
5.0, 10.0, 50.0, 100.0
75
1.8V to 5.5V
SC70-6
MCP4019
I2C
128
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
75
1.8V to 5.5V
SC70-5
Device
Resistance (typical)
Wiper
(Ω)
VDD
Operating
Range (1)
Package
Note 1: Analog characteristics only tested from 2.7V to 5.5V
© 2009 Microchip Technology Inc.
DS22147A-page 1
MCP4017/18/19
Device Block Diagram
VDD
VSS
SCL
SDA
A (2)
Power-up/
Brown-out
Control
W
I2C Serial
Interface
Module,
Control
Logic, &
Memory
Resistor
Network 0
(Pot 0)
B (1, 2)
Note 1
Note 1: Some configurations will have this
signal internally connected to ground.
2: In some configurations, this signal
may not be connected externally
(internally floating or grounded).
HV
Interface
WiperLock
Technology
Comparison of Similar Microchip Devices (1)
No
No
SC70-6
Yes
No
SOT-23-6
Yes
Yes
SOT-23-6
Yes
No
Yes
Yes
PDIP-8,
SOIC-8,
MSOP-8,
DFN-8
Control
Interface
# of Steps
Wiper
Configuration
Memory
Type
Resistance (typical)
Options (kΩ)
MCP4017
I2C
128
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
MCP4012
U/D
64
Rheostat
RAM
2.1, 5.0, 10.0, 50.0
1.8V to 5.5V
MCP4022
U/D
64
Rheostat
EE
2.1, 5.0, 10.0, 50.0
2.7V to 5.5V
MCP4132
SPI
129
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
MCP4142
SPI
129
Rheostat
EE
5.0, 10.0, 50.0, 100.0
2.7V to 5.5V
MCP4152
SPI
257
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
Yes
No
MCP4162
SPI
257
Rheostat
EE
5.0, 10.0, 50.0, 100.0
2.7V to 5.5V
Yes
Yes
MCP4532
I2C
129
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
Yes
No
MCP4542
I2C
129
Rheostat
EE
5.0, 10.0, 50.0, 100.0
2.7V to 5.5V
Yes
Yes
MCP4552
I2C
257
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
Yes
No
MCP4562
I2C
257
Rheostat
EE
5.0, 10.0, 50.0, 100.0
2.7V to 5.5V
Yes
Yes
MCP4018
I2C
128
Potentiometer
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
No
No
SC70-6
MCP4013
U/D
64
Potentiometer
RAM
2.1, 5.0, 10.0, 50.0
1.8V to 5.5V
Yes
No
SOT-23-6
Device
VDD
Operating
Range (2)
Package
MSOP-8,
DFN-8
MCP4023
U/D
64
Potentiometer
EE
2.1, 5.0, 10.0, 50.0
2.7V to 5.5V
Yes
Yes
SOT-23-6
MCP4019
I2C
128
Rheostat
RAM
5.0, 10.0, 50.0, 100.0
1.8V to 5.5V
No
No
SC70-5
MCP4014
U/D
64
Rheostat
RAM
2.1, 5.0, 10.0, 50.0
1.8V to 5.5V
Yes
No
SOT-23-5
MCP4024
U/D
64
Rheostat
EE
2.1, 5.0, 10.0, 50.0
2.7V to 5.5V
Yes
Yes
SOT-23-5
Note 1:
2:
This table is broken into three groups by a thick line (and color coding). The unshaded devices in this table
are the devices described in this data sheet, while the shaded devices offer a comparable resistor network
configuration.
Analog characteristics only tested from 2.7V to 5.5V
DS22147A-page 2
© 2009 Microchip Technology Inc.
MCP4017/18/19
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on VDD with respect to VSS ..... -0.6V to +7.0V
Voltage on SCL, and SDA with respect to VSS
............................................................................. -0.6V to 12.5V
Voltage on all other pins (A, W, and B)
with respect to VSS ............................ -0.3V to VDD + 0.3V
Input clamp current, IIK
(VI < 0, VI > VDD, VI > VPP ON HV pins) ........... ±20 mA
Output clamp current, IOK
(VO < 0 or VO > VDD) ....................................... ±20 mA
Maximum output current sunk by any Output pin
........................................................................... 25 mA
Maximum output current sourced by any Output pin
........................................................................... 25 mA
Maximum current out of VSS pin ...................... 100 mA
Maximum current into VDD pin ......................... 100 mA
Maximum current into A, W and B pins........... ±2.5 mA
Package power dissipation (TA = +50°C, TJ = +150°C)
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
SC70-5 ............................................................ 302 mW
SC70-6 .................................................................. TBD
Storage temperature .......................... -65°C to +150°C
Ambient temperature with power applied
........................................................... -40°C to +125°C
ESD protection on all pins ........................≥ 4 kV (HBM)
........................................................................≥ 400V (MM)
Maximum Junction Temperature (TJ) .............. +150°C
© 2009 Microchip Technology Inc.
DS22147A-page 3
MCP4017/18/19
AC/DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Supply Voltage
VDD
2.7
—
5.5
V
Analog Characteristics specified
1.8
—
5.5
V
Digital Characteristics specified
—
—
1.65
V
RAM retention voltage (VRAM) < VBOR
VDD Start Voltage
to ensure Wiper
Reset
VBOR
VDD Rise Rate to
ensure Power-on
Reset
VDDRR
Delay after device
exits the reset
state
(VDD > VBOR)
TBORD
—
10
20
µS
IDD
—
45
80
µA
Serial Interface Active,
Write all 0’s to Volatile Wiper
VDD = 5.5V, FSCL = 400 kHz
—
2.5
5
µA
Serial Interface Inactive,
(Stop condition, SCL = SDA = VIH),
Wiper = 0, VDD = 5.5V
Supply Current
(Note 8)
Note 1:
2:
3:
4:
5:
6:
7:
8:
(Note 7)
V/ms
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4018 device only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
POR/BOR is not rate dependent.
Supply current is independent of current through the resistor network
DS22147A-page 4
© 2009 Microchip Technology Inc.
MCP4017/18/19
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
Parameters
Resistance
(± 20%)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
RAB
Resolution
N
Step Resistance
RS
Wiper Resistance
RW
Nominal
Resistance
Tempco
ΔRAB/ΔT
Ratiometeric
Tempco
ΔVWB/ΔT
Resistor Terminal
Input Voltage
Range (Terminals
A, B and W)
Maximum current
through Terminal
(A, W or B)
Note 5
Note 1:
2:
3:
4:
5:
6:
7:
8:
Min
Typ
Max
Units
Conditions
4.0
5
6.0
kΩ
-502 devices (Note 1)
8.0
10
12.0
kΩ
-103 devices (Note 1)
40.0
50
60.0
kΩ
-503 devices (Note 1)
80.0
100
120.0
kΩ
-104 devices (Note 1)
—
RAB /
(127)
128
Taps
—
Ω
No Missing Codes
Note 5
—
100
170
Ω
VDD = 5.5 V, IW = 2.0 mA, code = 00h
—
155
325
Ω
VDD = 2.7 V, IW = 2.0 mA, code = 00h
—
50
—
ppm/°C TA = -20°C to +70°C
—
100
—
ppm/°C TA = -40°C to +85°C
—
150
—
ppm/°C TA = -40°C to +125°C
—
15
—
ppm/°C Code = Midscale (3Fh)
VA,VW,VB
Vss
—
VDD
V
IT
—
—
2.5
mA
Terminal A
IAW, W = Full Scale (FS)
—
—
2.5
mA
Terminal B
IBW, W = Zero Scale (ZS)
—
—
2.5
mA
Terminal W
IAW or IBW, W = FS or ZS
—
—
1.38
mA
—
—
0.688
mA
—
—
0.138
mA
—
—
0.069
mA
Note 4, Note 5
IAB, VB = 0V, VA = 5.5V,
RAB(MIN) = 4000
Terminal A
and
Terminal B
IAB, VB = 0V, VA = 5.5V,
RAB(MIN) = 8000
IAB, VB = 0V, VA = 5.5V,
RAB(MIN) = 40000
IAB, VB = 0V, VA = 5.5V,
RAB(MIN) = 80000
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4018 device only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
POR/BOR is not rate dependent.
Supply current is independent of current through the resistor network
© 2009 Microchip Technology Inc.
DS22147A-page 5
MCP4017/18/19
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
Parameters
Full Scale Error
(MCP4018 only)
(code = 7Fh)
Zero Scale Error
(MCP4018 only)
(code = 00h)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym
Min
Typ
Max
Units
VWFSE
-3.0
-0.1
—
LSb
5 kΩ
2.7V ≤ VDD ≤ 5.5V
-2.0
-0.1
—
LSb
10 kΩ
2.7V ≤ VDD ≤ 5.5V
-0.5
-0.1
—
LSb
50 kΩ
2.7V ≤ VDD ≤ 5.5V
-0.5
-0.1
—
LSb
100 kΩ 2.7V ≤ VDD ≤ 5.5V
—
+0.1
+3.0
LSb
5 kΩ
2.7V ≤ VDD ≤ 5.5V
—
+0.1
+2.0
LSb
10 kΩ
2.7V ≤ VDD ≤ 5.5V
—
+0.1
+0.5
LSb
50 kΩ
2.7V ≤ VDD ≤ 5.5V
—
+0.1
+0.5
LSb
100 kΩ 2.7V ≤ VDD ≤ 5.5V
VWZSE
Conditions
Potentiometer
Integral
Non-linearity
INL
-0.5
±0.25
+0.5
LSb
2.7V ≤ VDD ≤ 5.5V
MCP4018 device only (Note 2)
Potentiometer
Differential Nonlinearity
DNL
-0.25
±0.125
+0.25
LSb
2.7V ≤ VDD ≤ 5.5V
MCP4018 device only (Note 2)
Bandwidth -3 dB
(See Figure 2-83,
load = 30 pF)
BW
—
2
—
MHz
5 kΩ
Code = 3Fh
Note 1:
2:
3:
4:
5:
6:
7:
8:
—
1
—
MHz
10 kΩ
Code = 3Fh
—
260
—
kHz
50 kΩ
Code = 3Fh
—
100
—
kHz
100 kΩ Code = 3Fh
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4018 device only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
POR/BOR is not rate dependent.
Supply current is independent of current through the resistor network
DS22147A-page 6
© 2009 Microchip Technology Inc.
MCP4017/18/19
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Rheostat Integral
Non-linearity
MCP4018
(Note 3)
MCP4017 and
MCP4019 devices
only (Note 3)
R-INL
-2.0
±0.5
+2.0
LSb
-5.0
+3.5
+5.0
LSb
See Section 2.0
1.8V (Note 6)
10 kΩ
5.5V, IW = 450 µA
LSb
-4.0
+2.5
+4.0
LSb
2.7V, IW = 215 µA (Note 6)
LSb
1.8V (Note 6)
±0.5
+1.125
LSb
-1.5
+1
+1.5
LSb
2.7V, IW = 43 µA (Note 6)
LSb
1.8V (Note 6)
-0.8
±0.5
+0.8
LSb
-1.125
+0.25
+1.125
LSb
50 kΩ
5.5V, IW = 90 µA
-1.125
100 kΩ 5.5V, IW = 45 µA
2.7V, IW = 21.5 µA (Note 6)
LSb
1.8V (Note 6)
±0.25
+0.5
LSb
-0.75
+0.5
+0.75
LSb
2.7V, IW = 430 µA (Note 6)
LSb
1.8V (Note 6)
See Section 2.0
5 kΩ
5.5V, IW = 900 mA
-0.5
-0.5
±0.25
+0.5
LSb
-0.75
+0.5
+0.75
LSb
2.7V, IW = 215 µA (Note 6)
LSb
1.8V (Note 6)
See Section 2.0
-0.375
±0.25
+0.375
LSb
-0.375
±0.25
+0.375
LSb
LSb
-0.375
±0.25
+0.375
LSb
-0.375
±0.25
+0.375
LSb
See Section 2.0
CAW
—
75
Capacitance (Pw)
CW
—
120
Capacitance (PB)
CBW
—
75
7:
8:
2.7V, IW = 430 µA (Note 6)
LSb
See Section 2.0
Note 1:
2:
3:
4:
5:
6:
5.5V, IW = 900 µA
+2.0
See Section 2.0
Capacitance (PA)
5 kΩ
±0.5
See Section 2.0
R-DNL
Conditions
-2.0
See Section 2.0
Rheostat
Differential Nonlinearity
MCP4018
(Note 3)
MCP4017 and
MCP4019 devices
only (Note 3)
Units
LSb
—
10 kΩ
50 kΩ
5.5V, IW = 450 µA
5.5V, IW = 90 µA
2.7V, IW = 43 µA (Note 6)
1.8V (Note 6)
100 kΩ 5.5V, IW = 45 µA
2.7V, IW = 21.5 µA (Note 6)
1.8V (Note 6)
pF
f =1 MHz, Code = Full Scale
—
pF
f =1 MHz, Code = Full Scale
—
pF
f =1 MHz, Code = Full Scale
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4018 device only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
POR/BOR is not rate dependent.
Supply current is independent of current through the resistor network
© 2009 Microchip Technology Inc.
DS22147A-page 7
MCP4017/18/19
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Digital Inputs/Outputs (SDA, SCK)
Schmitt Trigger
High Input
Threshold
VIH
0.7 VDD
—
—
V
Schmitt Trigger
Low Input
Threshold
VIL
-0.5
—
0.3VDD
V
Hysteresis of
Schmitt Trigger
Inputs (Note 5)
VHYS
—
0.1VDD
—
V
N.A.
—
—
V
N.A.
—
—
V
0.1 VDD
—
—
V
0.05 VDD
—
—
V
VSS
—
0.2VDD
V
1.8V ≤ VDD ≤ 5.5V
All inputs except SDA and SCL
SDA
and
SCL
100 kHz
400 kHz
VDD < 2.0V
VDD ≥ 2.0V
VDD < 2.0V
VDD ≥ 2.0V
Output Low
Voltage (SDA)
VOL
VSS
—
0.4
V
VDD ≥ 2.0V, IOL = 3 mA
Input Leakage
Current
IIL
-1
—
1
µA
VIN = VDD and VIN = VSS
CIN, COUT
—
10
—
pF
fC = 400 kHz
N
0h
—
7Fh
hex
Pin Capacitance
VDD < 2.0V, IOL = 1 mA
RAM (Wiper) Value
Value Range
Wiper POR/BOR
Value
3Fh
NPOR/BOR
hex
Power Requirements
Power Supply
Sensitivity
(MCP4018 only)
Note 1:
2:
3:
4:
5:
6:
7:
8:
PSS
—
0.0005
0.0035
%/%
VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 3Fh
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS.
MCP4018 device only, includes VWZSE and VWFSE.
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
POR/BOR is not rate dependent.
Supply current is independent of current through the resistor network
DS22147A-page 8
© 2009 Microchip Technology Inc.
MCP4017/18/19
1.1
I2C Mode Timing Waveforms and Requirements
SCL
93
91
90
92
SDA
STOP
Condition
START
Condition
I2C Bus Start/Stop Bits Timing Waveforms.
FIGURE 1-1:
I2C BUS START/STOP BITS REQUIREMENTS
TABLE 1-1:
I2C AC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (Extended)
Operating Voltage VDD range is described in Section 2.0 “Typical
Performance Curves”
Param.
Symbol
No.
Characteristic
FSCL
D102
Cb
90
TSU:STA
91
92
93
Bus capacitive
loading
START condition
Setup time
THD:STA START condition
Hold time
TSU:STO STOP condition
Setup time
THD:STO STOP condition
Hold time
Standard Mode
Fast Mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
100 kHz mode
400 kHz mode
103
SCL
90
100
Units
0
0
—
—
4700
600
4000
600
4000
600
4000
600
100
400
400
400
—
—
—
—
—
—
—
—
kHz
kHz
pF
pF
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
Cb = 400 pF, 1.8V - 5.5V
Cb = 400 pF, 2.7V - 5.5V
Only relevant for repeated
START condition
After this period the first
clock pulse is generated
102
107
SDA
In
109
Max
101
106
91
Min
109
92
110
SDA
Out
Note 1: Refer to specification D102 (Cb) for load conditions.
FIGURE 1-2:
I2C Bus Data Timing.
© 2009 Microchip Technology Inc.
DS22147A-page 9
MCP4017/18/19
I2C BUS DATA REQUIREMENTS (SLAVE MODE)
TABLE 1-2:
I2C AC Characteristics
Parameter No.
Sym
Characteristic
100
THIGH
Clock high time
101
TLOW
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C ≤ TA ≤ +125°C (Extended)
Operating Voltage VDD range is described in AC/DC characteristics
Min
Max
Units
100 kHz mode
4000
—
ns
1.8V-5.5V
600
4700
—
—
ns
ns
2.7V-5.5V
Clock low time
400 kHz mode
100 kHz mode
1300
—
—
1000
ns
ns
102A (5)
TRSCL
SCL rise time
400 kHz mode
100 kHz mode
102B (5)
TRSDA
SDA rise time
400 kHz mode
100 kHz mode
20 + 0.1Cb
—
300
1000
ns
ns
103A (5)
TFSCL
SCL fall time
400 kHz mode
100 kHz mode
20 + 0.1Cb
—
300
300
ns
ns
(5)
TFSDA
SDA fall time
400 kHz mode
100 kHz mode
20 + 0.1Cb
—
40
300
ns
ns
400 kHz mode
300
ns
100 kHz mode
20 + 0.1Cb (4)
0
—
ns
400 kHz mode
100 kHz mode
0
250
—
—
ns
ns
400 kHz mode
100 kHz mode
100
—
—
3450
ns
ns
400 kHz mode
100 kHz mode
—
4700
900
—
ns
ns
400 kHz mode
1300
—
ns
103B
106
THD:DAT Data input hold
time
107
TSU:DAT
109
TAA
110
TBUF
2:
3:
4:
5:
6:
Output valid
from clock
Bus free time
1.8V-5.5V
2.7V-5.5V
Cb is specified to be from
10 to 400 pF
Cb is specified to be from
10 to 400 pF
Cb is specified to be from
10 to 400 pF
Cb is specified to be from
10 to 400 pF
1.8V-5.5V, Note 6
2.7V-5.5V, Note 6
(2)
(1)
Time the bus must be free
before a new transmission
can start
Philips Spec states N.A.
Input filter spike 100 kHz mode
—
50
ns
suppression
400 kHz mode
—
50
ns
(SDA and SCL)
As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the
requirement tsu; DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not
stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it
must output the next data bit to the SDA line
TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before
the SCL line is released.
The MCP4018/MCP4019 device must provide a data hold time to bridge the undefined part between VIH
and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but must
be tested in order to guarantee that the output data will meet the setup and hold specifications for the receiving device.
Use Cb in pF for the calculations.
Not Tested.
A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do not
unintentionally create a Start or Stop condition.
TSP
Note 1:
Data input
setup time
Conditions
DS22147A-page 10
© 2009 Microchip Technology Inc.
MCP4017/18/19
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 5L-SC70
(Note 1)
θJA
—
331
—
°C/W
Thermal Resistance, 6L-SC70
θJA
—
TBD
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
Note 1:
Package Power Dissipation (PDIS) is calculated as follows:
PDIS = (TJ - TA) / θJA,
where: TJ = Junction Temperature, TA = Ambient Temperature.
© 2009 Microchip Technology Inc.
DS22147A-page 11
MCP4017/18/19
NOTES:
DS22147A-page 12
© 2009 Microchip Technology Inc.
MCP4017/18/19
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
IDD Interface Inactive (µA)
60
50
IDD (µA)
40
400 kHz, 5.5V
30
20
400 kHz, 2.7V
10
100 kHz, 5.5V
100 kHz, 2.7V
0
-40
0
40
80
Temperature (°C)
120
FIGURE 2-1:
Interface Active Current
(IDD) vs. SCL Frequency (fSCL) and Temperature
(VDD = 1.8V, 2.7V and 5.5V).
© 2009 Microchip Technology Inc.
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
5.5V
2.7V
-40
0
40
80
120
Temperature (°C)
FIGURE 2-2:
Interface Inactive Current
(ISHDN) vs. Temperature and VDD.
(VDD = 1.8V, 2.7V and 5.5V).
DS22147A-page 13
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
DNL
0.2
0.1
INL
80
0
60
-0.1
25°C
-0.2
20
-0.3
260
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
125°C
220
85°
INL
180
140
100
RW
60
-40°C
25°C
-0.2
DNL
20
2000
25C Rw
25C INL
25C DNL
INL
85C Rw
85C INL
85C DNL
DNL
125C Rw
125C INL
125C DNL
0.05
1000
-0.05
-0.15
RW
-0.25
0
Note:
FIGURE 2-5:
5.0 kΩ : Pot Mode – RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V). (A = VDD, B = VSS)
-0.1
-0.2
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
125°C
3
2
1
RW
0
60
DNL
-40°C
20
-1
32
64
96
Wiper Setting (decimal)
FIGURE 2-7:
5.0 kΩ : Rheo Mode – RW
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V).(IW = 450uA, B = VSS)
-40C Rw
-40C INL
-40C DNL
2000
25C Rw
25C INL
25C DNL
RW
85C Rw
85C INL
85C DNL
INL
44
39
34
24
19
1000
14
DNL
500
9
4
0
-1
0
Note:
125C Rw
125C INL
125C DNL
29
1500
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
DS22147A-page 14
85°C
25°C
25C Rw
25C INL
25C DNL
100
-0.35
0
-40C Rw
-40C INL
-40C DNL
2500
0.25
0.15
DNL
140
0.35
1500
500
RW
-0.3
180
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
25°C
32
64
96
Wiper Setting (decimal)
0
Error (LSb)
Wiper Resistance (RW)
(ohms)
2500
0.1
INL
32
64
96
Wiper Setting (decimal)
FIGURE 2-4:
5.0 kΩ : Pot Mode – RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V). (A = VDD, B = VSS)
0.2
FIGURE 2-6:
5.0 kΩ : Rheo Mode – RW
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V).(IW = 1.4mA, B = VSS)
-0.3
0
-40°C
40
220
-0.1
0.3
0
260
0.2
0
125°C
60
300
0.3
0.1
125C Rw
125C INL
125C DNL
80
0
Error (LSb)
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
85C Rw
85C INL
85C DNL
20
FIGURE 2-3:
5.0 kΩ : Pot Mode – RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V). (A = VDD, B = VSS).
300
25C Rw
25C INL
25C DNL
85°C
32
64
96
Wiper Setting (decimal)
Wiper Resistance (RW)
(ohms)
0
-40C Rw
-40C INL
-40C DNL
100
RW
-40°C
40
120
0.3
Error (LSb)
125°C
125C Rw
125C INL
125C DNL
Error (LSb)
85°C
85C Rw
85C INL
85C DNL
Error (LSb)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
120
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
FIGURE 2-8:
5.0 kΩ : Rheo Mode – RW
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V). (IW = TBD, B = VSS)
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
-0.4
RBW Tempco (PPM)
Full-Scale Error (FSE) (LSb)
0.0
-0.2
-0.6
-0.8
5.5V
-1.0
-1.2
2.7
-1.4
1.8V
-1.6
-1.8
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-9:
5.0 kΩ : Full Scale Error
(FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
200
180
160
140
120
100
80
60
40
20
0
2.7V
5.5V
0
32
64
96
Wiper Setting (decimal)
FIGURE 2-12:
5.0 kΩ : RBW Tempco
FIGURE 2-13:
Response Time.
5.0 kΩ : Power-Up Wiper
ΔRWB / ΔT vs. Code.
Zero-Scale Error (ZSE) (LSb)
1.8
1.6
1.4
1.2
1.8V
1.0
2.7
0.8
0.6
0.4
5.5V
0.2
0.0
-40
0
40
80
Ambient Temperature (°C)
120
Nominal Resistance (RAB)
(Ohms)
FIGURE 2-10:
5.0 kΩ : Zero Scale Error
(ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
5200
5180
5160
5140
5120
5100
5080
5060
5040
5020
5000
Wiper
VDD
1.8V
2.7V
5.5V
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-11:
5.0 kΩ : Nominal Resistance
(Ω) vs. Temperature and VDD.
© 2009 Microchip Technology Inc.
FIGURE 2-14:
5.0 kΩ : Digital Feedthrough
(SCL signal coupling to Wiper pin).
DS22147A-page 15
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-15:
5.0 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=5.5V).
FIGURE 2-18:
5.0 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=5.5V).
FIGURE 2-16:
5.0 kΩ : Write Wiper (40h
→ 3Fh) Settling Time (VDD=2.7V).
FIGURE 2-19:
5.0 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=2.7V).
FIGURE 2-17:
5.0 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=1.8V).
FIGURE 2-20:
5.0 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=1.8V).
DS22147A-page 16
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
0.2
0.1
80
0
60
-0.1
-40°C
DNL
RW
INL
25°C
-0.2
20
-0.3
260
25C Rw
25C INL
25C DNL
INL
220
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
0.1
180
0
140
RW
25°C
60
-0.2
-40°C
20
125C Rw
125C INL
125C DNL
0.25
2000
0.05
-0.05
RW
-0.15
-0.25
0
FIGURE 2-23:
10 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V). (A = VDD, B = VSS)
© 2009 Microchip Technology Inc.
125C Rw
125C INL
125C DNL
125°C
RW
3
2
25°C
1
0
60
-40°C
DNL
INL
20
-1
32
64
96
Wiper Setting (decimal)
FIGURE 2-25:
10 kΩ Rheo Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V).(IW = 210uA, B = VSS)
-40C Rw
-40C INL
-40C DNL
3000
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
39
34
29
24
2000
19
INL
1000
RW
4
-1
0
Note:
14
9
DNL
0
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
85C Rw
85C INL
85C DNL
100
-0.35
0
Note:
INL
25C Rw
25C INL
25C DNL
85°C
0.35
0.15
DNL
1000
-40C Rw
-40C INL
-40C DNL
140
Wiper Resistance (RW)
(ohms)
85C Rw
85C INL
85C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
3000
25C Rw
25C INL
25C DNL
-0.3
32
64
96
Wiper Setting (decimal)
0
FIGURE 2-22:
10 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V). (A = VDD, B = VSS)
-0.1
-0.2
INL
180
32
64
96
Wiper Setting (decimal)
-40C Rw
-40C INL
-40C DNL
25°C
FIGURE 2-24:
10 kΩ Rheo Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V).(IW = 450uA, B = VSS)
-0.3
0
RW
-40°C
40
220
-0.1
DNL
100
0.2
0
260
0.2
0.3
0.1
60
300
0.3
125°C
85°
125C Rw
125C INL
125C DNL
125°C DNL
85°C
0
Error (LSb)
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
85C Rw
85C INL
85C DNL
20
FIGURE 2-21:
10 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V). (A = VDD, B = VSS)
300
25C Rw
25C INL
25C DNL
80
32
64
96
Wiper Setting (decimal)
Wiper Resistance (RW)
(ohms)
0
-40C Rw
-40C INL
-40C DNL
100
125°C
85°C
40
120
0.3
Error (LSb)
100
125C Rw
125C INL
125C DNL
Error (LSb)
85C Rw
85C INL
85C DNL
Error (LSb)
25C Rw
25C INL
25C DNL
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
120
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
FIGURE 2-26:
10 kΩ Rheo Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V). (IW = TBD, B = VSS)
DS22147A-page 17
MCP4017/18/19
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
100
RBW Tempco (PPM)
Full-Scale Error (FSE) (LSb)
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
5.5V
2.7
1.8V
80
2.7V
60
40
5.5V
20
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-27:
10 kΩ : Full Scale Error
(FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
0
32
64
96
Wiper Setting (decimal)
FIGURE 2-30:
10 kΩ : RBW Tempco
FIGURE 2-31:
Response Time.
10 kΩ : Power-Up Wiper
ΔRWB / ΔT vs. Code.
Zero-Scale Error (ZSE) (LSb)
0.9
0.8
0.7
0.6
1.8V
0.5
2.7
0.4
0.3
0.2
5.5V
0.1
0.0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-28:
10 kΩ : Zero Scale Error
(ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
Nominal Resistance (RAB)
(Ohms)
10200
10150
10100
Wiper
1.8V
10050
VDD
10000
2.7
9950
5.5V
9900
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-29:
10 kΩ : Nominal Resistance
(Ω) vs. Temperature and VDD.
DS22147A-page 18
FIGURE 2-32:
10 kΩ : Digital Feedthrough
(SCL signal coupling to Wiper pin).
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-33:
10 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=5.5V).
FIGURE 2-36:
10 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=5.5V).
FIGURE 2-34:
10 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=2.7V).
FIGURE 2-37:
10 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=2.7V).
FIGURE 2-35:
10 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=1.8V).
FIGURE 2-38:
10 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=1.8V).
© 2009 Microchip Technology Inc.
DS22147A-page 19
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
0.2
0.1
0
60
DNL
-0.1
INL
-40°C
RW
-0.2
25°C
20
-0.3
260
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
220
125C Rw
125C INL
125C DNL
125°C
85°
DNL
INL
25°C
60
-0.1
-0.2
20
6000
-0.05
INL
2000
-0.15
RW
0
-0.25
FIGURE 2-41:
50 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V).
DS22147A-page 20
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
125°C
85°C
INL
0.3
0.2
0.1
25°C
0
DNL
60
-0.1
RW
-0.2
-40°C
20
-0.3
32
64
96
Wiper Setting (decimal)
FIGURE 2-43:
50 kΩ Rheo Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V).(IW = 45uA, B = VSS)
-40C Rw
-40C INL
-40C DNL
8000
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
RW
6000
INL
4000
DNL
2000
0
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
25C Rw
25C INL
25C DNL
100
-0.35
0
-40C Rw
-40C INL
-40C DNL
10000
0.25
0.05
4000
32
64
96
Wiper Setting (decimal)
140
0.35
0.15
DNL
Note:
125C Rw
125C INL
125C DNL
-0.2
-0.3
180
Wiper Resistance (RW)
(ohms)
85C Rw
85C INL
85C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
8000
25C Rw
25C INL
25C DNL
RW
25°C
0
FIGURE 2-40:
50 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V).
-40C Rw
-40C INL
-40C DNL
-0.1
-40°C
40
32
64
96
Wiper Setting (decimal)
10000
INL
FIGURE 2-42:
50 kΩ Rheo Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V).(IW = 90uA, B = VSS)
-0.3
0
DNL
220
RW
-40°C
0.2
125°C
0
60
260
0.2
0
140
0.3
125C Rw
125C INL
125C DNL
0.1
300
0.3
0.1
180
100
85°C
0
Error (LSb)
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
85C Rw
85C INL
85C DNL
20
FIGURE 2-39:
50 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V).
300
25C Rw
25C INL
25C DNL
80
32
64
96
Wiper Setting (decimal)
Wiper Resistance (RW)
(ohms)
0
-40C Rw
-40C INL
-40C DNL
100
125°C
80
40
120
0.3
Error (LSb)
85°C
125C Rw
125C INL
125C DNL
Error (LSb)
85C Rw
85C INL
85C DNL
0
Note:
23
21
19
17
15
13
11
9
7
5
3
1
-1
Error (LSb)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
120
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
FIGURE 2-44:
50 kΩ Rheo Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V). (IW = TBD, B = VSS)
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
100
-0.04
RBW Tempco (PPM)
Full-Scale Error (FSE) (LSb)
0.00
-0.08
2.7
5.5V
-0.12
1.8V
-0.16
80
60
2.7V
40
5.5V
20
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-45:
50 kΩ : Full Scale Error
(FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
0
32
64
96
Wiper Setting (decimal)
FIGURE 2-48:
50 kΩ : RBW Tempco
FIGURE 2-49:
Response Time.
50 kΩ : Power-Up Wiper
ΔRWB / ΔT vs. Code.
Zero-Scale Error (ZSE) (LSb)
0.20
0.16
1.8V
0.12
2.7
0.08
0.04
5.5V
0.00
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-46:
50 kΩ : Zero Scale Error
(ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
Nominal Resistance (RAB)
(Ohms)
49800
49600
Wiper
49400
49200
VDD
1.8V
49000
2.7V
5.5V
48800
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-47:
50 kΩ : Nominal Resistance
(Ω) vs. Temperature and VDD.
© 2009 Microchip Technology Inc.
FIGURE 2-50:
50 kΩ : Digital Feedthrough
(SCL signal coupling to Wiper pin).
DS22147A-page 21
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-51:
50 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=5.5V).
FIGURE 2-54:
50 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=5.5V).
FIGURE 2-52:
50 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=2.7V).
FIGURE 2-55:
50 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=2.7V).
FIGURE 2-53:
50 kΩ : Write Wiper (40h →
3Fh) Settling Time (VDD=1.8V).
FIGURE 2-56:
50 kΩ : Write Wiper (FFh →
00h) Settling Time (VDD=1.8V).
DS22147A-page 22
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
DNL
0.2
0.1
80
0
60
INL
40
120
0.3
-0.1
100
RW
-40°C
25°C
-0.2
20
-0.3
260
25C Rw
25C INL
25C DNL
DNL
220
85°
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
0
140
INL
25°C
60
RW
-40°C
20
-0.2
125C Rw
125C INL
125C DNL
2500
RW
INL
0
-0.25
FIGURE 2-59:
100 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V).
© 2009 Microchip Technology Inc.
125°C
0.3
0.2
0.1
-40°C
-0.1
RW
-0.2
25°C
20
-0.3
32
64
96
Wiper Setting (decimal)
FIGURE 2-61:
100 kΩ Rheo Mode : RW
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V). (IW = 21uA, B = VSS)
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
RW
10000
INL
7500
5000
DNL
2500
0
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
125C Rw
125C INL
125C DNL
DNL
60
-0.35
0
85°C
100
12500
-0.15
85C Rw
85C INL
85C DNL
0
0.25
-0.05
5000
25C Rw
25C INL
25C DNL
INL
15000
0.05
7500
-40C Rw
-40C INL
-40C DNL
0.35
0.15
DNL
10000
-0.3
140
Wiper Resistance (RW)
(ohms)
85C Rw
85C INL
85C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
12500
25C Rw
25C INL
25C DNL
-0.2
32
64
96
Wiper Setting (decimal)
0
FIGURE 2-58:
100 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 2.7V).
-40C Rw
-40C INL
-40C DNL
INL
25°C
180
32
64
96
Wiper Setting (decimal)
15000
-0.1
RW
-40°C
40
FIGURE 2-60:
100 kΩ Rheo Mode : RW
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V). (IW = 45uA, B = VSS)
-0.3
0
Note:
0
220
-0.1
100
0.2
DNL
60
260
0.2
0.1
0.3
125C Rw
125C INL
125C DNL
0.1
300
0.3
125°C
180
125°C
85°C
0
Error (LSb)
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
85C Rw
85C INL
85C DNL
20
FIGURE 2-57:
100 kΩ Pot Mode : RW (Ω),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 5.5V).
300
25C Rw
25C INL
25C DNL
80
32
64
96
Wiper Setting (decimal)
Wiper Resistance (RW)
(ohms)
0
-40C Rw
-40C INL
-40C DNL
Error (LSb)
125°C
85°C
125C Rw
125C INL
125C DNL
Error (LSb)
85C Rw
85C INL
85C DNL
0
Note:
19
17
15
13
11
9
7
5
3
1
-1
Error (LSb)
100
25C Rw
25C INL
25C DNL
Wiper Resistance (RW)
(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
Wiper Resistance (RW)
(ohms)
120
32
64
96
Wiper Setting (decimal)
Refer to AN1080 for additional information on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
FIGURE 2-62:
100 kΩ Rheo Mode : RW
(Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and
Temperature (VDD = 1.8V). (IW = TBD, B = VSS)
DS22147A-page 23
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
100
-0.02
RBW Tempco (PPM)
Full-Scale Error (FSE) (LSb)
0.00
5.5V
-0.04
2.7
-0.06
80
60
2.7V
40
20
5.5V
1.8V
-0.08
0
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-63:
100 kΩ : Full Scale Error
(FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
0
32
64
96
Wiper Setting (decimal)
FIGURE 2-66:
100 kΩ : RBW Tempco
ΔRWB / ΔT vs. Code.
Zero-Scale Error (ZSE) (LSb)
0.12
0.08
1.8V
2.7
0.04
5.5V
0.00
-40
0
40
80
Ambient Temperature (°C)
120
Nominal Resistance (RAB)
(Ohms)
FIGURE 2-64:
100 kΩ : Zero Scale Error
(ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V).
99800
99600
99400
99200
99000
98800
98600
98400
98200
98000
97800
FIGURE 2-67:
Response Time.
100 kΩ : Power-Up Wiper
Wiper
VDD
1.8V
2.7V
5.5V
-40
0
40
80
Ambient Temperature (°C)
FIGURE 2-65:
100 kΩ : Nominal
Resistance (Ω) vs. Temperature and VDD.
DS22147A-page 24
120
FIGURE 2-68:
100 kΩ : Digital
Feedthrough (SCL signal coupling to Wiper pin).
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-69:
100 kΩ : Write Wiper (40h
→ 3Fh) Settling Time (VDD = 5.5V).
FIGURE 2-72:
100 kΩ : Write Wiper (FFh
→ 00h) Settling Time (VDD = 5.5V).
FIGURE 2-70:
100 kΩ : Write Wiper (40h
→ 3Fh) Settling Time (VDD = 2.7V).
FIGURE 2-73:
100 kΩ : Write Wiper (FFh
→ 00h) Settling Time (VDD = 2.7V).
FIGURE 2-71:
100 kΩ : Write Wiper (40h
→ 3Fh) Settling Time (VDD = 1.8V).
FIGURE 2-74:
100 kΩ : Write Wiper (FFh
→ 00h) Settling Time (VDD = 1.8V).
© 2009 Microchip Technology Inc.
DS22147A-page 25
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
4
0.3
3.5
2.5
VOL (mV)
VIH (V)
0.25
5.5V
3
2.7V
2
1.5
1
2.7V (@ 3mA)
0.2
0.15
5.5V (@ 3mA)
0.1
1.8V (@ 1mA)
0.05
0.5
1.8V
0
-40
0
40
80
0
120
-40
0
Temperature (°C)
FIGURE 2-75:
Temperature.
VIH (SCL, SDA) vs. VDD and
FIGURE 2-77:
Temperature.
80
120
VOL (SDA) vs. VDD and
1.2
2
5.5
V
1
5.5V
1.5
2.7V
0.8
VDD (V)
VIL (V)
40
Temperature (°C)
1
2.7V
0.6
0.4
0.5
1.8V
0.2
0
0
-40
0
40
80
120
-40
0
Temperature (°C)
FIGURE 2-76:
Temperature.
DS22147A-page 26
VIL (SCL, SDA) vs. VDD and
40
80
120
Temperature (°C)
FIGURE 2-78:
and Temperature.
POR/BOR Trip point vs. VDD
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
10
10
Code = 7Fh
Code = 3Fh
dB
dB
-30
Code = 0Fh
Code = 3Fh
-10
-10
-20
Code = 7Fh
0
0
Code = 1Fh
Code = 1Fh
-20
Code = 0Fh
-30
Code = 01h
-40
Code = 01h
-40
-50
-50
100
1,000
-60
100
10,000
5 kΩ – Gain vs. Frequency
FIGURE 2-79:
(-3dB).
Test Circuits
Code = 7Fh
0
dB
-30
+5V
Code = 3Fh
-10
-20
10,000
FIGURE 2-82:
100 kΩ – Gain vs.
Frequency (-3dB).
2.1
10
1,000
Frequency (kHz)
Frequency (kHz)
Code = 0Fh
VIN
Code = 1Fh
Code = 01h
-40
A
B
-50
-60
100
1,000
W
+5V
+
VOUT
-
10,000
Frequency (kHz)
FIGURE 2-80:
(-3dB).
10 kΩ – Gain vs. Frequency
FIGURE 2-83:
(-3dB).
10
Gain vs. Frequency Test
Code = 7Fh
0
Code = 3Fh
dB
-10
Code = 1Fh
-20
-30
Code = 0Fh
Code = 01h
-40
-50
-60
100
1,000
10,000
Frequency (kHz)
FIGURE 2-81:
(-3dB).
50 kΩ – Gain vs. Frequency
© 2009 Microchip Technology Inc.
DS22147A-page 27
MCP4017/18/19
NOTES:
DS22147A-page 28
© 2009 Microchip Technology Inc.
MCP4017/18/19
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follow.
TABLE 3-1:
Pin
Name
PINOUT DESCRIPTION FOR THE MCP4017/18/19
Pin Number
MCP4017 MCP4018 MCP4019
(SC70-6) (SC70-6) (SC70-5)
Pin
Type
Buffer
Type
Function
VDD
1
1
1
P
—
Positive Power Supply Input
VSS
2
2
2
P
—
Ground
SCL
3
3
3
I/O
ST (OD) I2C Serial Clock pin
SDA
4
4
4
I/O
ST (OD) I2C Serial Data pin
B
5
—
—
I/O
A
Potentiometer Terminal B
W
6
5
5
I/O
A
Potentiometer Wiper Terminal
A
—
6
—
I/O
A
Potentiometer Terminal A
Legend: A = Analog input
I = Input
© 2009 Microchip Technology Inc.
ST (OD) = Schmitt Trigger with Open Drain
O = Output
I/O = Input/Output
P = Power
DS22147A-page 29
MCP4017/18/19
3.1
Positive Power Supply Input (VDD)
The VDD pin is the device’s positive power supply input.
The input power supply is relative to VSS and can range
from 1.8V to 5.5V. A de-coupling capacitor on VDD (to
VSS) is recommended to achieve maximum
performance.
While the device’s voltage is in the range of 1.8V ≤ VDD
< 2.7V, the Resistor Network’s electrical performance
of the device may not meet the data sheet
specifications.
3.2
Ground (VSS)
The VSS pin is the device ground reference.
3.3
I2C Serial Clock (SCL)
The SCL pin is the serial clock pin of the I2C interface.
The MCP401X acts only as a slave and the SCL pin
accepts only external serial clocks. The SCL pin is an
open-drain output. Refer to Section 5.0 “Serial
Interface - I2C Module” for more details of I2C Serial
Interface communication.
3.4
W pin can support both positive and negative current.
The voltage on terminal W must be between VSS and
VDD.
3.7
Potentiometer Terminal A
The terminal A pin (available on some devices) is
connected to the internal potentiometer’s terminal A.
The potentiometer’s terminal A is the fixed connection
to the Full Scale (0x7F tap) wiper value of the digital
potentiometer.
The terminal A pin is available on the MCP4018
devices. The terminal A pin does not have a polarity
relative to the terminal W pin. The terminal A pin can
support both positive and negative current. The voltage
on Terminal A must be between VSS and VDD.
The terminal A pin is not available on the MCP4017
and MCP4019 devices. For these devices, the
potentiometer’s terminal A is internally floating.
I2C Serial Data (SDA)
The SDA pin is the serial data pin of the I2C interface.
The SDA pin has a Schmitt trigger input and an
open-drain output. Refer to Section 5.0 “Serial
Interface - I2C Module” for more details of I2C Serial
Interface communication.
3.5
Potentiometer Terminal B
The terminal B pin (available on some devices) is
connected to the internal potentiometer’s terminal B.
The potentiometer’s terminal B is the fixed connection
to the Zero Scale (0x00 tap) wiper value of the digital
potentiometer.
The terminal B pin is available on the MCP4017 device.
The terminal B pin does not have a polarity relative to
the terminal W pin. The terminal B pin can support both
positive and negative current. The voltage on terminal
B must be between VSS and VDD.
The terminal B pin is not available on the MCP4018
and MCP4019 devices. For these devices, the
potentiometer’s terminal B is internally connected to
VSS.
3.6
Potentiometer Wiper (W) Terminal
The terminal W pin is connected to the internal
potentiometer’s terminal W (the wiper). The wiper
terminal is the adjustable terminal of the digital
potentiometer. The terminal W pin does not have a
polarity relative to terminals A or B pins. The terminal
DS22147A-page 30
© 2009 Microchip Technology Inc.
MCP4017/18/19
4.0
GENERAL OVERVIEW
4.1.2
BROWN-OUT RESET
The MCP4017/18/19 devices are general purpose
digital potentiometers intended to be used in
applications where a programmable resistance with
moderate bandwidth is desired.
When the device powers down, the device VDD will
cross the VPOR/VBOR voltage. Once the VDD voltage
decreases below the VPOR/VBOR voltage the following
happens:
This Data Sheet covers a family of three Digital
Potentiometer and Rheostat devices. The MCP4018
device is the Potentiometer configuration, while the
MCP4017 and MCP4019 devices are the Rheostat
configuration.
• Serial Interface is disabled
Applications generally suited for the MCP401X devices
include:
•
•
•
•
Set point or offset trimming
Sensor calibration
Selectable gain and offset amplifier designs
Cost-sensitive mechanical trim pot replacement
As the Device Block Diagram shows, there are four
main functional blocks. These are:
• POR/BOR Operation
• Serial Interface - I2C Module
• Resistor Network
The POR/BOR operation and the Memory Map are
discussed in this section and the I2C and Resistor
Network operation are described in their own sections.
The Serial Commands commands are discussed in
Section 5.4.
4.1
POR/BOR Operation
If the VDD voltage decreases below the VRAM voltage
the following happens:
• Volatile wiper registers may become corrupted
As the voltage recovers above the VPOR/VBOR voltage
see Section 4.1.1 “Power-on Reset”.
Serial commands not completed due to a Brown-out
condition may cause the memory location to become
corrupted.
4.1.3
WIPER REGISTER (RAM)
The Wiper Register is volatile memory that starts
functioning at the RAM retention voltage (VRAM). The
Wiper Register will be loaded with the default wiper
value when VDD will rise above the VPOR/VBOR voltage.
4.1.4
DEVICE CURRENTS
The current of the device can be classified into two
modes of the device operation. These are:
• Serial Interface Inactive (Static Operation)
• Serial Interface Active
Static Operation occurs when a Stop condition is
received. Static Operation is exited when a Start
condition is received.
The Power-on Reset is the case where the device is
having power applied to it from VSS. The Brown-out
Reset occurs when a device had power applied to it,
and that power (voltage) drops below the specified
range.
The devices RAM retention voltage (VRAM) is lower
than the POR/BOR voltage trip point (VPOR/VBOR). The
maximum VPOR/VBOR voltage is less then 1.8V.
When VPOR/VBOR < VDD < 2.7V, the Resistor Network’s
electrical performance may not meet the data sheet
specifications. In this region, the device is capable of
reading and writing to its volatile memory if the proper
serial command is executed.
Table 4-1 shows the digital pot’s level of functionality
across the entire VDD range, while Figure 4-1 illustrates
the Power-up and Brown-out functionality.
4.1.1
POWER-ON RESET
When the device powers up, the device VDD will cross
the VPOR/VBOR voltage. Once the VDD voltage crosses
the VPOR/VBOR voltage, the following happens:
• Volatile wiper register is loaded with the default
wiper value (3Fh)
• The device is capable of digital operation
© 2009 Microchip Technology Inc.
DS22147A-page 31
MCP4017/18/19
TABLE 4-1:
VDD Level
DEVICE FUNCTIONALITY AT EACH VDD REGION (NOTE 1)
Serial
Interface
Potentiometer
Terminals
“unknown”
VDD < VBOR < 1.8V Ignored
VBOR ≤ VDD < 1.8V “Unknown” Operational with
reduced electrical
specs
1.8V ≤ VDD < 2.7V Accepted Operational with
reduced electrical
specs
2.7V ≤ VDD ≤ 5.5V Accepted Operational
Note 1:
Wiper Setting
Comment
Unknown
Wiper Register loaded
with POR/BOR value
Wiper Register
Electrical performance may not
determines Wiper
meet the data sheet specifications.
Setting
Wiper Register
Meets the data sheet specifications
determines Wiper
Setting
For system voltages below the minimum operating voltage, the customer will be recommended to use a
voltage supervisor to hold the system in reset. This will ensure that MCP4017/18/19 commands are not
attempted out of the operating range of the device.
Normal Operation Range
VDD
Outside Specified
AC/DC Range
Normal Operation Range
2.7V
1.8V
VPOR/BOR
VRAM
VSS
FIGURE 4-1:
DS22147A-page 32
Analog
Characteristics
not specified
Analog
Characteristics not specified
Device’s Serial
Interface is
“Not Operational”
VBOR Delay
Wiper Forced to Default POR/BOR setting
Power-up and Brown-out.
© 2009 Microchip Technology Inc.
MCP4017/18/19
5.0
SERIAL INTERFACE I2C MODULE
5.1
A 2-wire I2C serial protocol is used to write or read the
digital potentiometer’s wiper register. The I2C protocol
utilizes the SCL input pin and SDA input/output pin.
The I2C serial interface supports the following features.
• Slave mode of operation
• 7-bit addressing
• The following clock rate modes are supported:
- Standard mode, bit rates up to 100 kb/s
- Fast mode, bit rates up to 400 kb/s
• Support Multi-Master Applications
The serial clock is generated by the Master.
The I2C Module is compatible with the Phillips I2C
specification. Phillips only defines the field types, field
lengths, timings, etc. of a frame. The frame content
defines the behavior of the device. The frame content
for the MCP4017, MCP4018, and MCP4019 devices
are defined in this section of the Data Sheet.
Figure 5-1 shows a typical I2C bus configurations.
Single I2C Bus Configuration
Device 1
Device n
Host
Controller
Device 2
FIGURE 5-1:
Configurations.
I2C specifications require active low, passive high
functionality on devices interfacing to the bus. Since
devices may be operating on separate power supply
sources, ESD clamping diodes are not permitted. The
specification recommends using open drain transistors
tied to VSS (common) with a pull-up resistor. The
specification makes some general recommendations
on the size of this pull-up, but does not specify the
exact value since bus speeds and bus capacitance
impacts the pull-up value for optimum system
performance.
Common pull-up values range from 1 kΩ to a max of
~10 kΩ. Power sensitive applications tend to choose
higher values to minimize current losses during
communication but these applications also typically
utilize lower VDD.
The SDA and SCL float (are not driving) when the
device is powered down.
A "glitch" filter is on the SCL and SDA pins when the pin
is an input. When these pins are an output, there is a
slew rate control of the pin that is independent of device
frequency.
5.1.1
Device 3
Device 4
I2C I/O Considerations
SLOPE CONTROL
The device implements slope control on the SDA
output. The slope control is defined by the fast mode
specifications.
For Fast (FS) mode, the device has spike suppression
and Schmidt trigger inputs on the SDA and SCL pins.
Typical Application I2C Bus
Refer to Section 2.0 “Typical Performance Curves”,
AC/DC Electrical Characteristics table for detailed input
threshold and timing specifications.
© 2009 Microchip Technology Inc.
DS22147A-page 33
MCP4017/18/19
5.2
I2C Bit Definitions
If the Slave Address is not valid, the Slave Device will
issue a Not A (A). The A bit will have the SDA signal
high.
I2C bit definitions include:
•
•
•
•
•
•
Start Bit
Data Bit
Acknowledge (A) Bit
Repeated Start Bit
Stop Bit
Clock Stretching
If an error condition occurs (such as an A instead of A)
then an START bit must be issued to reset the
command state machine.
TABLE 5-1:
Figure 5-8 shows the waveform for these states.
5.2.1
START BIT
The Start bit (see Figure 5-2) indicates the beginning of
a data transfer sequence. The Start bit is defined as the
SDA signal falling when the SCL signal is “High”.
2nd Bit
1st Bit
SDA
Acknowledge
Bit Response
Event
General Call
Bus Collision
Start Bit.
DATA BIT
The SDA signal may change state while the SCL signal
is Low. While the SCL signal is High, the SDA signal
MUST be stable (see Figure 5-3).
2nd Bit
1st Bit
SDA
SCL
5.2.3
Data Bit.
ACKNOWLEDGE (A) BIT
The A bit (see Figure 5-4) is a response from the Slave
device to the Master device. Depending on the context
of the transfer sequence, the A bit may indicate
different things. Typically the Slave device will supply
an A response after the Start bit and 8 “data” bits have
been received. The A bit will have the SDA signal low.
SDA
SCL
D0
8
FIGURE 5-4:
5.2.4
N.A.
I2C Module Resets,
or a “Don’t Care” if
the collision occurs
on the Masters
“Start bit”.
REPEATED START BIT
The Repeated Start bit (see Figure 5-5) indicates the
current Master Device wishes to continue
communicating with the current Slave Device without
releasing the I2C bus. The Repeated Start condition is
the same as the Start condition, except that the
Repeated Start bit follows a Start bit (with the Data bits
+ A bit) and not a Stop bit.
The Start bit is the beginning of a data transfer
sequence and is defined as the SDA signal falling when
the SCL signal is “High”.
S
FIGURE 5-3:
A
Slave Address A
not valid
S
5.2.2
Comment
Slave Address A
valid
SCL
FIGURE 5-2:
MCP4017/18/19 A / A
RESPONSES
Note 1: A bus collision during the Repeated Start
condition occurs if:
• SDA is sampled low when SCL goes
from low to high.
• SCL goes low before SDA is asserted
low. This may indicate that another master is attempting to transmit a data "1".
A
9
Acknowledge Waveform.
SDA
1st Bit
SCL
Sr = Repeated Start
FIGURE 5-5:
Waveform.
DS22147A-page 34
Repeat Start Condition
© 2009 Microchip Technology Inc.
MCP4017/18/19
5.2.5
STOP BIT
5.2.7
If any part of the I2C transmission does not meet the
command format, it is aborted. This can be intentionally
accomplished with a START or STOP condition. This is
done so that noisy transmissions (usually an extra
START or STOP condition) are aborted before they
corrupt the device.
The Stop bit (see Figure 5-6) Indicates the end of the
I2C Data Transfer Sequence. The Stop bit is defined as
the SDA signal rising when the SCL signal is “High”.
A Stop bit resets the I2C interface of the other devices.
SDA A / A
5.2.8
SCL
5.2.6
IGNORING AN I2C TRANSMISSION
AND “FALLING OFF” THE BUS
The MCP4017/18/19 expects to receive entire, valid
I2C commands and will assume any command not
defined as a valid command is due to a bus corruption
and will enter a passive high condition on the SDA
signal. All signals will be ignored until the next valid
START condition and CONTROL BYTE are received.
P
FIGURE 5-6:
Transmit Mode.
ABORTING A TRANSMISSION
Stop Condition Receive or
CLOCK STRETCHING
“Clock Stretching” is something that the Secondary
Device can do, to allow additional time to “respond” to
the “data” that has been received.
The MCP4017/18/19 will not strech the clock signal
(SCL) since memory read accesses occur fast enough.
SDA
SCL
S
FIGURE 5-7:
1st 2nd 3rd 4th 5th 6th 7th 8th A/A 1st 2nd 3rd 4th 5th 6th 7th 8th A/A
Bit Bit Bit Bit Bit Bit Bit Bit
Bit Bit Bit Bit Bit Bit Bit Bit
P
Typical 16-bit I2C Waveform Format.
SDA
SCL
START
Condition
FIGURE 5-8:
Data allowed
to change
Data or
A valid
STOP
Condition
I2C Data States and Bit Sequence.
© 2009 Microchip Technology Inc.
DS22147A-page 35
MCP4017/18/19
I2C COMMAND PROTOCOL
5.2.9
The MCP4017/18/19 is a slave I2C device which
supports 7-bit slave addressing. The slave address
contains seven fixed bits. Figure 5-9 shows the control
byte format.
5.2.9.1
DEVICE I2C ADDRESS
TABLE 5-2:
Device
I2C Address
MCP4017
MCP4018
MCP4019
‘0101111’
‘0101111’
‘0101111’
Comment
Control Byte (Slave Address)
The Control Byte is always preceded by a START
condition. The Control Byte contains the slave address
consisting of seven fixed bits and the R/W bit. Figure 59 shows the control byte format and Table 5-2 shows
the I2C address for the devices.
5.2.9.2
The MCP4017/MCP4018/MCP4019 does not support
hardware address bits.
5.2.10
Start
bit
GENERAL CALL
The General Call is a method that the Master device
can communicate with all other Slave devices.
Slave Address
S A6 A5 A4 A3 A2 A1 A0 R/W
“0” “1” “0” “1” “1” “1” “1”
Hardware Address Pins
A/A
The MCP4017/18/19 devices do not respond to
General Call address and commands, and therefore
the communications are Not Acknowledged.
R/W bit
R/W = 0 = write
R/W = 1 = read
A bit (controlled by slave device)
A = 0 = Slave Device Acknowledges byte
A = 1 = Slave Device does not Acknowledge byte
FIGURE 5-9:
I2C Control Byte.
Slave Address Bits in the
Second Byte
S 0 0
0 0
0 0 0
0 A x
General Call Address
x
x
x
X
x
x
0
A P
“7-bit Command”
Reserved 7-bit Commands (By I2C Specification - Philips # 9398 393 40011, Ver. 2.1 January 2000)
‘0000 011’b - Reset and write programmable part of slave address by hardware.
‘0000 010’b - Write programmable part of slave address by hardware.
‘0000 000’b - NOT Allowed
The Following is a “Hardware General Call” Format
Second Byte
S 0 0 0
0
0 0 0 0
General Call Address
FIGURE 5-10:
DS22147A-page 36
A x
x
x
x
X
“7-bit Command”
x
n occurrences of (Data + A / A)
x
1 A x
x
x
x
X x
x
X A P
This indicates a “Hardware General Call”
MCP4016/7/8/9 will ignore this byte and
all following bytes (and A), until
a Stop bit (P) is encountered.
General Call Formats.
© 2009 Microchip Technology Inc.
MCP4017/18/19
5.3
Software Reset Sequence
Note:
This technique should be supported by
any I2C compliant device. The 24xxxx I2C
Serial EEPROM devices support this technique, which is documented in AN1028.
The Stop bit terminates the current I2C bus activity. The
MCP4017/18/19 wait to detect the next Start condition.
This sequence does not effect any other I2C devices
which may be on the bus, as they should disregard this
as an invalid command.
At times it may become necessary to perform a
Software Reset Sequence to ensure the MCP4017/18/
19 device is in a correct and known I2C Interface state.
This only resets the I2C state machine.
5.4
This is useful if the MCP4017/18/19 device powers up
in an incorrect state (due to excessive bus noise, etc),
or if the Master Device is reset during communication.
Figure 5-11 shows the communication sequence to
software reset the device.
• Write Operation
• Read Operations
S
‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’
S
Serial Commands
The MCP4017/18/19 devices support
commands. These commands are:
2
serial
P
Nine bits of ‘1’
Start bit
Start
bit
Stop bit
FIGURE 5-11:
Format.
Software Reset Sequence
The 1st Start bit will cause the device to reset from a
state in which it is expecting to receive data from the
Master Device.In this mode, the device is monitoring
the data bus in Receive mode and can detect the Start
bit forces an internal Reset.
The nine bits of ‘1’ are used to force a Reset of those
devices that could not be reset by the previous Start bit.
This occurs only if the MCP4017/18/19 is driving an A
on the I2C bus, or is in output mode (from a Read
command) and is driving a data bit of ‘0’ onto the I2C
bus. In both of these cases, the previous Start bit could
not be generated due to the MCP4017/18/19 holding
the bus low. By sending out nine ‘1’ bits, it is ensured
that the device will see a A (the Master Device does not
drive the I2C bus low to acknowledge the data sent by
the MCP4017/18/19), which also forces the MCP4017/
18/19 to reset.
The 2nd Start bit is sent to address the rare possibility
of an erroneous write. This could occur if the Master
Device was reset while sending a Write command to
the MCP4017/18/19, AND then as the Master Device
returns to normal operation and issues a Start condition
while the MCP4017/18/19 is issuing an A. In this case
if the 2nd Start bit is not sent (and the Stop bit was sent)
the MCP4017/18/19 could initiate a write cycle.
Note:
The potential for this erroneous write
ONLY occurs if the Master Device is reset
while sending a Write command to the
MCP4017/18/19.
© 2009 Microchip Technology Inc.
DS22147A-page 37
MCP4017/18/19
5.4.1
WRITE OPERATION
5.4.2
The write operation requires the START condition,
Control Byte, Acknowledge, Data Byte, Acknowledge
and STOP (or RESTART) condition. The Control (Slave
Address) Byte requires the R/W bit equal to a logic zero
(R/W = “0”) to generate a write sequence. The
MCP4017/18/19 is responsible for generating the
Acknowledge (A) bits.
READ OPERATIONS
The read operation requires the START condition,
Control Byte, Acknowledge, Data Byte, the master
generating the A and STOP condition. The Control
Byte requires the R/W bit equal to a logic one (R/W =
1) to generate a read sequence. The MCP4017/18/19
will A the Slave Address Byte and A all the Data Bytes.
The I2C Master will A the Slave Address Byte and the
last Data Byte. If there are multiple Data Bytes, the I2C
Master will A all Data Bytes except the last Data Byte
(which it will A).
Data is written to the MCP4017/18/19 after every byte
transfer (during the A bit). If a STOP or RESTART
condition is generated during a data transfer (before
the A bit), the data will not be written to MCP4017/18/
19.
The MCP4017/18/19 maintains control of the SDA
signal until all data bits have been clocked out.
Data bytes may be written after each Acknowledge.
The command is terminated once a Stop (P) condition
occurs. Refer to Figure 5-12 for the write sequence.
For a single byte write, the master sends a STOP or
RESTART condition after the 1st data byte is sent.
The command is terminated once a Stop (P) condition
occurs. Refer to Figure 5-13 for the read command
sequence. For a single read, the master sends a STOP
or RESTART condition after the 1st data byte (and A
bit) is sent from the slave.
The MSb of each Data Byte is a don’t care, since the
wiper register is only 7-bits wide.
Figure 5-14 shows the I2C communication behavior of
the Master Device and the MCP4017/18/19 device and
the resultant I2C bus values.
Fixed
Address
S 0 1 0
1
1
Figure 5-14 shows the I2C communication behavior of
the Master Device and the MCP4017/18/19 device and
the resultant I2C bus values.
Read/Write bit (“0” = Write)
1 1
0 A
x D6 D5 D4 D3 D2 D1 D0 A x D6 D5 D4 D3 D2 D1 D0 A
Slave Address Byte
Data Byte
Data Byte
STOP bit
x D6 D5 D4 D3 D2 D1 D0 A x D6 D5 D4 D3 D2 D1 D0 A P
Data Byte
Data Byte
Legend
S = Start Condition
P = Stop Condition
A = Acknowledge
X = Don’t Care
R/W = Read/Write bit
D6, D5, D4, D3, D2, D1, D0 = Data bits
FIGURE 5-12:
DS22147A-page 38
I2C Write Command Format.
© 2009 Microchip Technology Inc.
MCP4017/18/19
Fixed
Address
S 0 1 0
1
1
Read/Write bit (“1” = Read)
1 1
1 A
0 D6 D5 D4 D3 D2 D1 D0 A(1) 0 D6 D5 D4 D3 D2 D1 D0 A(1)
Slave Address Byte
Data Byte
Data Byte
STOP bit
(2)
0 D6 D5 D4 D3 D2 D1 D0 A(1)0 D6 D5 D4 D3 D2 D1 D0 A
Data Byte
P
Data Byte
Legend
S = Start Condition
P = Stop Condition
A = Acknowledge
X = Don’t Care
R/W = Read/Write bit
Note 1 = Data bits
Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP4017/18/19
will abort this transfer and release the bus.
2: The Master Device will A, and the MCP4017/18/19 will release the bus so the Master Device can
generate a Stop or Repeated Start condition.
FIGURE 5-13:
I2C Read Command Format.
© 2009 Microchip Technology Inc.
DS22147A-page 39
MCP4017/18/19
Write 1 Byte
S Slave Address
Master
A P
S 0 1 0 1 1 1 1 0 1 x d d d d d d d 1 P
MCP4017/18/19
I2C Bus
R
/
W A Data Byte (1)
0
0
S 0 1 0 1 1 1 1 0 0 x d d d d d d d 0 P
Write 2 Bytes
S Slave Address
Master
A Data Byte (1)
A P
S 0 1 0 1 1 1 1 0 1 x d d d d d d d 1 x d d d d d d d 1 P
MCP4017/18/19
I2C Bus
R
/
W A Data Byte (1)
0
0
0
S 0 1 0 1 1 1 1 0 0 x d d d d d d d 0 x d d d d d d d 1 P
Read 1 Byte
S Slave Address
Master
S 0 1 0 1 1 1 1 1 1
MCP4017/18/19
I2C Bus
R
/
W A Data Byte
A P
1 P
0 0 d d d d d d d 1
S 0 1 0 1 1 1 1 1 0 0 d d d d d d d 1 P
Read 2 Bytes
S Slave Address
Master
MCP4017/18/19
I2C Bus
R
/
W A Data Byte
S 0 1 0 1 1 1 1 1 1
A Data Byte
A P
0
1 P
0 0 d d d d d d d 1 0 d d d d d d d 1
S 0 1 0 1 1 1 1 1 0 0 d d d d d d d 0 0 d d d d d d d 1 P
Note 1: For Write Commands, the MSb of the Data Byte is a don’t care since the wiper register is only 7-bits wide.
FIGURE 5-14:
DS22147A-page 40
I2C Communication Behavior.
© 2009 Microchip Technology Inc.
MCP4017/18/19
6.0
RESISTOR NETWORK
A
The Resistor Network is made up of two parts. These
are:
• Resistor Ladder
• Wiper
Figure 6-1 shows a block diagram for the resistive
network.
Digital potentiometer applications can be divided into
two resistor network categories:
• Rheostat configuration
• Potentiometer (or voltage divider) configuration
RS
The MCP4019 device is a Rheostat device with
terminal A of the resistor floating, terminal B internally
connected to ground, and the wiper (W) available on
pin.
6.1
Resistor Ladder Module
The resistor ladder is a series of equal value resistors
(RS) with a connection point (tap) between the two
resistors. The total number of resistors in the series
(ladder) determines the RAB resistance (see Figure 61). The end points of the resistor ladder are connected
to the device Terminal A and Terminal B pins. The RAB
(and RS) resistance has small variations over voltage
and temperature.
The Resistor Network has 127 resistors in a string
between terminal A and terminal B. This gives 7-bits of
resolution.
The wiper can be set to tap onto any of these 127
resistors thus providing 128 possible settings
(including terminal A and terminal B). This allows zero
scale to full scale connections.
RW
(1)
RW
(1)
RW
(1)
N = 126
RS
7Eh
N = 125
RS
7Dh
W
The MCP4017 is a true rheostat, with terminal B and
the wiper (W) of the variable resistor available on pins.
The MCP4018 device offers a voltage divider
(potentiometer) with terminal B internally connected to
ground.
7Fh
N = 127
N=1
RS
01h
RW
(1)
RW
(1)
N=0
B
00h
Analog
Mux
Note 1: The wiper resistance is tap dependent.
That is, each tap selection resistance
has a small variation. This variation has
more effect on devices with smaller RAB
resistance (5.0 kΩ).
FIGURE 6-1:
Diagram.
TABLE 6-1:
Wiper Setting
07Fh
07Eh - 040h
03Fh
03Eh - 001h
000h
Resistor Network Block
WIPER SETTING MAP
Properties
Full Scale (W = A)
W=N
W = N (Mid Scale)
W=N
Zero Scale (W = B)
A wiper setting of 00h connects the Terminal W (wiper)
to Terminal B (Zero Scale). A wiper setting of 3Fh is the
Mid scale setting. A wiper setting of 7Fh connects the
Terminal W (wiper) to Terminal A (Full Scale). Table 61 illustrates the full wiper setting map.
Terminal A and B as well as the wiper W do not have a
polarity. These terminals can support both positive and
negative current.
© 2009 Microchip Technology Inc.
DS22147A-page 41
MCP4017/18/19
Step resistance (RS) is the resistance from one tap
setting to the next. This value will be dependent on the
RAB value that has been selected. Equation 6-1 shows
the calculation for the step resistance while Table 6-2
shows the typical step resistances for each device.
EQUATION 6-1:
RS CALCULATION
TABLE 6-3:
DEFAULT FACTORY
SETTINGS SELECTION
Resistance Typical
Code
RAB Value
R AB
R S = --------127
Equation 6-2 illustrates the calculation used to
determine the resistance between the wiper and
terminal B.
EQUATION 6-2:
A POR/BOR event will load the Volatile Wiper register
value with the default value. Table 6-3 shows the
default values offered.
RWB CALCULATION
R AB N
- + RW
R WB = ------------127
N = 0 to 127 (decimal)
Default POR Wiper
Setting
Code (1)
-502
5.0 kΩ
Mid-scale
3Fh
-103
10.0 kΩ
Mid-scale
3Fh
-503
50.0 kΩ
Mid-scale
3Fh
-104
100.0 kΩ
Mid-scale
3Fh
Note 1: Custom POR/BOR Wiper Setting options
are available, contact the local Microchip
Sales Office for additional information.
Custom options have minimum volume
requirements.
The digital potentiometer is available in four nominal
resistances (RAB) where the nominal resistance is
defined as the resistance between terminal A and
terminal B. The four nominal resistances are 5 kΩ,
10 kΩ, 50 kΩ, and 100 kΩ.
The total resistance of the device has minimal variation
due to operating voltage (see Figure 2-11, Figure 2-29,
Figure 2-47, or Figure 2-65).
TABLE 6-2:
STEP RESISTANCES
Resistance (Ω)
Part Number
Case
Min.
Total
(RAB)
Step (RS)
4000
31.496
MCP4017/18/19-502E Typical 5000
39.370
Max.
6000
47.244
Min.
8000
62.992
MCP4017/18/19-103E Typical 10000
78.740
Max.
12000
94.488
Min.
40000
314.961
MCP4017/18/19-503E Typical 50000
393.701
Max.
60000
472.441
Min.
80000
629.921
MCP4017/18/19-104E Typical 100000
Max.
DS22147A-page 42
120000
787.402
944.882
© 2009 Microchip Technology Inc.
MCP4017/18/19
6.2
Resistor Configurations
6.2.1
6.2.2
RHEOSTAT CONFIGURATION
When used as a rheostat, two of the three digital
potentiometer’s terminals are used as a resistive
element in the circuit. With terminal W (wiper) and
either terminal A or terminal B, a variable resistor is
created. The resistance will depend on the tap setting
of the wiper (and the wiper’s resistance). The
resistance is controlled by changing the wiper setting
The unused terminal (B or A) should be left floating.
Figure 6-2 shows the two possible resistors that can be
used. Reversing the polarity of the A and B terminals
will not affect operation.
POTENTIOMETER
CONFIGURATION
When used as a potentiometer, all three terminals of
the device are tied to different nodes in the circuit. This
allows the potentiometer to output a voltage
proportional to the input voltage. This configuration is
sometimes called voltage divider mode. The
potentiometer is used to provide a variable voltage by
adjusting the wiper position between the two endpoints
as shown in Figure 6-3. Reversing the polarity of the A
and B terminals will not affect operation.
V1
A
V3
W
A
B
RAW or
W
RBW
B
Resistor
FIGURE 6-2:
Rheostat Configuration.
This allows the control of the total resistance between
the two nodes. The total resistance depends on the
“starting” terminal to the Wiper terminal. So at the code
00h, the RBW resistance is minimal (RW), but the RAW
resistance in maximized (RAB + RW). Conversely, at the
code 3Fh, the RAW resistance is minimal (RW), but the
RBW resistance in maximized (RAB + RW).
The resistance Step size (RS) equates to one LSb of
the resistor.
Note:
To avoid damage to the internal wiper
circuitry in this configuration, care should
be taken to insure the current flow never
exceeds 2.5 mA.
V2
FIGURE 6-3:
Configuration.
Potentiometer
The temperature coefficient of the RAB resistors is
minimal by design. In this configuration, the resistors all
change uniformly, so minimal variation should be seen.
The Wiper resistor temperature coefficient is different
to the RAB temperature coefficient. The voltage at node
V3 (Figure 6-3) is not dependent on this Wiper
resistance, just the ratio of the RAB resistors, so this
temperature coefficient in most cases can be ignored.
Note:
To avoid damage to the internal wiper
circuitry in this configuration, care should
be taken to insure the current flow never
exceeds 2.5 mA.
The pinout for the rheostat devices is such that as the
wiper register is incremented, the resistance of the
resistor will increase (as measured from Terminal B to
the W Terminal).
© 2009 Microchip Technology Inc.
DS22147A-page 43
MCP4017/18/19
6.3
Wiper Resistance
In a potentiometer configuration, the wiper resistance
variation does not effect the output voltage seen on the
W pin.
Wiper resistance is the series resistance of the analog
switch that connects the selected resistor ladder node
to the Wiper Terminal common signal (see Figure 6-1).
The slope of the resistance has a linear area (at the
higher voltages) and a non-linear area (at the lower
voltages). In where resistance increases faster then the
voltage drop (at low voltages).
A value in the volatile wiper register selects which
analog switch to close, connecting the W terminal to
the selected node of the resistor ladder.
The resistance is dependent on the voltages on the
analog switch source, gate, and drain nodes, as well as
the device’s wiper code, temperature, and the current
through the switch. As the device voltage decreases,
the wiper resistance increases (see Figure 6-4 and
Table 6-4).
RW
The wiper can connect directly to Terminal B or to
Terminal A. A zero scale connections, connects the
Terminal W (wiper) to Terminal B (wiper setting of
000h). A full scale connections, connects the Terminal
W (wiper) to Terminal A (wiper setting of 7Fh). In these
configurations the only resistance between the
Terminal W and the other Terminal (A or B) is that of the
analog switches.
VDD
Note: The slope of the resistance has a linear
area (at the higher voltages) and a
non-linear area (at the lower voltages).
The wiper resistance is typically measured when the
wiper is positioned at either zero scale (00h) or full
scale (3Fh).
FIGURE 6-4:
Relationship of Wiper
Resistance (RW) to Voltage.
Since there is minimal variation of the total device
resistance over voltage, at a constant temperature (see
Figure 2-11, Figure 2-29, Figure 2-47, or Figure 2-65),
the change in wiper resistance over voltage can have a
significant impact on the INL and DNL error.
The wiper resistance in potentiometer-generated
voltage divider applications is not a significant source
of error.
The wiper resistance in rheostat applications can
create significant nonlinearity as the wiper is moved
toward zero scale (00h). The lower the nominal
resistance, the greater the possible error.
In a rheostat configuration, this change in voltage
needs to be taken into account. Particularly for the
lower resistance devices. For the 5.0 kΩ device the
maximum wiper resistance at 5.5V is approximately
3.2% of the total resistance, while at 2.7V it is
approximately 6.5% of the total resistance.
TABLE 6-4:
TYPICAL STEP RESISTANCES AND RELATIONSHIP TO WIPER RESISTANCE
RW / RS (%) (1)
Resistance (Ω)
Typical
Total
(RAB)
Step
(RS)
Wiper (RW)
Typical
Max @ Max @
5.5V
2.7V
RW =
Typical
RW / RAB (%) (2)
RW = Max RW = Max
@ 5.5V
@ 2.7V
RW =
Typical
RW = Max RW = Max
@ 5.5V
@ 2.7V
5000
39.37
100
170
325
254.00%
431.80%
825.5%
2.00%
3.40%
6.50%
10000
78.74
100
170
325
127.00%
215.90%
412.75%
1.00%
1.70%
3.25%
50000
393.70
100
170
325
25.40%
43.18%
82.55%
0.20%
0.34%
0.65%
100000
787.40
100
170
325
12.70%
21.59%
41.28%
0.10%
0.17%
0.325%
Note 1:
2:
RS is the typical value. The variation of this resistance is minimal over voltage.
RAB is the typical value. The variation of this resistance is minimal over voltage.
DS22147A-page 44
© 2009 Microchip Technology Inc.
MCP4017/18/19
6.4
Operational Characteristics
Understanding the operational characteristics of the
device’s resistor components is important to the system
design.
6.4.1
6.4.1.1
6.4.1.2
Differential Non-linearity (DNL)
DNL error is the measure of variations in code widths
from the ideal code width. A DNL error of zero would
imply that every code is exactly 1 LSb wide.
ACCURACY
111
Integral Non-linearity (INL)
INL error for these devices is the maximum deviation
between an actual code transition point and its
corresponding ideal transition point after offset and
gain errors have been removed. These endpoints are
from 0x00 to 0x7F. Refer to Figure 6-5.
Positive INL means higher resistance than ideal.
Negative INL means lower resistance than ideal.
110
Actual
transfer
function
101
Digital 100
Input
Code 011
Ideal transfer
function
010
Wide code, > 1 LSb
001
INL < 0
000
111
110
Digital Pot Output
101
Digital
Input
Code
FIGURE 6-6:
100
6.4.1.3
011
Ideal transfer
function
010
001
000
INL < 0
Digital Pot Output
FIGURE 6-5:
Narrow code < 1 LSb
Actual
transfer
function
INL Accuracy.
© 2009 Microchip Technology Inc.
DNL Accuracy.
Ratiometric temperature coefficient
The ratiometric temperature coefficient quantifies the
error in the ratio RAW/RWB due to temperature drift.
This is typically the critical error when using a
potentiometer device (MCP4018) in a voltage divider
configuration.
6.4.1.4
Absolute temperature coefficient
The absolute temperature coefficient quantifies the
error in the end-to-end resistance (Nominal resistance
RAB) due to temperature drift. This is typically the
critical error when using a rheostat device (MCP4017
and MCP4019) in an adjustable resistor configuration.
DS22147A-page 45
MCP4017/18/19
6.4.2
MONOTONIC OPERATION
Monotonic operation means that the device’s
resistance increases with every step change (from
terminal A to terminal B or terminal B to terminal A).
The wiper resistances difference at each tap location.
When changing from one tap position to the next (either
increasing or decreasing), the ΔRW is less then the
ΔRS. When this change occurs, the device voltage and
temperature are “the same” for the two tap positions.
RS63
0x3F
RS62
Digital Input Code
0x3E
0x3D
RS3
0x03
RS1
0x02
RS0
0x01
0x00
RW
(@ tap)
n=?
RBW =
RSn + RW(@ Tap n)
n=0
Resistance (RBW)
FIGURE 6-7:
DS22147A-page 46
RBW.
© 2009 Microchip Technology Inc.
MCP4017/18/19
7.0
DESIGN CONSIDERATIONS
In the design of a system with the MCP4017/18/19
devices, the following considerations should be taken
into account. These are:
• The Power Supply
• The Layout
In the design of a system with the MCP4017/18/19
devices, the following considerations should be taken
into account:
• Power Supply Considerations
• Layout Considerations
7.1
Power Supply Considerations
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 7-1 illustrates an
appropriate bypass strategy.
In this example, the recommended bypass capacitor
value is 0.1 µF. This capacitor should be placed as
close to the device power pin (VDD) as possible (within
4 mm).
7.2
Layout Considerations
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially
masking
the
MCP4017/18/19’s
performance. Careful board layout will minimize these
effects and increase the Signal-to-Noise Ratio (SNR).
Bench testing has shown that a multi-layer board
utilizing a low-inductance ground plane, isolated inputs,
isolated outputs and proper decoupling are critical to
achieving the performance that the silicon is capable of
providing. Particularly harsh environments may require
shielding of critical signals.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
7.2.1
RESISTOR TEMPCO
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in Figure 2-11,
Figure 2-29, Figure 2-47, and Figure 2-65.
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end to end change is RAB resistance.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
VDD
0.1 µF
VDD
W
B
VSS
FIGURE 7-1:
Connections.
SCL
SDA
PICmicro® Microcontroller
A
MCP4017/18/19
0.1 µF
VSS
Typical Microcontroller
© 2009 Microchip Technology Inc.
DS22147A-page 47
MCP4017/18/19
NOTES:
DS22147A-page 48
© 2009 Microchip Technology Inc.
MCP4017/18/19
8.0
APPLICATIONS EXAMPLES
Digital potentiometers have a multitude of practical
uses in modern electronic circuits. The most popular
uses include precision calibration of set point
thresholds, sensor trimming, LCD bias trimming, audio
attenuation, adjustable power supplies, motor control
overcurrent trip setting, adjustable gain amplifiers and
offset trimming. The MCP4017/18/19 devices can be
used to replace the common mechanical trim pot in
applications where the operating and terminal voltages
are within CMOS process limitations (VDD = 2.7V to
5.5V).
8.1
Set Point Threshold Trimming
Applications that need accurate detection of an input
threshold event often need several sources of error
eliminated. Use of comparators and operational
amplifiers (op amps) with low offset and gain error can
help achieve the desired accuracy, but in many
applications, the input source variation is beyond the
designer’s control. If the entire system can be
calibrated after assembly in a controlled environment
(like factory test), these sources of error are minimized
if not entirely eliminated.
Figure 8-1 illustrates a common digital potentiometer
configuration. This configuration is often referred to as
a “windowed voltage divider”. Note that R1 is not
necessary to create the voltage divider, but its
presence is useful when the desired threshold has
limited range. It is “windowed” because R1 can narrow
the adjustable range of VTRIP to a value much less than
VDD – VSS. If the output range is reduced, the
magnitude of each output step is reduced. This
effectively increases the trimming resolution for a fixed
digital potentiometer resolution. This technique may
allow a lower-cost digital potentiometer to be utilized
(64 steps instead of 256 steps).
The MCP4018’s low DNL performance is critical to
meeting calibration accuracy in production without
having to use a higher precision digital potentiometer.
EQUATION 8-1:
CALCULATING THE
WIPER SETTING FROM
THE DESIRED VTRIP
VDD
R1
MCP4018
A
SDA
SCL
W
VOUT
B
FIGURE 8-1:
Using the Digital
Potentiometer to Set a Precise Output Voltage.
8.1.1
TRIMMING A THRESHOLD FOR AN
OPTICAL SENSOR
If the application has to calibrate the threshold of a
diode, transistor or resistor, a variation range of 0.1V is
common. Often, the desired a resolution of 2 mV or
better is adequate to accurately detect the presence of
a precise signal. A “windowed” voltage divider, utilizing
the MCP4018, would be a potential solution. Figure 82 illustrates this example application.
VDD
VDD
Rsense
VCC+
R1
Comparator
MCP4018 A
VTRIP
SDA
W
MCP6021
SCL
B
VCC–
0.1 µF
FIGURE 8-2:
Calibration.
Set Point or Threshold
R WB
V TRIP = V DD ⎛⎝ ------------------⎞⎠
R1 + R2
RAB = RNominal
RWB = RAB • D
127
D=
VTRIP
VDD
• (R1 + RAB )
• 127
D = Digital Potentiometer Wiper Setting (0-127)
© 2009 Microchip Technology Inc.
DS22147A-page 49
MCP4017/18/19
8.2
Operational Amplifier
Applications
Figure 8-3 and Figure 8-4 illustrate typical amplifier
circuits that could replace fixed resistors with the
MCP4017/18/19 to achieve digitally-adjustable analog
solutions.
VIN
MCP6291
+
Op Amp
VDD
VOUT
–
R1
A
R3
W
B
MCP4018 MCP4017
FIGURE 8-3:
Trimming Offset and Gain in
a Non-Inverting Amplifier.
MCP4018
B
R4
A
W
VDD
–
Op Amp
R1
A
VIN
W
B
MCP4018
+
VOUT
MCP6021
1
fc = -----------------------------
2 π ⋅ R Eq ⋅ C
Thevenin R
= ( R 1 + R AB – R WB ) || ( R 2 + R WB ) + R w
Equivalent Eq
FIGURE 8-4:
DS22147A-page 50
Programmable Filter.
© 2009 Microchip Technology Inc.
MCP4017/18/19
8.3
Temperature Sensor Applications
Thermistors are resistors with very predictable
variation with temperature. Thermistors are a popular
sensor choice when a low-cost temperature-sensing
solution is desired. Unfortunately, thermistors have
non-linear characteristics that are undesirable, typically
requiring trimming in an application to achieve greater
accuracy. There are several common solutions to trim
& linearize thermistors. Figure 8-5 and Figure 8-6 are
simple methods for linearizing a 3-terminal NTC
thermistor. Both are simple voltage dividers using a
Positive Temperature Coefficient (PTC) resistor (R1)
with a transfer function capable of compensating for the
linearity error in the Negative Temperature Coefficient
(NTC) thermistor.
The circuit, illustrated by Figure 8-5, utilizes a digital
rheostat for trimming the offset error caused by the
thermistor’s part-to-part variation. This solution puts the
digital potentiometer’s RW into the voltage divider
calculation. The MCP4017/18/19’s RAB temperature
coefficient is a low 50 ppm (-20°C to +70°C). RW’s error
is substantially greater than RAB’s error because RW
varies with VDD, wiper setting and temperature. For the
50 kΩ devices, the error introduced by RW is, in most
cases, insignificant as long as the wiper setting is > 6.
For the 2 kΩ devices, the error introduced by RW is
significant because it is a higher percentage of RWB.
For these reasons, the circuit illustrated in Figure 8-5 is
not the most optimum method for “exciting” and
linearizing a thermistor.
The circuit illustrated by Figure 8-6 utilizes a digital
potentiometer for trimming the offset error. This
solution removes RW from the trimming equation along
with the error associated with RW. R2 is not required,
but can be utilized to reduce the trimming “window” and
reduce variation due to the digital pot’s RAB part-to-part
variability.
VDD
R1
NTC
Thermistor
VOUT
MCP4018
FIGURE 8-6:
Thermistor Calibration using
a Digital Potentiometer in a Potentiometer
Configuration.
VDD
R1
NTC
Thermistor
VOUT
R2
MCP4017
FIGURE 8-5:
Thermistor Calibration using
a Digital Potentiometer in a Rheostat
Configuration.
© 2009 Microchip Technology Inc.
DS22147A-page 51
MCP4017/18/19
8.4
Wheatstone Bridge Trimming
Another common configuration to “excite” a sensor
(such as a strain gauge, pressure sensor or thermistor)
is the wheatstone bridge configuration. The
wheatstone bridge provides a differential output
instead of a single-ended output. Figure 8-7 illustrates
a wheatstone bridge utilizing one to three digital
potentiometers. The digital potentiometers in this
example are used to trim the offset and gain of the
wheatstone bridge.
VDD
5 kΩ
MCP4017
VOUT
MCP4017
50 kΩ
FIGURE 8-7:
Trimming.
DS22147A-page 52
MCP4017
50 kΩ
Wheatstone Bridge
© 2009 Microchip Technology Inc.
MCP4017/18/19
9.0
DEVELOPMENT SUPPORT
9.1
Development Tools
To assist in your design and evaluation of the
MCP4017/18/19 devices, a Demo board using the
MCP4017 device is in development. Please check the
Microchip web site for the release of this board. The
board part number is tentatively MCP4XXXDM-PGA,
and is expected to be available in the summer of 2009.
TABLE 9-1:
9.2
Technical Documentation
Several additional technical documents are available to
assist you in your design and development. These
technical documents include Application Notes,
Technical Briefs, and Design Guides. Table 9-1 shows
some of these documents.
TECHNICAL DOCUMENTATION
Application
Note Number
Title
Literature #
AN1080
Understanding Digital Potentiometers Resistor Variations
DS01080
AN737
Using Digital Potentiometers to Design Low Pass Adjustable Filters
DS00737
AN692
Using a Digital Potentiometer to Optimize a Precision Single Supply Photo Detect
DS00692
AN691
Optimizing the Digital Potentiometer in Precision Circuits
DS00691
AN219
Comparing Digital Potentiometers to Mechanical Potentiometers
DS00219
—
Digital Potentiometer Design Guide
DS22017
—
Signal Chain Design Guide
DS21825
© 2009 Microchip Technology Inc.
DS22147A-page 53
MCP4017/18/19
NOTES:
DS22147A-page 54
© 2009 Microchip Technology Inc.
MCP4017/18/19
10.0
PACKAGING INFORMATION
10.1
Package Marking Information
Example:
5-Lead SC70
XXNN
Part Number
Code
MCP4019T-502E/LT
BENN
MCP4019T-103E/LT
BFNN
MCP4019T-503E/LT
BGNN
MCP4019T-104E/LT
BHNN
BENN
6-Lead SC70
XXNN
Example:
Part Number
Code
Part Number
Code
MCP4017T-502E/LT
AENN
MCP4018T-502E/LT
AANN
MCP4017T-103E/LT
AFNN
MCP4018T-103E/LT
ABNN
MCP4017T-503E/LT
AGNN
MCP4018T-503E/LT
ACNN
MCP4017T-104E/LT
AHNN
MCP4018T-104E/LT
ADNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
AANN
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
DS22147A-page 55
MCP4017/18/19
.
#
#$#/!- 0 #
1/%#
#!#
##+22---
2/
D
b
3
1
2
E1
E
4
5
e
A
e
A2
c
A1
L
3#
4#
5$8
%1
44""
5
5
56
7
(
1#
6,:#
;
9()*
<
!!1//
;
<
#!
%%
<
6,=!#
"
;
!!1/=!#
"
(
(
(
6,4#
;
(
.
#4#
4
9
4!/
;
<
9
4!=!#
8
(
<
!"!
#$!
!% #$ !% #$ #&! !
!#
"'(
)*+ ) #&#,$ --#
$##
- *9)
DS22147A-page 56
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009 Microchip Technology Inc.
DS22147A-page 57
MCP4017/18/19
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22147A-page 58
© 2009 Microchip Technology Inc.
MCP4017/18/19
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009 Microchip Technology Inc.
DS22147A-page 59
MCP4017/18/19
NOTES:
DS22147A-page 60
© 2009 Microchip Technology Inc.
MCP4017/18/19
APPENDIX A:
REVISION HISTORY
Revision A (March 2009)
• Original Release of this Document.
© 2009 Microchip Technology Inc.
DS22147A-page 61
MCP4017/18/19
NOTES:
DS22147A-page 62
© 2009 Microchip Technology Inc.
MCP4017/18/19
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
XXX
X
/XX
Resistance Temperature Package
Version
Range
Device:
Resistance
Version:
Single Rheostat with I2C
interface
MCP4017T: Single Rheostat with I2C
interface (Tape and Reel)
MCP4018: Single Potentiometer to GND
with I2C Interface
MCP4018T: Single Potentiometer to GND
with I2C Interface (Tape and
Reel)
MCP4019: Single Rheostat to GND with
I2C Interface
MCP4019T: Single Rheostat to GND with
I2C Interface (Tape and Reel)
MCP4017:
502
103
503
104
=
=
=
=
5 kΩ
10 kΩ
50 kΩ
100 kΩ
Temperature
Range:
E
= -40°C to +125°C
Package:
LT = Plastic Small Outline Transistor
(SC70), 5-lead, 6-lead
Examples:
a)
b)
c)
d)
a)
b)
c)
d)
a)
b)
c)
d)
© 2009 Microchip Technology Inc.
MCP4017T-502E/LT: 5 kΩ,
6-LD SC-70.
MCP4017T-103E/LT: 10 kΩ, 6-LD
SC-70.
MCP4017T-503E/LT: 50 kΩ,
6-LD SC-70.
MCP4017T-104E/LT: 100 kΩ,
6-LD SC-70.
MCP4018T-502E/LT: 5 kΩ,
6-LD SC-70.
MCP4018T-103E/LT: 10 kΩ,
6-LD SC-70.
MCP4018T-503E/LT: 50 kΩ,
6-LD SC-70.
MCP4018T-104E/LT: 100 kΩ,
6-LD SC-70.
MCP4019T-502E/LT: 5 kΩ,
5-LD SC-70.
MCP4019T-103E/LT: 10 kΩ,
5-LD SC-70.
MCP4019T-503E/LT: 50 kΩ,
5-LD SC-70.
MCP4019T-104E/LT: 100 kΩ,
5-LD SC-70.
DS22147A-page 63
MCP4017/18/19
NOTES:
DS22147A-page 64
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
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PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
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FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP,
PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
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and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS22147A-page 65
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Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/26/09
DS22147A-page 66
© 2009 Microchip Technology Inc.