Datenblatt

HAMBURG INDUSTRIES CO., LTD.
Wolfgang Knap GmbH & Co. KG / Lilienberggasse 13 / 1130 Vienna / Austria
TECHNICAL CHARACTERISTICS
1. General Characteristics
Dimension: 17.95L x 15.30W x 1.80H mm
Weight: Approx. 0.71 g
Contact principle: Friction technology
Operating position: Shaft up / Down / Horizontal
Mounting System: SMT Type (without post)
Durability: 5,000 cycles min.
2. Mechanical Characteristics
Insulation material: Thermoplastic, UL 94V-0
RoHS Directive 2002/95/EC Compliant
3. Electrical Characteristics
Number of contacts: 6, 8 pins (optional)
Contact resistance: 50 m typical, 100 m max.
Insulation resistance: >1000 M / 500 VDC
4. Solderability
Wave: Not applicable
IR reflow: 260C, 10 sec. Max.
Manual soldering: 360C, 3 sec. Max.
Unit: mm; Tolerances: 0.15 mm
Mechanical outline dimension
5. Environmental Characteristics
Operating temperature: - 40C ~ + 85C
Operating humidity: 10 % ~ 95 % RH
Storage temperature: - 40C ~ + 85C
Storage humidity: 10 % ~ 95 % RH
H&V Micro SIM Card Connector
Model No.: ICC-M02
Unit: mm; Tolerances: 0.05 mm
Reference dimension for PCB layout
Revision: 0.91 Date: JAN. 01, 2011
For further information,please contact:
Tel: +43 1 4030812 Fax: +43 1 4087213
E-mail: [email protected]
URL: http://www.knap.at