The iCE65 mobileFPGA family L-Series P-Series Optimized for ultra-low power applications Optimized for display, memory and SERDES applications (1.0 Volt and 1.2 Volt Operation) (1.2 Volt Operation) Part Number L01 L04 L08 P04 1,280 3,520 7,680 3,520 Embedded RAM Bits 64K 80K 128K 80K Embedded RAM 4K Blocks 16 20 32 20 Logic Cells Phase-Locked Loop 0 Power/Speed Grade ([email protected], [email protected]) 0 0 1 -L -T -L -T Core Operating Current, 0 KHz 12 µA 19 µA 26 µA 43 µA Core Operating Current, 32 KHz 15 µA 23 µA 31 µA 50 µA Core Operating Current, 32 MHz 3 mA 4 mA 7 mA 8 mA 14 mA 17 mA Configuration Bits 245K PaCKAGE 533K -L -T -T 54 µA 90 µA 43 µA 62 µA 100 µA 60 µA 9 mA 1,057K 533K Programmable I/O: Max I/O (LVDS Channels) 81-ball BGA 63 (0) 84-pin QFN 67 (0) 100-pin VQFP 72 (0) 121-pin BGA 92 (0) 132-ball BGA 93 (0) 196-ball BGA 284-ball BGA DiePlus ™ (Known Good Die) 72 (9) 95 (13) 95 (11) 95 (12) 150 (18) 150 (18) 148 (18) 176 (20) 222 (25) 174 (20) Programmable I/O: Max I/O (LVDS Channels) Wafer Level Chip Scale Package: WLCSP CS36 25 (0) CS63 48 (4) CC72 55 (8) Bare Die 95 (0) 176 (20) CS110 92 (12) 222 (25) 174 (20) Version 1.1 Packages are shown actual size. DiePlus™ Wafer Level Chip Scale Devices CS36 CS63 CC72 CS110 CB81 CB121 QN84 CB132 CB196 CB284 VQ100 .4 mm pitch 2.5 X 2.5 mm .4 mm pitch 3 X 4 mm .5 mm pitch 4 X 5 mm .4 mm pitch 4 X 5 mm .5 mm pitch 5 X 5 mm .5 mm pitch 6 X 6 mm .5 mm pitch 7 X 7 mm .5 mm pitch 8 X 8 mm .5 mm pitch 8 X 8 mm .5 mm pitch 12 X 12 mm .5 mm pitch 14 X 14 mm