Reliability Report

AOS Semiconductor
Product Reliability Report
AON7400A
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AON7400A. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AON7400A passes AOS quality
and reliability requirements. The released product will be categorized by the process family and
be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AON7400A combines advanced trench MOSFET technology with a low resistance package
to provide extremely low RDS(ON). This device is suitable for use as a high side switch in SMPS
and general purpose applications.
-RoHs Compliant
-Halogen Free
Detailed information refers to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Flammability Rating
Moisture Level
AON7400A
Standard sub-micron
Low voltage N channel process
8 leads DFN 3x3
Cu
Ag epoxy
Cu & Au wire
Epoxy resin with silica filler
UL-94 V-0
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
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III. Result of Reliability Stress for AON7400A
Test Item
Test Condition
Time
Point
Solder
Reflow
Precondition
168hr 85c /85%RH +3
cycle reflow @260c
-
HTGB
Temp = 150c ,
Vgs=100% of Vgsmax
168hrs
500 hrs
1000 hrs
HTRB
HAST
Pressure Pot
Temperature
Cycle
Temp = 150c ,
Vds=80% of Vdsmax
130 +/- 2c , 85%RH,
33.3 psi, Vgs = 80% of
Vgs max
121c , 29.7psi,
RH=100%
-65c to 150c ,
air to air
Lot Attribution
Total
Sample
size
11 lots
1947 pcs
0
10 lot
6 lot
4 lot
(Note A*)
1540pcs
0
10lot
6 lot
4 lot
(Note A*)
1540pcs
96 hrs
6 lots
330 pcs
0
96 hrs
(Note A*)
10 lots
55 pcs / lot
770 pcs
0
(Note A*)
77 pcs / lot
168hrs
500 hrs
1000 hrs
250 / 500
cycles
11 lot
(Note A*)
Number
of
Failures
77pcs / lot
0
77pcs / lot
847 pcs
0
77pcs / lot
Note A: The data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3
MTTF = 43026 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AON7400A). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
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9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
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= 1.83 x 10 / [2 x (20x77x168+ 12x77x500+ 8x77x1000) x 258] = 3
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MTTF = 10 / FIT = 2.90 x 10 hrs = 43026 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K
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