P3P816711A D

P3P816711A
Spread Spectrum Peak EMI
Reduction Device
Description
P3P816711A generates a 1x LVCMOS low EMI Spread Spectrum
clock of the input. The device accepts an AC or DC coupled external
clock input at CLKIN. It reduces electromagnetic interference (EMI)
at the clock source, allowing system wide reduction of EMI of down
stream clock and data dependent signals. It allows significant system
cost savings by reducing the number of circuit board layers, ferrite
beads, shielding, and other passive components that are traditionally
required to pass EMI regulations.
P3P816711A use the most efficient and optimized modulation
profile approved by the FCC and is implemented in a proprietary
all-digital method.
P3P816711A operates over a VDD range of 3.3 V ± 10% and is
available in TSOP−6 package over a temperature range of 0°C to
+70°C. P3I816711A operates over a temperature range of −40°C to
+85°C.
Application
The P3P816711A is targeted towards EMI management in
consumer electronics applications including Set Top Box.
Features
•
•
•
•
•
•
•
•
•
1x Low EMI Spread Spectrum Clock of the Input
External Reference Input Clock: 30 MHz
Output Clock: 30 MHz ± 0.3%(typ)
Low Inherent Cycle-to-Cycle Jitter
Supply Voltage: 3.3 V ± 10%
LVCMOS Input and Output
Available in TSOP−6 (6 Lead TSOT−23)
Operating Temperature Range: −40°C to +85°C
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2011
August, 2011 − Rev. 0
1
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MARKING
DIAGRAM
TSOP−6
CASE 318G
1
BM1 MG
G
1
BM1 = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
1
ModOUT
NC
GND
P3P
816711A
CLKIN
VDD
NC
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
P3P816711A/D
P3P816711A
VDD
ModOUT
PLL
CLKIN/XIN
GND
Figure 1. Block Diagram
Table 1. PIN DESCRIPTION
Pin#
Pin Name
Type
1
NC
2
GND
Power
3
CLKIN
Input
4
NC
Description
No Connect
Ground to entire chip.
External Reference Clock Input.
No Connect
5
VDD
Power
Power Supply to entire chip.
6
ModOUT
Output
Spread Spectrum Clock Output.
Table 2. OPERATING CONDITIONS
Symbol
VDD
TA
Parameter
Voltage on any pin with respect to VSS
Operating Temperature
Commercial
Industrial
Min
Max
Unit
2.97
3.63
V
0
−40
+70
+85
°C
CL
Load Capacitance
15
pF
CIN
Input Capacitance
7
pF
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
VDD, VIN
TSTG
Rating
Unit
Voltage on any pin with respect to Ground
−0.5 to +4.6
V
Storage Temperature
−65 to +125
°C
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
Static Discharge Voltage (As per JEDEC STD22−A114−B)
2.0
kV
TDV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
P3P816711A
Table 4. DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Min
Typ
Max
Unit
3.3
3.63
V
VDD
Operating voltage
2.97
VIL
Input low voltage
0
0.13xVDD
V
VIH
Input high voltage
0.85xVDD
VDD
V
0.4
V
VOL
Output low voltage (ModOUT Output)
IOL = 4 mA
VOH
Output high voltage (ModOUT Output)
IOH = −4 mA
IDD
Dynamic supply current (Unloaded Output)
10
mA
ICC
Static supply current (CLKIN pulled to GND)
0.5
mA
Max
Unit
2.4
V
Table 5. AC ELECTRICAL CHARACTERISTICS
Symbol
fIN
fOUT
Parameter
Min
Typ
Input Clock frequency
30
ModOUT Clock frequency
30
MHz
MHz
tLH (Notes 1, 2)
ModOUT Rise time (Measured from 20% to 80%)
5.0
ns
tHL (Notes 1, 2)
ModOUT Fall time (Measured from 80% to 20%)
4.5
ns
55
%
TDCOUT
(Notes 1, 2)
Output Clock Duty Cycle (ModOUT) (Measured at 50%)
TJC (Note 2)
Cycle−to−Cycle Jitter (ModOUT with Spread ON)
tON
45
50
ps
±200
PLL Lock Time (Stable power supply, valid input clock to
valid clock on ModOUT)
3.0
ms
1. Parameters are specified with 15 pF loaded outputs.
2. Parameter is guaranteed by design and characterization. Not 100% tested in production.
VDD
C1
C2
0.1 mF
2.2 mF
5
VDD
CLKIN
3
P3P816711A
6
ModOUT Clock
GND
2
Figure 2. Application Schematic
Table 6. ORDERING INFORMATION
Part Number
P3P816711A−06OR
Marking
Temperature
Package Type
Shipping†
BM1
0°C to +70°C
TSOP−6, Commerical
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
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3
P3P816711A
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
D
ÉÉ
ÉÉ
6
E1
1
NOTE 5
5
2
H
L2
4
GAUGE
PLANE
E
3
L
b
C
DETAIL Z
e
0.05
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
SEATING
PLANE
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
c
A
A1
DETAIL Z
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
6X
3.20
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
P3P816711A/D