Ordering Orderingnumber number: :ENA1455A ENA0886 LC87F7J32A CMOS IC FROM 32K byte, RAM 1024 byte on-chip http://onsemi.com 8-bit 1-chip Microcontroller Overview The LC87F7J32A is an 8-bit microcomputer that, centered around a CPU running at a minimum bus cycle time of 83.3ns, integrates on a single chip a number of hardware features such as 32K-byte flash ROM (onboard programmable), 1024-byte RAM, an on-chip debugger, a LCD controller/driver, sophisticated 16-bit timer/counter (may be divided into 8-bit timers), a 16-bit timer/counter (may be divided into 8-bit timers/counters or 8-bit PWMs), four 8-bit timers with a prescaler, a 16-bit timer with a prescaler (may be divided into 8-bit timers), a base timer serving as a time-of-day clock, a day and time counter, a synchronous SIO interface (with automatic block transmission/reception capabilities), an asynchronous/synchronous SIO interface, a UART interface (full duplex), two 12-bit PWM channels, a 12-bit/8-bit 10-channel AD converter, remote control receive function, a high-speed clock counter, a system clock frequency divider, an internal reset and a 25-source 10-vector interrupt feature. Features Flash ROM • Capable of on-board-programming with wide range, 3.0 to 5.5V,of voltage souce • Block-erasable in 128-byte units • 32768 × 8 bits RAM • 1024 × 9 bits Minimum Bus Cycle Time • 83.3ns (12MHz) VDD=3.0 to 5.5V • 125ns (8MHz) VDD=2.5 to 5.5V • 250ns (4MHz) VDD=2.2 to 5.5V Note: The bus cycle time here refers to the ROM read speed. Minimum Instruction Cycle Time (tCYC) • 250ns (12MHz) VDD=3.0 to 5.5V • 375ns (8MHz) VDD=2.5 to 5.5V • 750ns (4MHz) VDD=2.2 to 5.5V * This product is licensed from Silicon Storage Technology, Inc. (USA). Semiconductor Components Industries, LLC, 2013 May, 2013 Ver.1.00 O1707HKIM 20071009-S00002 No.A0886-1/29 LC87F7J32A Ports • Normal withstand voltage I/O ports Ports whose I/O direction can be designated in 1 bit units 15 (P1n, P30 to P31, P70 to P73, XT2) Ports whose I/O direction can be designated in 4 bit units 8 (P0n) (When N-channel open drain output is selected, data can be input in bit units.) • Normal withstand voltage input port 1 (XT1) • LCD ports Segment output 24 (S00 to S23) Common output 4 (COM0 to COM3) Bias terminals for LCD driver 3 (V1 to V3) Other functions Input/output ports 24 (PAn, PBn, PCn,) Input ports 7 (PLn) • Dedicated oscillator ports 2 (CF1, CF2) • Reset pin 1 (RES) • Power pins 6 (VSS1 to VSS3, VDD1 to VDD3) LCD Controller 1) Seven display modes are available (static, 1/2, 1/3, 1/4 duty × 1/2, 1/3 bias) 2) Segment output and common output can be switched to general-purpose input/output ports Timers • Timer 0: 16-bit timer/counter with two capture registers. Mode 0: 8-bit timer with an 8-bit programmable prescaler (with two 8-bit capture registers) × 2 channels Mode 1: 8-bit timer with an 8-bit programmable prescaler (with two 8-bit capture registers) + 8-bit counter (with two 8-bit capture registers) Mode 2: 16-bit timer with an 8-bit programmable prescaler (with two 16-bit capture registers) Mode 3: 16-bit counter (with two 16-bit capture registers) • Timer 1: 16-bit timer that supports PWM/toggle outputs Mode 0: 8-bit timer with an 8-bit prescaler (with toggle outputs) + 8-bit timer/counter with an 8-bit prescaler (with toggle outputs) Mode 1: 8-bit PWM with an 8-bit prescaler × 2 channels Mode 2: 16-bit timer/counter with an 8-bit prescaler (with toggle outputs) (toggle outputs also possible from the lower-order 8 bits) Mode 3: 16-bit timer with an 8-bit prescaler (with toggle outputs) (The lower-order 8 bits can be used as PWM.) • Timer 4: 8-bit timer with a 6-bit prescaler • Timer 5: 8-bit timer with a 6-bit prescaler • Timer 6: 8-bit timer with a 6-bit prescaler (with toggle output) • Timer 7: 8-bit timer with a 6-bit prescaler (with toggle output) • Timer 8: 16-bit timer Mode 0: 8-bit timer with an 8-bit prescaler × 2 channels (with toggle output) Mode 1: 16-bit timer with an 8-bit prescaler (with toggle output) • Base timer 1) The clock is selectable from the subclock (32.768kHz crystal oscillation), system clock, and timer 0 prescaler output. 2) Interrupts programmable in 5 different time schemes • Day and time counter 1) Using with a base timer,it can be used as 65000 day + minute + second counter. High-speed Clock Counter 1) Can count clocks with a maximum clock rate of 20MHz (at a main clock of 10MHz). 2) Can generate output real-time. No.A0886-2/29 LC87F7J32A SIO • SIO0: 8-bit synchronous serial interface 1) LSB first/MSB first mode selectable 2) Built-in 8-bit baudrate generator (maximum transfer clock cycle = 4/3 tCYC) 3) Automatic continuous data transmission (1 to 256 bits specifiable in 1-bit units, suspension and resumption of data transmission possible in 1-byte units) • SIO1: 8-bit asynchronous/synchronous serial interface Mode 0: Synchronous 8-bit serial I/O (2- or 3-wire configuration, 2 to 512 tCYC transfer clocks) Mode 1: Asynchronous serial I/O (half-duplex, 8-data bits, 1-stop bit, 8 to 2048 tCYC baudrates) Mode 2: Bus mode 1 (start bit, 8-data bits, 2 to 512 tCYC transfer clocks) Mode 3: Bus mode 2 (start detect, 8-data bits, stop detect) UART • Full duplex • 7/8/9 bit data bits selectable • 1 stop bit (2-bit in continuous data transmission) • Built-in baudrate generator AD Converter: 12-bits/8-bits × 12 channels • 12 bits/8 bits AD converter resolution selectable PWM: Multi frequency 12-bit PWM × 2 channels Infrared Remote Control Receiver Circuit 1) Noise reduction function (noise filter time constant: Approx. 120μs, when the 32.768kHz crystal oscillator is selected as the reference voltage source.) 2) Supports data encoding systems such as PPM (Pulse Position Modulation) and Manchester encoding 3) X’tal HOLD mode release function Watchdog Timer • External RC watchdog timer • Basetimer watchdog timer • Interrupt and reset signals selectable Clock Output Function 1) Able to output selected oscillation clock 1/1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64 as system clock. 2) Able to output oscillation clock of sub clock. No.A0886-3/29 LC87F7J32A Interrupts • 25 sources, 10 vector addresses 1) Provides three levels (low (L), high (H), and highest (X)) of multiplex interrupt control. Any interrupt requests of the level equal to or lower than the current interrupt are not accepted. 2) When interrupt requests to two or more vector addresses occur at the same time, the interrupt of the highest level takes precedence over the other interrupts. For interrupts of the same level, the interrupt into the smallest vector address takes precedence. No. Vector Address Level Interrupt Source 1 00003H X or L INT0 2 0000BH X or L INT1 3 00013H H or L INT2/T0L/INT4/remote control receiver 4 0001BH H or L INT3/INT5/BT0/BT1 5 00023H H or L T0H 6 0002BH H or L T1L/T1H 7 00033H H or L SIO0/UART1 receive 8 0003BH H or L SIO1/UART1 transmit 9 00043H H or L ADC//T6/T7/PWM4/PWM5 10 0004BH H or L Port 0/T4/T5 • Priority levels X > H > L • Of interrupts of the same level, the one with the smallest vector address takes precedence. • IFLG (List of interrupt source flag function) 1) Shows a list of interrupt source flags that caused a branching to a particular vector address (shown in the diagram above). Subroutine Stack Levels: 512 levels (The stack is allocated in RAM.) High-speed Multiplication/Division Instructions • 16 bits × 8 bits (5 tCYC execution time) • 24 bits × 16 bits (12 tCYC execution time) • 16 bits ÷ 8 bits (8 tCYC execution time) • 24 bits ÷ 16 bits (12 tCYC execution time) Oscillation Circuits • RC oscillation circuit (internal): For system clock • CF oscillation circuit: For system clock, with internal Rf • Crystal oscillation circuit: For low-speed system clock, with internal Rf • Frequency variable RC oscillation circuit (internal): For system clock 1) Adjustable in ±4% (typ) step from a selected center frequency. 2) Measures oscillation clock using a input signal from XT1 as a reference. System Clock Divider Function • Can run on low current. • The minimum instruction cycle selectable from 300ns, 600ns, 1.2μs, 2.4μs, 4.8μs, 9.6μs, 19.2μs, 38.4μs, and 76.8μs (at a main clock rate of 10MHz). Internal Reset Function • Power-On-Reset (POR) function 1) POR resets the system when the power supply voltage is applied. 2) POR release level is selectable from 4 levels (2.07V, 2.37V, 2.87V, 4.35V) by option. • Low Voltage Detection reset (LVD) function 1) LVD used with POR resets the system when the supply voltage is applied and when it is lowered. 2) LVD function is selectable from enable/disable and the reset level is selectable from 3 levels (2.31V, 2.81V, 4.28V) by option. No.A0886-4/29 LC87F7J32A Standby Function • HALT mode: Halts instruction execution while allowing the peripheral circuits to continue operation. (Some parts of the serial transfer function stops operation) 1) Oscillation is not halted automatically. 2) Canceled by a system reset or occurrence of an interrupt • HOLD mode: Suspends instruction execution and the operation of the peripheral circuits. 1) The CF, RC, X’tal, and frequency variable RC oscillators automatically stop operation. 2) There are three ways of resetting the HOLD mode. (1) Setting the reset pin to the low level (2) Setting at least one of the INT0, INT1, INT2, INT4, and INT5, pins to the specified level (3) Having an interrupt source established at port 0 • X'tal HOLD mode: Suspends instruction execution and the operation of the peripheral circuits except the base timer and the remote control circuit. 1) The CF, RC, and frequency variable RC oscillators automatically stop operation 2) The state of crystal oscillation established when the X'tal HOLD mode is entered is retained. 3) There are five ways of resetting the X'tal HOLD mode. (1) Setting the reset pin to the low level (2) Setting at least one of the INT0, INT1, INT2, INT4,and INT5 pins to the specified level (3) Having an interrupt source established at port 0 (4) Having an interrupt source established in the base timer circuit (5) Having an interrupt source established in the infrared remote control receiver circuit On-chip Debugger • Supports software debugging with the IC mounted on the target board. Package Form • QIP64E(14×14): • TQFP64J(10×10): Lead-free type Lead-free type Development Tools • On-chip debugger: TCB87-TypeB + LC87F7J32A Flash ROM Programming Board Package Programming boards QIP64E(14×14) W87F50256Q TQFP64J(10×10) W87F57256SQ Flash ROM Programmer Model Maker Single Flash Support Group, Inc. (Formerly Ando Electric Co., Ltd.) Supported Version (Note) AF9708/AF9709/ AF9709B AF9723 (Main body) Device After 0x.xx After 0x.xx Gang AF9833 (Unit) Our company SKK (SANYO FWS) After 0x.xx After x.xxA LC87F7J32A Note: Please check the latest version. Same Package and Pin Assignment as Mask ROM Version. 1) LC877J00 series options can be set by using flash ROM data. Thus the board used for mass production can be used for debugging and evaluation without modifications. 2) If the program for the mask ROM version is used, the usable ROM/RAM capacity is the same as the mask ROM version. No.A0886-5/29 LC87F7J32A Package Dimensions unit : mm (typ) 3159A 33 32 64 17 14.0 49 1 17.2 48 0.8 17.2 14.0 16 0.35 0.8 0.15 0.1 3.0max (2.7) (1.0) SANYO : QIP64E(14X14) Package Dimensions unit : mm (typ) 3310 12.0 0.5 10.0 33 32 64 17 10.0 49 1 16 0.5 0.18 12.0 48 0.125 (1.0) 0.1 1.2 MAX (1.25) SANYO : TQFP64J(10X10) No.A0886-6/29 LC87F7J32A S14/PB6 S15/PB7 VSS3 VDD3 S16/PC0 S17/PC1 S18/PC2 S19/PC3 S20/PC4 S21/PC5 S22/PC6 S23/PC7 COM0/PL0 COM1/PL1 COM2/PL2 COM3/PL3 Pin Assignment 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P70/INT0/T0LCP/AN8 49 32 S13/PB5 P71/INT1/T0HCP/AN9 50 31 S12/PB4 P72/INT2/T0IN/NKIN 51 30 S11/PB3 P73/INT3/T0IN/RMIN 52 29 S10/PB2 RES 53 28 S9/PB1 XT1/AN10 54 27 S8/PB0 XT2/AN11 55 26 S7/PA7 VSS1 56 25 S6/PA6 CF1 57 24 S5/PA5 CF2 58 23 S4/PA4 VDD1 59 22 S3/PA3 V1/PL4/AN0/DBGP0 60 21 S2/PA2 V2/PL5/AN1/DBGP1 61 20 S1/PA1/URX1 V3/PL6/AN2/DBGP2 62 19 S0/PA0/UTX1 P10/SO0 63 18 P07/T7O P11/SI0/SB0 64 17 P06/T6O 8 9 10 11 12 13 14 15 16 P13/SO1 P14/SI1/SB1 P15/SCK1 P16/ T1PWML P17/T1PWMH/BUZ P30/INT4/T1IN/T0LCP/PWM4 P31/INT5/T1IN/T0HCP/PWM5 VDD2 P04/AN7 7 P05/CKO 6 P03/AN6 5 P02/AN5 4 P01/AN4 3 P00/AN3 2 VSS2 1 P12/SCK0 LC87F7J32A Top view QIP64E(14×14) “Lead-free Type” TQFP64J(10×14) “Lead-free Type” No.A0886-7/29 LC87F7J32A PIN No. NAME PIN No. NAME 1 P12/SCK0 33 S14/PB6 2 P13/SO1 34 S15/PB7 3 P14/SI1/SB1 35 VSS3 4 P15/SCK1 36 VDD3 5 P16/T1PWML 37 S16/PC0 6 P17/T1PWMH/BUZ 38 S17/PC1 7 P30/INT4/T1IN/T0LCP1/PWM4 39 S18/PC2 8 P31/INT5/T1IN/T0HCP1/PWM5 40 S19/PC3 9 VDD2 41 S20/PC4 10 VSS2 42 S21/PC5 11 P00/AN3 43 S22/PC6 12 P01/AN4 44 S23/PC7 13 P02/AN5 45 COM0/PL0 14 P03/AN6 46 COM1/PL1 15 P04/AN7 47 COM2/PL2 16 P05/CKO 48 COM3/PL3 17 P06/T6O 49 P70/INT0/T0LCP/AN8 18 P07/T7O 50 P71/INT1/T0HCP/AN9 19 S0/PA0/UTX1 51 P72/INT2/T0IN 20 S1/PA1/URX1 52 P73/INT3/T0IN 21 S2/PA2 53 RES 22 S3/PA3 54 XT1/AN10 23 S4/PA4 55 XT2/AN11 24 S5/PA5 56 VSS1 25 S6/PA6 57 CF1 26 S7/PA7 58 CF2 27 S8/PB0 59 VDD1 28 S9/PB1 60 V1/PL4/AN0/DBGP0 29 S10/PB2 61 V2/PL5/AN1/DBGP1 30 S11/PB3 62 V3/PL6/AN2/DBGP2 31 S12/PB4 63 P10/SO0 32 S13/PB5 64 P11/SI0/SB0 No.A0886-8/29 LC87F7J32A System Block Diagram Interrupt control IR Standby control PLA Flash ROM RC VMRC Clock generator CF PC X’tal RES Reset circuit (LVD/POR) ACC Reset control WTD B register C register SIO0 Bus interface ALU SIO1 Port 0 Base timer Port 1 Timer 0 (High speed clock counter) ADC Timer 1 Port 3 Timer 6 Port 7 Timer 7 LCD Controller PSW RAR RAM Stack pointer Watchdog timer INT0 to 5 Noise Rejection Filter On-chip debugger PWM4 PWM5 UART1 Timer 4 Remote control receiver circuit Timer 5 Day and time counter No.A0886-9/29 LC87F7J32A Pin Description Pin Name VSS1 VSS2 VSS3 VDD1 I/O Description Option - - power supply pin No - + power supply pin No • 8-bit I/O port Yes VDD2 VDD3 PORT0 I/O • I/O specifiable in 4-bit units P00 to P07 • Pull-up resistors can be turned on and off in 4-bit units. • Input for HOLD release • Input for port 0 interrupt • Shared pins P00 to P04: AD converter input (AN3 to AN7) P05: Clock output (system clock/can selected from sub clock) P06: Timer 6 toggle output P07: Timer 7 toggle output PORT1 I/O • 8-bit I/O port Yes • I/O specifiable in 1-bit units P10 to P17 • Pull-up resistors can be turned on and off in 1-bit units. • Shared pins P10: SIO0 data output P11: SIO0 data input/bus I/O P12: SIO0 clock I/O P13: SIO1 data output P14: SIO1 data input/bus I/O P15: SIO1 clock I/O P16: Timer 1PWML output P17: Timer 1PWMH output/beeper output PORT3 I/O • 2-bit I/O port Yes • I/O specifiable in 1-bit units P30 to P31 • Pull-up resistors can be turned on and off in 1-bit units. • Shared pins P30: INT4 input/HOLD release input/timer 1 event input/timer 0L capture input/PWM4 P31: INT5 input/HOLD release input/timer 1 event input/timer 0L capture input/PWM5 • Interrupt acknowledge type PORT7 P70 to P73 I/O Rising Falling INT4 enable enable INT5 enable enable Rising & H level L level enable disable disable enable disable disable Falling • 4-bit I/O port No • I/O specifiable in 1-bit units • Pull-up resistors can be turned on and off in 1-bit units. • Shared pins P70: INT0 input/HOLD release input/timer 0L capture input/watchdog timer output P71: INT1 input/HOLD release input/timer 0H capture input P72: INT2 input/HOLD release input/timer 0 event input/timer 0L capture input/ high speed clock counter input P73: INT3 input (with noise filter)/timer 0 event input/timer 0H capture input/ remote control receiver input AD converter input ports: AN8 (P70), AN9 (P71) • Interrupt acknowledge type Rising Falling INT0 enable enable INT1 enable enable INT2 enable INT3 enable Rising & H level L level disable enable enable disable enable enable enable enable disable disable enable enable disable disable Falling Continued on next page. No.A0886-10/29 LC87F7J32A Continued from preceding page. Pin Name S0/PA0 to I/O I/O S7/PA7 S8/PB0 to I/O I/O • Segment output for LCD No • Segment output for LCD No • Can be used as general-purpose I/O port (PC) I/O COM3/PL3 V1/PL4 to No • Can be used as general-purpose I/O port (PB) S23/PC7 COM0/PL0 to Option • Can be used as general-purpose I/O port (PA) S15/PB7 S16/PC0 to Description • Segment output for LCD • Common output for LCD No • Can be used as general-purpose input port (PL) I/O V3/PL7 • LCD output bias power supply No • Can be used as general-purpose input port (PL) • Shared pins AD converter input ports: AN0 (V1) to AN2 (V3) On-chip debugger pins: DBGP0 (V1) to DBGP2 (V3) RES Input Reset pin No XT1 Input • 32.768kHz crystal oscillator input pin No • Shared pins General-purpose input port AD converter input port: AN10 Must be connected to VDD1 if not to be used. XT2 I/O • 32.768kHz crystal oscillator output pin No • Shared pins General-purpose I/O port AD converter input port: AN11 Must be set for oscillation and kept open if not to be used. CF1 Input CF2 Output Ceramic resonator input pin No Ceramic resonator output pin No No.A0886-11/29 LC87F7J32A Port Output Types The table below lists the types of port outputs and the presence/absence of a pull-up resistor. Data can be read into any input port even if it is in the output mode. Port Name P00 to P07 Option Selected in Units of Output Type Pull-up Resistor 1 CMOS 2 N-channel open drain No 1 CMOS Programmable 2 N-channel open drain Programmable 1 bit 1 CMOS Programmable 2 N-channel open drain Programmable P70 - No N-channel open drain Programmable P71 to P73 - No CMOS Programmable S0/PA0 to S23/PC7 - No CMOS Programmable COM0/PL0 to COM3/PL3 - No Input only No No P10 to P17 P30 to P31 1 bit Option Type 1 bit Programmable (Note) V1/PL4 to V3/PL6 - No Input only XT1 - No Input for 32.768 kHz crystal oscillator (Input only) XT2 - No Output for 32.768kHz crystal oscillator (Nch-open drain when in general-purpose output mode) No No Note1: Programmable pull-up resistors for port 0 are controlled in 4 bit units (P00 to 03, P04 to 07). *1 Connect the IC as shown below to minimize the noise input to the VDD1 pin. Be sure to electrically short the VSS1, VSS2, and VSS3 pins. LSI VDD1 Power supply For backup VDD2 VDD3 VSS1 VSS2 VSS3 *2 The internal memory is sustained by VDD1. If none of VDD2 and VDD3 are backed up, the high level output at the ports are unstable in the HOLD backup mode, allowing through current to flow into the input buffer and thus shortening the backup time. Make sure that the port outputs are held at the low level in the HOLD backup mode. No.A0886-12/29 LC87F7J32A Absolute Maximum Ratings at Ta = 25°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Maximum supply VDD max VDD1, VDD2, VDD1=VDD2=VDD3 VLCD VDD3 V1/PL4, V2/PL5, VDD1=VDD2=VDD3 voltage supply voltage for LCD V3/PL6 Input voltage VI(1) Port L XT1, CF1, RES Input/output VIO(1) voltage min typ max -0.3 +6.5 -0.3 VDD -0.3 VDD+0.3 -0.3 VDD+0.3 unit V Port 0, 1, 3, 7 Port A, B, C XT2 Peak output IOPH(1) current IOPH(2) Ports 0, 1 • CMOS output selected Ports A, B, C • Current at each pin Port 3 • CMOS output selected • Current at each pin Mean output IOPH(3) Port 71 to 73 Current at each pin IOMH(1) Ports 0, 1 • CMOS output selected Ports A, B, C • Current at each pin High level output current current (Note 1-1) IOMH(2) • CMOS output selected • Current at each pin IOMH(3) Ports 71 to 73 Current at each pin -20 -5 -7.5 -15 -3 Total output ΣIOAH(1) Ports 71 to 73 Total of all pins -5 current ΣIOAH(2) Port 1 Total of all pins -20 Peak output ΣIOAH(3) Ports 1, 71 to 73 Total of all pins -20 ΣIOAH(4) Port 3 Total of all pins -25 ΣIOAH(5) Port 0 Total of all pins -20 ΣIOAH(6) Ports 0, 3 Total of all pins -40 ΣIOAH(7) Ports A, B Total of all pins -25 ΣIOAH(8) Port C Total of all pins -20 ΣIOAH(9) Ports A, B, C Total of all pins -10 IOPL(1) Ports 0, 1 Current at each pin current Mean output (Note 1-1) mA 20 Ports A, B, C IOPL(2) Port 3 Current at each pin 30 IOPL(3) Ports 7, XT2 Current at each pin 10 IOML(1) Ports 0, 1 Current at each pin 15 Ports A, B, C current Low level output current Port 3 -10 IOML(2) Port 3 Current at each pin 20 7.5 IOML(3) Ports 7, XT2 Current at each pin Total output ΣIOAL(1) Ports 7, XT2 Total of all pins 15 current ΣIOAL(2) Ports 1 Total of all pins 40 ΣIOAL(3) Ports 1, 7, XT2 Total of all pins 50 ΣIOAL(4) Port 3 Total of all pins 45 ΣIOAL(5) Port 0 Total of all pins 40 ΣIOAL(6) Ports 0, 3 Total of all pins 80 ΣIOAL(7) Ports A, B Total of all pins 45 ΣIOAL(8) Port C Total of all pins 40 ΣIOAL(9) Ports A, B, C Total of all pins Pd max QIP64E(14×14) Ta=-40 to +85°C TQFP64J(10×10) Ta=-40 to +85°C Power dissipation Operating ambient Topr temperature Storage ambient Tstg temperature 80 298 mW -40 +85 -55 +125 °C Note 1-1: The mean output current is a mean value measured over 100ms. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. No.A0886-13/29 LC87F7J32A Allowable Operating Condtions at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Operating VDD(1) VDD1=VDD2=VDD3 supply voltage (Note 2-1) Memory VHD VDD1=VDD2=VDD3 sustaining min typ max unit 0-237μs≤tCYC≤200μs 3.0 5.5 0-356μs≤tCYC≤200μs 2.5 5.5 0-712μs≤tCYC≤200μs 2.2 5.5 2.0 5.5 RAM and register contents sustained in HOLD mode supply voltage High level input VIH(1) voltage • Ports 0, 3 Output disabled • Ports A, B, C 2.2 to 5.5 0.3VDD 2.2 to 5.5 0.3VDD 2.2 to 5.5 0.85VDD VDD 2.2 to 5.5 0.9VDD VDD 2.2 to 5.5 0.75VDD VDD 4.0 to 5.5 VSS 2.2 to 4.0 VSS 4.0 to 5.5 VSS 2.2 to 4.0 VSS 0.2VDD 2.2 to 5.5 VSS 0.45VDD 2.2 to 5.5 VSS 2.2 to 5.5 VSS • Port L VIH(2) • Port 1 • Output disabled • Ports 71 to 73 • When INT1VTSL=0 • Port 70 port input/ (P71only) +0.7 +0.7 VDD VDD interrupt side VIH(3) VIH(4) Port 71 interrupt • Output disabled side • When INT1VTSL=1 Port 70 watchdog Output disabled timer side VIH(5) XT1, XT2, CF1, RES Low level input VIL(1) voltage • Ports 0, 3 Output disabled • Ports A, B, C • Port L VIL(2) • Port 1 • Output disabled • Ports 71 to 73 • When INT1VTSL=0 • Port 70 port (P71 only) input/interrupt side VIL(3) VIL(4) Port 71 interrupt • Output disabled side • When INT1VTSL=1 Port 70 watchdog timer side VIL(5) XT1, XT2, CF1, RES Instruction cycle tCYC time (Note 2-2) External system clock frequency FEXCF(1) CF1 • CF2 pin open V 0.15VDD +0.4 0.2VDD 0.1VDD +0.4 0.8VDD -1.0 0.25VDD 3.0 to 5.5 0.237 200 2.5 to 5.5 0.356 200 2.2 to 5.5 0.712 200 3.0 to 5.5 0.1 12 2.5 to 5.5 0.1 8 2.2 to 5.5 0.1 4 μs • System clock frequency division ratio=1/1 • External system clock DUTY=50±5% • CF2 pin open 3.0 to 5.5 0.2 24.4 • System clock frequency 2.5 to 5.5 0.2 16 2.2 to 5.5 0.2 8 division ratio=1/2 MHz Note 2-1: VDD must be held greater than or equal to 3.0V in the flash ROM onboard programming mode. Note 2-2: Relationship between tCYC and oscillation frequency is 3/FmCF at a division ratio of 1/1 and 6/FmCF at a division ratio of 1/2. Continued on next page. No.A0886-14/29 LC87F7J32A Continued from preceding page. Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Oscillation FmCF(1) CF1, CF2 frequency range • 12MHz ceramic oscillation • See figure 1. FmCF(2) CF1, CF2 (Note 2-3) • 8MHz ceramic oscillation • See figure 1. FmCF(3) CF1, CF2 • 4MHz ceramic oscillation • See figure 1. FmRC Internal RC oscillation FmVMRC(1) • Frequency variable RC min typ max 3.0 to 5.5 12 2.5 to 5.5 8 2.2 to 5.5 4 2.2 to 5.5 0.3 1.0 unit 2.0 source oscillation MHz • When VMRAJ2 to 0=4, 2.2 to 5.5 10 2.2 to 5.5 4 2.2 to 5.5 32.768 VMFAJ2 to 0=0, VMSL4M=0 FmVMRC(2) • Frequency variable RC source oscillation • When VMRAJ2 to 0=4, VMFAJ2 to 0=0, VMSL4M=1 FsX’tal XT1, XT2 • 32.768kHz crystal oscillation • See figure 2. Frequency variable RC oscillation OpVMRC(1) When VMSL4M=0 OpVMRC(2) When VMSL4M=1 kHz 2.2 to 5.5 8 10 12 2.2 to 5.5 3.5 4 4.5 2.2 to 5.5 8 24 64 2.2 to 5.5 1 4 8 MHz usable range Frequency VmADJ(1) Each step of VMRAJn (Wide range) variable RC oscillation VmADJ(2) % Each step of VMFAJn adjustment (Small range) range Note 2-3: See Tables 1 and 2 for the oscillation constants. Electrical Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] High level input IIH(1) current • Ports 0, 1, 3, 7 • Output disabled • Ports A, B, C • Pull-up resistor off • Port L • VIN=VDD min typ max unit 2.2 to 5.5 1 2.2 to 5.5 1 2.2 to 5.5 1 2.2 to 5.5 15 (including output Tr's off leakage current) IIH(2) RES VIN=VDD IIH(3) XT1, XT2 • For input port specification • VIN=VDD Low level input IIH(4) CF1 VIN=VDD IIL(1) • Ports 0, 1, 3, 7 • Output disabled • Ports A, B, C • Pull-up resistor off • Port L • VIN=VSS current 2.2 to 5.5 -1 2.2 to 5.5 -1 2.2 to 5.5 -1 2.2 to 5.5 -15 μA (including output Tr's off leakage current) IIL(2) RES VIN=VSS IIL(3) XT1, XT2 • For input port specification • VIN=VSS IIL(4) CF1 VIN=VSS Continued on next page. No.A0886-15/29 LC87F7J32A Continued from preceding page. Specification Parameter Symbol Pin/Remarks Conditions VDD[V] High level output VOH(1) voltage VDD-1 VOH(2) IOH=-0.4mA 3.0 to 5.5 VDD-0.4 VOH(3) IOH=-0.2mA 2.2 to 5.5 VDD-0.4 IOH=-10mA 4.5 to 5.5 VDD-1.5 VOH(5) IOH=-1.6mA 3.0 to 5.5 VDD-0.4 VOH(6) IOH=-1mA 2.2 to 5-5 VDD-0.4 IOH=-0.4mA 3.0 to 5.5 VDD-0.4 IOH=-0.2mA 2.2 to 5.5 VDD-0.4 IOH=-1mA 4.5 to 5.5 VDD-1 IOH=-0.4mA 3.0 to 5.5 VDD-0.4 IOH=-0.2mA 2.2 to 5.5 VDD-0.4 Ports 30, 31 Ports 71 to 73 VOH(8) VOH(9) Ports A, B, C VOH(10) VOH(11) voltage VOL(1) VOL(2) Ports 0, 1 Ports 3 (PWM function max IOL=10mA 4.5 to 5.5 1.5 IOL=1.6mA 3.0 to 5.5 0.4 VOL(3) output mode) IOL=1mA 2.2 to 5.5 0.4 VOL(4) Ports 3 IOL=30mA 4.5 to 5.5 1.5 VOL(5) (Port function output IOL=5mA 3.0 to 5.5 0.4 IOL=2.5mA 2.2 to 5.5 0.4 VOL(6) mode) VOL(7) • Port 7 IOL=1.6mA 3.0 to 5.5 0.4 VOL(8) • XT2 IOL=1mA 2.2 to 5.5 0.4 VOL(9) Ports A, B, C IOH=1.6mA 3.0 to 5.5 0.4 IOL=1mA 2.2 to 5.5 0.4 VOL(10) LCD output typ 4.5 to 5.5 VOH(7) Low level output min IOH=-1mA VOH(4) Ports 0, 1 VODLS S0 to S23 voltage deviation • IO=0mA • VLCD, 2/3VLCD, 1/3VLCD level output 2.2 to 5.5 0 ±0.2 2.2 to 5.5 0 ±0.2 unit V • See Fig. 8. VODLC COM0 to COM3 • IO=0mA • VLCD, 2/3VLCD, 1/2VLCD, 1/3VLCD level output • See Fig. 8. LCD bias resistor RLCD(1) Resistance per See Fig. 8. one bias resister RLCD(2) Resistance per 2.2 to 5.5 80 2.2 to 5.5 40 See Fig. 8. one bias resister kΩ 1/2R mode Resistance of Rpu(1) Ports 0, 1, 3, 7 pull-up MOS Tr. Rpu(2) Ports A, B, C Hysteresis voltage VHYS(1) Ports 1, 7 VOH=0-9VDD RES Pin capacitance CP All pins 4.5 to 5.5 15 35 80 2.2 to 5.5 18 50 150 2.2 to 5.5 0.1VDD V 2.2 to 5.5 10 pF For pins other than that under test: VIN=VSS f=1MHz Ta=25°C No.A0886-16/29 LC87F7J32A Serial I/O Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V 1. SIO0 Serial I/O Characteristics (Note 4-1-1) Specification Parameter Symbol Pin/Remarks Conditions Input clock VDD[V] Frequency tSCK(1) Low level tSCKL(1) SCK0(P12) See Fig. 6. typ tSCKH(1) 2.2 to 5.5 pulse width tSCKHA(1) 1 tCYC • Continuous data 4 Serial clock • See Fig. 6. • (Note 4-1-2) Frequency tSCK(2) SCK0(P12) • CMOS output selected 4/3 • See Fig. 6. Output clock Low level tSCKL(2) 1/2 pulse width High level tSCK tSCKH(2) 2.2 to 5.5 pulse width tSCKHA(2) 1/2 • Continuous data tSCKH(2) transmission/reception mode +2tCYC • CMOS output selected • See Fig. 6. Data setup time Serial input unit 1 transmission/reception mode tsDI(1) SB0(P11), SI0(P11) tSCKH(2) +(10/3) tCYC tCYC • Must be specified with respect to rising edge of 2.2 to 5.5 0.03 2.2 to 5.5 0.03 SIOCLK Data hold time Output clock Input clock Output Serial output max 2 pulse width High level min • See Fig. 6. thDI(1) tdDO(1) delay time SO0(P10), SB0(P11) • Continuous data transmission/reception mode 2.2 to 5.5 • (Note 4-1-3) tdDO(2) • Synchronous 8-bit mode • (Note 4-1-3) tdDO(3) 2.2 to 5.5 (1/3)tCYC +0.05 μs 1tCYC +0.05 (Note 4-1-3) 2.2 to 5.5 (1/3)tCYC +0.15 Note 4-1-1: These specifications are theoretical values. Add margin depending on its use. Note 4-1-2: To use serial-clock-input in continuous trans/rec mode, a time from SI0RUN being set when serial clock is "H" to the first negative edge of the serial clock must be longer than tSCKHA. Note 4-1-3: Must be specified with respect to falling edge of SIOCLK. Must be specified as the time to the beginning of output state change in open drain output mode. See Fig. 6. No.A0886-17/29 LC87F7J32A 2. SIO1 Serial I/O Characteristics (Note 4-2-1) Specification Parameter Symbol Pin/Remarks Conditions Input clock Frequency tSCK(3) Low level tSCKL(3) SCK1(P15) See Fig.6. 2.2 to 5.5 tCYC SCK1(P15) • CMOS output selected 2 • See Fig. 6. tSCKL(4) 2.2 to 5.5 pulse width High level 1/2 tSCK tSCKH(4) 1/2 Serial output Serial input pulse width Data setup time unit 1 tSCK(4) Low level max 1 tSCKH(3) Frequency typ 2 pulse width High level min pulse width Output clock Serial clock VDD[V] tsDI(2) SB1(P14), SI1(P14) • Must be specified with respect to rising edge of SIOCLK. 2.2 to 5.5 0.03 2.2 to 5.5 0.03 • See Fig. 6. Data hold time thDI(2) Output delay tdDO(4) SO1(P13), time SB1(P14) • Must be specified with respect μs to falling edge of SIOCLK. • Must be specified as the time to the beginning of output state (1/3)tCYC 2.2 to 5.5 +0.05 change in open drain output mode. • See Fig. 6. Note 4-2-1: These specifications are theoretical values. Add margin depending on its use. Pulse Input Conditions at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] High/low level tPIH(1) INT0(P70), • Interrupt source flag can be set. pulse width tPIL(1) INT1(P71), • Event inputs for timer 0 or 1 are INT2(P72) enabled. min typ 2.2 to 5.5 1 2.2 to 5.5 2 2.2 to 5.5 64 2.2 to 5.5 256 2.2 to 5.5 4 2.2 to 5.5 200 max unit INT4(P30), INT5(P31) tPIH(2) INT3(P73) when noise • Interrupt source flag can be set. tPIL(2) filter time constant is • Event inputs for timer 0 are 1/1 enabled. tPIH(3) INT3(P73) when noise • Interrupt source flag can be set. tPIL(3) filter time constant is • Event inputs for timer 0 are 1/32 enabled. tPIH(4) INT3(P73) when noise • Interrupt source flag can be set. tPIL(4) filter time constant is • Event inputs for timer 0 are 1/128 tPIH(5) RMIN(P73) tPIL(5) enabled. Recognized by the infrared remote controller receiver circuit as a signal. tPIL(6) RES tCYC Resetting is enabled. RMCK (Note5-1) μs Note 5-1: Represents the period of the reference clock (1tCYC to 128tCYC or the source frequency of the subclock) for the infrared remote controller receiver circuit No.A0886-18/29 LC87F7J32A AD Converter Characteristics at VSS1 = VSS2 = VSS3 =0V <12bits AD Converter Mode at Ta =-40 to +85°C> Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Resolution N AN0(V1) to Absolute ET AN2(V3), Conversion AN7(P04), TCAD time Analog input typ 3.0 to 5.5 (Note 6-1) • See Conversion time calculation AN8(P70), formulas. AN9(P71), (Note 6-2) max unit 12 bit ±16 3.0 to 5.5 AN3(P00) to accuracy min 4.0 to 5.5 32 115 3.0 to 5.5 64 115 3.0 to 5.5 VSS VDD LSB μs AN10(XT1), VAIN AN11(XT2) voltage range Analog port IAINH VAIN=VDD 3.0 to 5.5 input current IAINL VAIN=VSS 3.0 to 5.5 1 -1 V μA <8bits AD Converter Mode at Ta =-40 to +85°C> Parameter Symbol Pin/Remarks Specification Conditions VDD[V] Resolution Absolute N AN0(V1) to ET AN2(V3), Conversion TCAD time Analog input VAIN AN7(P04), (Note 6-1) • See Conversion time calculation AN8(P70), formulas. AN9(P71), (Note 6-2) max unit 8 bit 3.0 to 5.5 ±1.5 4.0 to 5.5 20 90 3.0 to 5.5 40 90 3.0 to 5.5 VSS VDD LSB μs AN10(XT1), AN11(XT2) voltage range typ 3.0 to 5.5 AN3(P00) to accuracy min Analog port IAINH VAIN=VDD 3.0 to 5.5 input current IAINL VAIN=VSS 3.0 to 5.5 1 -1 V μA Conversion time calculation formulas: 12bits AD Converter Mode: TCAD(Conversion time)=((52/(division ratio)) + 2) × (1/3) ×tCYC 8bits AD Converter Mode: TCAD(Conversion time)=((32/(division ratio)) + 2) × (1/3) ×tCYC External Operating supply oscillation voltage range (FmCF) (VDD) System division ratio Cycle time (SYSDIV) (tCYC) AD division AD conversion time (TCAD) ratio (ADDIV) 12bit AD 8bit AD 4.0V to 5.5V 1/1 250ns 1/8 34.8μs 21.5μs 3.0V to 5.5V 1/1 250ns 1/16 69.5μs 42.8μs 4.0V to 5.5V 1/1 375ns 1/8 52.2μs 32.3μs 3.0V to 5.5V 1/1 375ns 1/16 104.3μs 64.2μs 3.0V to 5.5V 1/1 750ns 1/8 104.5μs 64.5μs CF-12MHz CF-8MHz CF-4MHz Note 6-1: The quantization error (±1/2LSB) must be excluded from the absolute accuracy. The absolute accuracy must be measured in the microcontroller's state in which no I/O operations occur at the pins adjacent to the analog input channel. Note 6-2: The conversion time refers to the period from the time an instruction for starting a conversion process till the time the conversion results register(s) are loaded with a complete digital conversion value corresponding to the analog input value. The conversion time is 2 times the normal-time conversion time when: • The first AD conversion is performed in the 12-bit AD conversion mode after a system reset. • The first AD conversion is performed after the AD conversion mode is switched from 8-bit to 12-bit conversion mode. No.A0886-19/29 LC87F7J32A Power-on reset (POR) Characteristics at Ta=-40 to +85°C, VSS1=VSS2=VSS3=0V Specification Parameter Symbol Pin/Remarks Conditions Option selected voltage POR release PORR • Select from option. voltage Detection voltage (Note 7-1) POUKS max 2.07V 1.95 2.07 2.19 2.25 2.37 2.49 2.87V 2.75 2.87 2.99 4.35V 4.21 4.35 4.49 0.7 0.95 (Note 7-2) PORIS typ 2.37V • See Fig. 7. unknown state Power supply rise min • Power supply rise time 100 time from 0V to 2.0V. unit V ms Note7-1: The POR release level can be selected out of 4 levels only when the LVD reset function is disabled. Note7-2: POR is in an unknown state before transistors start operation. Low voltage detection reset (LVD) Characteristics at Ta=-40 to +85°C, VSS1=VSS2=VSS3=0V Specification Parameter Symbol Pin/Remarks Conditions Option selected voltage LVD reset voltage LVDET (Note 8-2) • Select from option. (Note 8-1) (Note 8-3) • See Fig. 8. LVD LVHYS hysteresys width Detection voltage LVUKS unknown state Low voltage dtection minimum width min. max. 2.31V 2.21 2.31 2.41 2.81V 2.71 2.81 2.91 4.28V 4.18 4.28 4.38 2.31V 55 2.81V 60 4.28V 65 unit V mV • See Fig. 8. (Note 8-4) TLVDW typ. 0.7 0.95 V • See Fig. 9. 0.2 ms (Reply sensitivity) Note8-1: The LVD reset level can be selected out of 3 levels only when the LVD reset function is enabled. Note8-2: LVD reset voltage specification values do not include hysteresis voltage. Note8-3: LVD reset voltage may exceed its specification values when port output state changes and/or when a large current flows through port. Note8-4: LVD is in an unknown state before transistors start operation. No.A0886-20/29 LC87F7J32A Consumption Current Characteristics at Ta = -40°C to +85°C, VSS1 = VSS2 = VSS3 = 0V Parameter Normal mode Symbol Conditions VDD[V] • FmCF=12MHz ceramic oscillation mode consumption VDD1 =VDD2 current =VDD3 • System clock set to 12MHz side (Note 9-1) IDDOP(1) Specification Pin/ Remarks IDDOP(2) • FmX’tal=32.768kHz crystal oscillation mode min typ max 4.5 to 5.5 8.5 23 3.0 to 3.6 4.8 13 4.5 to 5.5 6.9 19 3.0 to 3.6 3.9 11 2.5 to 3.0 3.1 8.8 4.5 to 5.5 2.4 6.6 3.0 to 3.6 1.3 3.5 2.2 to 3.0 1.1 3.2 4.5 to 5.5 0.7 3.3 3.0 to 3.6 0.4 1.9 2.2 to 3.0 0.3 1.5 4.5 to 5.5 7.8 21 3.0 to 3.6 4.5 12 4.5 to 5.5 3.6 10 3.0 to 3.6 2.8 7.7 2.2 to 3.0 1.8 5.5 4.5 to 5.5 35 120 3.0 to 3.6 18 72 2.2 to 3.0 13 53 4.5 to 5.5 3.8 9.2 3.0 to 3.6 2.0 5.0 unit • Internal RC oscillation stopped. • Frequency variable RC oscillation stopped. • 1/1 frequency division ratio IDDOP(3) • FmCF=8MHz ceramic oscillation mode • FmX’tal=32.768kHz crystal oscillation mode IDDOP(4) • System clock set to 8MHz side • Internal RC oscillation stopped. IDDOP(5) • Frequency variable RC oscillation stopped. • 1/1 frequency division ratio IDDOP(6) • FmCF=4MHz ceramic oscillation mode • FmX’tal=32.768kHz crystal oscillation mode IDDOP(7) • System clock set to 4MHz side • Internal RC oscillation stopped. IDDOP(8) • Frequency variable RC oscillation stopped. • 1/2 frequency division ratio IDDOP(9) • FmCF=0Hz (oscillation stopped) mA • FmX’tal=32.768kHz crystal oscillation mode IDDOP(10) IDDOP(11) • System clock set to internal RC oscillation • Frequency variable RC oscillation stopped. • 1/2 frequency division ratio IDDOP(12) • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode • Internal RC oscillation stopped. IDDOP(13) • System clock set to 10MHz wifh frequency variable RC oscillation • 1/1 frequency division ratio IDDOP(14) • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode IDDOP(15) • Internal RC oscillation stopped. • System clock set to 4MHz wifh frequency IDDOP(16) variable RC oscillation • 1/1 frequency division ratio IDDOP(17) • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode IDDOP(18) • System clock set to 32.768kHz side • Internal RC oscillation stopped. IDDOP(19) • Frequency variable RC oscillation stopped. • 1/2 frequency division ratio HALT mode IDDHALT(1) • HALT mode consumption • FmCF=12MHz ceramic oscillation mode current • FmX’tal=32.768kHz crystal oscillation mode (Note 9-1) IDDHALT(2) • System clock set to 12MHz side • Internal RC oscillation stopped. • Frequency variable RC oscillation stopped. • 1/1 frequency division ratio IDDHALT(3) mA • HALT mode • FmCF=8MHz ceramic oscillation mode IDDHALT(4) μA 4.5 to 5.5 2.8 7.7 3.0 to 3.6 1.4 3.9 2.5 to 3.0 1.1 3.1 • FmX’tal=32.768kHz crystal oscillation mode • System clock set to 8MHz side • Internal RC oscillation stopped. IDDHALT(5) • Frequency variable RC oscillation stopped. • 1/1 frequency division ratio Note 9-1: The consumption current value includes none of the currents that flow into the output Tr and internal pull-up resistors. Continued on next page. No.A0886-21/29 LC87F7J32A Continued from preceding page. Parameter HALT mode Symbol Conditions VDD[V] • HALT mode consumption VDD1 =VDD2 current =VDD3 • FmX’tal=32.768kHz crystal oscillation mode (Note 9-1) IDDHALT(6) Specification Pin/ Remarks IDDHALT(7) min typ max unit 4.5 to 5.5 1.2 3.3 3.0 to 3.6 0.6 1.7 2.2 to 3.0 0.4 1.2 4.5 to 5.5 0.40 1.89 3.0 to 3.6 0.20 0.83 2.2 to 3.0 0.15 0.69 4.5 to 5.5 3.3 9.0 3.0 to 3.6 1.6 4.4 4.5 to 5.5 1.7 4.6 3.0 to 3.6 0.8 2.2 2.2 to 3.0 0.6 1.7 4.5 to 5.5 22 82 3.0 to 3.6 9 33 2.2 to 3.0 6 26 • HOLD mode 4.5 to 5.5 0.05 22 • CF1=VDD or open 3.0 to 3.6 0.03 13 2.2 to 3.0 0.02 9 • FmCF=4MHz ceramic oscillation mode • System clock set to 4MHz side • Internal RC oscillation stopped. IDDHALT(8) • Frequency variable RC oscillation stopped. • 1/2 frequency division ratio IDDHALT(9) • HALT mode • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode IDDHALT(10) • System clock set to internal RC oscillation • Frequency variable RC oscillation stopped. IDDHALT(11) • 1/2 frequency division ratio IDDHALT(12) mA • HALT mode • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode • Internal RC oscillation stopped. IDDHALT(13) • System clock set to 10MHz wifh frequency variable RC oscillation • 1/1 frequency division ratio IDDHALT(14) • HALT mode • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode IDDHALT(15) • Internal RC oscillation stopped. • System clock set to 4MHz wifh frequency IDDHALT(16) variable RC oscillation • 1/1 frequency division ratio IDDHALT(17) • HALT mode • FmCF=0Hz (oscillation stopped) • FmX’tal=32.768kHz crystal oscillation mode IDDHALT(18) • System clock set to 32.768kHz side μA • Internal RC oscillation stopped. IDDHALT(19) • Frequency variable RC oscillation stopped. • 1/2 frequency division ratio HOLD mode IDDHOLD(1) consumption IDDHOLD(2) current VDD1 (External clock mode) IDDHOLD(3) IDDHOLD(4) • HOLD mode 4.5 to 5.5 3.5 25 IDDHOLD(5) • CF1=VDD or open 3.0 to 3.6 2.2 15 2.2 to 3.0 2.0 10 (External clock mode) IDDHOLD(6) • LVD option selected Timer HOLD IDDHOLD(7) mode IDDHOLD(8) consumption current VDD1 • Timer HOLD mode 4.5 to 5.5 19 65 • CF1=VDD or open 3.0 to 3.6 7.0 31 2.2 to 3.0 4.5 17 μA (External clock mode) IDDHOLD(9) • FmX’tal=32.768kHz crystal oscillation mode Note 9-1: The consumption current value includes none of the currents that flow into the output Tr and internal pull-up resistors. F-ROM Programming Characteristics at Ta = +10°C to +55°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Onboard IDDFW(1) programming VDD1 min typ max unit • 128-byte programming • Erasing current included 3.0 to 5.5 5 10 mA 20 30 ms 40 60 μs current Programming time tFW(1) • Erasing time 3.0 to 5.5 • Programming time No.A0886-22/29 LC87F7J32A UART (Full Duplex) Operating Conditions at Ta = -40 to +85°C, VSS1 = VSS2 = VSS3 = 0V Specification Parameter Symbol Pin/Remarks Conditions VDD[V] Transfer ate UBR UTX(S0), 2.2 to 5.5 URX(S1) min typ max 16/3 unit 8192/3 tCYC Data length: 7/8/9 bits (LSB first) Stop bits: 1 bit (2-bit in continuous data transmission) Parity bits: None Example of 8-bit Data Transmission Mode Processing (Transmit Data=55H) Start bit Stop bit Start of transmission End of transmission Transmit data (LSB first) UBR Example of 8-bit Data Reception Mode Processing (Receive Data=55H) Stop bit Start bit Start of reception End of reception Receive data (LSB first) UBR Characteristics of a Sample Main System Clock Oscillation Circuit Given below are the characteristics of a sample main system clock oscillation circuit that are measured using a Our designated oscillation characteristics evaluation board and external components with circuit constant values with which the oscillator vendor confirmed normal and stable oscillation. Table 1 Characteristics of a Sample Main System Clock Oscillator Circuit with a Ceramic Oscillator Nominal Vendor Frequency Name 12MHz 8MHz 4MHz MURATA Circuit Constant Oscillator Name Operating Oscillation Voltage Stabilization Time Remarks C1 C2 Rf1 Rd1 Range typ max [pF] [pF] [Ω] [Ω] [V] [ms] [ms] CSTCE12M0G52-R0 (10) (10) Open 470 3.0 to 5.5 0.05 0.15 CSTCE8M00G52-R0 (10) (10) Open 2.2k 2.7 to 5.5 0.05 0.15 Internal MURATA Internal C1, C2 CSTLS8M00G53-B0 (15) (15) Open 680 2.5 to 5.5 0.05 0.15 C1, C2 CSTCR4M00G53-R0 (15) (15) Open 3.3k 2.2 to 5.5 0.05 0.15 Internal CSTLS4M00G53-B0 (15) (15) Open 3.3k 2.2 to 5.5 0.05 0.15 C1, C2 MURATA The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized after VDD goes above the operating voltage lower limit (see Figure 4). No.A0886-23/29 LC87F7J32A Characteristics of a Sample Subsystem Clock Oscillator Circuit Given below are the characteristics of a sample subsystem clock oscillation circuit that are measured using a Our designated oscillation characteristics evaluation board and external components with circuit constant values with which the oscillator vendor confirmed normal and stable oscillation. Table 2 Characteristics of a Sample Subsystem Clock Oscillator Circuit with a Crystal Oscillator Nominal Vendor Name Frequency Name Operating C3 C4 Rf2 Rd2 [pF] [pF] [Ω] [Ω] 18 18 Open 560 Voltage Range [V] Oscillation Stabilization Time typ max [s] [s] 1.4 3.0 Remarks Applicable EPSON 32.768kHz Circuit Constant Oscillator MC-306 TOYOKOMU 2.2 to 5.5 CL value= 12.5pF The oscillation stabilization time refers to the time interval that is required for the oscillation to get stabilized after the instruction for starting the subclock oscillation circuit is executed and to the time interval that is required for the oscillation to get stabilized after the HOLD mode is reset (see Figure 4). Note: The components that are involved in oscillation should be placed as close to the IC and to one another as possible because they are vulnerable to the influences of the circuit pattern. CF1 XT1 CF2 Rf1 Rf2 Rd1 C1 C2 XT2 Rd2 C3 C4 CF X’tal Figure 1 CF Oscillator Circuit Figure 2 XT Oscillator Circuit 0.5VDD Figure 3 AC Timing Measurement Point No.A0886-24/29 LC87F7J32A VDD Operating VDD lower limit 0V Power supply Reset time RES Internal RC oscillation tmsCF CF1, CF2 tmsX’tal XT1, XT2 Operating mode Unpredictable Reset Instruction execution Reset Time and Oscillation Stabilization Time HOLD reset signal HOLD reset signal absent HOLD release signal VALID Internal RC oscillation tmsCF CF1, CF2 tmsX’tal XT1, XT2 State HOLD HALT HOLD Reset Signal and Oscillation Stabilization Time Figure 4 Oscillation Stabilization Times No.A0886-25/29 LC87F7J32A VDD Note: External circuits for reset may vary depending on the usage of POR and LVD. Please refer to the user’s manual for more information. RRES RES CRES Figure 5 Reset Circuit SIOCLK: DATAIN: DI0 DI1 DI2 DI3 DI4 DI5 DI6 DATAOUT: DO0 DO1 DO2 DO3 DO4 DO5 DO6 DI7 DI8 DO7 DO8 Data RAM transfer period (SIO0 only) tSCK tSCKH tSCKL SIOCLK: tsDI thDI DATAIN: tdDO DATAOUT: Data RAM transfer period (SIO0 only) tSCKL tSCKHA SIOCLK: tsDI thDI DATAIN: tdDO DATAOUT: Figure 6 Serial I/O Waveforms tPIL tPIH Figure 7 Pulse Input Timing Signal Waveform No.A0886-26/29 LC87F7J32A VDD SW : ON/OFF (programmable) RLCD RLCD SW: ON (VLCD=VDD) RLCD RLCD VLCD RLCD RLCD 2/3VLCD RLCD 1/2VLCD RLCD 1/3VLCD RLCD RLCD GND Figure 8 LCD Bias Resistors (a) POR release voltage (PORRL) (b) VDD Reset period 100μs or longer Reset period Unknown-state (POUKS) RES Figure 9 Waveform observed when only POR is used (LVD not used) (RESET pin: Pull-up resistor RRES only) • The POR function generates a reset only when power is turned on starting at the VSS level. • No stable reset will be generated if power is turned on again when the power level does not go down to the VSS level as shown in (a). If such a case is anticipated, use the LVD function together with the POR function or implement an external reset circuit. • A reset is generated only when the power level goes down to the VSS level as shown in (b) and power is turned on again after this condition continues for 100μs or longer. No.A0886-27/29 LC87F7J32A LVD hysteresis width (LVHYS) LVD release voltage (LVDET+LVHYS) LVD reset voltage (LVDET) VDD Reset period Reset period Reset period Unknown-state (LVUKS) RES Figure 10 Waveform observed when both POR and LVD functions are used (RESET pin: Pull-up resistor RRES only) • Resets are generated both when power is turned on and when the power level lowers. • A hysteresis width (LVHYS) is provided to prevent the repetitions of reset release and entry cycles near the detection level. VDD LVD release voltage LVD reset voltage LVDET-0.5V TLVDW VSS Figure 11 Low voltage detection minimum width (Example of momentary power loss/Voltage variation waveform) No.A0886-28/29 LC87F7J32A ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PS No.A0886-29/29