Light Touch Switches/EVPAD 10 mm Square Center Space Long Travel SMD Light Touch Switches Type: EVPAD ■ Features ● The open center space allows for flexibility in choosing a LED Up to a 4.2-mm diameter chip LED can be mounted. ● Provides an excellent operational feel. • Crisp tactile feedback • Long stroke (1 mm) ● Supports auto reflow soldering. ■ Recommended Applications ● Control switches for automotive electronic equipment, such as car audio systems and heater control panels ■ Explanation of Part Numbers 1 2 3 4 5 E V P A D Product Code 6 7 Type 8 9 Height 6th K Terminal 6 Terminals ■ Specifications Type Snap action/Push-on type SPST Rating Contact Resistance Electrical Insulation Resistance Dielectric Withstanding Voltage Bouncing Operating Force 10 µA 2 Vdc to 50 mA 12 Vdc (Resistive load) 100 m액 max. 100 M액 min. (at 100 Vdc) 250 Vac for 1 minute 10 ms max. (ON, OFF) 4.0 N±0.8 N Mechanical Travel Endurance Operating Life Operating Temperature Storage Temperature Minimum Quantity/Packing Unit Quantity/Carton 1.0 mm±0.15 mm 100000 cycles min. –40 °C to +85 °C –40 °C to +85 °C (Bulk) –20 °C to +60 °C (Taping) 1000 pcs. Embossed Taping (Reel Pack) 5000 pcs. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2012 Light Touch Switches/EVPAD ■ Dimensions in mm (not to scale) (Embossed Taping) LED implementation position 9.8 .2 φ4 .5 φ4 0.8 3.2 B1 B2 A2 A4 0.8 0.8 10.15 9.8 0.8 φ7 A3 A1 0.5 max. (Plastic projection) EVPADK04K +0 10.35–0.4 A1,A2,A3,A4 11.3±0.1 8.4±0.1 A1 A3 B1 1.2±0.1 3.2±0.1 1.2±0.1 1.2±0.1 0.7 4.7 3.2+0.2 –0.1 LED implementation area B2 A2 A4 B1,B2 Circuit Diagram PWB land pattern for reference (Precautions for pattern design) ✽ Note that the terminals are exposed at the sections shaded with " " ✽ Establish electrical connection at A1, A2, A3, and A4 to improve the contact performance. ■ Recommended Reflow Soldering Conditions Fan or Normal Temp. Chip pocket P2 P0 E 230 180 Tape width=16.0 mm t1 Feeding hole φD0 F W A B Operation Top (°C) MAX. 260 ● Embossed Carrier Taping 150 t2 1 Chip component P1 Tape running direction The delivered carrier tape shape is either 1 or 2. (Normal Temp.) 90 to 30 Dimension t3 only applies to shape 2. 40 to 10 t2 t3 Soldering Time (s) 2 Unit: mm Part No. Height EVPAD 4.6 A B W F 10.7±0.2 10.7±0.2 16.0±0.3 E P1 7.5±0.1 1.75±0.10 12.0±0.1 P2 P0 D0 Dia 2.0±0.1 4.0±0.1 _0 1.5+0.1 t1 t2 t3 0.40±0.05 4.8±0.2 5.8±2.0 ● Standard Reel Dimensions in mm (not to scale) T E Item C B D r A A B Rate (mm) φ380.0±2.0 φ80.0±1.0 W C D E φ13.0±0.5 φ21.0±1.0 2.0±0.5 Item W T t r Rate (mm) 17.5±0.5 21.5±1.0 — — t Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2012