SOD1608

8D
-2
DF
N1
60
SOD1608
DFN1608D-2: leadless ultra small plastic package; 2
terminals
8 February 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
DFN1608D-2
Package type industry code
DFN1608D-2
Package style descriptive code
SOD (small outline diode)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
Mounting method type
S (surface mount)
Issue date
29-11-2011
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
0.75
-
0.8
0.85
mm
E
package width
1.55
-
1.6
1.65
mm
A
seated height
0.34
-
0.37
0.4
mm
n2
actual quantity of termination
-
-
2
-
SOD1608
NXP Semiconductors
DFN1608D-2: leadless ultra small plastic
package; 2 terminals
2. Package outline
SOD1608
Leadless ultra small plastic package; DFN1608D-2; 2 terminals; body 1.6 x 0.8 x 0.37 mm
indication of
Cathode
D
(2)
(2)
E
A
A1
e1
e2
1
b
(2 x)
2
L1
L2
0
1 mm
scale
Dimensions
Unit
mm
A(1)
A1
E
D
e1
e2
b
L1
L2
max 0.40 0.04 1.65 0.85
0.75 0.80 0.40
nom 0.37
1.60 0.80 0.37 0.57 0.70 0.75 0.35
min 0.34
1.55 0.75
0.67 0.72 0.32
Note
1. Dimension A is including plating thickness.
2. Solderable lead end, protrusion max. 0.02 mm
Outline
version
sod1608_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
11-11-22
12-06-07
SOD1608
Fig. 1. Package outline DFN1608D-2 (SOD1608)
SOD1608
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOD1608
NXP Semiconductors
DFN1608D-2: leadless ultra small plastic
package; 2 terminals
3. Soldering
Footprint information for reflow soldering of DFN1608D-2 package
SOD1608
1.15
0.75
1.05
0.65
0.95
0.55
0.9 0.8 0.7
0.7 0.8 0.9
1
2
0.1
1.8
0.2
1.9
2.0
solder land
solder land plus solder paste
solder paste deposit
solder resist
Dimensions in mm
sod1608_fr
Fig. 2. Reflow soldering footprint for DFN1608D-2 (SOD1608)
SOD1608
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOD1608
NXP Semiconductors
DFN1608D-2: leadless ultra small plastic
package; 2 terminals
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOD1608
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOD1608
NXP Semiconductors
DFN1608D-2: leadless ultra small plastic
package; 2 terminals
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2016
SOD1608
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5