LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M06 208-pin plastic LQFP (FPT-208P-M06) 208-pin plastic LQFP (FPT-208P-M06) Lead pitch 0.50 mm Package width × package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 2.55g Code (Reference) P-LFQFP208-28×28-0.50 Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 30.00±0.20(1.181±.008)SQ * 28.00±0.10(1.102±.004)SQ 156 0.145±0.055 (.006±.002) 105 157 104 0.08(.003) Details of "A" part +0.20 1.50 –0.10 +.008 .059 –.004 INDEX 0˚~8˚ 208 LEAD No. 53 1 52 0.50(.020) C 2003 FUJITSU LIMITED F208027S-c-3-3 0.22±0.05 (.009±.002) 0.08(.003) (Mounting height) 0.10±0.05 (.004±.002) (Stand off) "A" 0.60±0.15 (.024±.006) 0.25(.010) M Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0212