Infineon-TPM SLB 9645-DS-v01_00-EN

TPM
Trusted Platform Module
SLB9645 TCG Rev. 116
SLB9645VQ1.2
SLB9645TT1.2
SLB9645XT1.2
SLB9645XQ1.2
Data Sheet
Hardware Description
Rev. 1.1, 2014-02-12
Chip Card & Security ICs
Edition 2014-02-12
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
SLB9645
Trusted Platform Module
Revision History
Page or Item
Subjects (major changes since previous revision)
Rev. 1.1, 2014-02-12
Fixed typos, document references, added note to Table 8
Rev 1.0, 2013-09-17
Initial version
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Data Sheet
Hardware Description
3
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Device Types / Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
3.1
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
4.1
4.2
4.3
4.4
4.5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C Standard/Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
11
12
13
13
5
5.1
5.2
5.3
Package Dimensions (TSSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packing Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
14
14
15
6
6.1
6.2
6.3
Package Dimensions (VQFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packing Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
16
16
17
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Data Sheet
Hardware Description
4
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Pinout of the SLB9645TT1.2 (PG-TSSOP-28-2 Package, Top View) . . . . . . . . . . . . . . . . . . . . . . . 8
Pinout of the SLB9645VQ1.2 (PG-VQFN-32-13 Package, Top View) . . . . . . . . . . . . . . . . . . . . . . 8
Typical Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package Dimensions PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Tape & Reel Dimensions PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Recommended Footprint PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Chip Marking PG-TSSOP-28-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package Dimensions PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Tape & Reel Dimensions PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Recommended Footprint PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Chip Marking PG-VQFN-32-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Data Sheet
Hardware Description
5
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Buffer Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Not Connected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C Standard Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Recommended Footprint Dimensions (PG-TSSOP-28-2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Data Sheet
Hardware Description
6
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Overview
1
Overview
The SLB9645 is a Trusted Platform Module. It is available in different packages, see Table 1 below. It only
supports the I2C interface and features a dedicated interrupt pin which increases performance (since no polling
on the I2C bus is necessary). The I2C interface is compliant to both standard mode operation (up to 100 kHz) and
fast mode operation (up to 400 kHz); for details regarding the characteristics in these modes, please refer to
Section 4.5.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Compliant to TPM Main Specification, Version 1.2, Rev. 116
I2C compatible interface up to 400 kbps
Approved for Google Chromebook/Chromebox
Standard (-20..+85°C) and wide temperature range (-40..+85°C)
TSSOP-28 and VQFN-32 package
Optimized for battery operated devices: low standby power consumption (typ.150 µA)
24 PCRs
6 kBytes free NV memory
Up to 10 concurrent sessions
Up to eight 2048-bit keys can be loaded into volatile storage
16 slots for keys of up to 2048-bit
8 monotonic counters
1280 Bytes IO buffer
Built-in support by Linux™ kernel version 3.10 and higher
2
Device Types / Ordering Information
The SLB9645 product family features devices with different packages and different temperature ranges. Table 1
shows the available versions.
Table 1
Device Types
Device Name
Package
Remarks
SLB9645TT1.2
PG-TSSOP-28-2
Standard temperature range
SLB9645XT1.2
PG-TSSOP-28-2
Enhanced temperature range
SLB9645VQ1.2
PG-VQFN-32-13
Standard temperature range
SLB9645XQ1.2
PG-VQFN-32-13
Enhanced temperature range
Data Sheet
Hardware Description
7
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Pin Description
Pin Description
18
NC
NC
NC
22
GND
NC
NC
NC
25
NC
NC
NC
GND
NC
NC
NC
28
15
Pinning_TSSO P-28-2_SLB9645.vsd
TPM
SLB 9645 TT 1.2
PG-TSSOP-28-2
1
8
11
14
NC
NC
NC
Pinout of the SLB9645TT1.2 (PG-TSSOP-28-2 Package, Top View)
NC
30
GND
NC
NC
SDA
SCL
PP
GND
VDD
26
NC
1
DAVINT#
NC
TPM
SLB 9645 VQ 1.2
NC
NC
22
NC
PG-VQFN-32-13
NC
NC
NC
NC
NC
7
RESET#
NC
18
10
NC
NC
15
GND
NC
NC
NC
NC
NC
VDD
VDD
Figure 2
GND
VDD
RESET#
NC
PP
DAVINT#
VDD
GND
NC
SCL
SDA
Figure 1
4
Pinning_VQFN-32-13_SLB9645.vsd
3
Pinout of the SLB9645VQ1.2 (PG-VQFN-32-13 Package, Top View)
Data Sheet
Hardware Description
8
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Pin Description
Table 2
Buffer Types
Buffer Type
Description
TS
Tri-State pin
ST
Schmitt-Trigger pin
OD
Open-Drain pin
Table 3
I/O Signals
Pin Number
Name
Pin
Type
Buffer
Type
Function
PG-TSSOP- PG-VQFN28-2
32-13
1
29
SDA
I/O
OD
I2C Bus Data Signal
The data line of the I2C bus.
2
30
SCL
I/O
OD
I2C Bus Clock Signal
The clock signal of the I2C bus.
9
8
RESET#
I
ST
Reset
External reset signal. Asserting this pin
unconditionally resets the device. The signal is
active low.
6
2
DAVINT#
I/O
ST
Data Available Interrupt
This pin can be connected to the host interrupt
controller to allow interrupt driven reads of the
response data instead of polling of the
TPM_STS_x.dataAvail bit. The signal remains
inactive (high) as long as TPM_STS_x.dataAvail is
0. As soon as a response is available, the signal is
asserted (low) and remains active until the complete
response is read by the host.
7
31
PP
I
ST
Physical Presence
This pin should be connected to a jumper. The
standard position of the jumper should connect the
pin to GND. If the pin is connected to VDD, some
special commands are enabled (for instance, the
command TPM_ForceClear, also refer to [1]).
Name
Pin
Type
Buffer
Type
Function
VDD
PWR
—
Power Supply
All VDD pins must be connected externally and
should be bypassed to GND via 100 nF capacitors.
GND
GND
—
Ground
All GND pins must be connected externally.
Table 4
Power Supply
Pin Number
PG-TSSOP- PG-VQFN28-2
32-13
5, 10
1, 9, 10
4, 11, 18, 25 16, 26, 32
Data Sheet
Hardware Description
9
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Pin Description
Table 5
Not Connected
Pin Number
Name
PG-TSSOP- PG-VQFN28-2
32-13
3, 8, 12 - 17, 3 - 7, 11 NC
19 - 24, 26 - 15, 17 - 25,
28
27, 28
3.1
Pin
Type
Buffer
Type
Function
NU
—
Not Connected
All NC pins must not be connected externally (must
be left floating).
Typical Schematic
Figure 3 shows the typical schematic for the SLB9645. The power supply pins should be bypassed to GND with
capacitors located close to the device. The physical presence input may be connected to a jumper as shown in
the schematic; or it may be driven by other devices (this is application- or platform-dependent).
Note that pull-up resistors are needed on the I2C clock and data signals, these are not shown in the schematic.
VDD
SCL
SCL
SDA
SDA
RESET#
VDD
1 µF
RESET#
GND
2x 100 nF (place close to
device VDD/GND pins)
VDD
J1
Physical Presence
HW Switch
DAVINT#
PP
DAVINT#
4k7
NC
SLB 9645
Schematic _SLB9645 .vsd
Figure 3
Typical Schematic
Data Sheet
Hardware Description
10
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Electrical Characteristics
4
Electrical Characteristics
This chapter lists the maximum and operating ranges for various electrical and timing parameters.
4.1
Absolute Maximum Ratings
Table 6
Absolute Maximum Ratings
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Supply Voltage
VDD
-0.3
–
7
V
–
Voltage on any pin
Vmax
-0.3
–
VDD+0.3
V
–
Ambient temperature
TA
-40
–
85
°C
–
Storage temperature
TS
-40
–
125
°C
–
ESD robustness HBM:
1.5 kΩ, 100 pF
VESD,HBM
–
–
2000
V
According to EIA/JESD22-A114-B
ESD robustness
VESD,CDM
–
–
500
V
According to ESD Association
Standard STM5.3.1 - 1999
Latchup immunity
Ilatch
100
mA
According to EIA/JESD78
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
4.2
Functional Operating Range
Table 7
Functional Operating Range
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Supply Voltage
VDD
3.0
3.3
3.6
V
3.3 V system environment
Supply Voltage
VDD
1.62
1.8
1.98
V
1.8 V system environment
Ambient temperature
TA
-20
–
85
°C
Standard temperature range
devices
Ambient temperature
TA
-40
–
85
°C
Enhanced temperature range
devices
–
–
5
y
Operating lifetime
–
–
5
y
Average TA over lifetime
–
55
–
°C
Useful lifetime1)
1)
1) The useful lifetime of the device is 5 (five) years with a duty cycle (that means, a power-on time) of 100%. An useful lifetime
of 7 (seven) years can be guaranteed for a duty cycle of 70%. For both scenarios, it is assumed that the device will be used
for calculations for approximately 5% of the maximum useful lifetime.
Data Sheet
Hardware Description
11
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Electrical Characteristics
4.3
DC Characteristics
TA = 25°C, VDD = 3.3V ± 0.3V or 1.8V ± 0.18V unless otherwise noted
Table 8
Current Consumption
Parameter
Symbol
Values
Min.
Typ.
Max.
25
Unit
Note / Test Condition
mA
VDD = 3.3V ± 0.3V
Device is active and is operating
internally. Note that since the
device is mostly in an internal
sleep state in a “typical”
application, the typical average
current consumption is far less
than the maximum value. It is
assumed that in a normal
environment, the device is in an
internal sleep state for
approximately 90% of the
operating time of the platform.
Current Consumption in
Active Mode
IVDD_Active
3.0
Current Consumption in
Sleep Mode
IVDD_Sleep
0.9
mA
VDD = 3.3V ± 0.3V, pins SDA and
RESET# = VDD
Device is active, SCL is toggling
but no ongoing internal TPM
operation. The device is in an
internal sleep state.
150
µA
VDD = 3.3V ± 0.3V, pins SDA, SCL
and RESET# = VDD
Device is active, SCL is not
toggling and no ongoing internal
TPM operation. The device is in an
internal sleep state.
Current Consumption in
IVDD_Sleep_CS
Sleep Mode with Stopped
Clock
Note: Current consumption does not include any currents flowing through resistive loads on output pins!
Note: Device sleep mode will be entered after 30 seconds of inactivity after the last TPM command was executed.
Table 9
DC Characteristics
Parameter
Symbol
Values
Min.
Typ.
Unit
Note / Test Condition
Max.
Input voltage high
VIH
0.7 VDD
VDD+0.3 V
All pins except RESET#
Input voltage low
VIL
-0.3
0.3 VDD
V
All pins except RESET#
Input voltage high
VIH
0.8 VDD
VDD
V
Pin RESET#
Input voltage low
VIL
0
0.2 VDD
V
Pin RESET#
Input high leakage current IIH
-15
15
µA
VIN = VDD
Input low leakage current IIL
-15
15
µA
VIN = 0V
V
IOH = 1mA
V
IOL = 1mA
Output high voltage
VOH
Output low voltage
VOL
Data Sheet
Hardware Description
VDD-0.3
0.3
12
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Electrical Characteristics
4.4
AC Characteristics
TA = 25°C, VDD = 3.3V ± 0.3V or 1.8V ± 0.18V unless otherwise noted
Table 10
Device Reset
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Reset Pulse Width
tRST
80
—
—
µs
Cold (power-on) reset
Reset Pulse Width
tRST
10
—
—
µs
Warm reset
4.5
I2C Standard/Fast Mode Interface Characteristics
The electrical characteristics are compliant to the NXP I²C bus specification [5] and [6] for “standard-mode”
(fSCL ≤ 100 kHz) and “fast-mode” (fSCL ≤ 400 kHz), with certain deviations stated in Table 11 and Table 12 below.
For printed circuit board design the reduced output fall time tOF compared to the NXP I²C bus specification needs
to be considered!
TA = 25°C, VDD = 3.3V ± 0.3V unless otherwise noted
Table 11
I2C Standard Mode Interface Characteristics
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
SCL clock frequency
fSCL
0
—
100
kHz
—
Output fall time from
VIHmin to VILmax (at device
pin)
tOF
—
—
75
ns
10 pF ≤ Cb ≤ 400 pF
SCL fall time (bus line,
output)
tfSCL
—
—
25
ns
—
Unit
Note / Test Condition
Table 12
I2C Fast Mode Interface Characteristics
Parameter
Symbol
Values
Min.
Typ.
Max.
SCL clock frequency
fSCL
0
—
400
kHz
—
Hysteresis of input stage
VHYS
0.05
—
—
V
—
Output fall time from
VIHmin to VILmax (at device
pin)
tOF
0.4
—
75
ns
10 pF ≤ Cb ≤ 400 pF
Spikes suppressed by
input filter
tSP
—
20
—
ns
Input filter implemented for SCL,
not for SDA
SCL fall time (bus line,
output)
tfSCL
—
—
25
ns
—
-10
—
10
µA
VIN between 10% and 90% of the
supply voltage VDD; the condition
“If VDD is switched off, I/O pins of
fast-mode devices must not
obstruct the SDA and SCL lines” is
not fulfilled.
Input current (SCL, SDA) II
Data Sheet
Hardware Description
13
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Package Dimensions (TSSOP)
5
Package Dimensions (TSSOP)
0˚...8˚
-0.035
B
1.1 MAX.
0.9 ±0.05
0.1 ±0.05
4.4 ±0.1 1)
0.125 +0.075
All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS
compliant.
0.65
C
2)
0.22 +0.08
-0.03
0.13
28
M
0.1
0.6 ±0.1
A C 28x
6.4
15
1
0.25 M B 28x
14
9.7 ±0.1 1)
A
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.08 max. per side
GPS09034
Figure 4
Package Dimensions PG-TSSOP-28-2
5.1
Packing Type
PG-TSSOP-28-2: Tape & Reel (reel diameter 330mm), 3000 pcs. per reel
0.3
16 ±0.3
10.2
8
1.2
6.8
1.6
Figure 5
Tape & Reel Dimensions PG-TSSOP-28-2
5.2
Recommended Footprint
Controlling dimension is millimeters (mm).
B
e
L
A
Figure 6
Recommended Footprint PG-TSSOP-28-2
Data Sheet
Hardware Description
14
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Package Dimensions (TSSOP)
Table 13
Recommended Footprint Dimensions (PG-TSSOP-28-2)
e
0.65 mm
25.6 mil
A
6.10 mm
240 mil
L
1.30 mm
51 mil
B
0.40 mm
16 mil
5.3
Chip Marking
Line 1: SLB9645TT12 or SLB9645XT12 (see Table 1)
Line 2: G <datecode> KMC, <K> indicates assembly site code, <MC> indicates mold compound code
Line 3: 00 <Lot number>, the 00 is an internal FW indication (only at manufacturing due to field upgrade option)
Assembly Site Code
12345678901
G
KMC
12XXXXXXXXXXX
Softwarecode
Mold Compound Code
Lot Code
ChipMarking.vsd
Figure 7
Chip Marking PG-TSSOP-28-2
Data Sheet
Hardware Description
15
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Package Dimensions (VQFN)
6
Package Dimensions (VQFN)
All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS
compliant.
5
7 x 0.5 = 3.5
A
0.5
0.9 MAX.
0.1 A 2x
B
17
32x
0.05 C
0.1 C
24
25
0.1 B 2x
SEATING PLANE
5
3.6 ±0.1
16
Index Marking
9
32
8
1
3.6 ±0.1
C
(0.2)
(4.2)
0.4 ±0.05
0.05 MAX.
Figure 8
Package Dimensions PG-VQFN-32-13
6.1
Packing Type
Index Marking
32x
0.25 +0.05
-0.07
0.1 M A B C
0.05 M C
PG-VQFN-32-13-PO V01
PG-VQFN-32-13: Tape & Reel (reel diameter 330mm), 5000 pcs. per reel
0.3
5.25
12
8
5.25
Index Marking
1.1
PG-VQFN-32-13-TP V01
Figure 9
Tape & Reel Dimensions PG-VQFN-32-13
6.2
Recommended Footprint
Figure 10 shows the recommended footprint for the PG-VQFN-32-13 package.
4.1
3.6
0.5
4.1
3.6
0.7
Package outline 5 x 5
0.25
PG-VQFN-32-13-FP V01
Figure 10
Recommended Footprint PG-VQFN-32-13
Data Sheet
Hardware Description
16
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Package Dimensions (VQFN)
6.3
Chip Marking
Line 1: SLB9645
Line 2: VQ12 yy or XQ12_yy (see Table 1), the <yy> is an internal FW indication
Line 3: <Lot number> H <datecode>
Infineon
1234567
VQ12 YY
XXH
Softwarecode
Lot Code
Figure 11
ChipMarking_VQFN.vsd
Chip Marking PG-VQFN-32-13
Data Sheet
Hardware Description
17
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
References
References
[1]
—, “TPM Main Specification”, Version 1.2, Rev. 116, 2011-03-01, TCG (parts 1-3)
[2]
—, “TCG PC Client TPM Interface Specification (TIS)”, Version 1.21, 2011-04-28, TCG
[3]
—, “PC Client Implementation Specification”, Version 1.2, 2005-07-13, TCG
[4]
—, “TCG Software Stack Specification (TSS)”, Version 1.2, 2005-11-02, TCG
[5]
—, “NXP I²C bus specification, Rev. 03”, 19 June 2007
[6]
—, “NXP I²C bus specification, Rev. 4”, 13 February 2012
Data Sheet
Hardware Description
18
Rev. 1.1, 2014-02-12
SLB9645
Trusted Platform Module
Terminology
Terminology
I2C
Inter-Integrated Circuit
PCR
Platform Configuration Register
TCG
Trusted Computing Group
TPM
Trusted Platform Module
TSS
TCG Software Stack
Data Sheet
Hardware Description
19
Rev. 1.1, 2014-02-12
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG