LATTICE ICE40 MOBILE SOLUTIONS TM Lattice iCE40 Mobile Solutions The iCE40™ Ultra Low Power FPGA family is designed to address always on functions in mobile consumer devices. These functions extend from IR sub-systems, custom connectivity as well as sensor management solutions. The nature of always on functions present challenges to mobile designers due to constant current drain from the battery. By leveraging 40-nm low-power CMOS process and low power circuit design, the iCE40™ family delivers the lowest active and standby power consumption solutions in the market. This enables applications like sensor management in smartphones to collect and analyze mutiple sensor data streams in realtime and transform data in to information while keeping processors in low their lowest power mode. iCE40™ Ultra Low Power FPGAs are offered in ultra-small form factor packages, which makes it well suited for area constrained applications like smartphones and tablets. Key Features Flexible Logic Architecture • Multilple devices with 384 to 7680 LUTs • Up to 18 I/O pins WLCSP package • Up to 178 I/O in BGA package Integrated Hard Cores • Hard I2C & SPI Cores • Low Power & High-Speed Strobe Generator • Flexible Device Configuration through SPI Ultra-low Power Devices • Advanced 40 nm ultra-low power • As low as 45 µW standby power Flexible On-Chip Clocking • Six low-skew global signal resources • Phase Lock Loops Embedded and Distributed Memory • Up to 128 Kbits sysMEM™ Embedded Block RAM Ultra-Small Form Factor • As small as 16-pin WLCSP package 1.40mm x 1.48mm iCE40 Device Selection Guide LP Series (Low Power) Features Logic Cells LM Series (Low Power, Hard IP) LP384 LP640 LP1K LP4K LP8K LM1K LM2K LM4K 384 640 1280 3520 7680 1100 2048 3520 100 100 360 360 95 95 95 Typical (µA, @ 0KHz, 1.2V Vcc) Embedded RAM Bits 0 64K 64K 80K 128K 64K 80K 80K Phase-Locked Loop Core - - 1 2 2 1 1 1 I2C Core - - - - - 1 2 2 SPI Core - - - - - 1 2 2 Low Power Strobe Generator - - - - - 1 1 1 High Frequency Strobe Generator - - - - - 1 1 1 24mA Current Sink - 3 3 - - 3 3 3 Packages1 I/O Pins (dedicated I/Os) 10(2)2 16-ball WLCSP (1.40 x 1.48 mm) 10(2)2 18(2)2 18(2)2 18(2)2 25(2) 3 25(2) 25(2) 25(2) 25(2) 37(2) 35(2)3 35(2) 35(2) 35(2) 25-ball WLCSP (1.71 x 1.71 mm) 36-ball ucBGA (2.5 x 2.5 mm) 49-ball ucBGA (3 x 3 mm) 81-ball ucBGA (4 x 4 mm) 63(2)3 63(2)4 63(2)4 121-ball ucBGA (5 x 5 mm) 95(2)3 93(2) 93(2) 81-ball csBGA2 (5 x 5 mm) 62(2)3 178(3) 178(3) 32-pin QNF (5 x 5 mm) 121-ball csBGA (6 x 6 mm) 21(4) 92(2)3 225-ball ucBGA (7 x 7 mm) 84-pin QNFS2 (7 x 7 mm) 67(2)3 1. Packages: WLCSP - 0.35 mm pitch chip scale ball grid array, csBGA - 0.5 mm pitch Chip-Scale Ball Grid Array, ucBGA - 0.4 mm pitch Chip-Scale Ball Grid Array, caBGA - 0.8 mm pitch Ball Grid Array 2. No PLL available 3. No 24mA current sink 4. Only 1 PLL available LATTICESEMI.COM TM Solution Examples Sensor Hub Sensor Manager / Pre-Processor & Pedometer • Monitors numerous sensors to allow an applications processor to sleep longer • Connects to multiple sensors via I2C bus • Aggregates sensor data • Sends sensor data via SPI bus to an applications processor • Prioritizes and handles all sensor interrups • Collects Data streams from multiple sensors via I2C • Parces, processes , and loads into FIFO buffers in preparation for Processor • Decides when necassary to wake up the processor RGB LED Driver Infrared Tx/Rx • Drives and controls 3 LEDs or 1 RGB LED with 24mA current sink for color mixing and status indication • Connects to an applications processor via SPI • Infrared (IR) transmit (Tx) and receive (Rx) capable • IR Tx consumes 335 LUTs, IR Tx/Rx 418 LUTs • Performs all necessary infrared PWM functions • Interfaces to an applications processor via SPI bus • Allows plug-n-play addition of remote control feature to mobile devices PIN #1 ID FIDUCIAL LOCATED IN THIS AREA s A B C D E aaa D s B e A E1 3 25 X Øb Ø.05 Ø.015 M M (4X) D1 e 5 4 3 2 1 5 E A CA B C ccc C 4 C A1 REF. Min. Nor. Max. A A1 lo D E D1 E1 e aaa ccc r s 0.413 0.122 0.188 0.452 0.152 0.218 1.40 BSC 1.48 BSC 1.05 BSC 1.05 BSC 0.35 BSC 0.03 0.03 0.175 0.175 0.491 0.182 0.248 - iCE40LP1K 16-WLCSP 0.35mm Pitch - REF. Min. Nor. Max. A A1 lo D E D1 E1 e aaa ccc s 0.413 0.122 0.188 0.452 0.152 0.218 1.71 BSC 1.71 BSC 1.40 BSC 1.40 BSC 0.35 BSC 0.03 0.03 0.155 0.491 0.182 0.248 - iCE40LM4K 25-WLCSP 0.35mm Pitch - Applications Support [email protected] Copyright © 2013 Lattice Semiconductor Corporation. Lattice Semiconductor Corporation. Lattice Semiconductor, L (stylized) Lattice Semiconductor Corp., and Lattice (design), iCE40, iCE40 LP384, iCE40 LP640, iCE40 LP1K, iCE40 LP4K, iCE40 LP8K, iCE40 LM1K, iCE40 LM2K, iCE40 LM4K, iCE40 LM and iCE40 LP are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. October 2013 Order #: I0325 LATTICESEMI.COM