LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only . FOUR DIGIT LED DISPLAY (0.56 Inch) Pb Lead-Free Parts LFD5H5/6SBKS-XX/SRP218-PF DATA SHEET DOC. NO : QW0905- LFD5H5/6SBKS-XX/SRP218-PF REV. : C DATE : 03 - Mar. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD5H5/6SBKS-XX/SRP218-PF Page 1/8 Package Dimensions 8.0(0.31") 46.5(1.83") 17.8(0.7") UC 22.0(0.87") DIG.1 DIG.3 DIG.2 DIG.4 LC 14.2(0.56") 1.9 ψ1.2 9.6 LFD5H5/6SBKS-XX/SRP218-PF LIGITEK 21.8±0.5 4.0±0.5 ψ0.51 TYP 2.54*5=12.7 PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 15.24(0.6") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD5H6SBKS-XX/SRP218-PF LFD5H5SBKS-XX/SRP218-PF Page 2/8 PART NO. LFD5H5/6SBKS-XX/SRP218-PF Internal Circuit Diagram 9 8 6 DIG.3 12 DIG.2 A B C D E F G AM A B C D E F G PM DIG.4 DIG.1 A B C D E F G LC 6 A B C D E F G UC 11 7 4 2 1 10 5 3 8 DIG.3 9 DIG.2 A B C D E F G AM A B C D E F G PM 12 DIG.1 A B C D E F G LC DIG.4 A B C D E F G UC 11 7 4 2 1 10 5 3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LFD5H5/6SBKS-XX/SRP218-PF Electrical Connection PIN NO LFD5H5SBKS-XX/SRP218-PF PIN NO LFD5H6SBKS-XX/SRP218-PF 1 Anode E 1 Cathode E 2 Anode D 2 Cathode D 3 Anode UC,LC,AM,PM 3 Cathode UC,LC,AM,PM 4 Anode C 4 Cathode C 5 Anode G 5 Cathode G 6 Common Cathode Dig.4,PM 6 Common Anode Dig.4,PM 7 Anode B 7 Cathode B 8 Common Cathode Dig.3,AM 8 Common Anode Dig.3,AM 9 Common Cathode Dig.2,LC 9 Common Anode Dig.2,LC 10 Anode F 10 Cathode F 11 Anode A 11 Cathode A 12 Common Cathode Dig.1,UC 12 Common Anode Dig.1,UC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LFD5H5/6SBKS-XX/SRP218-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SBKS Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 120 mW Ir 50 μA ESD 500 V Reverse Current Per Any Chip Electrostatic Discharge( * ) Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO λD (nm) △λ Vf(v) (nm) Iv(mcd) IV-M Typ. Max. Min. Typ. Common Cathode LFD5H5SBKS-XX/SRP218-PF 475 InGaN/SiC Blue LFD5H6SBKS-XX/SRP218-PF Electrical 26 3.5 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.2 5.0 8.5 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD5H5/6SBKS-XX/SRP218-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Dominant Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/8 PART NO.LFD5H5/6SBKS-XX/SRP218-PF Typical Electro-Optical Characteristics Curve SBK-S CHIP Fig.2 Relative Intensity vs. Forward Current 30 1.5 Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage 25 20 15 10 5 0 1 2 3 4 1.25 1.0 0.75 0.5 0.25 0 5 0 5 Relative Intensity@20mA Forward Current@20mA 40 30 20 10 0 50 75 Ambient Temperature( ℃) 20 25 30 Fig.4 Relative Intensity vs. Wavelength Fig.3 Forward Current vs. Temperature 25 15 Forward Current(mA) Forward Voltage(V) 0 10 100 1.0 0.5 0 380 430 480 530 580 Wavelength (nm) 630 680 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LFD5H5/6SBKS-XX/SRP218-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C Temp(°C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO.LFD5H5/6SBKS-XX/SRP218-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11