AOS Semiconductor Product Reliability Report AON7400A rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AON7400A. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AON7400A passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AON7400A combines advanced trench MOSFET technology with a low resistance package to provide extremely low RDS(ON). This device is suitable for use as a high side switch in SMPS and general purpose applications. -RoHs Compliant -Halogen Free Detailed information refers to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Moisture Level AON7400A Standard sub-micron Low voltage N channel process 8 leads DFN 3x3 Cu Ag epoxy Cu & Au wire Epoxy resin with silica filler UL-94 V-0 Up to Level 1 * Note * based on info provided by assembler and mold compound supplier 2 III. Result of Reliability Stress for AON7400A Test Item Test Condition Time Point Solder Reflow Precondition 168hr 85c /85%RH +3 cycle reflow @260c - HTGB Temp = 150c , Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs HTRB HAST Pressure Pot Temperature Cycle Temp = 150c , Vds=80% of Vdsmax 130 +/- 2c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121c , 29.7psi, RH=100% -65c to 150c , air to air Lot Attribution Total Sample size 11 lots 1947 pcs 0 10 lot 6 lot 4 lot (Note A*) 1540pcs 0 10lot 6 lot 4 lot (Note A*) 1540pcs 96 hrs 6 lots 330 pcs 0 96 hrs (Note A*) 10 lots 55 pcs / lot 770 pcs 0 (Note A*) 77 pcs / lot 168hrs 500 hrs 1000 hrs 250 / 500 cycles 11 lot (Note A*) Number of Failures 77pcs / lot 0 77pcs / lot 847 pcs 0 77pcs / lot Note A: The data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3 MTTF = 43026 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AON7400A). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2 x (20x77x168+ 12x77x500+ 8x77x1000) x 258] = 3 9 7 MTTF = 10 / FIT = 2.90 x 10 hrs = 43026 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K 3