62 ' PMEG2005EPK 20 V, 0.5 A low VF MEGA Schottky barrier rectifier Rev. 2 — 14 March 2012 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 (DFN1608D-2) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. 1.2 Features and benefits Average forward current: IF(AV) ≤ 0.5 A AEC-Q101 qualified Reverse voltage: VR ≤ 20 V Solderable side pads Low forward voltage VF ≤ 410 mV Package height typ. 0.37 mm Low reverse current Ultra small and leadless SMD plastic package 1.3 Applications Low voltage rectification Low power consumption applications High efficiency DC-to-DC conversion Ultra high-speed switching Switch mode power supply Reverse polarity protection LED backlight for mobile application 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions average forward current square wave; δ = 0.5; f = 20 kHz; Tamb ≤ 130 °C IF(AV) Min Typ Max Unit - - 0.5 A square wave; δ = 0.5; f = 20 kHz; Tsp ≤ 140 °C - - 0.5 A [1] VR reverse voltage Tj = 25 °C - - 20 V VF forward voltage IF = 500 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C - 360 410 mV IR reverse current VR = 10 V; Tj = 25 °C - 30 130 µA trr reverse recovery time IR = 0.5 A; IF = 0.5 A; IR(meas) = 0.1 A; Tj = 25 °C - 3 - ns [1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2. Pin Pinning information Symbol Description 1 K cathode[1] 2 A anode Simplified outline Graphic symbol 1 1 2 2 sym001 Transparent top view SOD1608 (DFN1608D-2) [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PMEG2005EPK DFN1608D-2 Leadless ultra small plastic package; 2 terminals SOD1608 4. Marking Table 4. Marking codes Type number Marking code PMEG2005EPK 1000 0000 VENDOR CODE CATHODE BAR READING DIRECTION READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac909 Fig 1. SOD1608 binary marking code description PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 2 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VR reverse voltage Tj = 25 °C - 20 V IF forward current Tsp ≤ 135 °C - 0.7 A average forward current square wave; δ = 0.5; f = 20 kHz; Tamb ≤ 130 °C - 0.5 A - 0.5 A IF(AV) [1] square wave; δ = 0.5; f = 20 kHz; Tsp ≤ 140 °C IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.5 - 2 A IFSM non-repetitive peak forward current square wave; tp = 8 ms; Tj(init) = 25 °C - 3 A Ptot total power dissipation Tamb ≤ 25 °C [2] - 390 mW [3] - 830 mW [1] - 1470 mW Tj junction temperature - 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air Rth(j-sp) thermal resistance from junction to solder point Min Typ Max Unit [1][2] - - 320 K/W [1][3] - - 150 K/W [1][4] - - 85 K/W [5] - - 20 K/W [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. [5] Soldering point of cathode tab. PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 3 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 006aac940 103 duty cycle = Zth(j-a) (K/W) 1 0.75 0.5 0.33 102 0.25 0.2 0.1 0.05 0 0.02 0.01 10 10-3 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aac941 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.25 0.1 0.05 0 10 10-3 0.02 0.01 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for cathode 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 4 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 006aac942 102 duty cycle = 1 0.75 Zth(j-a) (K/W) 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 10 10-3 10-2 10-1 1 102 10 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C - 270 300 mV IF = 500 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C - 360 410 mV VR = 10 V; Tj = 25 °C - 30 130 µA VR = 20 V; Tj = 25 °C - 70 300 µA VR = 1 V; f = 1 MHz; Tj = 25 °C - 35 - pF VR = 10 V; f = 1 MHz; Tj = 25 °C - 13 - pF IR Cd reverse current diode capacitance trr reverse recovery time IF = 0.5 A; IR = 0.5 A; IR(meas) = 0.1 A; Tj = 25 °C - 3 - ns VFRM peak forward recovery voltage IF = 0.5 A; dIF/dt = 20 mA/µs; Tj = 25 °C - 380 - mV PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 5 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 006aac943 10 IF (A) 1 006aac944 10-1 IR (A) 10-2 (1) (1) (2) 10-3 (2) 10-1 (3) (4) (5) 10-4 (3) 10-5 10-2 10-6 10-3 (4) 10-7 10-4 0.0 0.2 0.4 0.6 VF (V) 0.8 10-8 0 5 10 (1) Tj = 150 °C (1) Tj = 125 °C (2) Tj = 125 °C (2) Tj = 85 °C (3) Tj = 85 °C (3) Tj = 25 °C (4) Tj = 25 °C (4) Tj = −40 °C 15 20 VR (V) (5) Tj = −40 °C Fig 5. Forward current as a function of forward voltage; typical values 006aac945 75 Fig 6. Reverse current as a function of reverse voltage; typical values 006aac946 0.25 PF(AV) (W) Cd (pF) (4) 0.20 (3) (2) 50 (1) 0.15 0.10 25 0.05 0 0 5 10 15 VR (V) 20 0.00 0.00 f = 1 MHz; Tamb = 25 °C 0.25 0.50 IF(AV) (A) 0.75 Tj = 150 °C (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ = 1 Fig 7. Diode capacitance as a function of reverse voltage; typical values PMEG2005EPK Product data sheet Fig 8. Average forward power dissipation as a function of average forward current; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 6 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 006aac947 0.7 PR(AV) (W) 0.6 006aac948 0.75 (1) IF(AV) (A) 0.5 (2) 0.50 (1) 0.4 (2) (3) (3) 0.3 0.25 0.2 (4) (4) 0.1 0.0 0 5 10 15 VR (V) 20 0.00 0 25 50 75 100 125 Tj = 125 °C FR4 PCB, standard footprint (1) δ = 1 Tj = 150 °C (2) δ = 0.9 (1) δ = 1 (DC) (3) δ = 0.8 (2) δ = 0.5; f = 20 kHz (4) δ = 0.5 (3) δ = 0.2; f = 20 kHz 150 175 Tamb (°C) (4) δ = 0.1; f = 20 kHz Fig 9. Average reverse power dissipation as a function of reverse voltage; typical values 006aac949 0.75 Fig 10. Average forward current as a function of ambient temperature; typical values 006aac950 0.75 (1) (1) IF(AV) (A) IF(AV) (A) (2) (2) 0.50 0.50 (3) (3) 0.25 0.25 (4) 0.00 0 25 50 (4) 75 100 125 150 175 Tamb (°C) 0.00 0 25 50 75 100 125 150 175 Tamb (°C) FR4 PCB, mounting pad for cathode 1 cm2 Ceramic PCB, Al2O3, standard footprint Tj = 150 °C Tj = 150 °C (1) δ = 1 (DC) (1) δ = 1 (DC) (2) δ = 0.5; f = 20 kHz (2) δ = 0.5; f = 20 kHz (3) δ = 0.2; f = 20 kHz (3) δ = 0.2; f = 20 kHz (4) δ = 0.1; f = 20 kHz (4) δ = 0.1; f = 20 kHz Fig 11. Average forward current as a function of ambient temperature; typical values PMEG2005EPK Product data sheet Fig 12. Average forward current as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 7 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 006aac951 0.75 (1) IF(AV) (A) (2) 0.50 (3) 0.25 (4) 0.00 0 25 50 75 100 125 150 175 Tsp (°C) Tj = 150 °C (1) δ = 1 (DC) (2) δ = 0.5; f = 20 kHz (3) δ = 0.2; f = 20 kHz (4) δ = 0.1; f = 20 kHz Fig 13. Average forward current as a function of solder point temperature; typical values 8. Test information IF IR(meas) time IR trr 006aad022 Fig 14. Reverse recovery definition PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 8 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier IF time VF VFRM VF time 001aab912 Fig 15. Forward recovery definition P tcy duty cycle δ = tp tcy tp t 006aac658 Fig 16. Duty cycle definition The current ratings for the typical waveforms are calculated according to the equations: IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined as RMS current. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 9 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 9. Package outline 0.40 0.34 0.85 0.75 1 0.80 0.72 1.65 1.55 0.40 0.32 2 0.75 0.67 0.04 Dimensions in mm 11-11-21 Fig 17. Package outline SOD1608 (DFN1608D-2) 10. Soldering Footprint information for reflow soldering of SOD1608 package SOD1608 1.15 0.75 1.05 0.65 0.95 0.55 0.9 0.8 0.7 0.7 0.8 0.9 1 2 0.1 0.2 1.8 1.9 2.0 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm sod1608_fr Fig 18. Reflow soldering footprint for SOD1608 (DFN1608D-2) PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 10 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 11. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes PMEG2005EPK v.2 20120314 Product data sheet - PMEG2005EPK v.1 - - Modifications: PMEG2005EPK v.1 PMEG2005EPK Product data sheet • • • 5 “Limiting values”: IF corrected 7 “Characteristics”: trr and VFRM added Fig 14. and 15: added 20120112 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 11 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 12. Legal information 12.1 Data sheet status Document status[1] [2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 12.2 Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 12 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published athttp://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G reenChip,HiPerSmart,HITAG,I²C-bus logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE Ultralight,MoReUse,QLPAK,Silicon Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia andUCODE — are trademarks of NXP B.V. HD Radio andHD Radio logo — are trademarks of iBiquity Digital Corporation. 13. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:[email protected] PMEG2005EPK Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 March 2012 © NXP B.V. 2012. All rights reserved. 13 of 14 PMEG2005EPK NXP Semiconductors 20 V, 0.5 A low VF MEGA Schottky barrier rectifier 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 12.1 12.2 12.3 12.4 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . .8 Quality information . . . . . . . . . . . . . . . . . . . . . . .9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 March 2012 Document identifier: PMEG2005EPK