PMEG2010AEJ 20 V, 1 A very low VF MEGA Schottky barrier rectifier in SOD323F package Rev. 03 — 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very small and flat lead Surface Mounted Device (SMD) plastic package. 1.2 Features Forward current: ≤ 1 A Reverse voltage: ≤ 20 V Very low forward voltage Very small and flat lead SMD plastic package 1.3 Applications Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Inverse polarity protection Low power consumption applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit IF forward current Tsp ≤ 55 °C - - 1 A VR reverse voltage - - 20 V - 480 550 mV VF [1] forward voltage Pulse test: tp ≤ 300 μs; δ ≤ 0.02. IF = 1000 mA [1] PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Symbol [1] 1 1 2 2 sym001 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number PMEG2010AEJ Package Name Description Version SC-90 plastic surface mounted package; 2 leads SOD323F 4. Marking Table 4. Marking codes Type number Marking code PMEG2010AEJ EM 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Max Unit - 20 V - 1 A VR reverse voltage IF forward current IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 5.5 A IFSM non-repetitive peak forward current square wave; tp = 8 ms - 10 A Ptot total power dissipation Tamb ≤ 25 °C [1] - 360 mW [2] - 830 mW Tsp ≤ 55 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. PMEG2010AEJ_3 Product data sheet Min © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 2 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) Rth(j-sp) Conditions thermal resistance from junction to ambient in free air thermal resistance from junction to solder point Min Typ Max Unit [1][2] - - 350 K/W [1][3] - - 150 K/W [4] - - 55 K/W [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating are available on request. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Solder point of cathode tab. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol VF IR Cd [1] Parameter Conditions Min Typ Max Unit IF = 10 mA - 240 270 mV IF = 100 mA - 300 350 mV IF = 500 mA - 400 460 mV [1] forward voltage reverse current diode capacitance IF = 1000 mA - 480 550 mV VR = 5 V - 5 10 μA VR = 8 V - 7 20 μA VR = 10 V - 8 30 μA VR = 15 V - 10 50 μA VR = 20 V - 15 70 μA VR = 1 V; f = 1 MHz - 40 50 pF Pulse test: tp ≤ 300 μs; δ ≤ 0.02. PMEG2010AEJ_3 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 3 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 006aaa361 104 IF (mA) 103 (1) (2) 103 (1) 102 006aaa362 105 IR (μA) 104 (2) (3) 102 10 (4) 10 1 (3) 1 (4) 10−1 (5) 10−1 (5) 10−2 10−2 10−3 0 0.1 0.2 0.3 0.4 0.5 0 0.6 0.7 VF (V) 5 15 20 VR (V) (1) Tamb = 150 °C (1) Tamb = 150 °C (2) Tamb = 125 °C (2) Tamb = 125 °C (3) Tamb = 85 °C (3) Tamb = 85 °C (4) Tamb = 25 °C (4) Tamb = 25 °C (5) Tamb = −40 °C (5) Tamb = −40 °C Fig 1. 10 Forward current as a function of forward voltage; typical values Fig 2. Reverse current as a function of reverse voltage; typical values 006aaa363 80 Cd (pF) 60 40 20 0 0 5 10 15 20 VR (V) Tamb = 25 °C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2010AEJ_3 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 4 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 8. Package outline 1.35 1.15 0.80 0.65 0.5 0.3 1 2.7 2.3 1.8 1.6 2 0.25 0.10 0.40 0.25 Dimensions in mm Fig 4. 04-09-13 Package outline SOD323F (SC-90) 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG2010AEJ [1] Package SOD323F Description Packing quantity 4 mm pitch, 8 mm tape and reel 3000 10000 -115 -135 For further information and the availability of packing methods, see Section 14. 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) 001aab169 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 5. Reflow soldering footprint SOD323F (SC-90) PMEG2010AEJ_3 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 5 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 11. Mounting 43.4 43.4 10 0.6 10 0.6 0.6 40 40 0.6 0.6 0.5 0.5 0.6 Dimensions in mm 006aaa487 Dimensions in mm PCB thickness: d = 1.6 mm Fig 6. FR4 PCB, standard footprint SOD323F (SC-90) PMEG2010AEJ_3 Product data sheet 006aaa488 PCB thickness: d = 1.6 mm Fig 7. FR4 PCB, mounting pad for cathode 1 cm2 SOD323F (SC-90) © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 6 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMEG2010AEJ_3 20100115 Product data sheet - PMEG2010AEJ_2 Modifications: • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. PMEG2010AEJ_2 20051014 Product data sheet - PMEG2010AEJ_1 PMEG2010AEJ_1 20050302 Product data sheet - - PMEG2010AEJ_3 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 7 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PMEG2010AEJ_3 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 03 — 15 January 2010 8 of 9 PMEG2010AEJ NXP Semiconductors 20 V, 1 A very low VF MEGA Schottky barrier rectifier 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 5 6 7 8 8 8 8 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 January 2010 Document identifier: PMEG2010AEJ_3