U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Features φ3 Round shape type, UB,UC,UG : Water Clear epoxy UY : Pale Yellow Clear epoxy UR : Pale Red Clear epoxy Package Product features ・Outer Dimension φ3 Round shape type ・Operation temperature range. Storage Temperature :-40℃∼100℃ Operating Temperature :-40℃∼85℃ ・No lead package and lead–free soldering compatible Dominant wavelength Blue Blue Green Green Yellow Red : : : : : 470nm (UB) 505nm (UC) 525nm (UG) 590nm (UY) 626nm (UR) Half Intensity Angle UB,UC,UG UY,UR : 56 deg. : 66 deg. Die materials UB,UC,UG : InGaN, UY,UR : AlGaInP Rank grouping parameter Sorted by luminous intensity per rank taping Soldering methods TTW (Through The Wave) soldering and manual soldering ESD InGaN : Less than 1kV(HBM), Packing Bulk : 200pcs(MIN.) AlGaInP : More than 2kV(HBM) Recommended Applications Amusement Equipment, Electric Household Appliances, OA/FA, Other General Applications 2004.10.29 Page 1 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Color and Luminous Intensity Part No. Material Emitted Color UB3804X InGa N B lue UC3804X InGa N B lue Green UG3804X InGa N Green UY3864X AlGa InP Y ellow UR3864X AlGa InP Red 2004.10.29 (Ta=25℃) Lens Color Water Clear Clear P ale Y ellow P ale Red Dominant Wavelength Luminous Intens ity λ d (nm) Iv (mc d) T YP. IF MIN. T YP. IF 470 20 240 672 20 505 20 672 2,688 20 525 20 960 2,688 20 590 20 250 500 20 630 20 220 440 20 Page 2 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Absolute Maximum Ratings Ite m S ymbol P owe r Dissipa tion F orwa rd Curre nt P ulse F orwa rd Curre nt ※ 1 De ra ting (T a =25℃ or hig he r) Re ve rse Volta ge Ope ra ting T e mpe ra ture S tora ge T e mpe ra ture (Ta=25℃) Absolute Ma x imum Ra tings Unit UB UC UG UY UR Pd 105 105 105 150 150 mW IF 25 25 25 50 50 mA IF R M 60 60 60 100 100 mA ⊿ IF 0.33 0.33 0.33 0.67 0.67 mA/℃ VR 5 5 5 5 5 V T opr -40~ +85 ℃ T s tg -40~ +100 ℃ ※1 IFRM Measurement condition : Pulse Width≦1ms., Duty≦1/20. 2004.10.29 Page 3 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Electro-Optical Characteristics Item (Ta=25℃) Characteristics Symbol Conditions TYP. Forward Voltage IF=20mA Unit UB UC UG UY UR 3.7 3.7 3.7 2.2 2.2 VF V MAX. 4.2 4.2 4.2 2.8 2.8 Reverse Current VR =5V IR MAX. 100 100 100 100 100 μA Peak Wavelength IF=20mA λp TYP. 465 502 517 592 641 nm IF=20mA λd TYP. 470 505 525 590 630 nm IF=20mA ⊿λ TYP. 26 30 35 18 18 nm IF=20mA 2θ1/2 TYP. 56 56 56 66 66 deg. Dominant Wavelength Spectral Line Half Width Half Intensity Angle 2004.10.29 Page 4 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Luminous Intensity Rank Ra nk UB MIN. A B C D E F G H IV （mcd） UG UC MAX. MIN. (Ta=25℃) MAX. MIN. MAX. UY MIN. Condition UR MAX. MIN. MAX. 672 1,344 250 500 220 440 960 1,920 350 700 300 600 240 480 1,344 2,688 960 1,920 500 1,000 440 880 336 672 1,920 3,840 1,344 2,688 700 1,400 600 1,200 480 960 2,688 5,376 1,920 3,840 1,000 2,000 880 1,760 672 1,344 3,840 - 2,688 5,376 1,400 - 960 1,920 3,840 7,680 - 5,376 - 1,344 1,200 IF = 20mA - ※Please contact our sales staff concerning rank designation of UY and UR. 2004.12.27 Page 5 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UB) Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Relative Intensity Condition : Ta = 25℃ Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Relative Intensity Forward Voltage VF(V) 2004.10.29 Condition : Ta = 25℃ Relative Intensity Forward Current IF(mA) Condition : Ta = 25℃ Forward Current IF(mA) Page 6 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UB) Derating Ambient Temperature vs. Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage VF(V) Power Dissipation : Pd (mW) Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) 2004.10.29 Condition : IF=20mA Relative Intensity Maximum Forward Current : IF MAX. (mA) Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Page 7 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UB) Dynamic Drive Rating Pulse Width vs. Maximum Tolerable Peak Current Duty (%) 2004.10.29 Condition : Ta = 25℃ IF peak Max./IF DC MAX. Maximum Forward Current : IF MAX. (mA) Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Pulse Width : tw (μs) Page 8 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UC) Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Relative Intensity Condition : Ta = 25℃ Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Relative Intensity Forward Voltage VF(V) 2004.10.29 Condition : Ta = 25℃ Relative Intensity Forward Current IF(mA) Condition : Ta = 25℃ Forward Current IF(mA) Page 9 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UC) Derating Ambient Temperature vs. Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage VF(V) Power Dissipation : Pd (mW) Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) 2004.10.29 Condition : IF=20mA Relative Intensity Maximum Forward Current : IF MAX. (mA) Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Page 10 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UC) Dynamic Drive Rating Pulse Width vs. Maximum Tolerable Peak Current Duty (%) 2004.10.29 Condition : Ta = 25℃ IF peak Max./IF DC MAX. Maximum Forward Current : IF MAX. (mA) Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Pulse Width : tw (μs) Page 11 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UG) Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Relative Intensity Condition : Ta = 25℃ Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Relative Intensity Forward Voltage VF(V) 2004.10.29 Condition : Ta = 25℃ Relative Intensity Forward Current IF(mA) Condition : Ta = 25℃ Forward Current IF(mA) Page 12 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UG) Derating Ambient Temperature vs. Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage VF(V) Power Dissipation : Pd (mW) Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) 2004.10.29 Condition : IF=20mA Relative Intensity Maximum Forward Current : IF MAX. (mA) Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Page 13 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UG) Dynamic Drive Rating Pulse Width vs. Maximum Tolerable Peak Current Duty (%) 2004.10.29 Condition : Ta = 25℃ IF peak Max./IF DC MAX. Maximum Forward Current : IF MAX. (mA) Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Pulse Width : tw (μs) Page 14 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UY) Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Relative Intensity Condition : Ta = 25℃ Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Relative Intensity Forward Voltage VF(V) 2004.10.29 Condition : Ta = 25℃ Relative Intensity Forward Current IF(mA) Condition : Ta = 25℃ Forward Current IF(mA) Page 15 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UY) Derating Ambient Temperature vs. Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage VF(V) Power Dissipation : Pd (mW) Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) 2004.10.29 Condition : IF=20mA Relative Intensity Maximum Forward Current : IF MAX. (mA) Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Page 16 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UY) Dynamic Drive Rating Pulse Width vs. Maximum Tolerable Peak Current Duty (%) 2004.10.29 Condition : Ta = 25℃ IF peak Max./IF DC MAX. Maximum Forward Current : IF MAX. (mA) Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Pulse Width : tw (μs) Page 17 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UR) Spectral Distribution Spatial Distribution Example Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Relative Intensity Condition : Ta = 25℃ Wavelength [nm] Forward Voltage vs. Forward Current Forward Current vs. Relative Intensity Forward Voltage VF(V) 2004.10.29 Condition : Ta = 25℃ Relative Intensity Forward Current IF(mA) Condition : Ta = 25℃ Forward Current IF(mA) Page 18 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UR) Derating Ambient Temperature vs. Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Forward Voltage VF(V) Power Dissipation : Pd (mW) Ambient Temperature : Ta(℃) Ambient Temperature : Ta(℃) 2004.10.29 Condition : IF=20mA Relative Intensity Maximum Forward Current : IF MAX. (mA) Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature : Ta(℃) Page 19 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UR) Dynamic Drive Rating Pulse Width vs. Maximum Tolerable Peak Current Duty (%) 2004.10.29 Condition : Ta = 25℃ IF peak Max./IF DC MAX. Maximum Forward Current : IF MAX. (mA) Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Pulse Width : tw (μs) Page 20 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Package Dimensions 2004.10.29 (Unit: mm) Page 21 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type TTW (Through The Wave) soldering Conditions Pre-heating 100 ℃ 60 s (MAX.) (MAX.) Solder Bath Temp. 265 ℃ (MAX.) Dipping Time 5 s (MAX.) 1) The dip soldering process shall be 2 times maximum. 2) The product shall be cooled to normal temperature before the second dipping process. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 2004.10.29 400 ℃ (MAX.) 3 s (MAX.) 2 times (MAX.) Page 22 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Resistance to Soldering Heat Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Lead Tension Vibration, Variable Frequency Applicable Standard EIAJ ED4701/100(101) EIAJ ED4701/300(302) EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(401) EIAJ ED4701/400(403) Testing Conditions Duration Ta = 25℃, IF = Maxium Rated Current Failure 1,000 h 0/25 10sec 0/25 Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 5 cycles 0/25 Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 10sec 0/10 2h 0/10 260±5℃, 3mm from package base □ 10N,1time ( 0.4 and Flat Package : 5N) 2 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction Failure Criteria Items Symbols Luminous Intensity Iv Forward Voltage VF Reverse Current IR Cosmetic Appearance - 2004.10.29 Conditions IF Value of each product Luminous Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V - Failure criteria Testing Min. Value ＜ Spec. Min. Value x 0.5 Testing Max. Value ≧ Spec. Max. Value x 1.2 Testing Max. Value ≧ Spec. Max. Value x 2.5 No notable, decoloration, deformation and cracking Page 23 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products described in the data sheets are made to be used in standard electronic applications such as office automation appliances, communication devices, audio visual, home appliances, and measuring instruments. 5) If the products in the data sheets are to be used for purposes other than the above which requires high level reliability and safety where failure and or malfunction of the product may cause death or other serious effects on the human body such as airplane, space activity, transportation, medical, nuclear), please contact our sales personnel. 6) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 7) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 8) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2004.10.29 Page 24