5081 SMT Board-to-Board Verbinder RM 0,80mm SMT Board-to-Board Connectors, 0.80mm Pitch Technische Daten / Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Farbe Weiss Colour White Kontaktmaterial Kupferlegierung Contact Material Copper alloy Kontaktoberfläche Lt. Oberflächenoptionen, über Ni Contact Surface Acc. to options (see below), over Ni Lötbarkeit IEC 60512-12A Solderability IEC 60512-12A Durchgangswiderstand < 20mΩ Contact Resistance < 20mΩ Isolationswiderstand > 1000MΩ Insulation Resistance > 1000MΩ Spannungsfestigkeit 300VAC/DC Test Voltage 300VAC/DC Nennstrom 500 mA Current Rating 500 mA Temperaturbereich -40°C ... +105°C Temperature Range -40°C ... +105°C Verarbeitung Reflow-Lötverfahren Processing Reflow soldering Series 5081 Stiftleiste Plug wppro.com/serie-XXX wppro.com/series-XXX Type * 01 01 L=2.80 L1=1.80 L2=1.35mm 02 L=3.30 L1=1.80 L2=1.35mm 03 L=3.80 L1=1.80 L2=1.35mm 04 L=4.30 L1=2.30 L2=1.35mm 05 L=4.80 L1=2.30 L2=1.35mm 06 L=5.30 L1=2.30 L2=1.35mm 07 L=5.30 L1=2.30 L2=1.25mm Contacts * 40 08-50 © W+P PRODUCTS Plating * 00 00 Vergoldet Gold plated Packaging * ST ST TR (Option) TEL +49 5223 98507-0 E-MAIL [email protected] 5081 SMT Board-to-Board Verbinder RM 0,80mm SMT Board-to-Board Connectors, 0.80mm Pitch Mating Heights: Series 5081 Buchsenleiste Female Headers * Dies ist ein Bestellbeispiel bitte durch Ihre Spezifikationen ersetzen. * This is an order example please replace by your specifications. wppro.com/serie-XXX wppro.com/series-XXX Type * 08 08 L=2.90 L1=1.65mm 09 L=3.40 L1=1.65mm 10 L=3.90 L1=1.65mm 11 L=3.90 L1=1.25mm Contacts * 40 08-50 Female Male Type 08 Type 09 Type 10 Type 11 Type 01 4.00mm - - - Type 02 4.50mm - - - Type 03 5.00mm - - - Type 04 - 5.50mm - - Type 05 - 6.00mm - - Type 06 - 6.50mm 7.00mm - Type 07 - - - 7.00mm Plating 00 00 Vergoldet Gold plated Packing * ST ST TR (Option) Lieferformen / Packaging Options: ST In Stangen ohne Pick&Place-Pads / In tubes w/o Pick&Place-Pads TR (Option) Tape & Reel / Tape & Reel TEL +49 5223 98507-0 E-MAIL [email protected] Informationen zum Reflow-Lötverfahren Reflow Soldering Information Reflow-Lötempfehlung Reflow Soldering Recommendation Die Bauteile sollten gemäß folgendem TemperaturProfil in Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies Löten im Reflow-Verfahren verarbeitet werden (Maximalwerte). Items should be soldered according to IPC/JEDEC JSTD-020C temperature profile for leadfree reflow soldering (maximum values). wppro.com/serie-XXX wppro.com/series-XXX Profileigenschaft Kennwert Temperatur Minimum TSmin 150°C Temperatur Maximum TSmax 200°C Dauer TSmin - TSmax 60-180s Temperatur Lötbereich TL 217°C Verweildauer oberhalb TL 60-180s Ramp-Up Rate TSmax - TP max. 3°C / s Höchsttemperatur TP 260°C ±5 Dauer Höchsttemperatur 20-40s Ramp-Down Rate TPmax - TSmin 6°C / s Dauer 25°C - Höchsttemperatur TP Max. 8 min Profile Feature Key Values Minimum Temperature TSmin 150°C Maximum Temperatur TSmax 200°C Duration TSmin - TSmax 60-180s Soldering Range Temperature TL 217°C Duration above TL 60-180s Ramp-Up Rate TSmax - TP max. 3°C / s Peak Temperature TP 260°C ±5 Duration Peak Temperature 20-40s Ramp-Down Rate TPmax - TSmin 6°C / s Duration 25°C - Peak Temp. TP Max. 8min TEL +49 5223 98507-0 E-MAIL [email protected]