LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M08 144-pin plastic LQFP (FPT-144P-M08) 144-pin plastic LQFP (FPT-144P-M08) 0.50 mm Package width × package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 1.20g Code (Reference) P-LFQFP144-20×20-0.50 Note 1) *:Values do not include resin protrusion. Resin protrusion is +0.25(.010)Max(each side). Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 22.00±0.20(.866±.008)SQ * 20.00±0.10(.787±.004)SQ 108 Lead pitch 0.145±0.055 (.006±.002) 73 109 72 0.08(.003) Details of "A" part +0.20 1.50 –0.10 +.008 .059 –.004 0˚~8˚ INDEX 144 37 "A" LEAD No. 1 36 0.50(.020) C 2003 FUJITSU LIMITED F144019S-c-4-6 0.22±0.05 (.009±.002) 0.08(.003) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) (Mounting height) 0.10±0.10 (.004±.004) (Stand off) 0.25(.010) M Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0212