SSIG20N135H Main Product Characteristics: VCES 1350V VCE(sat) 1.9V (typ.) ID 20A @ TC = 100°C TO-247 Schematic diagram Features and Benefits: Advanced Trench-FS Process Technology Low Collector-Emitter Saturation Voltage, Typical Data is 1.9V@20A Fast Switching High Input Impedance Pb- Free Product Power Switch Circuit of Induction Cooker Description: It utilizes the latest processing techniques to achieve the high cell density and reduces VCE(sat) rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application of induction cooker and a wide variety of other applications. Absolute max Rating: Symbol Parameter Max. Units IC @ TC = 25°C Continuous Collector Current 40 IC @ TC = 100°C Continuous Collector Current 20 ICM Pulsed Collector Current 60 Power Dissipation@ TC = 25°C 310 W Power Dissipation@ TC = 100°C 155 W VCES Collector-Emitter Voltage 1350 V VGES Gate-to-Emitter Voltage ± 30 V TJ Operating Junction Temperature Range -55 to +175 °C TSTG Storage Temperature Range -55 to +175 °C TL Maximum Temperature of Solding 260 °C PD @TC = 25°C ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 A page 1 of 9 SSIG20N135H Thermal Resistance Symbol Characterizes Typ. Max. Units RθJC Junction-to-case① — 0.4 ℃/W RθJA Junction-to-ambient ② — 40 ℃/W Electrical Characterizes @TA=25℃ unless otherwise specified Symbol V(BR)CES VCE(sat) Parameter Collector-to-Emitter breakdown voltage Min. Typ. Max. Units 1350 — — V — 1.9 2.1 V — 2.05 — V Collector-Emitter Saturation voltage Conditions VGE = 0V, IC = 0.5mA VGE=15V, IC=20A,TC=25°C VGE=15V, IC=20A,TC=125°C VGE(th) Gate threshold voltage 4.8 5.8 6.8 V VGE= VCE, ID = 0.4mA ICES Zero gate voltage collector current — — 100 μA VCE = 1350V IGES Gate-to-Emitter forward leakage — — 200 — — -100 Qg Total gate charge — 192 — Qge Gate-to-Emitter charge — 16 — Qgc Gate-to-Collector("Miller") charge — 78 — td(off) Turn-Off delay time — 190 — tf Fall time — 100 — Eoff Turn-Off delay time — 0.9 — Cies Input capacitance — 2040 — Coes Output capacitance — 70 — Cres Reverse transfer capacitance — 42 — trr Reverse Recovery Time — 240 — ns TJ = 25°C, IF =20A, di/dt = Qrr Reverse Recovery Charge — 3050 — nC 20A/μs μA VGE =30V VGE = -30V Ic = 20A, nC VCE= 600V, VGE = 15V ns mJ VGE=15V, Vcc=600V, Rg=10Ω IC=20A, TJ = 25°C VGE = 0V pF VCE = 25V ƒ = 1MHz Notes: ①These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heat sink, assuming maximum junction temperature of TJ(MAX)=175°C. ②The R JA is the sum of the thermal impedance from junction to case RJC and case to ambient. ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 2 of 9 SSIG20N135H Typical electrical and thermal characteristics O Figure 1: Typical Output Characteristics(TJ=25 C) Figure 3.Typical Transfer Characteristics O Figure 2: Typical Output Characteristics(TJ=175 C) Figure 4: Gate to Emitter threshold Voltage as a function of TJ ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 3 of 9 SSIG20N135H Typical electrical and thermal characteristics Figure 5: Typical Diode Forward Characteristics Figure 7. Typical VCE(sat) as a Function of TJ ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Figure 6. Forward Voltage as a Function of TJ Figure 8: Capacitance Characteristics Version : 1.0 page 4 of 9 SSIG20N135H Typical electrical and thermal characteristics Figure 9: Switching Time Vs Rg Figure 10: Switching Loss Vs Rg Figure11: Switching Loss Vs IC Figure 12: Gate Charge Characteristics ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 5 of 9 SSIG20N135H Typical electrical and thermal characteristics Figure 13. Maximum Forward Biased Safe Figure 14. Turn Off Safe Operating Area Operating Area Case Temperature Figure15. Normalized Maximum Transient Thermal Impedance ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 6 of 9 SSIG20N135H Mechanical Data: ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 7 of 9 SSIG20N135H Ordering and Marking Information Device Marking: SSIG20N135H Package (Available) TO247 Operating Temperature Range C : -55 to 175 ºC Devices per Unit Package Type Units/ Tube Tubes/Inner Box Units/Inner Inner Box Boxes/Carton Box Units/Carton Box TO247 30 8 240 1200 5 Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) Tj=125℃ to 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=150℃@ 100% of Max VGES 168 hours 500 hours 1000 hours 3 lots x 77 devices ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 8 of 9 SSIG20N135H ATTENTION: ■ ■ ■ ■ ■ ■ ■ ■ Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your Silikron representative nearest you before using any Silikron products described or contained herein in such applications. Silikron assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all Silikron products described or contained herein. Specifications of any and all Silikron products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. Silikron Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all Silikron products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of Silikron Semiconductor CO.,LTD. Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. Silikron believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the Silikron product that you intend to use. Customer Service Worldwide Sales and Service: [email protected] Technical Support: [email protected] Suzhou Silikron Semiconductor Corp. 11A, 428 Xinglong Street, Suzhou Industrial Park, P.R.China TEL: (86-512) 62560688 FAX: (86-512) 65160705 E-mail: [email protected] ©Silikron Semiconductor CO.,LTD. 2015.03.09 www.silikron.com Version : 1.0 page 9 of 9