Thick Film Chip Resistors Thick Film Chip Resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T n Features l Small size and lightweight l High reliability Metal glaze thick film resistive element and three layers of electrodes l Compatible with placement machines Taping and bulk case packaging available l Suitable for both reflow and flow soldering l Approved under the ISO 9001 system Approved under the QS-9000 system l Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A n Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R J 3 G E Y J 1 0 2 V Product Code Thick Film Chip Resistors Size, Power Rating Type : inches Power R. 0.05 W 1GE : 0201 0.063 W 2GE : 0402 0.1 W 3GE : 0603 0.125 W 6GE : 0805 0.25 W 8GE : 1206 0.25 W 14 : 1210 0.5 W 12 : 1812 0.5 W 12Z : 2010 1W 1T : 2512 Code Y ]Nil Marking Marking Value Marking on black side No marking Resistance Tolerance Code J 0 Tolerance ±5% Jumper Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal Point is expressed by R as 4.7 = 4R7. Jumper is expressed by R00. Packaging Specifications Packaging Punched (Paper) Taping V (Only 3G, 6G, 8G type) Code U Embossed Taping (Only 14, 12, 12Z, 1T type) B Bulk case (Only 2G, 3G, 6G type) X Punched (Paper) Taping 2 mm pitch, 10000 pcs. Y Punched (Paper) Taping 2 mm pitch, 20000 pcs. (Only 2G, 3G type) (Only 2G type) C Punched (Paper) Taping 2 mm pitch, 15000 pcs. (Only 1G type) ] When partly omitted, all the rest P/N factors should be moved up respectively. Rev.02/04 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Thick Film Chip Resistors n Dimensions in mm (not to scale) n Construction L a W Protective coating High purity alumina Termination (Inner) t substrate b Dimensions (mm) Type (inches) Termination ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12 (1812) ERJ12Z (2010) ERJ1T (2512) (Between) Resistive element Termination (Outer) L W a b Weight (1000 pcs.) t 0.60 ±0.03 0.30 ±0.03 0.12±0.05 0.15±0.05 0.25 ±0.05 0.15 g 1.00 ±0.05 0.50 ±0.05 0.20±0.10 0.25±0.05 0.35 ±0.05 0.8 g 1.60 ±0.15 0.80 +0.15 0.30±0.20 0.30±0.15 0.45 ±0.10 Ð0.05 2g 2.00 ±0.10 4g 1.60 +0.05 0.50±0.20 0.50±0.20 0.60 ±0.10 3.20 +0.05 Ð0.20 Ð0.15 10 g 3.20 ±0.20 2.50 ±0.20 0.50±0.20 0.50±0.20 0.60 ±0.10 16 g 4.50 ±0.20 3.20 ±0.20 0.50±0.20 0.50±0.20 0.60 ±0.10 27 g 27 g 45 g ±0.20 5.00 ±0.20 6.40 ±0.20 1.25 ±0.10 2.50 ±0.20 3.20 ±0.20 0.40 ±0.20 0.60 ±0.20 0.65 ±0.20 0.40 ±0.20 0.60 0.60 ±0.20 0.60 ±0.10 0.60 ±0.20 0.60 ±0.10 n Ratings Type (inches) ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12, 12Z (1812, 2010) ERJ1T (2512) Jumper Power Rating Limiting Element Maximum Overload Resistance Voltage (Maximum Voltage(2) at 70 ¡C Tolerance(%) (1) RCWV) (V) (W) (V) Resistance Range (W) min. max. 0.05 15 30 ±5 10 1 M 0.063 50 100 ±5 1 2.2 M 0.1 50 100 ±5 1 10 M 0.125 150 200 ±5 1 10 M 0.25 200 400 ±5 1 10 M 0.25 200 400 ±5 1 10 M 0.5 200 400 ±5 1 10 M 1 200 400 ±5 1 1 M 1G 2G á 3G 6Gá8Gá14á12á12Zá1T Rated Current Maximum Overload Current 0.5 A 1 A 2 A 1A 2A 4A T.C.R. Standard ´10-6/¡C Resistance Values (ppm/¡C) <10 W: Ð100 to +600 E24 E24 E24 10 W to 1 MW: ±200 E24 E24 E24 1 MW<: Ð400 to +150 E24 E24 (1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV=Ö Power Rating ´ Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever is less. (2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined from SOTV=2.5 ´ Power Rating or max. Overload Voltage listed above whichever is less. 70 ¡C 100Ð55 ¡C 80 60 3G, 6G, 8G 40 1G,2G,14,12,12Z,1T 155 ¡C 20 125 ¡C 0Ð60 Ð40 Ð20 0 20 40 60 80 100 120 140 160 180 Ambient Temperature (¡C) Rated Load (%) Power Derating Curve For resistors operating in ambient temperature above 70 ¡C, power rating should be derated in accordance with the right figure. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Thick Film Chip Resistors n Packaging Specifications l Standard Quantity Type (inches) Thickness (mm) Punched (Paper) Taping ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12,12Z (1812, 2010) ERJ1T (2512) 0.25 15000 pcs./reel (2 mm pitch) 10000 20000 10000 5000 0.35 0.45 pcs./reel pcs./reel pcs./reel pcs./reel Embossed Taping (4 mm pitch) Bulk Case (2 mm pitch) (2 mm pitch) (2 mm pitch) (4 mm pitch) ] 0.6 5000 pcs./reel (4 mm pitch)] 0.6 5000 pcs./reel (4 mm pitch)] 50000 pcs./case 25000 pcs./case 10000 pcs./case 0.6 5000 pcs./reel 0.6 5000 pcs./reel 0.6 4000 pcs./reel ] Please consult us if resistors other than shown above are needed. l Taping Reel l Bulk Case (mm) T Slider 12 Shutter 38 fB fC fA Type 110 W fA fB fC W T Dimensions 1G,2G,3G 9.0±1.0 11.4±2.0 0 (mm) 6G,8G,14 180.0Ð3.0 60 min. 13.0±1.0 12,12Z,1T 13.0±1.0 15.4±2.0 l Punched (Paper) Taping Compartment Chip component Type 1G Dimensions 2G 3G (mm) 6G 8G P1 P2 A B 0.38±0.05 0.70±0.05 1.10±0.10 1.65±0.15 2.00±0.15 0.68±0.05 1.20±0.05 1.90±0.10 2.50±0.20 3.60±0.20 8.00±0.20 3.50±0.05 1.75±0.10 P2 P0 fD0 2.00±0.05 4.00±0.10 1.50+0.10 0 T 0.47±0.05 0.52±0.05 0.70±0.05 Type P1 1G 2.00±0.10 Dimensions 2G 3G (mm) 6G 4.00±0.10 8G W F E F W A Tape running direction P0 Compartment B B A T Sprocket hole fD0 F E W Sprocket hole fD0 l Embossed Taping E 0.84±0.05 t Chip component Type 14 Dimensions 12 (mm) 12Z 1T A 2.80±0.20 3.50±0.20 2.80±0.20 3.60±0.20 Type P2 14 Dimensions 12 2.00±0.05 (mm) 12Z 1T P1 P2 B fD1 Tape running direction P0 W F E P1 3.50±0.20 8.00±0.30 3.50±0.05 4.80±0.20 1.75±0.10 4.00±0.10 5.30±0.20 12.00±0.30 5.50±0.05 6.90±0.20 P0 fD0 t 4.00±0.10 1.50+0.10 0 1.00±0.10 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. fD1 1 min. 1.5 min. Thick Film Chip Resistors n Recommended Land Pattern In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). Type (inches) ERJ1G(0201) ERJ2G(0402) ERJ3G(0603) ERJ6G(0805) ERJ8G(1206) ERJ14(1210) ERJ12(1812) ERJ12Z(2010) ERJ1T(2512) c Chip Resistor a b Dimensions (mm) a b c 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 0.7 to 0.9 2 to 2.2 0.8 to 1 1 to 1.4 3.2 to 3.8 0.9 to 1.4 2 to 2.4 4.4 to 5 1.2 to 1.8 2 to 2.4 4.4 to 5 1.8 to 2.8 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 3.6 to 4 6.2 to 7 1.8 to 2.8 5 to 5.4 7.6 to 8.6 2.3 to 3.5 n Recommended Soldering Conditions Recommendations and precautions are described below. l Recommended soldering conditions for reflow áReflow soldering should be a maximum of two times áPlease contact us for additional information when used in conditions other than those specified. áPlease measure the temperature of terminations and study every type of printed circuit board for solderability, before actual use. Peak Preheating Main heating Peak Temperature Time 140 ¡C to 160 ¡C 60 s to 120 s Above 200 ¡C 30 s to 40 s 235 ± 5 ¡C max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating Temperature For soldering (Example : Sn/Pb) Preheating Heating Main heating Peak 150 ¡C to 180 ¡C 60 s to 120 s Above 230 ¡C 30 s to 40 s max. 260 ¡C max. 10 s Time l Recommended soldering conditions for flow For soldering For lead-free soldering Temperature Time Temperature Time Preheating 140 ¡C to 160 ¡C 60 s to 120 s 150 ¡C to 180 ¡C 60 s to 120 s Soldering 245±5 ¡C 20 s to 30 s max. 260 ¡C max. 10 s Safety Precautions 1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and confirmation test with the resistors actually mounted on the board. When a load of more than the rated power is applied under load condition at steady state, it may impair performance and/or reliability of the resistor. Never exceed the specified rated power. 2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of the resistors. 3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds and up to 350 ¡C). 4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may damage the protective coating of the resistor and may affect its performance. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.