ASM3P2775A Product Preview Low Power Peak EMI Reducing Solution Description The ASM3P2775A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The ASM3P2775A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The ASM3P2775A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. The ASM3P2775A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The ASM3P2775A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation.’ Applications The ASM3P2775A is targeted towards all portable devices with very low power requirements like MP3 players and digital still cameras. • • • • TSOT−6 O SUFFIX CASE 419AF TSSOP−8 T SUFFIX CASE 948AL SOIC−8 S SUFFIX CASE 751BD PIN CONFIGURATIONS 1 PD VSS ModOUT XOUT VDD XIN / CLKIN 6−Pin TSOT−23 Package (Top View) 1 VDD XIN / CLKIN Features • • • • • • • http://onsemi.com Generates an EMI Optimized Clock Signal at the Output Integrated Loop Filter Components Operates with a 3.3 V Supply Operating Current less than 4 mA Low Power CMOS Design Input Frequency Range: 13 MHz to 30 MHz Generates a 1X Low EMI Spread Spectrum Clock of the Input Frequency Frequency Deviation: ±1.8% (Typ) @ 14.7 MHz Input Frequency Available in 6−pin TSOT−23, 8−pin SOIC and 8−pin TSSOP Packages Commercial Temperature Range These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant NC XOUT PD ModOUT NC VSS 8−Pin SOIC and TSSOP Packages (Top View) KEY SPECIFICATIONS Specification Description Supply Voltage VDD = 3.3 V ± 0.3 V Cycle−to−Cycle Jitter 200 pS (Typ) Output Duty Cycle 45/55% (worst case) Modulation Rate Equation FIN/640 Frequency Deviation ±1.8% (Typ) @ 14.7 MHz This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. © Semiconductor Components Industries, LLC, 2011 August, 2011 − Rev. P2 1 Publication Order Number: ASM3P2775A/D ASM3P2775A VDD PD XIN / CLKIN XOUT PLL Modulation Frequency Divider Crystal Oscillator Phase Detector Feedback Divider VSS Loop Filter VCO Output Divider ModOUT Figure 1. Block Diagram Table 1. PIN DESCRIPTION (6−Pin TSOT−23 Package) Pin# Pin Name Type Description 1 PD I Power−down control pin. Pull low to enable power−down mode. Connect to VDD if not used. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 XIN / CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 4 VDD P Power supply for the entire chip. 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. Table 2. PIN DESCRIPTION (8−Pin SOIC and TSSOP Packages) Pin# Pin Name Type 1 XIN / CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Description 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 PD I Power−down control pin. Pull low to enable power−down mode. Connect to VDD if not used. 4 NC − No connect. 5 VSS P Ground connection. 6 ModOUT O Spread spectrum clock output. 7 NC − No connect. 8 VDD P Power supply for the entire chip. http://onsemi.com 2 ASM3P2775A Figure 2. Modulation Profile Table 3. SPECIFICATIONS Description Specification Frequency Range 13 MHz < CLKIN < 30 MHz Modulation Equation FIN/640 Frequency Deviation ±1.8% (Typ) @ 14.7 MHz Table 4. ABSOLUTE MAXIMUM RATINGS Symbol Rating Unit Voltage on any pin with respect to Ground −0.5 to +4.6 V Storage temperature −65 to +125 °C TA Operating temperature −40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV VDD, VIN TSTG TDV Parameter Static Discharge Voltage (As per JEDEC STD22− A114−B) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 5. DC ELECTRICAL CHARACTERISTICS (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated.) Min Typ Max Unit VIL Input low voltage Parameter VSS−0.3 − 0.8 V VIH Input high voltage 2.0 − VDD+0.3 V IIL Input low current − − −35 mA IIH Input high current − − 35 mA IXOL XOUT output low current (@ 0.4 V, VDD = 3.3 V) − 3 − mA IXOH XOUT output high current (@ 2.5 V, VDD = 3.3 V) − 3 − mA VOL Output low voltage (VDD = 3.3 V, IOL = 8 mA) − − 0.4 V VOH Output high voltage (VDD = 3.3 V, IOH = 8 mA) 2.5 − − V IDD Static supply current (Note 1) − − 10 mA ICC Dynamic supply current (3.3 V, 16 MHz and no load) − 3.5 − mA VDD Operating voltage 3.0 3.3 3.6 V tON Power−up time (first locked cycle after power−up) (Note 2) − − 5 mS Output impedance − 45 − W Symbol ZOUT 1. XIN / CLKIN pin and PD pin are pulled low. 2. VDD and XIN / CLKIN input are stable, PD pin is made high from low. http://onsemi.com 3 ASM3P2775A Table 6. AC ELECTRICAL CHARACTERISTICS Symbol CLKIN ModOUT fd Parameter Min Typ Max Unit Input frequency 13 − 30 MHz Output frequency 13 − 30 MHz − ±1.85 − % Frequency Deviation Input Frequency = 13 MHz − ±1.45 − tLH (Note 3) Output rise time (measured at 0.8 V to 2.0 V) Input Frequency = 30 MHz 0.5 1.1 1.3 nS tHL (Note 3) Output fall time (measured at 2.0 V to 0.8 V) 0.3 0.8 1.0 nS tJC Jitter (cycle−to−cycle) − 200 300 pS tD Output duty cycle 45 50 55 % 3. tLH and tHL are measured into a capacitive load of 15 pF. Table 7. TYPICAL CRYSTAL SPECIFICATIONS Fundamental AT Cut Parallel Resonant Crystal Nominal frequency 14.31818 MHz Frequency tolerance ±50 ppm or better at 25°C Operating temperature range −25°C to +85°C Storage temperature −40°C to +85°C Load capacitance 18 pF Shunt capacitance 7 pF maximum ESR 25 W R Crystal XIN Rx XOUT CL CL CL = 2*(CP – CS), Where CP = Load capacitance of crystal from crystal vendor datasheet. Where CS = Stray capacitance due to CIN, PCB, Trace, etc. Figure 3. Typical Crystal Interface Circuit http://onsemi.com 4 ASM3P2775A VDD C1 0.1 mF 2.2 mF C2 VDD XIN / CLKIN CL RS ModOUT Clock ModOUT Y1 XOUT CL ASM3P2775A VSS VDD PD Note: Refer to Pin Description table for Functionality details. Figure 4. Typical Application Schematic http://onsemi.com 5 ASM3P2775A PACKAGE DIMENSIONS TSOT−23, 6 LEAD CASE 419AF−01 ISSUE O SYMBOL D MIN NOM A e E1 MAX 1.00 A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 E 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC e 0.95 TYP L 0.30 L1 0.40 0.20 0.50 0.60 REF L2 0.25 BSC 0º θ 8º TOP VIEW A2 A b q L A1 c L1 SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. http://onsemi.com 6 L2 ASM3P2775A PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50 L 0.40 1.27 θ 0º 8º TOP VIEW D h A1 θ A c e b L END VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. http://onsemi.com 7 ASM3P2775A PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.15 0.90 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 1.05 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. http://onsemi.com 8 ASM3P2775A Table 8. ORDERING INFORMATION Part Number Marking ASM3P2775AF−06OR X4LL ASM3P2775AF−08TT Package Type Temperature 6−Pin TSOT−23, TAPE & REEL, Pb Free Commercial 3P2775AF 8−Pin TSSOP, TUBE, Pb Free Commercial ASM3P2775AF−08TR 3P2775AF 8−Pin TSSOP, TAPE & REEL, Pb Free Commercial ASM3P2775AF−08ST 3P2775AF 8−Pin SOIC, TUBE, Pb Free Commercial ASM3P2775AF−08SR 3P2775AF 8−Pin SOIC, TAPE & REEL, Pb Free Commercial ASM3P2775AG−06OR X3LL 6−Pin TSOT−23, TAPE & REEL, Green Commercial ASM3P2775AG−08TT 3P2775AG 8−Pin TSSOP, TUBE, Green Commercial ASM3P2775AG−08TR 3P2775AG 8−Pin TSSOP, TAPE & REEL, Green Commercial ASM3P2775AG−08ST 3P2775AG 8−Pin SOIC, TUBE, Green Commercial ASM3P2775AG−08SR 3P2775AG 8−Pin SOIC, TAPE & REEL, Green Commercial ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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