LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LWK2043/A-B02 DATA SHEET DOC. NO : QW0905-LWK2043/A-B02 REV. : A DATE : 11 -Mar. - 2016 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK2043/A-B02 Page 1/8 Package Dimensions 3.0 4.2 4.0 5.2 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LWK2043/A-B02 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT WK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Ir 50 μA Electrostatic Discharge( * ) ESD 500 V Operating Temperature Topr -20~ +80 ℃ Storage Temperature Tstg -30~ +100 ℃ Reverse Current @5V Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO LWK2043/A-B02 MATERIAL In/GaN Emitted Lens White Water Clear Chromaticity Coordinates (Typ.) X 0.28 Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Y Typ. Max. Min. Typ. 0.28 3.5 4.0 3400 6200 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Viewing angle 2θ 1/2 (deg) 30 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK2043/A-B02 Page 3/8 Brightness Code For Standard LED Lamps WK CHIP Luminous Intensity(mcd) at 20mA Group Min. Max. A27 3400 4000 A28 4000 5000 A29 5000 6200 A30 6200 7700 A31 7700 9500 A32 9500 11500 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/8 PART NO. LWK2043/A-B02 . Chromaticity Coordinates Specifications for Bin Grading BIN A1 A2 A3 A4 A5 X Y 0.21 0.21 0.22 X Y 0.190 0.26 0.150 0.26 0.165 0.27 0.22 0.205 0.22 0.205 0.22 0.165 0.23 0.180 0.23 0.220 0.23 0.220 0.23 0.180 0.24 0.195 0.24 0.235 0.24 0.235 0.24 0.195 0.25 0.210 0.25 0.250 0.25 0.250 0.25 0.210 0.26 0.225 0.26 0.265 . CIE Chromaticity Diagram BIN B1 B2 B3 B4 B5 BIN X Y 0.265 0.31 0.340 0.225 0.31 0.300 0.240 0.32 0.315 0.27 0.280 0.32 0.355 0.27 0.280 0.32 0.355 0.27 0.240 0.32 0.315 0.28 0.255 0.33 0.330 0.28 0.295 0.33 0.370 0.28 0.295 0.33 0.370 0.28 0.255 0.33 0.330 0.29 0.270 0.34 0.345 0.29 0.310 0.34 0.385 0.29 0.310 0.34 0.385 0.29 0.270 0.34 0.345 0.30 0.285 0.35 0.360 0.30 0.325 0.35 0.400 0.30 0.325 0.30 0.285 0.31 0.300 0.31 0.340 C1 C2 C3 C4 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK2043/A-B02 Page 5/8 Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 5.0 4.0 1 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Fig.5 Luminous Spectrum(Ta=25 ℃) SPECTRAL RADIANCE 100 Intensity 80 60 40 20 0 500 600 Wavelength (nm) 700 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) 400 1000 Forward Current(mA) Forward Voltage(V) -40 100 800 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK2043/A-B02 Page 6/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK2043/A-B02 Page 7/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 Page 8/8 PACKING SPECIFICATION 1.1000 PCS / BAG 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : ' Q T ,: W : N, , W G, S PC s kg s kg H