BAT54T Single Schottky barrier diode Rev. 01 — 14 December 2009 Product data sheet 1. Product profile 1.1 General description Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a SOT416 (SC-75) ultra small Surface-Mounted Device (SMD) plastic package. 1.2 Features Low forward voltage: max. 400 mV Low capacitance: max. 10 pF Ultra small SMD plastic package AEC-Q101 qualified 1.3 Applications Ultra high-speed switching Voltage clamping Protection circuits Blocking diode 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter IF forward current VR reverse voltage VF [1] forward voltage Pulse test: tp ≤ 300 μs; δ ≤ 0.02. Conditions IF = 10 mA [1] Min Typ Max Unit - - 200 mA - - 30 V - - 400 mV BAT54T NXP Semiconductors Single Schottky barrier diode 2. Pinning information Table 2. Pinning Pin Description 1 anode 2 not connected 3 cathode Simplified outline Graphic symbol 3 3 2 n.c. 1 1 006aaa436 2 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAT54T SC-75 plastic surface-mounted package; 3 leads SOT416 Table 4. Marking codes 4. Marking Type number Marking code BAT54T ZW 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VR reverse voltage IF forward current IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 IFSM non-repetitive peak forward current square wave Min Max Unit - 30 V - 200 mA - 300 mA tp = 100 μs - 4 A tp = 1 ms - 2 A - 1 A tp = 10 ms Tamb ≤ 25 °C Ptot total power dissipation - 150 mW Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAT54T_1 Product data sheet [1] © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 2 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode 6. Thermal characteristics Table 6. Symbol Thermal characteristics Parameter Conditions Rth(j-a) thermal resistance from junction to ambient Rth(j-sp) thermal resistance from junction to solder point in free air Min Typ Max Unit [1] - - 833 K/W [2] - - 350 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF IR Parameter Conditions Min Typ Max Unit IF = 0.1 mA - - 240 mV IF = 1 mA - - 320 mV IF = 10 mA - - 400 mV IF = 30 mA - - 500 mV IF = 100 mA - - 800 mV - - 2 μA - - 5 ns - - 10 pF [1] forward voltage reverse current trr reverse recovery time Cd diode capacitance VR = 25 V [2] VR = 1 V; f = 1 MHz [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA. BAT54T_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 3 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode msa892 103 IF (mA) msa893 103 IR (μA) (1) (2) (3) 102 (1) 102 (2) 10 10 1 10−1 (1) (2) (3) 0 1 0.4 0.8 VF (V) (3) 10−1 0 1.2 10 (1) Tamb = 125 °C (1) Tamb = 125 °C (2) Tamb = 85 °C (2) Tamb = 85 °C (3) Tamb = 25 °C (3) Tamb = 25 °C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. 20 VR (V) 30 Reverse current as a function of reverse voltage; typical values msa891 15 Cd (pF) 10 5 0 0 10 20 VR (V) 30 f = 1 MHz; Tamb = 25 °C Fig 3. Diode capacitance as a function of reverse voltage; typical values BAT54T_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 4 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode 8. Test information tr t D.U.T. RS = 50 Ω tp 10 % + IF IF SAMPLING OSCILLOSCOPE trr t Ri = 50 Ω V = VR + IF × RS VR (1) 90 % mga881 input signal output signal (1) IR = 1mA Fig 4. Reverse recovery time test circuit and waveforms 9. Package outline 0.95 0.60 1.8 1.4 3 0.45 0.15 1.75 0.9 1.45 0.7 1 2 0.30 0.15 0.25 0.10 1 Dimensions in mm Fig 5. Package outline SOT416 (SC-75) BAT54T_1 Product data sheet 04-11-04 © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 5 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BAT54T SOT416 -115 -135 [1] 4 mm pitch, 8 mm tape and reel For further information and the availability of packing methods, see Section 14. 11. Soldering 2.2 1.7 solder lands solder resist 1 0.85 2 solder paste 0.5 (3×) occupied area Dimensions in mm 0.6 (3×) 1.3 Fig 6. Reflow soldering footprint SOT416 (SC-75) BAT54T_1 Product data sheet sot416_fr © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 6 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BAT54T_1 20091214 Product data sheet - - BAT54T_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 7 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAT54T_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 14 December 2009 8 of 9 BAT54T NXP Semiconductors Single Schottky barrier diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 6 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 December 2009 Document identifier: BAT54T_1