NCS199 D

NCS199A1, NCS199A2,
NCS199A3
Current-Shunt Monitor,
Voltage Output,
Bi-Directional Zero-Drift
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Features
•
•
•
•
•
•
•
•
•
Wide Common−Mode Input Range −0.3 V to 26 V
Supply Voltage Range from 2.7 V to 26 V
Low Offset Voltage ±150 mV Max
Low Offset Drift (0.5 mV/°C)
Low Gain Error (max 1.5%)
Rail−to−rail Input and Output Capability
Low Current Consumption (typ 65 mA, 100 mA max)
NCV Prefix for Automotive and Other Applications Requiring
Unique Site Qualified and PPAP Capable
These are Pb−free Devices
PIN CONNECTIONS
REF
1
GND
2
VS
3
6
OUT
5
IN−
4
IN+
MARKING DIAGRAM
6
XXXMG
G
1
XXX = Specific Device Code (See page 4)
M
= Date Code
G
= Pb−Free Package
Typical Applications
•
•
•
•
SC70−6
SQ SUFFIX
CASE 419B
− +
The NCS199A1, NCS199A2 and NCS199A3 are voltage output
current shunt monitors that can measure voltage across shunts at
common−mode voltages from −0.3 V to 26 V, independent of supply
voltage. Three fixed gains are available: 50 V/V, 100 V/V or 200 V/V.
The low offset of the zero−drift architecture enables current sensing
with maximum drops across the shunt as low as 10 mV full−scale.
The devices can operate from a single +2.7 V to +26 V power
supply, drawing a maximum of 100 mA of supply current. All versions
are specified over the extended operating temperature range (–40°C to
+125°C).
Current Sensing (High−Side/Low−Side)
Automotive
Telecom
Sensors
(Note: Microdot may be in either location)
Product
Gain
R3−R4
R1−R2
NCS199A1
50
20 kW
1 MW
NCS199A2
100
10 kW
1 MW
NCS199A3
200
5 kW
1 MW
V OUT + ǒI LOAD
R SHUNTǓGAIN ) V REF
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
October, 2015 − Rev. 0
1
Publication Order Number:
NCS199/D
NCS199A1, NCS199A2, NCS199A3
RSHUNT
Supply
Load
NCS199Ax
R1
R3
IN−
−
IN+
+
Output
OUT
Reference
Voltage
R4
REF
VS
GND
R2
+2.7 V to +26 V
0.01 mF
To
0.1 mF
Figure 1. Application Schematic
Table 1. MAXIMUM RATINGS
Rating
Symbol
Supply Voltage (Note 1)
Analog Inputs
Differential (VIN+)−(VIN−)
Value
Unit
VS
+26
V
VIN+,VIN−
−26 to +26
V
Common−Mode (Note 2)
GND−0.3 to +26
REF Input
VREF
GND−0.3 to ( Vs) +0.3
V
Output (Note 2)
VOUT
GND−0.3 to ( Vs) +0.3
V
5
mA
Maximum Junction Temperature
TJ(max)
+150
°C
Storage Temperature Range
TSTG
−65 to +150
°C
ESD Capability, Human Body Model (Note 3)
HBM
±3000
V
ESD Capability, Machine Model (Note 3)
MM
±100
V
CDM
±1000
V
Input Current into Any Pin (Note 2)
Charged Device Model (Note 3)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for safe
operating parameters.
2. Input voltage at any pin may exceed the voltage shown if current at that pin is limited to 5 mA.
3. This device series incorporates ESD protection and is tested by the following methods
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per AEC−Q100−011.
Latchup Current Maximum Rating: 50 mA per JEDEC standard: JESD78
Table 2. THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, SC70 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Symbol
Value
Unit
RqJA
250
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for safe
operating parameters.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Table 3. RECOMMENDED OPERATING RANGES
Rating
Symbol
Min
Max
Unit
Supply Voltage
VS
2.7
26
V
Ambient Temperature
TA
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NCS199A1, NCS199A2, NCS199A3
Table 4. ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = −40°C to 125°C, guaranteed by characterization and/or design.
At TA = +25°C, VSENSE = VIN+ − VIN−, and VREF = VS/2, unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
GAIN
G
50
100
200
Ge
+0.2
+1.5
%
TA = −10°C to 125°C
7
20
ppm/°C
VSENSE = −5 mV to 5 mV
±0.01
%
No sustained oscillation
1
nF
NCS199A1
NCS199A2
NCS199A3
Gain Error
VSENSE = −5 mV to 5 mV
Gain Error vs. Temperature
Nonlinearity Error
Maximum Capacitive Load
V/V
VOLTAGE OFFSET
Offset Voltage (RTI Note 6)
Offset Drift
VSENSE = 0 mV
NCS199A2, NCS199A3
NCS199A1
VOS
±5.0
±150
mV
dV/dT
0.1
0.5
0.6
2.0
mV/°C
60
mA
26
V
INPUT
Input Bias Current
VSENSE = 0 mV
Common−Mode Input Voltage Range
Common−Mode
Rejection Ratio
Common−Mode
Rejection Ratio
NCS199A2,
NCS199A3
NCS199A1
IIB
VCM
−0.3
CMRR
100
115
dB
VS = 3.3 V, VIN+ = 3 V to +26 V,
VSENSE = 0 mV
100
115
dB
VS = 3.3 V, VIN+ = 0 V to +26 V,
VSENSE = 0 mV (TA = −10°C to 85°C)
100
120
dB
97
110
dB
VS = 3.3 V, VIN+ = 3 V to +26 V,
VSENSE = 0 mV
97
110
dB
VS = 3.3 V, VIN+ = 0 V to +26 V,
VSENSE = 0 mV (TA = −10°C to 85°C)
97
115
dB
VS = 5 V, VIN+ = 2 V to +26 V,
VSENSE = 0 mV
VS = 5 V, VIN+ = 2 V to +26 V,
VSENSE = 0 mV
CMRR
OUTPUT
Output Voltage Low
Referenced from GND
RL = 10 kΩ to Ground
VOL
5
50
mV
Output Voltage High
Referenced from VS
RL = 10 kΩ to Ground
VOH
0.05
0.2
V
CLOAD = 10 pF, NCS199A1
CLOAD = 10 pF, NCS199A2
CLOAD = 10 pF, NCS199A3
BW
100
60
40
kHz
SR
0.4
V/ms
en
35
nV/ǠHz
DYNAMIC PERFORMANCE
Bandwidth (f−3dB)
Slew Rate
NOISE
Spectral Density, 1 kHz (RTI Note 6)
POWER SUPPLY
Operating Voltage Range
VSENSE = 0 mV
Vs
Quiescent Current
VSENSE = 0 mV
IDD
Quiescent Current over Temperature
VSENSE = 0 mV
Power Supply Rejection Ratio
VS = +2.7 V to +26 V, VIN+ =18 V,
VSENSE = 0 mV
PSRR
2.7
65
±0.1
26
V
100
mA
115
mA
±10
mV/V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. RTI = referenced−to−input.
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3
NCS199A1, NCS199A2, NCS199A3
ORDERING INFORMATION
Device
Gain
Marking
NCS199A1SQT2G
50
ACQ
NCS199A2SQT2G
100
ACR
NCS199A3SQT2G
200
ACP
Package
Shipping †
SC70−6
(Pb−Free)
3000 / Tape and Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
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4
NCS199A1, NCS199A2, NCS199A3
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
H
A
D
6
5
GAGE
PLANE
4
L
L2
E1
E
1
2
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
e
B
6X
ddd
TOP VIEW
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
b
C A-B D
M
A2
DETAIL A
A
6X
ccc C
A1
SIDE VIEW
C
SEATING
PLANE
c
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
6X
6X
0.30
0.66
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCS199/D