5051 Kompakter SMT-Board-to-Board Verbinder - RM 0,50mm Compact SMT-Board to Board Connector - 0,50mm Pitch Series Type * 5051 1 1 Stift; H=2.40mm Male; H=2.40mm 2 Stift; H=2,90mm Male; H=2,90mm 3 Stift; H=3,90mm Male; H=´3,90mm 4 Stift; H=4,40mm Male, H=4,40mm TEL +49 5223 98507-0 FAX +49 5223 98507-50 Contacts * 040 10-50 60 80 90 100 120 © W+P PRODUCTS Technische Daten /Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial Phosphorbronze Contact Material Phosphor bronze Kontaktoberfläche Gold über Nickel Contact Surface Gold over nickel Lötbarkeit IEC512-12A Solderability IEC512-12A Durchgangswiderstand < 50mΩ Contact Resistance < 50mΩ Isolationswiderstand > 100MΩ Insulation Resistance > 100MΩ Spannungsfestigkeit 100VDC Test Voltage 100VDC Nennspannung 50V AC/DC Voltage Rating 50V AC/DC Nennstrom 0,5A Current Rating 0,5A Temperaturbereich -20°C ... +125°C Temperature Range -20°C ... +125°C Verarbeitung Reflow-Lötverfahren; weitere Informationen in Kapitel T Processing Reflow soldering, detailed information in ch. T Plating 00 00 Vergoldet Gold plated Packing * PPTR PPST PPTR E-MAIL [email protected] WEBSITE www.wppro.com 1 5051 Kompakter SMT-Board-to-Board Verbinder - RM 0,50mm Compact SMT-Board to Board Connector - 0,50mm Pitch Series 5051 Type * 5 5 Buchse; H=2,20mm Female; H=2,20mm 6 Buchse; H=2,70mm Female, H=2,70mm 7 Buchse; H=3,20mm Female; H=3,20mm 8 Buchse; H=3,00mm Female, H=3,00mm 9 Buchse; H=3,50mm Female, H=3,50mm * Dies ist ein Bestellbeispiel bitte durch Ihre Spezifikationen ersetzen. * This is an order example please replace by your specifications. TEL +49 5223 98507-0 FAX +49 5223 98507-50 2 Contacts * 040 Plating Packaging * 00 PPTR 10-50 60 80 90 100 00 Vergoldet 120 Gold plated PPST In Stangen mit PP-Pad In tubes w/ PP-Pad PPTR Tape & Reel Verpackung mit PP-Pad Tape & Reel packing w/ PP-Pad Lieferformen / Packing Options: PPST In Stangen mit PP-Pad / In tubes w/ PP-Pad PPTR Tape & Reel Verpackung mit PP-Pad / Tape & Reel packing w/ PP-Pad E-MAIL [email protected] WEBSITE www.wppro.com Informationen zum Reflow-Lötverfahren Reflow-Soldering Information Reflow-Lötempfehlung Reflow Soldering Recommendation Die Bauteile sollten gemäß folgendem TemperaturProfil in Anlehnung an die IPC/JEDEC J_STD-020C für bleifreies Löten im Reflow-Verfahren verarbeitet werden (Maximalwerte). Items should be solderes according to IPC/JEDEC J-STD-020C temperature profile for leadfree reflow soldering (maximum values). TEL +49 5223 98507-0 FAX +49 5223 98507-50 Profileigenschaft Kennwert Temperatur Minimum TSmin 150°C Temperatur Maximum TSmax 200°C Dauer TSmin - TSmax 60-180s Temperatur Lötbereich TL 217°C Verweildauer oberhalb TL 60-180s Ramp-Up Rate TSmax - TP max. 3°C / s Höchsttemperatur TP 260°C ±5 Dauer Höchsttemperatur 20-40s Ramp-Down Rate TPmax - TSmin 6°C Dauer 25°C - Höchsttemperatur TP Max. 8 min Profile Feature Key Values Minimum Temperature TSmin 150°C Maximum Temperatur TSmax 200°C Duration TSmin - TSmax 60-180s Soldering Range Temperature TL 217°C Duration above TL 60-180s Ramp-Up Rate TSmax - TP max. 3°C / s Peak Temperature TP 260°C ±5 Duration Peak Temperature 20-40s Ramp-Down Rate TPmax - TSmin 6°C Duration 25°C - Peak Temp. TP Max. 8 min E-MAIL [email protected] WEBSITE www.wppro.com 3