SSF5NS70GB Main Product Characteristics VDSS 700V RDS(on) 1.3Ω (typ.) ID 5A ① TO-251S Marking and Pin Schematic Diagram Assignment Features and Benefits High dv/dt and avalanche capabilities 100% avalanche tested Low input capacitance and gate charge Low gate input resistance Description: The SSF5NS70GB series MOSFETs is a new technology, which combines an innovative technology and advance process. This new technology achieves low Rdson, energy saving, high reliability and uniformity, superior power density and space saving. Absolute Max Rating Symbol Parameter Max. ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 5① ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 3.1① IDM Pulsed Drain Current ② 15 Power Dissipation ③ 50 W Linear Derating Factor 0.4 W/°C VDS Drain-Source Voltage 700 V VGS Gate-to-Source Voltage ± 30 V EAS Single Pulse Avalanche Energy @ L=22.4mH 54 mJ IAR Avalanche Current @ L=22.4mH 2.2 A -55 to +150 °C PD @TC = 25°C TJ TSTG Operating Junction and Storage Temperature Range ©Silikron Semiconductor CO.,LTD. 2013.03.14 www.silikron.com Version : 1.0P Units A page 1 of 8 SSF5NS70GB Thermal Resistance Symbol Characteristics RθJC Junction-to-case ③ Typ. Max. Units For TO-251S PKG — 2.5 ℃/W For TO-251S PKG — 75 ℃/W Junction-to-ambient RθJA (t ≤ 10s) ④ Electrical Characteristics @TA=25℃ unless otherwise specified Symbol Parameter Min. V(BR)DSS Drain-to-Source breakdown voltage RDS(on) Static Drain-to-Source on-resistance VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage Qg Typ. Max. Units V 700 — — — 1.3 1.6 — 3.1 — 2 — 4 — 2.8 — — — 1 — — 50 — — 100 — — -100 Total gate charge — 8.3 — Qgs Gate-to-Source charge — 2.3 — Qgd Gate-to-Drain("Miller") charge — 2.6 — td(on) Turn-on delay time — 10 — tr Rise time — 18 — td(off) Turn-Off delay time — 17 — tf Fall time — 15 — Ciss Input capacitance — 272 — Coss Output capacitance — 168 — Crss Reverse transfer capacitance — 3.14 — Conditions VGS = 0V, ID = 250μA VGS=10V,ID = 1A Ω TJ = 125°C VDS = VGS, ID = 250μA V TJ = 125°C VDS = 700V,VGS = 0V μA TJ = 125°C VGS =30V nA VGS = -30V ID = 4A, nC VDS=100V, VGS = 10V VGS=10V, VDS =380V, ns RGEN=18Ω,ID =4.5A VGS = 0V pF VDS = 25V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Min. Typ. Max. Units — — 5① A — — 15 A Conditions MOSFET symbol showing the integral reverse p-n junction diode. VSD Diode Forward Voltage — 0.84 1.2 V IS=2.8A, VGS=0V trr Reverse Recovery Time — 284 — nS TJ = 25°C, IF = IS, Qrr Reverse Recovery Charge — 1395 — nC di/dt = 100A/μs ©Silikron Semiconductor CO.,LTD. 2013.03.14 www.silikron.com Version : 1.0P page 2 of 8 SSF5NS70GB Test circuits and Waveforms EAS Test Circuit: Switching Time Test Circuit: Gate charge test circuit: Switching Waveforms: Notes: ①Calculated continuous current based on maximum allowable junction temperature. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C ©Silikron Semiconductor CO.,LTD. 2013.03.14 www.silikron.com Version : 1.0P page 3 of 8 SSF5NS70GB Typical electrical and thermal characteristics Figure 2. Gate to source cut-off voltage Figure 1: Typical Output Characteristics Figure 3. Drain-to-Source Breakdown Voltage Vs. Case Temperature ©Silikron Semiconductor CO.,LTD. Figure 4: Normalized On-Resistance Vs. Case Temperature 2013.03.14 www.silikron.com Version : 1.0P page 4 of 8 SSF5NS70GB Typical electrical and thermal characteristics Figure 5. Maximum Drain Current Vs. Case Figure 6. Typical Capacitance Vs. Drain-to-Source Temperature ©Silikron Semiconductor CO.,LTD. Voltage 2013.03.14 www.silikron.com Version : 1.0P page 5 of 8 SSF5NS70GB Mechanical Data: TO-251S PACKAGE OUTLINE DIMENSION ©Silikron Semiconductor CO.,LTD. 2013.03.14 www.silikron.com Version : 1.0P page 6 of 8 SSF5NS70GB Ordering and Marking Information Device Marking: SSF5NS70GB Package (Available) TO-251S Operating Temperature Range C : -55 to 150 ºC Devices per Unit Package Type Units/ Tube Tubes/Inner Box Units/Inner Inner Box Boxes/Carton Box Units/Carton Box TO-251S 75 60 4500 22500 5 Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) Tj= 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=150℃ @ 100% of Max VGSS 168 hours 500 hours 1000 hours 3 lots x 77 devices ©Silikron Semiconductor CO.,LTD. 2013.03.14 www.silikron.com Version : 1.0P page 7 of 8 SSF5NS70GB ATTENTION: ■ ■ ■ ■ ■ ■ ■ ■ Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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Customer Service Worldwide Sales and Service: [email protected] Technical Support: [email protected] Suzhou Silikron Semiconductor Corp. 11A, 428 Xinglong Street, Suzhou Industrial Park, P.R.China TEL: (86-512) 62560688 FAX: (86-512) 65160705 E-mail: [email protected] ©Silikron Semiconductor CO.,LTD. 2013.03.14 www.silikron.com Version : 1.0P page 8 of 8