INTERSIL ISL32274EFBZ

ISL32172E, ISL32272E, ISL32372E, ISL32174E,
ISL32274E, ISL32374E, ISL32179E
®
Data Sheet
December 16, 2008
QUAD, ±16.5kV ESD Protected, 3.0V
to 5.5V, Low Power, RS-422 Transmitters
The Intersil ISL32x7xE are ±16.5kV IEC61000-4-2 ESD
Protected, 3.0V to 5.5V powered, QUAD transmitters for
balanced communication using the RS-422 standard. These
drivers have very low output leakage currents (±10µA), so
they present a low load to the RS-422 bus.
Driver (Tx) outputs are tri-statable, and incorporate a hot
plug feature to keep them disabled during power-up and
down. Versions are available with a common EN/EN
(‘172 pinout), a two channel EN12/EN34 (‘174 pinout), or a
versatile combination of individual and group channel
enables (see Table 1).
The ISL32372E, ISL32374E utilize slew rate limited drivers
which reduce EMI, and minimize reflections from improperly
terminated transmission lines, or from unterminated stubs in
multidrop and multipoint applications. Drivers on the other
versions are not limited, so they can achieve the 10Mbps or
32Mbps data rates. All versions are offered in Industrial and
Extended Industrial (-40°C to +125°C) temperature ranges.
A 50% smaller footprint (compared to the TSSOP) is
available with the ISL32179E’s QFN package. This device
also features a logic supply pin (VL), that sets the switching
points of the enable and DI inputs to be compatible with a
lower supply voltage in mixed voltage systems. Two speed
select pins allow the ISL32179E user to select from three
slew rate options for 460kbps, 10Mbps, or 32Mbps data
rates. Individual channel and group enable pins increase the
ISL32179E’s flexibility.
FN6824.0
Features
• IEC61000 ESD Protection on RS-422 Outputs . . ±16.5kV
- Class 3 ESD Level on all Other Pins . . . . . . 12kV HBM
- High Machine Model ESD Level on all Pins . . . . . 700V
• Wide Supply Range . . . . . . . . . . . . . . . . . . . 3.0V to 5.5V
• Specified for +125°C Operation
• Available in Industry Standard Pinouts (‘172/’174) or in a
Space Saving QFN (ISL32179E) with Added Features
• Logic Supply Pin (VL) Eases Operation in Mixed Supply
Systems (ISL32179E Only)
• User Selectable Data Rate (ISL32179E Only)
• Hot Plug - Tx Outputs Remain Three-state During
Power-up and Power-Down
• Low Tx Leakage Allows > 256 Devices on the Bus
• High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 32Mbps
• Low Quiescent Supply Current . . . . . . . . . . 0.8mA (Max)
- Low Shutdown Supply Current . . . . . . . . . . . . . . . 60µA
• Current Limiting and Thermal Shutdown for Driver
Overload Protection
• Tri-statable Tx Outputs
• 5V Tolerant Logic Inputs When VCC ≤ 5V
• Pb-free (RoHS compliant)
Applications
• Telecom Equipment
• Motor Controllers / Encoders
• Programmable Logic controllers
• Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
FUNCTION
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
VL PIN?
TX
ENABLE
TYPE
QUIESCENT
ICC (mA)
LOW POWER
SHUTDOWN?
PIN
COUNT
ISL32172E
4 Tx
32
NO
YES
NO
EN, EN
<1
NO
16
ISL32272E
4 Tx
10
NO
YES
NO
EN, EN
<1
NO
16
ISL32372E
4 Tx
0.46
YES
YES
NO
EN, EN
<1
NO
16
ISL32174E
4 Tx
32
NO
YES
NO
EN12, EN34
<1
NO
16
ISL32274E
4 Tx
10
NO
YES
NO
EN12, EN34
<1
NO
16
ISL32374E
4 Tx
0.46
YES
YES
NO
EN12, EN34
<1
NO
16
ISL32179E
4 Tx
32, 10, 0.46
SELECTABLE
YES
YES
INDIV. AND
GROUP
ENABLES
<1
YES
24
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Pinouts
ISL32174E, ISL32274E, ISL32374E
(16 LD N-SOIC, TSSOP)
TOP VIEWS
ISL32172E, ISL32272E, ISL32372E
(16 LD N-SOIC, TSSOP)
TOP VIEWS
16 VCC
DI1 1
15 DI4
Y1 2
14 Y4
Z1 3
EN 4
13 Z4
EN12 4
Z2 5
12 EN
Z2 5
DI1 1
Y1 2
Z1 3
D
D
D
16 VCC
15 DI4
D
D
14 Y4
13 Z4
12 EN34
D
11 Z3
11 Z3
Y2 6
DI2 7
10 Y3
DI2 7
10 Y3
GND 8
9 DI3
GND 8
9 DI3
Y2 6
D
D
Y1
DI1
SHDNEN
VCC
VL
DI4
ISL32179E
(24 LD QFN)
TOP VIEW
24
23
22
21
20
19
EN2
3
16 EN4
EN
4
15 EN3
Z2
5
14 EN
Y2
6
13 Z3
7
8
9
10
11
12
Y3
17 Z4
DI3
2
SPB
EN1
GND
18 Y4
SPA
1
DI2
Z1
Ordering Information
PART NUMBER
(Notes 1, 2)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL32172EFBZ
ISL32172 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32172EFVZ
32172 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32172EIBZ
ISL32172 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32172EIVZ
32172 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32174EFBZ
ISL32174 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32174EFVZ
32174 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32174EIBZ
ISL32174 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32174EIVZ
32174 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32179EFRZ
321 79EFRZ
-40 to +125
24 Ld QFN
L24.4x4C
ISL32179EIRZ
321 79EIRZ
-40 to +85
24 Ld QFN
L24.4x4C
ISL32272EFBZ
ISL32272 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32272EFVZ
32272 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32272EIBZ
ISL32272 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32272EIVZ
32272 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
2
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Ordering Information (Continued)
PART NUMBER
(Notes 1, 2)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL32274EFBZ
ISL32274 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32274EFVZ
32274 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32274EIBZ
ISL32274 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32274EIVZ
32274 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32372EFBZ
ISL32372 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32372EFVZ
32372 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32372EIBZ
ISL32372 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32372EIVZ
32372 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
ISL32374EFBZ
ISL32374 EFBZ
-40 to +125
16 Ld SOIC
M16.15
ISL32374EFVZ
32374 EFVZ
-40 to +125
16 Ld TSSOP
MDP0044
ISL32374EIBZ
ISL32374 EIBZ
-40 to +85
16 Ld SOIC
M16.15
ISL32374EIVZ
32374 EIVZ
-40 to +85
16 Ld TSSOP
MDP0044
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD020
Truth Tables
ISL32179E
INPUTS
ISL32172E, ISL32272E, ISL32372E
INPUTS
OUTPUTS
ENX EN EN DIX SPA SPB ZX YX
OUTPUTS
COMMENTS
EN
EN
DIX
ZX
YX
0
X
X
X
X
X
Z
Z Chan X outputs disabled
X
0
1/0
0/1
1/0
X
0
1
X
X
X
Z
Z All outputs disabled
1
X
0/1
1/0
0/1
1
X
0
1/0
1
1
0
1
X
Z
Z
1
1
X
0/1
1
1
1
X
0
1/0
0
1
1
1
X
0/1
0
1
1
X
0
1/0
X*
0
1
1
X
0/1
X*
0
NOTE: Z = Tri-state
ISL32174E, ISL32274E, ISL32374E
INPUTS
OUTPUTS
EN12 EN34 DIX
Z1
Y1
Z2
Y2
Z3
Y3
Z4
Y4
0
0
X
Z
Z
Z
Z
Z
Z
Z
Z
0
1
1/0
Z
Z
Z
Z
0/1
1/0
0/1
1/0
1
0
1/0
0/1
1/0
0/1
1/0
Z
Z
Z
Z
1
1
1/0
0/1
1/0
0/1
1/0
0/1
1/0
0/1
1/0
0/1 1/0 Individual ENX controls
chan X (32Mbps)
1/0 0/1
0/1 1/0 Individual ENX controls
chan X (10Mbps)
1/0 0/1
0/1 1/0 Individual ENX controls
chan X (460kbps)
1/0 0/1
NOTE: *Keep SPA = 1 for lowest current in SHDN. If using individual
channel enables, and the SHDN mode, connect EN and EN to VCC
for the lowest SHDN current. ISL32179E enters SHDN when
SHDNEN = 1 and all channels are disabled. Z = Tri-state.
NOTE: Z = Tri-state
3
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Pin Descriptions
PIN
FUNCTION
EN, EN
Group driver output enables, that are internally pulled high to VCC. All ISL32x72E driver outputs, Y and Z, are enabled by driving EN
high OR EN low, and the outputs are high impedance when EN is low AND EN is high (i.e., if using only the active high EN, connect
EN directly to VCC or VL; if using only the active low EN, connect EN directly to GND). On the ISL32179E accomplish group enable
by connecting all the ENX pins to VCC or VL, and then use the EN or EN pin as previously described. If the group driver enable
function isn’t required (see Note), connect EN to VCC, or connect EN to GND. (ISL32x72E and ISL32179E only)
EN12,
EN34
Paired driver output enables, that are internally pulled high to VCC. Driving EN12 (EN34) high enables Channel 1 and 2 (3 and 4)
outputs (Y and Z). Driving EN12 (EN34) low disables Channel 1 and 2 (3 and 4) outputs. If the driver enable function isn’t required
(see Note), connect EN12 and EN34 to VCC. (ISL32x74E only)
ENx
Individual driver output enables that are internally pulled high to VCC. Forcing ENx high (along with EN high OR EN low) enables the
channel X outputs (Y and Z). Driving ENX low disables the Channel X outputs, regardless of the states of EN and EN. Connect both
EN and EN to VCC for the lowest SHDN current if utilizing SHDN mode (see SHDNEN below). If the individual driver enable function
isn’t required (see Note), connect ENX to VCC. (ISL32179E only)
SHDNEN
Low power SHDN mode enable. A high level allows the ISL32179E to enter a low power mode when all channels are disabled. A low
level prevents the device from entering the low power mode. (ISL32179E only)
DIx
Driver input. A low on DI forces the corresponding channel’s output Y low and output Z high. Similarly, a high on DI forces output Y
high and output Z low.
SPA, SPB
GND
Speed select inputs that are internally pulled-high. See ISL32179E Truth Table on page 3. (ISL32179E only)
Ground connection. This is also the potential of the QFN thermal pad.
Yx
±16.5kV IEC61000-4-2 ESD Protected RS-422 level, noninverting transmitter output.
Zx
±16.5kV IEC61000-4-2 ESD Protected RS-422 level, inverting transmitter output.
VCC
VL
System power supply input (3.0V to 5.5V). On devices with a VL pin, power-up VCC first.
Logic power supply input. Connecting the VL pin to the lower voltage power supply of a logic device (e.g., UART or µcontroller)
interfacing with the ISL32179E tailors its logic pin (DI, EN (all varieties), SHDNEN, and SP) VIL/VIH levels to values compatible with
the lower supply voltage. Power-up this supply after VCC, and keep VL ≤ VCC. (ISL32179E only)
NOTE: Unused EN pins of any type should not be left floating, even though they have internal pull-ups.
4
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Typical Operating Circuits (1 of 4 Channels Shown)
NETWORK USING GROUP ENABLES
+3.3V TO 5V
+3.3V TO 5V
+
16
VCC
0.1µF
0.1µF
+
16
VCC
ISL32x73E
3 RO
ISL32x72E
R
A
2
B
1
RT
2
Y
3
Z
D
12 EN
DI 1
EN 4
EN 12
EN
GND
GND
4
8
8
NETWORK USING PAIRED ENABLES
+3.3V TO 5V
+3.3V TO 5V
+
16
VCC
0.1µF
0.1µF
+
16
VCC
ISL32x75E
A1 2
3 RO1
4
R
EN12 4
ISL32x74E
RT
B1 1
2
Y1
3
Z1
D
DI1 1
EN12
GND
GND
8
8
NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
1.8V
+3.3V TO 5V
+3.3V TO 5V
+
22
21
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
0.1µF
0.1µF
21
VCC
VL
9 SHDNEN
15 EN
4 EN
1 RO1
A1 24
RT
B1 23
2 EN1
GND
10
USING INDIVIDUAL CHANNEL ENABLES AND
CONFIGURED FOR LOWEST SHDN SUPPLY CURRENT
NOTE: POWER-UP VCC BEFORE VL
5
20
VL
SHDNEN 22
ISL32179E
EN 14
EN1-EN4 2,3,15,16
Y
DI 23
Z
D
EN 4
VCC
ISL32x77E
R
2.5V
+
24
1
VCC
LOGIC
DEVICE
µP, ASIC,
UART)
GND
9
USING ACTIVE HIGH GROUP ENABLE AND
CONFIGURED FOR LOWEST SHDN SUPPLY CURRENT
NOTE: POWER-UP VCC BEFORE VL
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Absolute Maximum Ratings
Thermal Information
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
VL to GND (ISL32179E Only) . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Input Voltages
DI, EN (all varieties) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Output Current
Y, Z (Per Output, Continuous, TJ ≤ 125°C) . . . . . . . . . . . . 100mA
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
16 Ld SOIC Package (Note 3) . . . . . . .
80
N/A
16 Ld TSSOP Package (Note 3) . . . . .
105
N/A
24 Ld QFN Package (Notes 4, 5). . . . .
42
5
Maximum Junction Temperature (Plastic Package) . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range
ISL32x7xEF . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
ISL32x7xEI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379 for details.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V and 4.5V to 5.5V; VL = VCC (ISL32179E only); Typicals are at VCC = 3.3V
or VCC = 5V, TA = +25°C; Unless Otherwise Specified.(Notes 6, 10)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 9)
TYP
Full
2.5
-
MAX
(Note 9) UNITS
DC CHARACTERISTICS
Differential VOUT
VOD
No Load
RL = 100Ω (RS-422)
(see Figure 1)
Single-Ended VOUT (Y or Z)
VO
VCC
VCC ≥ 3V
Full
2
2.6
-
V
VCC ≥ 4.5V
Full
3
4
-
V
IO = -20mA, VOH
Full
2.4
2.7
-
V
IO = 20mA, VOL
Full
-
0.2
0.4
V
ΔVOD
RL = 100Ω (see Figure 1)
Full
-
0.01
0.2
V
VOC
RL = 100Ω (see Figure 1)
Full
-
2.6
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
RL = 100Ω (see Figure 1)
Full
-
0.01
0.2
V
Input High Voltage (Logic Pins,
Note 14)
VIH1
VL = VCC if ISL32179E
Full
2.2
-
-
V
VCC ≤ 5.5V, DI
Full
2.7
-
-
V
VCC ≤ 5.5V, ENs
Full
2.4
-
-
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
VIH2
VIH2E
Input Low Voltage (Logic Pins,
Note 14)
6
VCC ≤ 3.6V
VIH3
2.7V ≤ VL < 3.0V (ISL32179E Only)
Full
2
-
-
V
VIH4
2.3V ≤ VL < 2.7V (ISL32179E Only)
Full
1.6
-
-
V
VIH5
1.6V ≤ VL < 2.3V (ISL32179E Only)
Full
0.72*VL
-
-
V
VIH6
1.5V ≤ VL < 1.6V (ISL32179E Only)
25
-
0.45*VL
-
V
VIL1
VL = VCC if ISL32179E
Full
-
-
0.8
V
VIL2
VL ≥ 2.7V (ISL32179E Only)
Full
-
-
0.6
V
VIL3
2.3V ≤ VL < 2.7V (ISL32179E Only)
Full
-
-
0.6
V
VIL4
1.6V ≤ VL < 2.3V (ISL32179E Only)
Full
-
-
0.22*VL
V
VIL5
1.5V ≤ VL < 1.6V (ISL32179E Only)
25
-
0.25*VL
-
V
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V and 4.5V to 5.5V; VL = VCC (ISL32179E only); Typicals are at VCC = 3.3V
or VCC = 5V, TA = +25°C; Unless Otherwise Specified.(Notes 6, 10) (Continued)
PARAMETER
SYMBOL
Logic Input Current
Output Leakage Current (Y, Z)
Thermal Shutdown Threshold
TEMP
(°C)
MIN
(Note 9)
TYP
MAX
(Note 9) UNITS
-
1
µA
IIN1
DIX = 0V or VCC
Full
-1
IIN2
SP, EN, EN, ENX, SHDNEN = 0V or VCC
Full
-15
9
15
µA
IIN3
EN12, EN34 = 0V or VCC
Full
-30
18
30
µA
IOZ
EN = 0, VCC = 0V to 5.5V, -0.25 ≤ VO ≤ 6V
Full
-10
-
10
µA
EN = 0, VCC = 3V to 5.5V, VO = 0V to VCC
25
-8
-
8
nA
IOSD1
Driver Short-Circuit Current,
VO = High or Low
TEST CONDITIONS
(Note 16)
-30
-
30
nA
EN = 1, VY or VZ = 0V (Note 7)
Full
-
-
±150
mA
EN = 1, VY or VZ = VCC (Note 7)
Full
-
-
±200
mA
Full
-
160
-
°C
DI = 0V or VCC, EN = 1
Full
-
0.6
0.8
mA
DI = 0V or VCC, All outputs disabled
(Note 15), SHDNEN = 1 (ISL32179E only)
Full
-
60
90
µA
IEC61000-4-2, From
Bus Pins to GND
Air Gap
25
-
±16.5
-
kV
Contact
TSD
SUPPLY CURRENT
No-Load Supply Current
ICC
Shutdown Supply Current
ISHDN
ESD PERFORMANCE
RS-422 Pins (Y, Z)
25
-
±9
-
kV
Human Body Model, From Bus Pins to GND
25
-
±15
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
±12
-
kV
Machine Model
25
-
700
-
V
VOD = ±1.5V, CD = 820pF (see Figure 4)
Full
460
4000
-
kbps
tPLH, tPHL RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
90
300
ns
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
55
150
ns
All Pins
DRIVER SWITCHING CHARACTERISTICS (ISL32372E, ISL32374E, ISL32179E, 460kbps)
Maximum Data Rate
fMAX
Driver Single-Ended Output Delay
Driver Single-Ended Output Skew
tSSK
Ch-to-Ch Output Delay Skew
tSKCC
(Figure 2, Note 11)
Full
-
60
200
ns
Part-to-Part Output Delay Skew
tSKPP
(Figure 2, Note 8)
Full
-
-
300
ns
Driver Differential Output Skew
tDSK
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
2
60
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
60
100
220
ns
Driver Enable to Output High
tZH
SW = GND (see Figure 3, Note 12)
Full
-
-
200
ns
Driver Enable to Output Low
tZL
SW = VCC (see Figure 3, Note 12)
Full
-
-
200
ns
Driver Disable from Output High
tHZ
SW = GND (see Figure 3)
Full
-
-
100
ns
Driver Disable from Output Low
tLZ
SW = VCC (see Figure 3)
Full
-
-
100
ns
Driver Enable from SHDN to High
tSDH
ISL32179E Only, SW = GND
(see Figure 3, Note 13)
Full
-
-
750
ns
Driver Enable from SHDN to Low
tSDL
ISL32179E Only, SW = VCC
(see Figure 3, Note 13)
Full
-
-
750
ns
VOD = ±1.5V, CD = 400pF (see Figure 4)
Full
10
20
-
Mbps
tPLH, tPHL RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
13
25
ns
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
2
9
ns
DRIVER SWITCHING CHARACTERISTICS (ISL32272E, ISL32274E, ISL32179E, 10Mbps)
Maximum Data Rate
fMAX
Driver Single-Ended Output Delay
Driver Single-Ended Output Skew
tSSK
Ch-to-Ch Output Delay Skew
tSKCC
(Figure 2, Note 11)
Full
-
6
12
ns
Part-to-Part Output Delay Skew
tSKPP
(Figure 2, Note 8)
Full
-
-
20
ns
Driver Differential Output Skew
tDSK
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
2
6
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
7
11
20
ns
Driver Enable to Output High
tZH
SW = GND (see Figure 3, Note 12)
Full
-
-
20
ns
Driver Enable to Output Low
tZL
SW = VCC (see Figure 3, Note 12)
Full
-
-
20
ns
7
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V and 4.5V to 5.5V; VL = VCC (ISL32179E only); Typicals are at VCC = 3.3V
or VCC = 5V, TA = +25°C; Unless Otherwise Specified.(Notes 6, 10) (Continued)
PARAMETER
SYMBOL
Driver Disable from Output High
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 9)
TYP
tHZ
SW = GND (see Figure 3)
Full
-
-
tLZ
MAX
(Note 9) UNITS
20
ns
SW = VCC (see Figure 3)
Full
-
-
20
ns
Driver Enable from SHDN to High
tSDH
ISL32179E Only, SW = GND (see Figure 3,
Note 13)
Full
-
-
750
ns
Driver Enable from SHDN to Low
tSDL
ISL32179E Only, SW = VCC (see Figure 3,
Note 13)
Full
-
-
750
ns
Driver Disable from Output Low
DRIVER SWITCHING CHARACTERISTICS (ISL32172E, ISL32174E, ISL32179E, 32Mbps)
Maximum Data Rate
fMAX
Driver Single-Ended Output Delay
VOD = ±1.5V, CD = 100pF (see Figure 4)
Full
32
50
-
Mbps
tPLH, tPHL RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
3
8
15
ns
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
1
3.5
ns
Ch-to-Ch Output Delay Skew
tSKCC
(Figure 2, Note 11)
Full
-
3
5.5
ns
Part-to-Part Output Delay Skew
tSKPP
(Figure 2, Note 8)
Full
-
-
8
ns
Driver Differential Output Skew
tDSK
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
0.5
2
ns
Driver Differential Rise or Fall Time
tR, tF
Driver Single-Ended Output Skew
tSSK
RDIFF = 100Ω, CD = 50pF (see Figure 2)
Full
-
7
12
ns
tZH
SW = GND (see Figure 3, Note 12)
Full
-
-
20
ns
Driver Enable to Output Low
tZL
SW = VCC (see Figure 3, Note 12)
Full
-
-
20
ns
Driver Disable from Output High
tHZ
SW = GND (see Figure 3)
Full
-
-
20
ns
tLZ
Driver Enable to Output High
SW = VCC (see Figure 3)
Full
-
-
20
ns
Driver Enable from SHDN to High
tSDH
ISL32179E Only, SW = GND (see Figure 3,
Note 13)
Full
-
-
750
ns
Driver Enable from SHDN to Low
tSDL
ISL32179E Only, SW = VCC (see Figure 3,
Note 13)
Full
-
-
750
ns
Driver Disable from Output Low
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
7. Applies to peak current. See “Typical Performance Curves” beginning on page 12 for more information.
8. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
temperature, etc.).
9. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
10. EN = 0 indicates that the output(s) under test are disabled via the appropriate logic pin settings. EN = 1 indicates that the logic pins are set to
enable the output(s) under test.
11. Channel-to-channel skew is the magnitude of the worst case delta between any two propagation delays of any two outputs on the same IC, at
the same test conditions.
12. For ISL32179E, keep SHDNEN low to avoid entering SHDN.
13. Keep SHDNEN high to enter SHDN when all transmitters are disabled (ISL32179E only).
14. Logic Pins are the DIs, the enable variants, and SHDNEN.
15. Only one of the SPX pins low, plus EN1-EN4 low with EN and EN high, or EN low and EN high with EN1-EN4 high.
16. Temperature range is -20°C to +40°C.
8
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Test Circuits and Waveforms
RL/2
EN
VCC OR VL
Z
DI
VOD
D
Y
VOC
RL/2
FIGURE 1. DC DRIVER TEST CIRCUITS
DI
LOWER OF VCC OR VL
1.5V
1.5V
0V
tPHL
tPLH
VOH
OUT (Y)
VCC OR VL
50%
EN
tSSK
Z
DI
50%
tSSK
tPLH
tPHL
RDIFF
D
VOL
CD
VOH
50%
50%
OUT (Z)
Y
VOL
SIGNAL
GENERATOR
tDDLH
DIFF OUT (Y - Z)
tDDHL
90%
0V
10%
tR
-VOD
tF
tSSK = |tPLH(Y OR Z) - tPHL(Z OR Y)|
FIGURE 2A. TEST CIRCUIT
+VOD
90%
0V
10%
tDSK = |tDDLH - tDDHL|
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
EN
Z
DI
110Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
3V OR VL
EN
1.5V
1.5V
GND
0V
50pF
tZH
tSDH
tHZ
OUTPUT HIGH
VOH - 0.5V
PARAMETER
OUTPUT
DI
SW
tHZ
Y/Z
1/0
GND
tLZ
Y/Z
0/1
VCC
tZH (Note 12)
Y/Z
1/0
GND
tZL (Note 12)
Y/Z
0/1
VCC
tSDH (Note 13)
Y/Z
1/0
GND
tSDL (Note 13)
Y/Z
0/1
FIGURE 3A. TEST CIRCUIT
VOH
50%
OUT (Y, Z)
0V
tZL
tSDL
OUT (Y, Z)
tLZ
VCC
50%
OUTPUT LOW
VCC
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
9
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Test Circuits and Waveforms (Continued)
VCC OR VL
EN
+
Z
DI
100Ω
D
CD
Y
LOWER OF VCC OR VL
DI
0V
VOD
-
SIGNAL
GENERATOR
+VOD
DIFF OUT (Y - Z)
-VOD
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. DRIVER DATA RATE
Application Information
RS-422 is a differential (balanced) data transmission
standard for use in long haul or noisy environments. RS-422
is a point-to-multipoint (multidrop) standard, which allows
only one driver and up to 10 (assuming one unit load
devices) receivers on each bus.
Driver Features
These RS-422 drivers are differential output devices that
deliver at least 2V across a 100Ω load. The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
The 460kbps driver outputs are slew rate limited to minimize
EMI, and to reduce reflections in unterminated or improperly
terminated networks. Outputs of the 10Mbps and 32Mbps
drivers are not limited, so faster output transition times allow
the higher data rates.
Driver Enable Functions
All product types include functionality to allow disabling of
the Tx outputs. The ISL32x72E types feature group (all four
Tx) enable functions that are active high (EN) or active low
(EN). Drivers enable when EN = 1, or when EN = 0, and they
disable only when EN = 0 and EN = 1. ISL32x74E versions
use active high paired enable functions (EN12 and EN34)
that enable (when high) or disable (when low) the
corresponding pairs of Tx. All four of these enable pins have
internal pull-up resistors to VCC, but unused enable pins that
need to be high (e.g., EN when using the EN input for enable
control, or EN12 and EN34 when using always enabled
drivers) should always be connected externally to VCC. If
VCC transients might exceed 7V, then inserting a series
resistor between the input(s) and VCC limits the current that
will flow if the input’s ESD protection starts conducting.
The ISL32179E has the most flexible enable scheme. Its six
enable pins allow for group, paired, or individual channel
enable control. Figure 5 details the ISL32179E’s internal
enable logic. To utilize a group enable function, connect all
the ENx pins high, and handle the EN and EN pins as
described in the previous paragraph. For paired enables,
connect EN and EN high (for the lowest current in SHDN
mode, if SHDN is used) and tie EN1 and EN2 together, and
10
EN3 and EN4 together. For individual channel enables,
again connect EN and EN high, and drive the appropriate
ENX (active high) for the particular channel. All of the enable
pins incorporate pull-up resistors to VCC, but unused enable
pins of any type should be externally connected high, rather
than being left floating. Connecting to VCC is the best
choice, but VL may be utilized as long as SHDN power isn’t
a primary concern (for each VL connected input, ICC
increases by ((VCC - VL)/600kΩ). If VCC or VL transients
might exceed 7V, then inserting a series resistor between
the input(s) and the supply limits the current that will flow if
the input’s ESD protection starts conducting.
1 OF 4 CHANNELS
ENX
VCC
VCC
CHX EN
EN
EN
VCC
FIGURE 5. ISL32179E ENABLE LOGIC
Wide Supply Range
These ICs are designed to operate with a wide range of
supply voltages from 3.0V to 5.5V, and they meet the
RS-422 specifications for that full supply voltage range.
5.5V TOLERANT LOGIC PINS
Logic input pins (driver inputs, enables, SHDNEN) contain
no ESD nor parasitic diodes to VCC (nor to VL), so they
withstand input voltages exceeding 5.5V regardless of the
VCC and VL voltages. Input voltages up to 7V are easily
tolerated.
Logic Supply (VL Pin, ISL32179E Only)
Note: Power-up VCC before powering up the VL supply. If
unused enable pins are connected to VL rather than to VCC,
then a small ICC ((VCC - VL)/600kΩ) will flow due to the
internal pull-up resistor connecting to VCC.
The ISL32179E includes a VL pin that powers the logic
inputs (driver inputs, enables, SHDNEN). These pins
interface with “logic” devices such as UARTs, ASICs, and
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
µcontrollers, and today most of these devices use power
supplies significantly lower than 3.3V. Thus, the logic
device’s low VOH might not exceed the VIH of a 3.3V or 5V
powered DI or enable input. Connecting the VL pin to the
power supply of the logic device (as shown in Figure 6)
reduces the DI and enable input switching points to values
compatible with the logic device’s output levels. Tailoring the
logic pin input switching points to the supply voltage of the
UART, ASIC, or µcontroller eliminates the need for a level
shifter/translator between the two ICs.
VCC = +3.3V
VCC = +2V
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-422 control
lines (EN, EN, ENx) is unable to ensure that the RS-422 Tx
outputs remain disabled. If the equipment is connected to
the bus, a driver activating prematurely during power-up may
drive invalid data on the bus. To avoid this scenario, this
family incorporates a “Hot Plug” function. During power-up,
circuitry monitoring VCC ensures that the Tx outputs remain
disabled for a period of time, regardless of the state of the
enable pins. This gives the processor/ASIC a chance to
stabilize and drive the RS-422 control lines to the proper states.
ESD Protection
VIH ≥ 2
DI
EN
GND
TXD
VOH ≤ 2
VIH ≥ 2
DEN
VOH ≤ 2
ISL32172E
GND
UART/PROCESSOR
VCC = +3.3V
VCC = +2V
VL
DI
EN
GND
VIH = 0.85V
TXD
VOH ≤ 2
VIH = 0.85V
DEN
VOH ≤ 2
ISL32179E
All pins on these devices include class 3 (>12kV) Human
Body Model (HBM) ESD protection structures, but the
RS-422 pins (driver outputs) incorporate advanced
structures allowing them to survive ESD events in excess
of ±15kV HBM, and ±16.5kV to IEC61000-4-2. The RS-422
pins are particularly vulnerable to ESD damage because
they typically connect to an exposed port on the exterior of
the finished product. Simply touching the port pins, or
connecting a cable, can cause an ESD event that might
destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, and
without degrading the RS-422 common mode range of
-0.3V to +6V. This built-in ESD protection eliminates the
need for board level protection structures (e.g., transient
suppression diodes), and the associated, undesirable
capacitive load they present.
IEC61000-4-2 Testing
GND
UART/PROCESSOR
FIGURE 6. USING VL PIN TO ADJUST LOGIC LEVELS
VL can be anywhere from VCC down to 1.5V, and Table 2
indicates typical VIH and VIL values for various VL settings
so the user can ascertain whether or not a particular VL
voltage meets his needs.
TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-422 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The
IEC61000 standard’s lower current limiting resistor coupled
with the larger charge storage capacitor yields a test that is
much more severe than the HBM test. The extra ESD
protection built into this device’s RS-422 pins allows the
design of equipment meeting level 4 criteria without the need
for additional board level protection on the RS-422 port.
VL (V)
VIH (V)
VIL (V)
1.6
0.7
0.45
2
0.85
0.6
2.3
1.1
0.75
2.7
1.4 (DI), 1.1 (ENs)
0.85
2.7
2
0.8
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The RS-422 pins withstand ±16.5kV
air-gap discharges.
3.3
2.2
0.8
CONTACT DISCHARGE TEST METHOD
AIR-GAP DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
11
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±9kV. Devices in this family survive ±9kV contact
discharges on the RS-422 pins.
Data Rate, Cables, and Terminations
exceeds the RS-422 specification. A novel design sets the
short circuit current limit depending on the VCC value, so
unlike some competing devices, the VCC = 5V short circuit
current is only slightly higher than the corresponding
VCC = 3.3V level (see Figure 12).
RS-422 is intended for network lengths up to 4000’, but the
maximum system data rate decreases as the transmission
length increases. Devices operating at 32Mbps handle
lengths up to 328’ (100m) in 5V systems, and lengths up to
200’ (62m) in 3.3V systems (see Figures 31 and 32). The
460kbps versions can operate at full data rates with lengths
of thousands of feet. Note that system jitter requirements
may limit a network to shorter distances.
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about 20°. If the fault persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Twisted pair is the cable of choice for RS-422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in RS-422 ICs.
With TA = +125°C and VCC = 5.5V, four 100Ω differentially
terminated drivers in the TSSOP package put the IC at the
edge of its maximum allowed junction temperature. Using
larger termination resistors, a lower maximum supply
voltage, or one of the packages with a lower thermal
resistance (θJA) provides more safety margin. When
designing for +125°C operation, be sure to measure the
application’s switching current, and include this in the
thermal calculations.
Proper termination is imperative, when using the 10Mbps or
32Mbps devices, to minimize reflections. Short networks
using the 460kbps versions need not be terminated, but,
terminations are recommended unless power dissipation is
an overriding concern.
In point-to-point, or point-to-multipoint (multiple receivers on
bus) networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible.
Built-In Driver Overload Protection
High Temperature Operation
Low Power Shutdown Mode (ISL32179E Only)
These BiCMOS transmitters all use a fraction of the power
required by their bipolar counterparts, but the QFN version
includes a shutdown feature that reduces the already low
quiescent ICC by 90%. The ISL32179E enters shutdown
(SHDN) whenever the SHDNEN pin is high and all four
drivers are disabled (see “Pin Descriptions” on page 4). Note
that the enable times from SHDN are longer than the enable
times when the IC isn’t in SHDN.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
Typical Performance Curves
VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise Specified. VL notes apply to the ISL32179E
only.
4.3
+85°C
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
110
100
+25°C
90
80
+85°C
70
+25°C
60
+125°C
50
+125°C
40
30
20
VCC = 3.3V
10
VCC = 5V
0
0
0.5
1.0 1.5 2.0
2.5 3.0
3.5 4.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
4.5
5.0
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
12
RDIFF = 100Ω
4.1
VCC = 5V
3.9
3.7
3.5
3.3
3.1
2.9
VCC = 3.3V
2.7
2.5
-40
-25
-10
5
20 35 50 65
TEMPERATURE (°C)
80
95
110 125
FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Typical Performance Curves
+25°C
140
100
+125°C
+25°C
80 +85°C
VCC = 3.3V
RDIFF = ∞
+125°C
60
40
20
VOL
0
0
1.0
1.5
2.0
2.5
Y OR Z OUTPUT VOLTAGE (V)
+125°C
+25°C
+85°C
100
60
40
20
VOL
0
0
0.5
VOH
1.0
1.5 2.0 2.5 3.0 3.5
Y OR Z OUTPUT VOLTAGE (V)
150
4.5
5.0
VCC = 5V
EN = VCC
VCC = 3.3V
100
OUTPUT CURRENT (mA)
450
400
350
300
Y OR Z = LOW
50
0
-50
VCC = 3.3V
-100
250
VCC = 3.3V
200
-40
-25
VCC = 5V
-10
5
20 35 50
65
TEMPERATURE (°C)
80
95
110 125
-150
-0.5
0
Y OR Z = HIGH
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
OUTPUT VOLTAGE (V)
FIGURE 12. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 11. SUPPLY CURRENT vs TEMPERATURE
60
94
VL = 1.6V TO VCC
tSSK
92
VCC = 5V
50
90
40
SKEW (ns)
PROPAGATION DELAY (ns)
4.0
FIGURE 10. DRIVER SINGLE-ENDED (Y OR Z) OUTPUT
CURRENT vs OUTPUT VOLTAGE
500
VCC = 5V
VCC = 5V
RDIFF = ∞
+125°C
80
3.0 3.3
FIGURE 9. DRIVER SINGLE-ENDED (Y OR Z) OUTPUT
CURRENT vs OUTPUT VOLTAGE
ICC (µA)
120
VOH
0.5
+25°C
+85°C
+85°C
DRIVER OUTPUT CURRENT (mA)
DRIVER OUTPUT CURRENT (mA)
120
VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise Specified. VL notes apply to the ISL32179E
only. (Continued)
88
86
tDDLH
tSSK
VCC = 3.3V
30
VL = 1.6V TO VCC
20
84
tDDHL
10
82
tDSK
80
-40
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
125
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL32372E, ISL32374E,
ISL32179E, 460kbps OPTION)
13
0
-40
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
VCC = 3.3V OR 5V
80
95
110 125
FIGURE 14. DRIVER SKEW vs TEMPERATURE (ISL32372E,
ISL32374E, ISL32179E, 460kbps OPTION)
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Typical Performance Curves
VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise Specified. VL notes apply to the ISL32179E
only. (Continued)
20
3.0
VL = 1.6V to VCC
18
17
2.5
tDDLH
tSSK
VL = 1.6V, VCC = 3.3V OR 5V
16
SKEW (ns)
PROPAGATION DELAY (ns)
19
tDDHL
15
14
2.0
1.5
13
12
tDDLH
11
1.0
VL = VCC = 3.3V OR 5V
tDSK
tDDHL
10
-40
-25
-10
5
20 35 50
65
TEMPERATURE (°C)
80
95
0.5
-40
110 125
FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL32272E, ISL32274E,
ISL32179E, 10Mbps OPTION)
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110 125
FIGURE 16. DRIVER SKEW vs TEMPERATURE (ISL32272E,
ISL32274E, ISL32179E, 10Mbps OPTION)
1.2
16
15
1.0
13 tDDLH
12
SKEW (ns)
0.8
VL = 1.6V, VCC = 3.3V OR 5V
tDDHL
11
10
tDSK
8
tDDLH
tDDHL
-25
-10
5
20
35
50
65
TEMPERATURE (°C)
80
95
FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL32172E, ISL32174E,
ISL32179E, 32Mbps OPTION)
VH
DI
0
Z
1.5
Y
0
0
Y-Z
-1
-2
-3
TIME (40ns/DIV)
FIGURE 19. DRIVER WAVEFORMS, LOW TO HIGH
(ISL32372E, ISL32374E, ISL32179E)
14
5
20
35
50
65
TEMPERATURE (°C)
80
95
110 125
RDIFF = 100Ω, CD = 50pF
VH
DI
0
3.0
Y
1.5
Z
0
VH = VCC OR VL
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
2
-10
FIGURE 18. DRIVER SKEW vs TEMPERATURE (ISL32172E,
ISL32174E, ISL32179E, 32Mbps OPTION)
VH = VCC OR VL
3
-25
VCC = 3.3V, VL = 1.6V TO VCC
RDIFF = 100Ω, CD = 50pF
DRIVER INPUT (V)
DRIVER OUTPUT (V)
VCC = 3.3V, VL = 1.6V TO VCC
0
-40
110 125
DRIVER OUTPUT (V)
6
-40
VL ≥ 3V, VCC = 3.3V OR 5V
0.2
VL ≥ 3V, VCC = 3.3V OR 5V
7
1
VL = 1.6V to VCC, VCC = 3.3V OR 5V
tSSK
0.6
0.4
9
3.0
VL = 1.6V, VCC = 3.3V OR 5V
tDSK
DRIVER INPUT (V)
PROPAGATION DELAY (ns)
14
3
2
1
0
-1
-2
-3
Y-Z
TIME (40ns/DIV)
FIGURE 20. DRIVER WAVEFORMS, HIGH TO LOW
(ISL32372E, ISL32374E, ISL32179E)
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
VCC = 5V, VL = 1.6V TO VCC
DI
0
5.0
Z
2.5
Y
0
DRIVER INPUT (V)
VH
2
Y-Z
0
5.0
Y
2.5
Z
0
-2
-4
-5
5
4
2
0
Y-Z
-2
-4
-5
TIME (40ns/DIV)
TIME (40ns/DIV)
DI
0
3.0
Z
1.5
Y
0
DRIVER INPUT (V)
VH
DRIVER OUTPUT (V)
VCC = 3.3V, VL = 1.6V TO VCC
RDIFF = 100Ω, CD = 50pF
2
1
Y-Z
0
-1
-2
-3
VH
DI
0
3.0
Y
1.5
Z
0
3
2
1
0
Y-Z
-1
-2
-3
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 23. DRIVER WAVEFORMS, LOW TO HIGH
(ISL32272E, ISL32274E, ISL32179E)
FIGURE 24. DRIVER WAVEFORMS, HIGH TO LOW
(ISL32272E, ISL32274E, ISL32179E)
VH
DI
0
5.0
Z
2.5
Y
0
DRIVER OUTPUT (V)
VCC = 5V, VL = 1.6V TO VCC
RDIFF = 100Ω, CD = 50pF
DRIVER INPUT (V)
DRIVER OUTPUT (V)
VCC = 5V, VL = 1.6V TO VCC
RDIFF = 100Ω, CD = 50pF
VH = VCC OR VL
VH = VCC OR VL
3
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
VCC = 3.3V, VL = 1.6V TO VCC
FIGURE 22. DRIVER WAVEFORMS, HIGH TO LOW
(ISL32372E, ISL32374E, ISL32179E)
RDIFF = 100Ω, CD = 50pF
VH
DI
0
5.0
Y
2.5
Z
0
VH = VCC OR VL
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
VH = VCC OR VL
5
4
2
Y-Z
0
-2
-4
-5
TIME (10ns/DIV)
FIGURE 25. DRIVER WAVEFORMS, LOW TO HIGH
(ISL32272E, ISL32274E, ISL32179E)
15
DRIVER INPUT (V)
FIGURE 21. DRIVER WAVEFORMS, LOW TO HIGH
(ISL32372E, ISL32374E, ISL32179E)
DRIVER INPUT (V)
0
VH
DI
VH = VCC OR VL
VH = VCC OR VL
5
4
RDIFF = 100Ω, CD = 50pF
DRIVER INPUT (V)
RDIFF = 100Ω, CD = 50pF
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
VCC = 5V, VL = 1.6V TO VCC
VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise Specified. VL notes apply to the ISL32179E
only. (Continued)
DRIVER OUTPUT (V)
Typical Performance Curves
5
4
2
0
Y-Z
-2
-4
-5
TIME (10ns/DIV)
FIGURE 26. DRIVER WAVEFORMS, HIGH TO LOW
(ISL32272E, ISL32274E, ISL32179E)
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
VH
DI
0
Z
1.5
Y
0
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
2
Y-Z
0
-1
-2
-3
0
3.0
Y
1.5
Z
0
3
2
1
0
Y-Z
-1
-2
-3
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 28. DRIVER WAVEFORMS, HIGH TO LOW
(ISL32172E, ISL32174E, ISL32179E)
DI
0
5.0
Z
2.5
Y
0
VCC = 5V, VL = 1.6V TO VCC
RDIFF = 100Ω, CD = 50pF
VH
DI
0
5.0
Y
2.5
Z
0
VH = VCC OR VL
5
4
2
DRIVER INPUT (V)
VH
DRIVER OUTPUT (V)
RDIFF = 100Ω, CD = 50pF
VH = VCC OR VL
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
FIGURE 27. DRIVER WAVEFORMS, LOW TO HIGH
(ISL32172E, ISL32174E, ISL32179E)
VCC = 5V, VL = 1.6V TO VCC
VH
DI
VH = VCC OR VL
VH = VCC OR VL
3
1
RDIFF = 100Ω, CD = 50pF
Y-Z
0
-2
-4
-5
TIME (10ns/DIV)
FIGURE 29. DRIVER WAVEFORMS, LOW TO HIGH
(ISL32172E, ISL32174E, ISL32179E)
16
DRIVER INPUT (V)
3.0
VCC = 3.3V, VL = 1.6V TO VCC
DRIVER INPUT (V)
RDIFF = 100Ω, CD = 50pF
DRIVER INPUT (V)
DRIVER OUTPUT (V)
VCC = 3.3V, VL = 1.6V TO VCC
VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise Specified. VL notes apply to the ISL32179E
only. (Continued)
DRIVER OUTPUT (V)
Typical Performance Curves
5
4
2
0
Y-Z
-2
-4
-5
TIME (10ns/DIV)
FIGURE 30. DRIVER WAVEFORMS, HIGH TO LOW
(ISL32172E, ISL32174E, ISL32179E)
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
3
DI
DRIVER OUTPUT (V) DRIVER OUTPUT (V)
0
DRIVER + CABLE DELAY
(~288ns)
3.0
1.5
Y-Z
0
-1.5
-3.0
3.0
+85°C
1.5
Y-Z
0
-1.5
+125°C
-3.0
TIME (80ns/DIV)
FIGURE 31. WORST CASE (NEGATIVE) FIVE PULSE DRIVER
WAVEFORMS DRIVING 200 FEET (62m) OF CAT5
CABLE (SINGLE TERMINATED WITH 121Ω)
(ISL32172E, ISL32174E, ISL32179E)
32Mbps
VCC = VL = 4.5V
5
DI
0
DRIVER OUTPUT (V) DRIVER OUTPUT (V)
32Mbps
VCC = VL = 3V
DRIVER + CABLE DELAY
4.5
3.0
1.5
0
-1.5
-3.0
-4.5
4.5
3.0
1.5
0
-1.5
-3.0
-4.5
(~472ns)
DRIVER INPUT (V)
VCC = VL = 3.3V or 5V, TA = +25°C; Unless Otherwise Specified. VL notes apply to the ISL32179E
only. (Continued)
DRIVER INPUT (V)
Typical Performance Curves
Y-Z
+85°C
Y-Z
+125°C
TIME (80ns/DIV)
FIGURE 32. WORST CASE (NEGATIVE) FIVE PULSE DRIVER
WAVEFORMS DRIVING 328 FEET (100m) OF
CAT5 CABLE (SINGLE TERMINATED WITH 121Ω)
(ISL32172E, ISL32174E, ISL32179E)
Die Characteristics
SUBSTRATE AND QFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
TRANSISTOR COUNT:
1682
PROCESS:
Si Gate BiCMOS
17
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
α
B S
0.050 BSC
-
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
α
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
1.27 BSC
H
N
NOTES:
MILLIMETERS
16
0°
16
8°
0°
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
18
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Package Outline Drawing
L24.4x4C
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 10/06
4X 2.5
4.00
A
20X 0.50
B
PIN 1
INDEX AREA
PIN #1 CORNER
(C 0 . 25)
24
19
1
4.00
18
2 . 50 ± 0 . 15
13
0.15
(4X)
12
7
0.10 M C A B
0 . 07
24X 0 . 23 +- 0
. 05 4
24X 0 . 4 ± 0 . 1
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
C
0 . 90 ± 0 . 1
BASE PLANE
( 3 . 8 TYP )
SEATING PLANE
0.08 C
SIDE VIEW
(
2 . 50 )
( 20X 0 . 5 )
C
0 . 2 REF
5
( 24X 0 . 25 )
0 . 00 MIN.
0 . 05 MAX.
( 24X 0 . 6 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
19
FN6824.0
December 16, 2008
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Thin Shrink Small Outline Package Family (TSSOP)
MDP0044
0.25 M C A B
D
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
A
(N/2)+1
N
MILLIMETERS
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
PIN #1 I.D.
E
E1
1
(N/2)
B
0.20 C B A
2X
N/2 LEAD TIPS
TOP VIEW
0.05
e
C
SEATING
PLANE
H
A
1.20
1.20
1.20
1.20
1.20
Max
A1
0.10
0.10
0.10
0.10
0.10
±0.05
A2
0.90
0.90
0.90
0.90
0.90
±0.05
b
0.25
0.25
0.25
0.25
0.25
+0.05/-0.06
c
0.15
0.15
0.15
0.15
0.15
+0.05/-0.06
D
5.00
5.00
6.50
7.80
9.70
±0.10
E
6.40
6.40
6.40
6.40
6.40
Basic
E1
4.40
4.40
4.40
4.40
4.40
±0.10
e
0.65
0.65
0.65
0.65
0.65
Basic
L
0.60
0.60
0.60
0.60
0.60
±0.15
L1
1.00
1.00
1.00
1.00
1.00
Reference
Rev. F 2/07
0.10 M C A B
b
0.10 C
N LEADS
SIDE VIEW
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
SEE DETAIL “X”
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
END VIEW
L1
A
A2
GAUGE
PLANE
0.25
L
A1
0° - 8°
DETAIL X
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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20
FN6824.0
December 16, 2008