SLE95050H ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Features Asymmetric authentication based on Elliptic Curve Cryptographic (ECC) Large NVM for storage of device behavior and logistic information Quad Flat Non Leaded package(WQFN) – RoHS compliant Infineon Single Wire Interface (SWI) for communication between host and accessory Applications Batteries Printer Cartridges Accessories such as earphones, Speakers, Docking Stations, Game Controller, Chargers Medical Equipment and Diagonistic Supplies. Authentication of system services, functionalities and networking systems Description The Infineon ORIGA™ ORIGinal product Authentication chip helps OEMs and system manufacturers to ensure the authenticity and safety of their original products. It offers a robust cryptographic solution to protect against unauthorized aftermarket replacements and copies. With more than 0.5 Billion ORIGAs deployed at major OEM customers, the ORIGA™ in small WQFN package is particularly suited for applications with very stringent space requirements. The product reduces cost by eliminating the need for additional secure key storage ICs in the host system. ORIGA™ features the market leading strong asymmetric cryptography engine and large user non-volatile memory. The Infineonsingle wire host interface (SWI) allows operation using a single dedicated contact which reduces size and, in turn, improves reliability, robustness, performance, and system cost. Product Brief www.infineon.com Please read the Important Notice and Warnings at the end of this document Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Table of Contents Table of Contents Features 1 Applications ................................................................................................................................... 1 Description 1 Table of Contents ........................................................................................................................... 2 1 1.1 1.2 1.3 Overview ...................................................................................................................... 3 Advantages..................................................................................................................................................... 3 Application Domains..................................................................................................................................... 3 Personalization and Key Management ....................................................................................................... 4 2 System Configuration..................................................................................................... 5 3 3.1 3.2 3.3 3.4 3.5 System Features ............................................................................................................ 6 Strong Asymmetric Cryptography Engine .................................................................................................. 6 Non-Volatile Memory .................................................................................................................................... 6 Single-Wire Interface as I/O Interface ......................................................................................................... 6 Power Supply – Low Power .......................................................................................................................... 6 Others ............................................................................................................................................................. 6 4 4.1 4.2 4.3 Electrical Characteristics ................................................................................................ 7 Input/Output Signals .................................................................................................................................... 7 Operating Characteristics............................................................................................................................. 8 Device Configuration and Electrical Schematics ....................................................................................... 9 5 5.1 Single-Wire Interface.....................................................................................................11 Single-Wire Transaction ............................................................................................................................. 11 6 6.1 6.2 6.3 6.4 Packaging ....................................................................................................................13 Pin Configuration ........................................................................................................................................ 13 Pin Out .......................................................................................................................................................... 13 Package Dimensions of WQFN-6................................................................................................................ 14 Tape & Reel, Marking and Soldering Info .................................................................................................. 15 7 Evaluation Kit...............................................................................................................15 Revision History ............................................................................................................................16 Product Brief 2 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Overview 1 Overview Infineon Technologies’ ORIGATM SLE95050H is an authentication chip that offers a robust cryptographic solution, designed to assist system manufacturers to ensure the authenticity and safety of their original products, and protection of their investments against after-market replacements. It leverages Infineon’s market leading security knowhow into the battery and accessory authentication markets. With its innovative asymmetric cryptography approach, it significantly reduces system cost whilst making a leap up in security. 1.1 Advantages Infineon Technologies’ ORIGATM SLE95050H family offers the following advantages: Improved security using unique asymmetrical public/private key cryptography with two different keys for encryption and decryption Improved total system cost by allowing a host-side software implementation without compromising security and reducing maintenance or support efforts created by wrong accessories Improved safety of the system by ensuring system integrity and control Large Non-Volatile Memory (NVM) of 576bit (standard customer NVM of 512bit + 64 bits protected NVM) for storage of device behavior or logistic information (e.g. store number of usage cycles, store data for logistic chain traceability) 1.2 Application Domains The main area of application is authentication leading to increased safety, functionality and reliability of the accessories, replacement parts and disposables. The Infineon Technologies’ ORIGA™ family lends itself for use in multiple application domains which use its safety and highly reliable authentication features. These protect the systems from unauthorized accessories, replacement parts and disposables. Such unauthorized accessories will be easily and immediately detected, allowing the systems decide a suitable next execution step. Application Domain Examples Batteries − Computing Devices, Digital Imaging, Mobile Phones Printer Cartridges Accessories − Earphones, Speakers, Docking Stations, Game Controller, Chargers Other Peripherals Original Replacement Parts Medical Equipment & Diagnostic Supplies Authentication of system services, functionalities and parts in networked systems Product Brief 3 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Overview 1.3 Personalization and Key Management Authentication Chips are produced in a standard version. For different customers and different applications these chips have to be individualized / personalized. This is done by configuring chips with customer specific information (keys, etc). IFX test and personalization facility Secure Infineon Environment Customer Environment Only the unprotected NVM can be accessed or written at this point Single die After Wafer test the secure storage is locked, the UID can not be changed, the secret key can not be accessed from the outside. Figure 1 Personalization Personalization must be performed in a controlled, trusted and protected environment, to prevent any misuse or illegal use of chips. Customer parameters must be protected against unauthorized knowledge or use. Infineon‘s security chip manufacturing and testing facility is security certified and evaluated by a third party authority, and it meets the requirements for performing the critical personalization flow. ORIGATM SLE95050H customers (or their approved contracted manufacturers) receive unique sets of key pairs associated with customers’ products. The secret key should be the same for one accessory product type (e.g. headset) or across a range of products (battery, headset, docking station) to assure interoperability. The corresponding host side public key will be provided to the customer with the host side personalization package. Product Brief 4 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution System Configuration 2 System Configuration The ORIGATM devices are a compact design which encompasses the authentication function and analog function in a single solution. The entire functionality of the SLE95050H ORIGATM devices is supported via Infineon’s proprietary smart SingleWire Interface protocol which supports three communication modes: Uni-cast, Multi-cast and Broadcast communication. Unicast mode allows commands to be sent, written and read to a single device, while Multicast mode allows commands for multiple devices, and Broadcast for all devices. The authentication system (Figure 1) consists of a host device serving as the master communicating through the Single Wire Interface (SWI) to the accessory(ies) containing the SLE95050H. VDD VDD ICharge ISWI RSWI HOST IVDDP +Charge VDD CVDD ORIGA GND SWI SWI 1) host VSWI GND GND GND CCAP ICap GND CAP 1) GPIO configured as open drain output with drive capability of >1mA-10mA Figure 2 Product Brief System Building Blocks of SLE95050H – Indirect Powered via Single Wire Interface. 5 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution System Features 3 System Features Strong Asymmetric Cryptography Engine Non-volatile Memory Infineon Technologies Single Wire Interface (SWI) as I/O interface Power Supply – Single Wire Interface powered or Battery powered solution. 3.1 Strong Asymmetric Cryptography Engine Elliptic Curve Cryptography (ECC) – based authentication Host challenge by software (master – slave) Processing time of less than 60ms for authentication on ORIGA Processing time of complete challenge/response: Less than 200ms (w/o pre-computing of ECC challenge/response, depending on host microcontroller) Software library is available for host integration 3.2 Non-Volatile Memory 512-bits unprotected NVM for user mode area Up to 192 bits protected NVM read-only space for customer specified information which cannot be modified by the end user Counter can be decremented on command by the system host, in conjunction with certain events, such as expired time, dispensed units, charging cycles etc The counter value can only be read by the host, it cannot be reprogrammed 3.3 Single-Wire Interface as I/O Interface Up to 500kbit/s transmission speed and programmable Supports adaptive learning mode Powered directly (e.g. from Battery) or indirect via Single-Wire interface (SWI) Multiple device capabilities in direct powered mode Device ID search scheme and address manage for multiple device capabilities 3.4 Power Supply – Low Power Typical usage of 0.8mArms – 1.3mArms@2VDD Wide operating conditions: 2.2 to 4.8V at VDDP Pin For Single-Wire-Interface powered mode (indirect power) the communication line has to be connected via pull-up to at least 3V (see VDD in figure 2) Less than 12uA in power-down/sleep mode. Power-up: 10ms for full system power up Power-down: after continuous logic 0 for >196µs on SWI 3.5 Others ESD – − HBM = 2kV − CDM = 500V Product Brief 6 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Electrical Characteristics 4 Electrical Characteristics Table 1 Absolute Max Ratings Parameter Symbol Unit Values Min. Typ. Max. Junction Temperature range Tj -20 110 ℃ IO / VDD power supply VDDP 1.85 6 V Digital supply. VDIG 1.25 1.85 V Signal voltage level VSWI 6 V Note: 4.1 Table 2 Stresses above the maximum values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding anyone of these values may cause irreversible damage to the integrated circuit. Input/Output Signals I/O and Power Signals Pin No. 4 Pin Name/ Pad Inst VDD Pin Type PWR Buffer Type - 5 6 1 SWIO VSS CAP I/O GND PWR OD - Product Brief Note / Test Condition Function 2.2V to 4.8V power supply. I/O / VDDP power supply. Open-drain input and pull-down wired-AND. Supports single-wire interface protoccol. SWIO / VDD ground. Digital power supply. 7 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Electrical Characteristics 4.2 Operating Characteristics Table 3 Power Supply Parameter Symbol Values Unit Min Typ Digital Supply (internal) VDIG 1.4 I/O / VDD Power Supply VDDP 2.2 Active Supply Current IVDDP 0.6 SWI Drain Current 1.55 1.3 1.7 V 4.8 V 3.5 mArms 8 mArms 12.0 uA IOD 1 Inactive Supply Current Max Icore(Inactive) 2 1.0 All Min, Typ and Max values contained in this table are preliminary. Final values are to be confirmed. 1. 2. Prolong drain current exceeding 10mA may damage the device. Tested at VOL = 0.4V Host powers down SLE95050H Table 4 Thermal Characteristics Values Parameter Unit Symbol Min Ambient Temperature Table 5 TA Typ -20 Max 25 110 °C I/O Characteristics Values Unit Parameter Symbol Input High Voltage VIH Input Low Voltage Min Typ Conditions/Remark s Max 2.2 4.8 V LVTTL VIL 0.8 V LVTTL Input High Current IIH 10 uA Input Low Current IIL 1 uA Output Low Current IOL 8 mA All Min, Typ and Max values contained in this table are preliminary. Final values are to be confirmed. Output High Voltage and Current depend on external pull-up circuitry Product Brief 8 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Electrical Characteristics 4.3 Device Configuration and Electrical Schematics The SLE95050H ORIGATM supports multiple configuration options: 1. Host Software to single SLE95050H. 2. Host Software to multiple SLE95050H. Once initialized the host system may trigger a search ID sequence to identify ORIGATM devices. After identification of such devices, the host can execute a challenge, verify the response and then determine the success of the authentication. The following figures illustrate the SLE95050H powering options. VDD VDD ICharge ISWI RSWI HOST IVDDP +Charge VDD CVDD ORIGA GND SWI SWI 1) host VSWI GND GND GND CCAP ICap GND CAP 1) GPIO configured as open drain output with drive capability of >1mA-10mA Figure 3 Product Brief Single Wire Interface Powered using one GPIO 9 Revision 1.0 2015-10-10 GND GND ORIGA™ High Temperature GND Electrical Characteristics ICap Original Product Authentication and Brand Protection Solution CAP CCAP GND VDD VDD GPIO 2 ISWI RSWI HOST ICharge IVDDP +Charge VDD CVDD GPIO 1 SWI VSWI GND GND CAP ICap GND Figure 4 ORIGA GND CCAP GND Single Wire Interface Powered using two GPIOs VDD VDD VDD VDD CVDD GPIO 2 ORIGA GND ISWI RSWI HOST GPIO 1 SWI VSWI GND GND Figure 5 Product Brief GND CCAP ICap GND CAP Direct Powered using two GPIOs 10 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Single-Wire Interface 5 Single-Wire Interface 5.1 Single-Wire Transaction Each SWI packet consists of 11 bits (3 command, 8 data bits). When logic 1 on the SWI is seen for a time longer than the power-up time of 10ms, the chip is powered-up and reset. Each bit is either 1 or 3 Pwr Pwr Up down (10ms) Figure 6 Trg (B) Pwr down chk Data 0 Pwr down Pwr up Trg (B) Data1 Pwr down chk A typical single transaction of the SWI protocol. In power-up mode, the host can send instructions based on the SWI protocol. When the communication is done, the host can decide to maintain the SWI line at logic 1 or to set it to logic 0 for a time longer than the powerdown time of 500µs to power-down the chip to save power. Pwr down Figure 7 Pwr up Trg (B) Data 0 Stop Trg (M/U) Data 1 Pwr Down chk Power-Uo Single Packet Transaction. In power-down mode, the power sequence and timing is required again before the host can start communication with the chip. Pwr down Figure 8 Pwr up Trg (B) Data 0 Trg (M/U) Data 1 Trg (M/U) Data N Pwr down chk Back-to-Back Data Packet Transaction. Interrupt can be enabled by the host controller. The host controller must first send an interrupt enable control on the SWI to enable the interrupt on the device(s). Once the device is allowed to interrupt, the host holds the line at logic 1 and if any interrupt- enabled device needs an interrupt, it will pull the line low for a period no greater than the designated interrupt period of 1٢. Once the host detects the logic 0, it interprets that there is an interrupt and will initiate a check on the devices for the interrupt flag. Product Brief 11 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Single-Wire Interface Each bit is either 1 or 3 Pwr down Figure 9 Product Brief Pwr up Trg (B) Single interrupt 1 Device ID search Up to 3 for multiple interrupt Int Interrupt stop arm Trg (B) Data 1 Pwr down chk Device-ID Search Data Packet Transaction 12 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Packaging 6 Packaging The SLE95050H comes in a WQFN-6 type package. 6.1 Pin Configuration Figure 10 6.2 VSS CAP 1 5 SWIO NC 2 4 VDDP NC 3 Pin Configuration (WQFN-6 package) Pin Out Table 6 Pin No. 6 Pin Assignment and description. Non mentioned pins are not connected. Pin Name/ Pad Inst 4 VDDP Pin Type Pad Description Domain Supply 2.2V - 4.8V power supply VDDP VDDP 5 SWIO I/O Bi-dir pad with input and open-drain pull output driver 6 VSS GND Digital ground VDDP 1 CAP O 1.5V supply pad VDD Product Brief 13 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Packaging 6.3 Figure 11 Product Brief Package Dimensions of WQFN-6 WQFN-6 14 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Evaluation Kit 6.4 Tape & Reel, Marking and Soldering Info Figure 12 Tape & Reel: 13” with 4” hub, 4x4mm; 6.000 units/reel, reels/box: 1; 7 Evaluation Kit The ORIGATM EvalKit USB Stick allows a complete evaluation of all the features of ORIGA™ family. Each Evaluation kit contains dual ORIGATM SLE95050 and SLE95200. Do note that these are not High Temperature parts and please contact Infineon for High Temperature part evaluation. After installing the demo software from the CD, user will be able to communicate with the on-board ORIGATM devices. Figure 13 Product Brief USB Evaluation kit 15 Revision 1.0 2015-10-10 ORIGA™ High Temperature Original Product Authentication and Brand Protection Solution Evaluation Kit Revision History Major changes since the last revision Page or Reference Description of change ORIGATM SLE95050H Release. Product Brief 16 Revision 1.0 2015-10-10 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, Infineon™, ISOFACE™, IsoPACK™, i-Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Trademarks updated August 2015 Other Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition 2015-10-10 Published by Infineon Technologies AG 81726 München, Germany SLE95050H Product Briefowners. © 2015 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? 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