TPM Trusted Platform Module SLB9645 TCG Rev. 116 SLB9645VQ1.2 SLB9645TT1.2 SLB9645XT1.2 SLB9645XQ1.2 Data Sheet Hardware Description Rev. 1.1, 2014-02-12 Chip Card & Security ICs Edition 2014-02-12 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. SLB9645 Trusted Platform Module Revision History Page or Item Subjects (major changes since previous revision) Rev. 1.1, 2014-02-12 Fixed typos, document references, added note to Table 8 Rev 1.0, 2013-09-17 Initial version Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 Data Sheet Hardware Description 3 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Device Types / Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 3.1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Typical Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 4.1 4.2 4.3 4.4 4.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2C Standard/Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 11 12 13 13 5 5.1 5.2 5.3 Package Dimensions (TSSOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 14 15 6 6.1 6.2 6.3 Package Dimensions (VQFN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chip Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Data Sheet Hardware Description 4 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Pinout of the SLB9645TT1.2 (PG-TSSOP-28-2 Package, Top View) . . . . . . . . . . . . . . . . . . . . . . . 8 Pinout of the SLB9645VQ1.2 (PG-VQFN-32-13 Package, Top View) . . . . . . . . . . . . . . . . . . . . . . 8 Typical Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package Dimensions PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape & Reel Dimensions PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Recommended Footprint PG-TSSOP-28-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Chip Marking PG-TSSOP-28-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Package Dimensions PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Tape & Reel Dimensions PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Recommended Footprint PG-VQFN-32-13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Chip Marking PG-VQFN-32-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Data Sheet Hardware Description 5 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Buffer Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Not Connected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Functional Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 I2C Standard Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 I2C Fast Mode Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Recommended Footprint Dimensions (PG-TSSOP-28-2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Data Sheet Hardware Description 6 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Overview 1 Overview The SLB9645 is a Trusted Platform Module. It is available in different packages, see Table 1 below. It only supports the I2C interface and features a dedicated interrupt pin which increases performance (since no polling on the I2C bus is necessary). The I2C interface is compliant to both standard mode operation (up to 100 kHz) and fast mode operation (up to 400 kHz); for details regarding the characteristics in these modes, please refer to Section 4.5. Features • • • • • • • • • • • • • • Compliant to TPM Main Specification, Version 1.2, Rev. 116 I2C compatible interface up to 400 kbps Approved for Google Chromebook/Chromebox Standard (-20..+85°C) and wide temperature range (-40..+85°C) TSSOP-28 and VQFN-32 package Optimized for battery operated devices: low standby power consumption (typ.150 µA) 24 PCRs 6 kBytes free NV memory Up to 10 concurrent sessions Up to eight 2048-bit keys can be loaded into volatile storage 16 slots for keys of up to 2048-bit 8 monotonic counters 1280 Bytes IO buffer Built-in support by Linux™ kernel version 3.10 and higher 2 Device Types / Ordering Information The SLB9645 product family features devices with different packages and different temperature ranges. Table 1 shows the available versions. Table 1 Device Types Device Name Package Remarks SLB9645TT1.2 PG-TSSOP-28-2 Standard temperature range SLB9645XT1.2 PG-TSSOP-28-2 Enhanced temperature range SLB9645VQ1.2 PG-VQFN-32-13 Standard temperature range SLB9645XQ1.2 PG-VQFN-32-13 Enhanced temperature range Data Sheet Hardware Description 7 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Pin Description Pin Description 18 NC NC NC 22 GND NC NC NC 25 NC NC NC GND NC NC NC 28 15 Pinning_TSSO P-28-2_SLB9645.vsd TPM SLB 9645 TT 1.2 PG-TSSOP-28-2 1 8 11 14 NC NC NC Pinout of the SLB9645TT1.2 (PG-TSSOP-28-2 Package, Top View) NC 30 GND NC NC SDA SCL PP GND VDD 26 NC 1 DAVINT# NC TPM SLB 9645 VQ 1.2 NC NC 22 NC PG-VQFN-32-13 NC NC NC NC NC 7 RESET# NC 18 10 NC NC 15 GND NC NC NC NC NC VDD VDD Figure 2 GND VDD RESET# NC PP DAVINT# VDD GND NC SCL SDA Figure 1 4 Pinning_VQFN-32-13_SLB9645.vsd 3 Pinout of the SLB9645VQ1.2 (PG-VQFN-32-13 Package, Top View) Data Sheet Hardware Description 8 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Pin Description Table 2 Buffer Types Buffer Type Description TS Tri-State pin ST Schmitt-Trigger pin OD Open-Drain pin Table 3 I/O Signals Pin Number Name Pin Type Buffer Type Function PG-TSSOP- PG-VQFN28-2 32-13 1 29 SDA I/O OD I2C Bus Data Signal The data line of the I2C bus. 2 30 SCL I/O OD I2C Bus Clock Signal The clock signal of the I2C bus. 9 8 RESET# I ST Reset External reset signal. Asserting this pin unconditionally resets the device. The signal is active low. 6 2 DAVINT# I/O ST Data Available Interrupt This pin can be connected to the host interrupt controller to allow interrupt driven reads of the response data instead of polling of the TPM_STS_x.dataAvail bit. The signal remains inactive (high) as long as TPM_STS_x.dataAvail is 0. As soon as a response is available, the signal is asserted (low) and remains active until the complete response is read by the host. 7 31 PP I ST Physical Presence This pin should be connected to a jumper. The standard position of the jumper should connect the pin to GND. If the pin is connected to VDD, some special commands are enabled (for instance, the command TPM_ForceClear, also refer to [1]). Name Pin Type Buffer Type Function VDD PWR — Power Supply All VDD pins must be connected externally and should be bypassed to GND via 100 nF capacitors. GND GND — Ground All GND pins must be connected externally. Table 4 Power Supply Pin Number PG-TSSOP- PG-VQFN28-2 32-13 5, 10 1, 9, 10 4, 11, 18, 25 16, 26, 32 Data Sheet Hardware Description 9 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Pin Description Table 5 Not Connected Pin Number Name PG-TSSOP- PG-VQFN28-2 32-13 3, 8, 12 - 17, 3 - 7, 11 NC 19 - 24, 26 - 15, 17 - 25, 28 27, 28 3.1 Pin Type Buffer Type Function NU — Not Connected All NC pins must not be connected externally (must be left floating). Typical Schematic Figure 3 shows the typical schematic for the SLB9645. The power supply pins should be bypassed to GND with capacitors located close to the device. The physical presence input may be connected to a jumper as shown in the schematic; or it may be driven by other devices (this is application- or platform-dependent). Note that pull-up resistors are needed on the I2C clock and data signals, these are not shown in the schematic. VDD SCL SCL SDA SDA RESET# VDD 1 µF RESET# GND 2x 100 nF (place close to device VDD/GND pins) VDD J1 Physical Presence HW Switch DAVINT# PP DAVINT# 4k7 NC SLB 9645 Schematic _SLB9645 .vsd Figure 3 Typical Schematic Data Sheet Hardware Description 10 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Electrical Characteristics 4 Electrical Characteristics This chapter lists the maximum and operating ranges for various electrical and timing parameters. 4.1 Absolute Maximum Ratings Table 6 Absolute Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Supply Voltage VDD -0.3 – 7 V – Voltage on any pin Vmax -0.3 – VDD+0.3 V – Ambient temperature TA -40 – 85 °C – Storage temperature TS -40 – 125 °C – ESD robustness HBM: 1.5 kΩ, 100 pF VESD,HBM – – 2000 V According to EIA/JESD22-A114-B ESD robustness VESD,CDM – – 500 V According to ESD Association Standard STM5.3.1 - 1999 Latchup immunity Ilatch 100 mA According to EIA/JESD78 Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 4.2 Functional Operating Range Table 7 Functional Operating Range Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Supply Voltage VDD 3.0 3.3 3.6 V 3.3 V system environment Supply Voltage VDD 1.62 1.8 1.98 V 1.8 V system environment Ambient temperature TA -20 – 85 °C Standard temperature range devices Ambient temperature TA -40 – 85 °C Enhanced temperature range devices – – 5 y Operating lifetime – – 5 y Average TA over lifetime – 55 – °C Useful lifetime1) 1) 1) The useful lifetime of the device is 5 (five) years with a duty cycle (that means, a power-on time) of 100%. An useful lifetime of 7 (seven) years can be guaranteed for a duty cycle of 70%. For both scenarios, it is assumed that the device will be used for calculations for approximately 5% of the maximum useful lifetime. Data Sheet Hardware Description 11 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Electrical Characteristics 4.3 DC Characteristics TA = 25°C, VDD = 3.3V ± 0.3V or 1.8V ± 0.18V unless otherwise noted Table 8 Current Consumption Parameter Symbol Values Min. Typ. Max. 25 Unit Note / Test Condition mA VDD = 3.3V ± 0.3V Device is active and is operating internally. Note that since the device is mostly in an internal sleep state in a “typical” application, the typical average current consumption is far less than the maximum value. It is assumed that in a normal environment, the device is in an internal sleep state for approximately 90% of the operating time of the platform. Current Consumption in Active Mode IVDD_Active 3.0 Current Consumption in Sleep Mode IVDD_Sleep 0.9 mA VDD = 3.3V ± 0.3V, pins SDA and RESET# = VDD Device is active, SCL is toggling but no ongoing internal TPM operation. The device is in an internal sleep state. 150 µA VDD = 3.3V ± 0.3V, pins SDA, SCL and RESET# = VDD Device is active, SCL is not toggling and no ongoing internal TPM operation. The device is in an internal sleep state. Current Consumption in IVDD_Sleep_CS Sleep Mode with Stopped Clock Note: Current consumption does not include any currents flowing through resistive loads on output pins! Note: Device sleep mode will be entered after 30 seconds of inactivity after the last TPM command was executed. Table 9 DC Characteristics Parameter Symbol Values Min. Typ. Unit Note / Test Condition Max. Input voltage high VIH 0.7 VDD VDD+0.3 V All pins except RESET# Input voltage low VIL -0.3 0.3 VDD V All pins except RESET# Input voltage high VIH 0.8 VDD VDD V Pin RESET# Input voltage low VIL 0 0.2 VDD V Pin RESET# Input high leakage current IIH -15 15 µA VIN = VDD Input low leakage current IIL -15 15 µA VIN = 0V V IOH = 1mA V IOL = 1mA Output high voltage VOH Output low voltage VOL Data Sheet Hardware Description VDD-0.3 0.3 12 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Electrical Characteristics 4.4 AC Characteristics TA = 25°C, VDD = 3.3V ± 0.3V or 1.8V ± 0.18V unless otherwise noted Table 10 Device Reset Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Reset Pulse Width tRST 80 — — µs Cold (power-on) reset Reset Pulse Width tRST 10 — — µs Warm reset 4.5 I2C Standard/Fast Mode Interface Characteristics The electrical characteristics are compliant to the NXP I²C bus specification [5] and [6] for “standard-mode” (fSCL ≤ 100 kHz) and “fast-mode” (fSCL ≤ 400 kHz), with certain deviations stated in Table 11 and Table 12 below. For printed circuit board design the reduced output fall time tOF compared to the NXP I²C bus specification needs to be considered! TA = 25°C, VDD = 3.3V ± 0.3V unless otherwise noted Table 11 I2C Standard Mode Interface Characteristics Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition SCL clock frequency fSCL 0 — 100 kHz — Output fall time from VIHmin to VILmax (at device pin) tOF — — 75 ns 10 pF ≤ Cb ≤ 400 pF SCL fall time (bus line, output) tfSCL — — 25 ns — Unit Note / Test Condition Table 12 I2C Fast Mode Interface Characteristics Parameter Symbol Values Min. Typ. Max. SCL clock frequency fSCL 0 — 400 kHz — Hysteresis of input stage VHYS 0.05 — — V — Output fall time from VIHmin to VILmax (at device pin) tOF 0.4 — 75 ns 10 pF ≤ Cb ≤ 400 pF Spikes suppressed by input filter tSP — 20 — ns Input filter implemented for SCL, not for SDA SCL fall time (bus line, output) tfSCL — — 25 ns — -10 — 10 µA VIN between 10% and 90% of the supply voltage VDD; the condition “If VDD is switched off, I/O pins of fast-mode devices must not obstruct the SDA and SCL lines” is not fulfilled. Input current (SCL, SDA) II Data Sheet Hardware Description 13 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Package Dimensions (TSSOP) 5 Package Dimensions (TSSOP) 0˚...8˚ -0.035 B 1.1 MAX. 0.9 ±0.05 0.1 ±0.05 4.4 ±0.1 1) 0.125 +0.075 All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS compliant. 0.65 C 2) 0.22 +0.08 -0.03 0.13 28 M 0.1 0.6 ±0.1 A C 28x 6.4 15 1 0.25 M B 28x 14 9.7 ±0.1 1) A Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.08 max. per side GPS09034 Figure 4 Package Dimensions PG-TSSOP-28-2 5.1 Packing Type PG-TSSOP-28-2: Tape & Reel (reel diameter 330mm), 3000 pcs. per reel 0.3 16 ±0.3 10.2 8 1.2 6.8 1.6 Figure 5 Tape & Reel Dimensions PG-TSSOP-28-2 5.2 Recommended Footprint Controlling dimension is millimeters (mm). B e L A Figure 6 Recommended Footprint PG-TSSOP-28-2 Data Sheet Hardware Description 14 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Package Dimensions (TSSOP) Table 13 Recommended Footprint Dimensions (PG-TSSOP-28-2) e 0.65 mm 25.6 mil A 6.10 mm 240 mil L 1.30 mm 51 mil B 0.40 mm 16 mil 5.3 Chip Marking Line 1: SLB9645TT12 or SLB9645XT12 (see Table 1) Line 2: G <datecode> KMC, <K> indicates assembly site code, <MC> indicates mold compound code Line 3: 00 <Lot number>, the 00 is an internal FW indication (only at manufacturing due to field upgrade option) Assembly Site Code 12345678901 G KMC 12XXXXXXXXXXX Softwarecode Mold Compound Code Lot Code ChipMarking.vsd Figure 7 Chip Marking PG-TSSOP-28-2 Data Sheet Hardware Description 15 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Package Dimensions (VQFN) 6 Package Dimensions (VQFN) All dimensions are given in millimeters (mm) unless otherwise noted. The packages are “green” and RoHS compliant. 5 7 x 0.5 = 3.5 A 0.5 0.9 MAX. 0.1 A 2x B 17 32x 0.05 C 0.1 C 24 25 0.1 B 2x SEATING PLANE 5 3.6 ±0.1 16 Index Marking 9 32 8 1 3.6 ±0.1 C (0.2) (4.2) 0.4 ±0.05 0.05 MAX. Figure 8 Package Dimensions PG-VQFN-32-13 6.1 Packing Type Index Marking 32x 0.25 +0.05 -0.07 0.1 M A B C 0.05 M C PG-VQFN-32-13-PO V01 PG-VQFN-32-13: Tape & Reel (reel diameter 330mm), 5000 pcs. per reel 0.3 5.25 12 8 5.25 Index Marking 1.1 PG-VQFN-32-13-TP V01 Figure 9 Tape & Reel Dimensions PG-VQFN-32-13 6.2 Recommended Footprint Figure 10 shows the recommended footprint for the PG-VQFN-32-13 package. 4.1 3.6 0.5 4.1 3.6 0.7 Package outline 5 x 5 0.25 PG-VQFN-32-13-FP V01 Figure 10 Recommended Footprint PG-VQFN-32-13 Data Sheet Hardware Description 16 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Package Dimensions (VQFN) 6.3 Chip Marking Line 1: SLB9645 Line 2: VQ12 yy or XQ12_yy (see Table 1), the <yy> is an internal FW indication Line 3: <Lot number> H <datecode> Infineon 1234567 VQ12 YY XXH Softwarecode Lot Code Figure 11 ChipMarking_VQFN.vsd Chip Marking PG-VQFN-32-13 Data Sheet Hardware Description 17 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module References References [1] —, “TPM Main Specification”, Version 1.2, Rev. 116, 2011-03-01, TCG (parts 1-3) [2] —, “TCG PC Client TPM Interface Specification (TIS)”, Version 1.21, 2011-04-28, TCG [3] —, “PC Client Implementation Specification”, Version 1.2, 2005-07-13, TCG [4] —, “TCG Software Stack Specification (TSS)”, Version 1.2, 2005-11-02, TCG [5] —, “NXP I²C bus specification, Rev. 03”, 19 June 2007 [6] —, “NXP I²C bus specification, Rev. 4”, 13 February 2012 Data Sheet Hardware Description 18 Rev. 1.1, 2014-02-12 SLB9645 Trusted Platform Module Terminology Terminology I2C Inter-Integrated Circuit PCR Platform Configuration Register TCG Trusted Computing Group TPM Trusted Platform Module TSS TCG Software Stack Data Sheet Hardware Description 19 Rev. 1.1, 2014-02-12 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG