Datenblatt

HAMBURG INDUSTRIES CO., LTD.
Wolfgang Knap GmbH & Co. KG / Lilienberggasse 13 / 1130 Vienna / Austria
TECHNICAL CHARACTERISTICS
1. General Characteristics
Dimension: 13.56L x 13.38W x 1.60H mm
Weight: Approx. 0.35 g
Contact principle: Friction technology
Operating position: Shaft up / Down / Horizontal
Mounting System: SMT Type (without post)
Durability: 5,000 cycles min.
2. Mechanical Characteristics
Insulation material: Thermoplastic, UL 94V-0
RoHS Directive 2011/65/EU Compliant
3. Electrical Characteristics
Number of contacts: 8 pins
Contact resistance: 100 m / 20 mA
Insulation resistance: >1000 M / 500 VDC
4. Solderability
Wave: Not applicable
IR reflow: 260C, 10 sec. Max.
Manual soldering: 360C, 3 sec. Max.
Unit: mm; Tolerances: 0.15 mm
Mechanical outline dimension
5. Environmental Characteristics
Operating temperature: - 25C ~ + 85C
Operating humidity: 10 % ~ 95 % RH
Storage temperature: - 40C ~ + 85C
Storage humidity: 10 % ~ 95 % RH
6. Pin Assignments
Pin
1
2
3
4
5
6
7
8
Name
DAT2
CD/DAT3
CMD
VDD
CLK
VSS
DAT0
DAT1
Micro SD Mode
Description
Data Line (Bit 2)
Card Detect / Data Line (Bit 3)
Command Response
Supply Voltage
Clock
Supply Voltage Ground
Data Line (Bit 0)
Data Line (Bit 1)
H&V Micro SD Card Connector
Model No.: MCA-T01
Revision: 1.0
Date: SEP. 22, 2014
For further information, please contact:
Tel: +43 1 4030812 Fax: +43 1 4087213
Unit: mm; Tolerances: 0.05 mm
Reference dimension for PCB layout
Note:
1. Coplanarity of solder pins 0.10mm max.
2. Recommended thickness of solder paste > 0.15mm.
E-mail: [email protected]
URL: http://www.knap.at