NCS36510 D

NCS36510
Advance Information
Low Power System-on-Chip
For 2.4 GHz IEEE
802.15.4-2006 Applications
The NCS36510 is a low power, fully integrated, System on Chip
that integrates a 2.4 GHz IEEE 802.15.4−2006 compliant transceiver,
ARM® Cortex®−M3 microprocessor, RAM and FLASH memory, a
true random number generator, and multiple peripherals to support
design of a complete and secure wireless network with minimal
external components.
The NCS36510 offers advanced power management techniques that
allow operation down to supply voltages as low as 1 V while
minimizing current consumption. The NCS36510 is specifically
designed for applications requiring maximum battery life while
minimizing cost.
The NCS36510 incorporates an industry leading 32 bit
ARM Cortex−M3 for high performance, low power and low cost
processing. The NCS36510 includes 640 kB of embedded FLASH
memory for program storage along with 48 kB of RAM for data storage.
NCS36510 uses a hardware accelerated MAC to minimize
processor overhead while maximizing available processor power for
running application software.
Peripherals include DMA, UART(2), SPI(2), I2C(2), PWM, RTC,
three programmable timers, WDT, 18 GPIO, 10 bit ADC with four
external inputs and integrated temperature and voltage sensors.
www.onsemi.com
MARKING
DIAGRAM
1 40
40 PIN QFN, 6x6
MN SUFFIX
CASE 488AR
A
WL
YY
WW
G
NCS36510
AWLYYWWG
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 33 of
this data sheet.
Features
• Low Voltage Operation to as low as 1.0 V
• 0.18 mA Coma Mode Leakage Current
• 0.65 mA Coma Mode Sleep Current
• 6.6 mW Receive Power Consumption
• −99 dBm Receiver Sensitivity
• 6.9 mW Transmit Power Consumption
• Programmable Output Power to X8 dBm
• 2.4 GHz IEEE 802.15.4−2006 Transceiver
• ARM Cortex − M3 Processor
• AES 128/256 Encryption Engine
• True Random Number Generator
• 640 kB Embedded FLASH Memory
• 48 kB Internal RAM Memory
Typical Applications
• Internet of Things
• Building and Industrial Automation
• ZigBee® / 6LoWPAN / WirelessHART® / Threadt
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2015
December, 2015 − Rev. P5
1
Publication Order Number:
NCS36510/D
NCS36510
INTRODUCTION
Table 1. REFERENCES
Topic
Reference
Web Link
WPAN Standard
IEEE 802.15.4−2006 Standard
CCM Encryption
NIST SP800−38C
AES Encryption Standard
FIPS 197
http://www.nist.org/nist_plugins/content/content.php?content.39
Cryptography
Wikipedia
https://en.wikipedia.org/wiki/Block_cipher_mode_of_operation
ARM Cortex M3
Product Information and Support
ZigBee Alliance
Website
http://www.zigbee.org/
6LoWPAN WG
Website
https://datatracker.ietf.org/wg/6lowpan/charter/
Thread Group
Website
http://threadgroup.org/
HART Communication Group
Website
http://en.hartcomm.org/main_article/wirelesshart.html
https://standards.ieee.org/findstds/standard/802.15.4−2006.html
http://csrc.nist.gov/publications/PubsSPs.html#SP 800
http://www.arm.com/products/processors/cortex−m/cortex−m3.php
Table 2. DEFINITIONS
Abbreviation
Meaning
ACK
Refers to an acknowledge packet, part of 802.15.4
ADC
Analog to Digital Converter
AES
Advanced Encryption Standard
AGC
Automatic Gain Control
AHB
AMBA High−performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
API
Application Programming Interface
BCD
Binary Coded Decimal
BO
Brownout − loss of power below specified operating threshold
BOM
Bill Of Materials
CBC
Cipher Block Chaining
CCM
Counter with CBC
CPU
Central Processing Unit
CSMA−CA
Carrier Sense Multiple Access with Collision Avoidance, part of 802.15.4
CTR
Counter mode
DMA
Direct Memory Access
DWT
Data Watchpoint and Trace unit
ED
Energy Detection, part of 802.15.4
ESR
Equivalent Series Resistance
ETM
Embedded Trace Macrocell
EVM
Error Vector Magnitude
FIFO
First In First Out
fips197
AES encryption standard
FPB
Flash Patch Breakpoint unit
GPIO
General Purpose I/O
I2C
Serial wire interface
IF
Intermediate frequency
www.onsemi.com
2
NCS36510
Table 2. DEFINITIONS
Abbreviation
Meaning
IOH
Digital pad current when pad is driven to VOH
IOL
Digital pad current when pad is driven to VOL
ITM
Instrumentation Trace Macrocell
LFSR
Linear Feedback Shift Register
LNA
Low Noise Amplifier
LPF
Low Pass Filter
LQI
Link Quality Indicator, part of 802.15.4
MAC
Medium Access Control layer
MISO
Master In Slave Out, part of I2C protocol
MOSI
Master Out Slave In, part of I2C protocol
MUX
Multiplexer
NIST
National Institute of Standards and Technology
NVIC
Nested Vectored Interrupt Controller
OTA
Over The Air
PA
Power Amplifier
PMU
Power Management Unit
POR
Power On Reset
PWM
Pulse Width Modulation
QFN
Quad Flat No Leads, package type
RF
Radio Frequency
RSSI
Receive Signal Strength Indicator
RTC
Real Time Clock
RX
SAR ADC
Receive or Receiver
Successive Approximation Register Analog to Digital Converter
SCLK
SPI Clock, part of SPI protocol
SDK
Software Development Kit
SPI
Serial Peripheral Interface
SW
Software
SWD
Serial Wire Debug
TPIU
Bridge between the ETM and ITM
TRNG
True Random Number Generator
TX
UART
Transmit or Transmitter
Universal Asynchronous Receiver/Transmitter
UVI
Under−Voltage Indicator
VCO
Voltage Controlled Oscillator
VOH
Digital pad maximum output voltage of pullup driver at a current of IOH
VOL
Digital pad maximum output voltage of pulldown driver at a current of IOL
WDT
Watch Dog Timer
www.onsemi.com
3
NCS36510
BLOCK DIAGRAM
INTERRUPT
AND
WAKEUP
CONTROL
ARM
CORTEX −M3
NCS36510
Instruction
Data
BUS MATRIX
SWDIO
I−code
D−code
SWDCLK
DMA
320 kB
FLASH A
320 kB
FLASH B
SERIAL
WIRE
DEBUG
System Bus
16 kB
SRAM A
SWO
SWD_RESET
DIO[13]
DIO[12]
DIO[11]
RESETN
AHB to APB
BRIDGE
16 kB
SRAM B
16 kB
SRAM C
TEST MODES
TEST
FLASH
CONTROL
VDDIO
PAD CONTROL
TIMERS
UART 1
POWER SEQ
UART 2
VPA
MODULATOR
RFPWR
TX
RADIO
MAC
SPI 1
DEMODULATOR
SPI 2
2
RX
I C1
RF ANALOG
CONTROL
I2 C 2
DIO[17:0]
GPIO
32MO
32MI
CLOCK
CTRL
32KO
PWM
WATCH
DOG
32 kHz
SUPPLY
MONITOR
RTC
32 MHz
32KI
RESETN
SAR ADC
RESET
CTRL
V3V
V1VO
V1VI
C
R
O
S
S
B
A
R
PMU
FVDDHO
DVDDA
DVDD
AVDDn
FVDDL
RVDDn
TEMP SENSOR
128 AES
FVDDHI
RANDOM
NUMBER
GENERATOR
DC20150827
Figure 1. NCS36510 Block Diagram
www.onsemi.com
4
MUX
A[3:0]
NCS36510
FUNCTIONAL DESCRIPTION
Both clock domains have an internal and external user
selectable clock reference. The external clock reference
choices are crystal based and more accurate than the internal
clock references. The internal clock references can be
calibrated against the external 32 MHz clock.
A hardware accelerated MAC offloads the processor to do
application tasks. An extensive software API manages all
hardware peripherals, allowing the developer to focus on
application code.
The integrated processor is an industry leading 32 bit
ARM Cortex−M3 with SWD debugging. Integrated
memory modules include 640 kB of embedded FLASH and
48 kB of RAM. The FLASH memory is split into 2 x 320 kB
banks, enabling over the air upgrades or lower power
consumption if both memories are not needed. Both FLASH
banks also include an 8 kB information block. The
information block includes ON Semiconductor factory trim
values, the bootloader, and customer specific trim values.
Details can be found in the SDK documentation. Four
different software controlled power modes are available to
maximize opportunities to save power in the application.
The NCS36510 has an integrated 10 bit ADC. The input
is single ended to reduce power consumption, but a
pseudo−differential mode is available. Various input scale
factors can be used to measure signals up to V3V, regardless
of the power supply voltage. Hardware enabled relative
measurements are also supported. Four independent
external analog inputs are multiplexed at the input to the
ADC. The ADC can also measure internal temperature and
supply voltage sensors.
Up to 18 general purpose digital I/Os are available and are
programmable. Options include drive strength and
pullup/pulldown resistors. The GPIOs can be used in
conjunction with the following integrated peripherals:
UART, SPI, I2C, and PWM.
The NCS36510 is a system on chip for IEEE
802.15.4−2006 applications. Many functions are integrated
to lower cost while delivering high performance at the
lowest power consumption.
The NCS36510 PMU supports two supply voltage modes:
3 V and 1 V. In 3 V mode a voltage source from 2 V to 3.6 V
is applied to V3V which feeds into the internal
pre−regulator. The pre−regulator regulates the output, V1V,
down to about 1.1 V. From 2 V to 2.6 V the pre−regulator
uses an internal linear regulator to generate V1V. From 2.6 V
to 3.6 V an internal switching regulator can be used to
increase the power conversion efficiency. In 1 V mode the
pre−regulator is disabled and the core is supplied directly.
V1V can be as low as 1 V and as high as 1.6 V.
The RF receive path has been optimized for minimum
power while maintaining high sensitivity. The receive chain
employs two down conversion stages with the first one using
an IF that is the LO divided by 16 and the second with a fixed
low IF. After the second down conversion the signal is
digitized for baseband processing which includes image
rejection and demodulation. Automatic gain control is used
to maximize dynamic range in the analog path.
The RF transmit path has also been optimized for low
power. Direct modulation in the frequency synthesizer is
used to remove the need for an additional mixer. A
non−linear switching power amplifier is used to maximize
power efficiency.
To minimize BOM costs, the RF transmit and receive pins
can be connected together to avoid an external RF switch.
The LO for the IF and RF blocks are generated by a fully
integrated fractional N frequency synthesizer. The reference
clock for the frequency synthesizer is a 32 MHz external
oscillator.
The NCS36510 has two clock domains. The low speed
32.768 kHz clock is typically used to periodically cycle
between the lowest power coma mode and run mode. The
high speed 32 MHz clock is used in run mode and by the
internal frequency synthesizer for LO generation.
www.onsemi.com
5
NCS36510
PIN CONFIGURATIONS
RX
TX
RFPWR
VPA
TEST
RESETN
DIO[13]
DIO[12]
DIO[11]
DIO[17]
31
32
33
34
35
36
37
38
39
40
DIO[10]
DIO[9]
DIO[8]
DIO[16]
VDDIO
DIO[15]
DIO[7]
DIO[6]
DIO[5]
DIO[4]
1
30
2
29
3
28
4
27
5
26
NCS36510
6
25
7
24
8
23
9
22
10
21
20
19
18
17
16
15
14
13
12
11
V1VO
NC
FVDDHO
FVDDHI
DVDD
DIO[14]
DIO[0]
DIO[1]
DIO[2]
DIO[3]
6
X32MI
X32MO
A1
A0
V3V
V1VI
DC20150827.
Figure 2. 40−Pin QFN Configuration (Top View)
www.onsemi.com
A3
A2
X32KI
X32KO
NCS36510
PIN ASSIGNMENT
Table 3. 40−PIN QFN CONFIGURATION
Pin
Pin Name
1
DIO[10]
General Purpose Digital I/O
Description
2
DIO[9]
General Purpose Digital I/O
3
DIO[8]
General Purpose Digital I/O
4
DIO[16]
General Purpose Digital I/O
5
VDDIO
Digital I/O Bank Power
6
DIO[15]
General Purpose Digital I/O
7
DIO[7]
General Purpose Digital I/O
8
DIO[6]
General Purpose Digital I/O
9
DIO[5]
General Purpose Digital I/O
10
DIO[4]
General Purpose Digital I/O
11
DIO[3]
General Purpose Digital I/O
12
DIO[2]
General Purpose Digital I/O
13
DIO[1]
General Purpose Digital I/O
14
DIO[0]
General Purpose Digital I/O
15
DIO[14]
General Purpose Digital I/O
16
DVDD
Digital 950 mV Regulator
17
FVDDHI
Embedded FLASH 1.8 V Regulator, Input to external filter required for 1 V mode
18
FVDDHO
Embedded FLASH 1.8 V Regulator, Output from external filter required for 1 V mode
19
NC
20
V1VO
Tie to GND or leave floating
Core 1.1 V Regulator, Output to external filter required for 3 V mode using the switching regulator
21
V1VI
Core 1.1 V Regulator, Input to external filter required for 3 V mode using the switching regulator
22
V3V
Main power input
23
A0
ADC Channel Input
24
A1
ADC Channel Input
25
X32MO
32 MHz Crystal Output
26
X32MI
32 MHz Crystal Input
27
X32K0
32.768 kHz Crystal Output
28
X32KI
32.768 kHz Crystal Input
29
A2
ADC Channel Input
30
A3
ADC Channel Input
31
RX
RF LNA Input
32
TX
RF PA Output
33
RFPWR
34
VPA
35
TEST
36
RESETN
37
DIO[13]
General Purpose Digital I/O
38
DIO[12]
General Purpose Digital I/O
39
DIO[11]
General Purpose Digital I/O
40
DIO[17]
General Purpose Digital I/O
EP
Exposed Pad
RF PA Regulator Output
RF PA Regulator Input
Test Input (used to enable SWD Interface)
Active Low Reset
GND, thermal pad under package
www.onsemi.com
7
NCS36510
CPU
Adjustable clock rates and clock switching also provide
further means of lowering the power consumption.
Typically the CPU is clocked at 32 MHz to execute code as
quickly as possible.
Next to the regular ARM Cortex−M3 processor interrupts,
the NCS36510 implements 20 external source interrupts for
peripheral devices. A powerful nested, pre−emptive and
priority based interrupt handling assure timely and flexible
response to external events.
The NCS36510 integrates the powerful and energy
efficient ARM Cortex−M3 processor. The processor uses
the Thumb−2 instruction set and is optimized for high
performance with reduced code size and low power
operation. The Cortex−M3 efficiently handles multiple
parallel peripherals and has integrated sleep modes
including data retention for the lowest possible coma mode
current. With industry standard tool chain and support,
developing applications on the NCS36510 platform reduces
time to market.
MEMORY ORGANIZATION
This section documents the memory map of the NCS36510.
application related trims that can be programmed by the
customer: 32.768 kHz external oscillator, 32 MHz external
oscillator, and the RSSI offset. At the factory these are set to
a nominal value.
FLASH
NCS36510 contains a total of 640 kB of FLASH memory,
organized as two banks of 320 kB each. Two independent
banks are used to allow either OTA upgrades or to shut down
an unused bank to save power.
Both FLASH banks include an 8 kB information block.
This information block contains the bootloader and factory
programmed trim values. There are a minimum of three
RAM
NCS36510 has a total of 48 kB of internal RAM, split into
three banks of 16 kB. One or two of the RAM banks can be
used in coma mode for data retention.
www.onsemi.com
8
NCS36510
ROM table
0x3FFFFFFF
External private peripheral bus
SRAM A (16 kB)
0x3FFFC000
ETM
TPIU
0xFFFFFFFF
0x3FFFBFFF
Reserved
SRAM B (16 kB)
0xE0100000
0xE00FFFFF
0x3FFF8000
0x3FFF7FFF
SRAM C (16 kB)
NVIC
Private Peripheral Bus:
Reserved
External
FPB
DWT
ITM
0xE0040000
0xE003FFFF
Private Peripheral Bus:
0x3FFF4000
0x2400041C
DMA (7 B)
Internal
0xE0000000
0xDFFFFFFF
0x24000400
0x2400015F
0x24000100
0x240000FF
MAC LUT (96 B)
External Device (1 GB)
MAC RAM (256 B)
0x24000000
0xA0000000
0x9FFFFFFF
0x00351FFF
Program Memory B Alias
320 kB)
0x00302000
0x00301FFF
0x00300000
Information Block B Alias (8 kB)
External RAM (1 GB)
0x60000000
0x5FFFFFFF
Peripherals (0.5 GB)
0x00251FFF
Program Memory A Alias
(320 kB)
0x00202000
0x00201FFF
0x00200000
Information Block A Alias (8 kB)
0x40000000
0x3FFFFFFF
SRAM (0.5 GB)
0x20000000
0x1FFFFFFF
Code (0.5 GB)
0x00000000
Program Memory A
(320 kB)
Information Block A (8 kB)
0x00051FFF
Program Memory B
(320 kB)
0x00002000
0x00001FFF
0x00000000
Test Modes
Device Option
PMU
Pad Control
Clock Control
Reserved
RF/Analog Control
Reset Control
FLASH Control
AES
SAR ADC
MAC Configuration
Reserved
Randomizer
Crossbar
RTC
Reserved
I2C #2
GPIO
PWM
Watchdog
SPI #2
UART #2
I2C
SPI
UART
Reserved
Timer 2
Timer 1
Timer 0
0x00151FFF
0x00102000
0x00101FFF
0x00100000
Reserved
Information Block B (8 kB)
Figure 3. Memory Map
www.onsemi.com
9
0xE00FF000
0xE00FEFFF
0xE0042000
0xE0041000
0xE0040000
0xE003FFFF
0xE000F000
0xE000E000
0xE000DFFF
0xE0003000
0xE0002000
0xE0001000
0xE0000000
0x4001F000
0x4001E000
0x4001D000
0x4001C000
0x4001B000
0x4001A000
0x40019000
0x40018000
0x40017000
0x40016000
0x40015000
0x40014000
0x40013000
0x40012000
0x40011000
0x40010000
0x4000F000
0x4000E000
0x4000D000
0x4000C000
0x4000B000
0x4000A000
0x40009000
0x40008000
0x40007000
0x40006000
0x40005000
0x40004FFF
0x40003000
0x40002000
0x40001000
0x40000000
NCS36510
SYSTEM CLOCKS
APB
32.768 kHz
X32MO
32 MHz
24
32 MHz
Internal
OSC
32 MHz
OSC
X32MI
25
CLOCK
CONTROL
X32KO
27
32.768 kHz
Internal
OSC
32.768 kHz
OSC
X32KI
28
NCS36510
DC20150827
Figure 4. Clock System
An internal 32 MHz oscillator is typically used for fast
boot up before the external 32 MHz oscillator is enabled and
ready.
The 32.768 kHz internal oscillator is typically used
during low power modes as it has the lowest power
consumption. If accuracy is a higher priority over power
consumption then the external 32.768 kHz oscillator can be
used instead.
Both internal oscillators can be trimmed by using the
32 MHz crystal oscillator based clock as a timing reference.
The NCS36510 can be run from any of the four available
clocks. There are two external oscillators, one 32 MHz and
one 32.768 kHz. Both require external crystals to be used.
There are two internal oscillators, one 32 MHz and one
32.768 kHz.
The 32 MHz external crystal based clock is needed for
802.15.4−2006 timing requirements. The external
32.768 kHz crystal based clock is only needed if an accurate
RTC is required.
RESET
EXTERNAL RESET
There are five sources of reset: internal POR and BO,
external reset, software reset, and watchdog timer.
When the external reset pin is driven low, the NCS36510
is held in reset. The processor debug logic is not reset.
INTERNAL POWER−ON RESET AND BROWNOUT
SOFTWARE RESET
The POR and BO functions are combined in the PMU.
During startup, the POR is released when V3V is at a high
enough voltage to support the internal digital logic voltage
regulators. After power up the voltage at V1V is monitored
and if it gets too low, a brownout reset is generated. A POR
and a brownout have the same effect on the system which is
a full reset including the processor debug logic.
Upon POR or BO the processor starts to fetch instructions
from address 0x0 where the boot loader resides. The boot
loader loads the analog trim values from FLASH into the
trim registers, figures out where the most recent application
is located (FLASH bank A or B), checks the application
binary and finally starts the application.
Software reset can be called when switching from one
application to the other, after remap of the FLASH banks, or
on exit of a processor exception. The software requested
reset will not reset all processor or peripheral device
registers.
WATCHDOG TIMER
To help prevent errant software locking up the NCS36510
a WDT is provided. The WDT is disabled upon power up
and must be enabled by software. The watchdog is paused
when the debugger halts the processor. The processor debug
logic is not reset.
www.onsemi.com
10
NCS36510
EXCEPTION HANDLING
The ARM Cortex−M3 processor supports priority based
nested vectored interrupts. The NCS36510 has 35 interrupts
with
16
levels
of
programmable
priority.
Table 4.
Exception
Number
Exception Type
Priority
Description
1
Reset
−3 (Highest)
Reset
2
NMI
−2
Non−maskable interrupt. This is set to the watchdog interrupt.
3
Hard fault
−1
All fault conditions if the corresponding fault handler is not enabled.
4
MemManage fault
Programmable
Memory management fault
5
Bus fault
Programmable
Bus fault
6
Usage fault
Programmable
Exceptions resulting from program error.
7−10
Reserved
11
SVC
Programmable
Supervisor Call
12
Debug Monitor
Programmable
Debug monitor (breakpoints, watchpoints, or external debug requests)
13
Reserved
Programmable
14
PendSV
Programmable
Pendable Service Call
15
SYSTICK
Programmable
System Tick Timer
16
Timer 0
Programmable
Timer 0 interrupt
17
Timer 1
Programmable
Timer 1 interrupt
18
Timer 2
Programmable
Timer 2 interrupt
19
UART
Programmable
UART interrupt
20
SPI
Programmable
SPI interrupt
21
I2C
Programmable
I2C interrupt
22
GPIO
Programmable
GPIO interrupt
23
RTC
Programmable
Real−time−clock interrupt
24
Flash Controller
Programmable
Flash Controller
25
MAC
Programmable
MAC interrupt
26
AES
Programmable
AES interrupt
27
ADC
Programmable
ADC interrupt
28
Clock Calibration
Programmable
Clock calibration interrupt
29
UART #2
Programmable
UART Interrupt
30
UVI
Programmable
Under Voltage Indicator Interrupt
31
DMA
Programmable
DMA interrupt
32
CDBGPWRUPREQ
Programmable
Debug request
33
SPI #2
Programmable
SPI #2 Interrupt
34
I2C #2
Programmable
I2C #2 Interrupt
35
FVDDH Comp
Programmable
FVDDH Supply Comparator Trip
www.onsemi.com
11
NCS36510
WIRELESS TRANSCEIVER
RADIO
The NCS36510 radio is a single ended interface to
minimize power consumption and external components.
The transmit and receive pins are separated in the package
but are typically connected on the application board. When
transmitting the receiver is disabled, and vice versa. A
biasing inductor is typically shared between the ports to
minimize external components.
The wireless transceiver consists of a:
• Radio
♦
Receiver
Transmitter
♦ Antenna Diversity
Modem
♦
•
RECEIVER
GAIN
GAIN
RX
LNA
LOI
31
GAIN
LO
LOI
SD
ADC
OUTI
SD
ADC
OUTQ
LOQ
FREQ
SYNTHESIZER
N/M
LOI
POWER
LOQ
33 TRANSMITTER
RFPWR
TX
VCO
LO
LPF
32 MHz
TXRF
32
Switching PA
DATA
NCS36510
DC20140606.1
Figure 5. Radio Block Diagram
An external matching circuit is required to transform the
impedance of the connected transmit/receive port to the
antenna impedance to maximize power transfer and receiver
sensitivity.
imaginary components (I and Q). The I and Q signals are
then converted to the digital domain for baseband
processing. The receive path employs an AGC algorithm to
maximize dynamic range.
Receiver
Transmitter
A fully integrated fractional N frequency synthesizer is
used to generate the necessary LO. The RF input is amplified
by a LNA and is followed by a sliding IF mixer to down
convert the signal to the first IF of LO/16. After further gain
the signal is down converted again to baseband as real and
The transmitter directly modulates the output baseband
signal to RF in the frequency synthesizer. This avoids an
additional mixer and saves power. The non−linear switching
PA offers the highest efficiency theoretically possible.
www.onsemi.com
12
NCS36510
34
PWRADJ
VPA
33 RFPWR
DAC
32
TX_IN
TX
RF Match
NCS36510
DC20140606.2
Figure 6. Transmitter
is offered. Antenna diversity requires an external antenna
switch to switch between two separate antennas located at
least a quarter wavelength away from each other. Using a
GPIO port, an external antenna switch can be automatically
switched to maximize sensitivity.
The PA requires an external inductor from the Tx pin to the
RFPWR pin.
The supply voltage at VPA can be from 1 V to 3.6 V,
independently from the other power domains. Typically
VPA is connected to V3V.
The RF output power is determined by the power setting
set at the RFPWR regulator. The maximum DC voltage at
RFPWR is about 2 V. When the transmitter is off, the
RFPWR node is pulled to ground through an internal switch.
MODEM
The NCS36510 modem combines a proprietary blend of
hardware and software to implement the requirements of the
IEEE 802.15.4−2006 standard. By efficiently splitting the
hardware and software interface for the modem, processor
bandwidth is maximized and power consumption is
minimized.
Antenna Diversity
Using a single antenna in a RF multi−path environment
may make it difficult to receive signals consistently. To
combat this natural phenomenon, antenna diversity support
PERIPHERAL DEVICES
CROSS BAR
NCS36510 has 18 digital IO pins to communicate with
external devices. These pins are shared between the
following internal peripheral devices:
1. UART 1
2. UART 2
3. I2C 1
4. I2C 2
5. SPI 1
6. SPI 2
7. PWM
8. GPIO
9. SWD
The application needs to configure the cross bar to wire
the desired peripheral device to the desired IO pins, given
the system constraints. The tables below indicate what
peripheral device can be wired to what pin.
www.onsemi.com
13
NCS36510
35
37
SWD
38
PAD
CONTROL
39
40
1
UART 1,2
2
3
4
SPI 1,2
6
CROSS
BAR
7
2
I C 1,2
8
9
10
GPIO
11
12
13
PWM
14
15
NCS36510
DC20140627 .1
Figure 7. Cross Bar
The debug port is wired to digital IO 11, 12 and 13, only
when the TEST pin is pulled to logic ‘1’. Debug port IO’s
can’t be assigned to different IO’s.
www.onsemi.com
14
TEST
DIO[13]
DIO[12]
DIO[11]
DIO[17]
DIO[10]
DIO[9]
DIO[8]
DIO[16]
DIO[15]
DIO[7]
DIO[6]
DIO[5]
DIO[4]
DIO[3]
DIO[2]
DIO[1]
DIO[0]
DIO[14]
NCS36510
The software API implements macros to set up the cross bar.
Table 5. CROSS BAR
DIO
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Transmit
Data
Receive
Data
X
Clear To
Send
X
Request To
Send
UART
X
Data
Terminal
Ready
X
Data Set
Ready
X
Data Carrier
Detect
X
Ring
Indicator
X
Transmit
Data
X
Receive
Data
UART#2
X
Clear To
Send
X
Request To
Send
I2C
X
SCLK
X
X
SDATA
SCLK
I2C#2
SDATA
X
X
X
X
X
X
X
X
X
SDATAO
X
X
SDATAI
X
X
SSNI
X
X
SSNO<0>
SSNO<1>
X
X
SCLK
SPI#1
0
X
X
X
X
X
X
X
SSNO<2>
X
X
SSNO<3>
X
www.onsemi.com
15
X
X
NCS36510
Table 5. CROSS BAR
DIO
17
16
15
SCLK
PWM
x
SSNO<0>
x
Output
15
14
13
X
X
11
9
8
7
6
X
X
5
4
3
2
1
0
X
x
X
X
X
X
12
X
11
X
10
X
9
GPIO
10
X
SSNI
16
12
X
SDATAI
17
13
X
SDATAO
SPI#2
14
X
8
X
7
X
6
X
5
X
4
X
3
X
2
X
1
X
0
X
PERIPHERAL ENABLE AND DISABLE
To save power, each peripheral device can be switched on
or off. The software API implements functions to enable and
disable the clocks by manipulating the clock control register.
•
•
•
•
DIGITAL INPUT/OUTPUT
NCS36510 has 18 identical GPIO. The following list
documents the programmable options available
independently for each GPIO. Programming is done with
software API calls.
Each GPIO input is compatible with CMOS levels and has
hysteresis.
Options:
• Bi−directional capability
• Individually configurable interrupt lines
• Rising, falling, or both edge interrupt
• High, low, or both logic level interrupt
SAR ADC
The NCS36510 has a fully integrated 10 bit SAR ADC.
The ADC is single ended to reduce power consumption. A
six input multiplexer allows up to four external signals to be
measured. The other two inputs are for internal temperature
and battery voltage (V3V) sensors.
The SAR ADC completes a conversion as fast as 5 ms with
a 4 MHz sample clock in 20 clock cycles.
To support a wide range of input voltages, there is a
programmable resistive voltage divider on the external
inputs. The table below shows the ideal settings.
Loopback mode
Push pull or open drain
Four programmable drive strengths
Pullup, pulldown or neither
www.onsemi.com
16
NCS36510
V3V
t °C
REF
0,95 V
A0
A1
A2
A3
23
24
MUX
SCALE
MUX[2:0]
SCALE[3:0]
SAR
ADC
10
OUT[9:0]
29
30
NCS36510
DC20140627. 1
Figure 8. ADC Block Diagram
differential voltage is automatically divided by the third
conversion resulting in a pseudo−differential ratio.
This SAR ADC has a finite input time constant. The mux
has a finite resistance, and the input of the ADC has a finite
capacitance. The input voltage must be fully settled to get an
accurate conversion. The input time constant also depends
on the scale factors programmed. The following table
contains typical values for time constants as a function of the
input scale factor. For maximum accuracy, at least 7 time
constants of settling time are recommended.
Warning: The user has the responsibility to respect the
absolute maximum ratings. The voltage on the ADC pins
cannot exceed V3V + 0.3 V, regardless of the input scaling.
Several modes of ADC operation are available including
absolute, ratio based, and pseudo−differential.
All ADC conversions are referenced to an internal fixed
reference of nominally 950 mV. Absolute conversions
represent the input signal compared to this fixed reference.
Table 6. ADC SCALE FACTORS
Scale Factor
Maximum Input
Input Resistance
1.00
950 mV
High Impedance
0.69
1.3 V
80 kW
0.53
1.7 V
52 kW
0.43
2.1 V
43 kW
0.36
2.5 V
38 kW
0.31
2.9 V
36 kW
0.28
3.3 V
34 kW
0.24
3.7 V
32 kW
Table 7. TYPICAL ADC SETTLING TIMES
For applications that require measuring an external signal
versus an external reference, a ratio based conversion mode
is supported. Two ADC conversions are done back to back
and automatically divided to get a ratio.
Pseudo−differential mode is similar to ratio based mode,
except the final computation is the difference of the two
signals instead of the ratio.
Ratio based pseudo−differential mode consists of three
conversions. The first two are taken as a differential signal,
the third is considered as a reference. The resulting
Scale Factor
Time Constant, t
7t
1.00
160 ns
1.12 ms
0.69
110 ns
770 ns
0.53
85 ns
595 ns
0.43
68 ns
476 ns
0.36
58 ns
406 ns
0.31
50 ns
350 ns
0.28
44 ns
308 ns
0.24
39 ns
273 ns
The ADC can be used in either single or continuous
conversion modes.
There is a status bit that can be polled to determine if the
ADC is busy. An interrupt can also be configured to avoid
consuming processor cycles polling the status bit.
Averaging can improve the accuracy of the SAR ADC
conversions as compared to single shot measurements.
The ADC is configured and controlled by software API
calls.
www.onsemi.com
17
NCS36510
PWM
The PWM Module is a peripheral that generates a
programmable duty cycle output signal. The duty cycle can
be programmed from 0% to 100% with 8 bit resolution.
The PWM is configured and controlled by software API
calls.
The first counter is a 15 bit sub−second counter
(2^15−1/32768 = 1s). It can be used for wait times less than
one second. The other counter is a 32 bit seconds counter.
The seconds counter is incremented by the sub−second
counter rollover. The second counter can count up to ~136
years so it can be used as a Unix (POSIX or Epoch) time
counter if desired. Each counter has programmable
independent alarms interrupts. Through software it is
possible to enable a combination of second and sub−seconds
counter. The RTC is configured and controlled by software
API calls.
UART
NCS36510 implements two UART devices, UART 1 and
UART 2.
UART 1 is a complete implementation of a 16550 UART.
By configuring the crossbar UART1 can be set up as a
complete 16550 UART, with all control wires.
Configuration registers are written and read by the
NCS36510 support code. The baud rate generator produces
timing strobes at the baud rate (for the transmitter) and at 16
times the selected baud rate (for the receiver). The receiver
examines the incoming data and uses the first edge of the
start bit to determine the bit timing. Transmit and receive
paths can be configured to use a single register for data or to
use FIFOs. Finite State Machines (FSMs) control transmit
and receive sections. Various error conditions can cause an
interrupt to be generated.
UART 2 is similar as UART 1, only RX and TX lines can
be wired to IO pins.
The UART peripherals are configured and controlled by
software API calls.
MAC
The NCS36510 MAC is comprised of a proprietary mix
of hardware and software. The developer interfaces with the
MAC through software API calls.
The MAC implements all necessary functions of the IEEE
802.15.4−2006 specification as required to develop
non−beaconed wireless networks including:
• Channel access
• Frame validation
• Acknowledged frame delivery (ACK)
• Association/Disassociation
• Hooks for security
• 16 bit or 64 bit extended addresses
• CSMA−CA
• ACK
• ED
• LQI
• 16 channels
I2C
NCS36510 implements two I2C bus master interfaces.
The I2C bus is an industry−standard two−wire (clock and
data) serial communication bus. The I2C bus is a
single master, multiple slave bus. I2C specifies that the I2C
master will initiate all read and write transactions, and that
the I2C slave will respond to these requests.
The I2C peripherals are configured and controlled by
software API calls.
SECURITY
The AES 128/256 module provides hardware support for
the encryption and decryption operations used in IEEE
802.15.4−2006. To support security required for IEEE
802.15.4−2006, the use of CCM is required. CCM is a
combination of counter mode (CTR) and cipher block
chaining (CBC). It can perform a “Counter” (CTR) or a
Cipher Block Chaining (CBC) encryption in 12 clocks for
128 bit encryption, or 16 clocks for 256 bit encryption.
The definition of CCM mode encryption is documented in
the NIST publication SP800−38C. Details of the
implementation of the AES module can be found in federal
information processing standard fips197. For more
information,
visit
the
following
website:
https://en.wikipedia.org/wiki/Block_cipher_mode_of_ope
ration.
The security is configured and controlled by software API
calls.
SPI
NCS36510 implements two SPI Bus Controllers. The SPI
peripherals are synchronous serial data link controllers.
The SPI bus controller can be configured under software
control to be a master or slave device. The data is transmitted
synchronously with the MOSI relative to the SCLK
generated by the master device. The master also receives
data on the MISO signal in a full duplex fashion.
The SPI controllers can be used with up to three slave
devices. When the core is configured as a slave, the MISO
signal is tri−stated to allow for multiple slaves to transmit
data to the master when the slave’s SSn control is active (or
selected).
The SPI is configured and controlled by software API
calls.
TIMERS
NCS36510 has three independent hardware timers. Each
timer is a 16 bit down counter with a selectable prescaler.
Prescaler values of 1, 16 and 256 can be selected. The
RTC
The RTC consists of two counters that are clocked by the
32.768 kHz clock (either internal or external references).
www.onsemi.com
18
NCS36510
TRUE RANDOM NUMBER GENERATOR
NCS36510 implements a TRNG. The randomizer can be
used to create uniformly distributed 32−bit random
numbers. It can be preloaded with a 32−bit random seed
value. The random number is generated using a maximum
length LFSR. The polynomial used is x32 + x22 + x2 + 1.
The TRNG is configured and controlled by software API
calls.
prescaler extends the timer’s range at the expense of
precision.
The timer provides two modes of operation that provide
a free running value and also periodic interrupts.
The timer contains several configuration registers that can
be written and read by the NCS36510 support software. Two
4 bit prescalers precede a 16 bit counter. The counter can be
clocked at either the input clock rate, or a choice of 7
pre−scaled rates. The counter can be loaded with a value
from a preload register. The counter can optionally generate
an interrupt.
The timers are configured and controlled by software API
calls.
DMA
The DMA controller is a single channel direct memory
access controller. It can be used to directly transfer data from
memory to memory, peripheral to memory, memory to
peripheral and peripheral to peripheral. After initial setup,
the DMA controller initiates data transfer from the user
specified source location to the internal DMA FIFO. It then
performs another transfer to move the date from the FIFO to
the user specified destination location. Through the DMA
software API, the DMA complete event can be polled for, or
a prior registered interrupt handler can be called upon DMA
complete interrupt.
SYSTEM TICK TIMER
Like most ARM Cortex devices, the NCS36510
implements a system tick timer. This system tick timer is
owned by the software and is used for ticking the real time
operating system.
WATCHDOG TIMER
NCS36510 implements one programmable watchdog
timer. The watchdog timer is disabled by default and the
application software needs to instantiate the watchdog timer
driver and enable it. To assist software development, the
watchdog timer is paused when the in−circuit debugger halts
the CPU.
The watchdog is on the 32.768 kHz clock domain so it has
a minimum resolution of 30.5 mS. It is 18 bits wide giving
it a maximum timeout time of 8 seconds.
The WDT is configured and controlled by software API
calls.
SWD DEBUG INTERFACE
NCS36510 implements a standard ARM SWD interface.
Use any SWD compliant hardware debugger interface to
interact with the internals of the NCS36510. Section 13.2
details how to connect the in circuit debugger hardware.
Note that the NCS36510 cannot go into coma mode with the
debugger attached.
Warning: Some debuggers do not work at 1 V.
POWER MANAGEMENT UNIT
internal logic signal and the system will be configured in 1 V
mode.
Warning: Connecting V1VO/I to V3V when V3V is
greater than the absolute maximum rating for the V1VO/I
domains will result in damage to NCS36510.
The pre−regulator voltage is split into two pins, V1VO
(V1V Output), and V1VI (V1V Input). Between these pins
a power supply filter must be put on the application board to
suppress the switching regulator noise. Throughout this
document this pre−regulator voltage may be referred to as
simply V1V. The user has the responsibility to filter this
voltage as specified to obtain the published performance
specifications.
NCS36510 has an advanced PMU supporting two voltage
supply modes: 3 V and 1 V, and four operating modes: Run,
Sleep, Deep Sleep, and Coma.
PRE−REGULATOR
In 3 V mode the V3V voltage is pre−regulated to a voltage
of about 1.1 V. The default voltage regulator is the linear
regulator. The application is responsible for controlling the
switching regulator, including monitoring the V3V voltage
with the internal voltage sensor. The switching regulator is
only allowed if V3V > 2.6 V.
In 1 V mode, the pre−regulator is disabled. Connecting the
V3V and V1VO/I pins to 1 V will automatically generate an
www.onsemi.com
19
NCS36510
V3V
Linear
Regulator
22
1
20
V1VO
0
64MHz CLK
1
Switching
Regulator
32.768kHz CLK
0
COMA MODE
STARTUP /POR
V3V < 2.6V
NCS36510
DC20140627 .1
Figure 9. Pre−Regulator System
SYSTEM OF LINEAR REGULATORS
Warning: The DVDD regulator is pinned out for
de−coupling only. The application is not allowed to use this
regulator to power anything other than the NCS36510
internal circuits.
The pre−regulator voltage (V1V) is the input voltage
(V1VI) for an array of internal linear regulators that are
automatically enabled and disabled in the appropriate modes
to minimize power consumption. These internal regulators
supply the internal analog and digital blocks.
www.onsemi.com
20
NCS36510
V1VI
21
VREF
OPA
16
DVDD
Digital
Blocks
VREF
OPA
AVDD
Analog
Blocks
NCS 36510
DC 20140714 .1
Figure 10. Linear Regulator System
EMBEDDED FLASH POWER SUPPLIES
To support the embedded FLASH two internal power
supplies are implemented. One is the FVDDH, which is
1.8 V, and the other is FVDDL, which is 1.2 V.
In 3 V mode, the FVDDH is generated by a linear
regulator powered by V3V. In 1 V mode, a voltage
multiplier is used to boost the V3V input voltage to the
required level.
The FVDDH voltage is split into two pins, FVDDHO
(FVDDH Output), and FVDDHI (FVDDHI Input).
Between these pins a power supply filter must be put on the
application board to suppress the voltage multiplier noise.
Throughout this document this voltage may be referred to as
simply FVDDH. The user has the responsibility to filter this
voltage as specified to obtain the published performance
specifications.
In either 3 V or 1 V modes the FVDDL voltage is
generated by a linear regulator from FVDDHI.
Warning: The application is not allowed to use this
regulator to power anything other than the NCS36510
internal circuits.
www.onsemi.com
21
NCS36510
22
V3V
Voltage
Multiplier
64MHz CLK
1
18
FVDDHO
0
V 3V < 1.65V
Linear
Regulator
Linear
Regulator
17
FVDDHI
FVDDL
NCS 36510
DC20151214
Figure 11. Flash Regulator System
• Sleep
• Deep Sleep
• Coma
OPERATING MODES
Operating runs are selected by software as highlighted below.
• Run
Table 8. POWER MODES
Mode
Digital
FLASH
Retention SRAM A
Retention SRAM B
32 MHz Clock
Run
ON
ON
ON
ON
ON
Sleep
ON
ON
ON
ON
ON
Deep Sleep
ON
OFF
ON
ON
ON
COMA
OFF
OFF
Programmable
Programmable
OFF
processor clock is gated, the processor is not executing code.
When an interrupt is detected, the FLASH memories are
powered up and the processor enters run mode and executes
code starting from the last known location.
The software application needs to decide when to enter
any of the sleep modes. The SDK offers a power
management unit API.
RUN MODE
In run mode all digital systems are powered and running
including external and/or internal oscillators. The processor
is executing code.
COMA MODE
In coma mode, only retention registers are powered in the
digital system. All processor, trim, and peripheral registers
retain their values. The high speed oscillator(s) are powered
down. The low speed oscillator clocks the CPU. The
processor clock is gated and waiting for an interrupt. When
an interrupt is received, the FLASH memory and remaining
digital systems will power up and the processor will enter
run mode and start executing code from the location, just
after where the power saving mode was entered. The
processor will stall until the FLASH memories are properly
powered. What FLASH banks are powered is decided upon
the FLASH power settings in the FLASH control block,
managed by the software FLASH driver.
SLEEP MODE
Sleep mode is the same as run mode except the processor
clock is gated. Since the processor clock is gated, the
processor is not executing code. When an interrupt is
detected, the processor enters run mode and executes code
starting from the last known location.
DEEP SLEEP MODE
Deep sleep mode is the same as sleep mode except the
FLASH memories are also powered down. Since the
www.onsemi.com
22
NCS36510
ELECTRICAL CHARACTERISTICS
Table 9. ABSOLUTE MAXIMUM RATINGS
Ratings
Symbol
Value
Unit
V3V Pin Voltage
−0.3 to 3.9
V
VPA Pin Voltage
−0.3 to 3.9
V
VDDIO Pin Voltage
−0.3 to 3.9
V
DVDD Pin Voltage
−0.3 to 1.8
V
FVDDHI/FVDDHO Pin Voltage
−0.3 to 2.38
V
V1VO/V1VI Pin Voltage
−0.3 to 1.8
V
−0.3 to VDDIO+0.3, v 3.9
V
Analog Pin Voltage (Note 2)
−0.3 to V3V+0.3, v 3.9
V
Crystal Pin Voltage (Note 3)
−0.3 to DVDD+0.3, v 1.8
V
RX Pin Voltage
−0.3 to VPA+0.3, v 3.9
V
TX Pin Voltage
−0.3 to VPA+0.3, v 3.9
V
RFPWR Pin Voltage
−0.3 to VPA+0.3, v 3.9
V
TJ(max)
125
°C
TSTG
−40 to 125
°C
ESD Capability, Human Body Model (Note 4)
2000
V
ESD Capability, Charged Device Model (Note 5)
250
V
Latchup Current Level (Note 6)
100
mA
Digital Pin Voltage (Note 1)
Maximum Junction Temperature
Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. GPIO[17:0], RESETN, TEST
2. A0, A1, A2, A3
3. X32KI, X32KO, X32MI, X32MO
4. ESD Human Body Model tested per JEDEC JS−001−2012.
5. ESD Charged Device Model tested per JEDEC JESD22−C101.
6. JESD78 Rev. D at Room Temperature.
Table 10. NORMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
V3V Supply Voltage – 3 V Mode
V3V3
2.0
3.0
3.6
V
V3V Supply Voltage – 1 V Mode (connected to V1V)
V3V1
1.0
1.15
1.6
V
VPA Supply Voltage
VPA
1.0
3.0
3.6
V
VDDIO
1.0
3.3
3.6
V
V1V
1.0
1.15
1.6
V
TA
−40
27
85
°C
VDDIO Supply Voltage
V1V Supply Voltage (Note 7)
Ambient Temperature
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
7. V1V is only an input in 1 V mode
www.onsemi.com
23
NCS36510
Table 11. ELECTRICAL CHARACTERISTICS
For typical values TA = 27°C, for min/max values TA = −40°C to 85°C; unless otherwise noted.
Power supplies V3V = VPA = 3 V, VDDIO = 3.3 V, unless otherwise noted.
Test Conditions
Parameter
Symbol
Min
Typ
Max
Unit
COMA MODE SLEEP CURRENT
Coma Mode Sleep Current (Note 8)
1 V Mode (Note 9)
3 V Mode, Switching Regulator
3 V Mode, Linear Regulator (Note 10)
1.0
0.65
4.96
μA
8. Coma mode = CPU running on internal 32 kHz osc and waiting for interrupt, both retention RAMS disabled, all other functions powered
down
9. V1V = V3V = VPA = 1.0 V
10. V3V = VPA = 2.0 V
COMA MODE LEAKAGE CURRENT
Coma Mode Leakage Current (Notes 9
and 11)
1 V Mode
μA
0.18
11. Coma mode = No clock present, CPU static, both retention RAMS disabled, all other functions powered down.
CORE POWER CONSUMPTION
1V Mode Transmit Current
(Notes 12, 13 and 14)
+2.6 dBm (Max. Power Setting)
0 dBm
−16 dBm (Min. Power Setting)
6.9
6.7
4.7
mA
3V Mode Transmit Current – Switching
Regulator (Notes 12, 13 and 14)
+7.6 dBm (Max. Power Setting)
0 dBm
−16 dBm (Min. Power Setting)
14.3
7
2.64
mA
3V Mode Transmit Current – Linear
Regulator (Notes 12, 13 and 14)
+7.6 dBm (Max. Power Setting)
0 dBm
−16 dBm (Min. Power Setting)
16.2
9
4.7
mA
1V Mode Receive Current (Notes 12
and 14)
6.6
mA
3V Mode Receive Current (Notes 12
and 14) – Switching Regulator
3.6
mA
3V Mode Receive Current (Notes 12
and 14) – Linear Regulator
6.5
mA
12. Peripherals disabled, CPU halted, 32 MHz crystal oscillator, CW Mode, 2.44GHz
13. Transmit power depends on RF matching circuit
14. ON Semiconductor evaluation board, TX and RX pins connected together, conducted measurement, 50W system
GENERAL
RAM − Total
3 banks of 16 kB RAM, up to two banks
retained in COMA mode
16
48
kB
FLASH − Total
2 banks of 320 kB FLASH, independent
power controls
320
640
kB
FLASH Erase Cycles Before Failure
(Note 15)
10k
cycles
FLASH Read Current (Note 15)
2.3
mA
FLASH Erase Current (Note 15)
5
mA
FLASH Write Current (Note 15)
3
Data Retention at 85°C
10
mA
years
15. Guaranteed by design.
RF RECEIVER
1V Mode Receive Sensitivity (Notes 16 Maximum of −85 dBm at a PER of 1% as
defined by (Note 17)
and 18)
−99
dBm
3V Mode Receive Sensitivity – Linear
Regulator (Notes 16 and 18)
−99
dBm
Maximum of −85 dBm at a PER of 1% as
defined by (Note 17)
www.onsemi.com
24
NCS36510
Table 11. ELECTRICAL CHARACTERISTICS
For typical values TA = 27°C, for min/max values TA = −40°C to 85°C; unless otherwise noted.
Power supplies V3V = VPA = 3 V, VDDIO = 3.3 V, unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
RF RECEIVER
3V Mode Receive Sensitivity – Switching Regulator (Notes 16 and 18)
Maximum of −85 dBm at a PER of 1% as
defined by (Note 17)
−98
dBm
Saturation (Note 16)
Maximum of −20 dBm at a PER of 1% as
defined by (Note 17)
−20
dBm
High−Side Adjacent Channel Rejection
(Note 16)
Signal at −82 dBm, O−QPSK modulated
interferer ±5 MHz, PER of 1% as defined
by (Note 17)
Minimum of 0dB required by (Note 17)
28
dB
Low−Side Adjacent Channel Rejection
(Note 16)
Signal at −82 dBm, O−QPSK modulated
interferer ±5 MHz, PER of 1% as defined
by (Note 17)
Minimum of 0 dB required by (Note 17)
29
dB
High−Side Alternate Channel Rejection Signal at −82 dBm, O−QPSK modulated
(Note 16)
interferer ±10 MHz, PER of 1% as defined
by (Note 17)
Minimum of 30dB required by (Note 17)
34
dB
Low−Side Alternate Channel Rejection
(Note 16)
Signal at −82 dBm, O−QPSK modulated
interferer ±10 MHz, PER of 1% as defined
by (Note 17)
Minimum of 30dB required by (Note 17)
37
dB
Co−channel Rejection (Note 16)
Signal at −82 dBm, O−QPSK modulated
interferer, PER of 1%
−7
dB
RSSI dynamic range (Note 16)
Energy Detect − Minimum of 40 dB required by (Note 17)
80
dB
RSSI Accuracy (Note 16)
Energy Detect − Maximum of ±6 dB required by (Note 17)
±3
dBm
Spurious Emissions 1GHz to 12.75GHz Radiated Measurement, converted to dBm
(LO Leakage) (Note 16)
ETSI EN 300 328 Requirement is −47dBm
−69
dBm
Frequency Error Tolerance (Note 19)
±100
ppm
16. ON Semiconductor evaluation board, TX and RX pins connected together, conducted measurement, 50W system.
17. IEEE 802.15.4−2006 Standard.
18. 2.48 GHz
19. Difference between center frequency of the received RF signal and LO frequency, measured on ON Semiconductor bench evaluation board.
RF TRANSMITTER
Carrier Offset (Note 16)
At maximum recommended power setting
as defined by (Note 17)
Maximum of ±40 ppm as required by
(Note 17)
2
ppm
1 V Mode – Maximum Output Power
(Note 16)
Conducted measurement, 50 W load
Minimum of −3 dBm as required by
(Note 17)
2.6
dBm
3 V Mode – Maximum Output Power
(Note 16)
Conducted measurement, 50 W load
Minimum of −3 dBm as required by
(Note 17)
7.6
dBm
Minimum Output Power (Note 16)
Conducted measurement, 50 W load
−16
dBm
Error Vector Magnitude (Note 16)
At maximum recommended power setting
as defined by (Note 17)
Maximum of 35% as required by (Note 17)
3 V mode with switching regulator enabled
20
%
www.onsemi.com
25
NCS36510
Table 11. ELECTRICAL CHARACTERISTICS
For typical values TA = 27°C, for min/max values TA = −40°C to 85°C; unless otherwise noted.
Power supplies V3V = VPA = 3 V, VDDIO = 3.3 V, unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
RF TRANSMITTER
Spurious Emissions (Note 16), Worst
Case Requirement
Maximum power setting, conducted measurement, 50 W load
3 V Mode with switching regulator enabled
−41.23 dBm required for (Note 20)
Limit 54 dBμV/m = −41.23 dBm EIRP
(Note 21)
−46
dBm
32.768
kHz
20. FCC Part 15.247, ETSI EN 300 440, ETSI EN 300 328
21. Field strength to dBm converter: http://www.compeng.com.au/radiated−power−calculator/
EXTERNAL OSCILLATOR – 32.768 kHz
Crystal frequency
Accuracy requirements
−100
100
ppm
ESR
80
kW
Crystal shunt capacitance (C0)
2.0
pF
INTERNAL OSCILLATOR – 32.768 kHz
Uncalibrated
Calibrated frequency
26
36
47
32.68
32.768
32.85
kHz
EXTERNAL OSCILLATOR – 32 MHz
32
Crystal frequency
Accuracy requirements
−30
MHz
30
ppm
ESR
50
W
Crystal shunt capacitance (C0)
2.0
pF
INTERNAL OSCILLATOR – 32 MHz
Uncalibrated frequency
28
32
41
MHz
Calibrated frequency
31
32
33
MHz
10b SAR ADC
Conversion time
5
ms
INL (Note 16)
No averaging, 16 samples averaged
6, 4
Codes
DNL (Note 16)
No averaging, 16 samples averaged
4, 1
Codes
−40C Value (Note 22)
777
Codes
+30C Value (Note 22)
664
Codes
+85C Value (Note 22)
546
Codes
Uncalibrated Accuracy (Note 23)
+/−5
°C
0.654
0.651
V
TEMPERATURE SENSOR
22. From Automated Test Equipment (ATE)
23. Guaranteed by design.
POR/BROWNOUT
Reset trip points (Note 24)
Trip high (POR)
Trip Low (Brownout)
24. V1V power domain.
DIGITAL I/O
VIL
Highest input voltage recognized as a
logic low
www.onsemi.com
26
0.3 *
VDDIO
V
NCS36510
Table 11. ELECTRICAL CHARACTERISTICS
For typical values TA = 27°C, for min/max values TA = −40°C to 85°C; unless otherwise noted.
Power supplies V3V = VPA = 3 V, VDDIO = 3.3 V, unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ
VIH
0.7 *
VDDIO
Max
Unit
DIGITAL I/O
Lowest input voltage recognized as a
logic high
Input leakage
VDDIO = 2.97 V
V
3
Input hysteresis (Note 27)
nA
Vhyst
375
411
650
mV
Logic high source current, IOH
VDDIO = 3.3 V
Pad driven to VOH = 0.8 * VDDIO
IOH3V0
IOH3V1
IOH3V2
IOH3V3
−1.5
−3
−5.5
−12
−1
−2
−4
−8
−0.8
−1.7
−3.1
−6
mA
Logic low sink current, IOL
VDDIO = 3.3 V
Pad driven to VOL = 0.2 * VDDIO
IOL3V0
IOL3V1
IOL3V2
IOL3V3
1
2.25
4.25
8.1
1.6
3.1
6
11.6
2.25
4.25
8
15
mA
8
10
12
kW
Pullup/Pulldown Resistance (Notes 25
and 26)
25. RESET pin has a fixed pullup
26. TEST has a fixed pulldown
27. Guaranteed by design.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS − RECEIVER
80
3V Mode − Linear
Regulator
60
1V Mode
40
20
0
−106
IEEE 802.15.4 1%
Limit
−102
53
51
3V Mode − Switching
Regulator
RELATIVE POWER LEVEL (dBr)
PACKET ERROR RATE (%)
100
−98
44
43
35
32
29
26
−50
−30
−10
10
30
50
INPUT POWER (dBm)
RELATIVE FREQUENCY (MHz)
Figure 12. Packet Error Rate
Figure 13. CW Mode Blocking / De−sensitization
www.onsemi.com
27
NCS36510
7.6
7.7
7.5
7.6
TRANSMIT POWER (dBm)
TRANSMIT POWER (dBm)
TYPICAL CHARACTERISTICS − TRANSMITTER 3 V MODE
7.4
7.3
7.2
7.1
7.0
6.9
6.8
6.6
2.405 2.415 2.425 2.435 2.445 2.455
7.3
7.2
7.1
7.0
6.9
6.7
2.405 2.415 2.425 2.435 2.445 2.455
2.465 2.475
(GHz)
Figure 14. 3 V Mode with Switching Regulator
Transmitter Output Power in CW Mode at
Maximum Power
Figure 15. 3 V Mode with Linear Regulator
Transmitter Output Power in CW Mode at
Maximum Power
10
10
5
5
0
−5
−10
−15
−20
2
4
6
8
10
12
14
16
18
−5
−10
−15
20
2
4
6
8
10
12
14
16
18
Figure 17. 3 V Mode with Linear Regulator
Transmit Power in CW Mode, 2.4425 GHz
TRANSMITTER CURRENT (mA)
TRANSMIT POWER SETTING CODE
Figure 16. 3 V Mode with Switching Regulator
Trasmit Power in CW Mode, 2.4425 Hz
7
0
0
TRANSMIT POWER SETTING CODE
12
2
0
−20
0
2.465 2.475
(GHz)
TRANSMIT POWER (dBm)
TRANSMIT POWER (dBm)
7.4
6.8
6.7
TRANSMITTER CURRENT (mA)
7.5
2
4
6
8
10
12
14
16
18
14
9
4
20
0
TRANSMIT POWER SETTING CODE
2
4
6
8
10
12
14
16
18
TRANSMIT POWER SETTING CODE
Figure 18. 3 V Mode with Switching Regulator
Transmitter Current versus Power Setting,
2.4425 GHz
Figure 19. 3 V Mode with Linear Regulator
Transmitter Current versus Power Setting,
2.4425 GHz
www.onsemi.com
28
20
20
NCS36510
TYPICAL CHARACTERISTICS − TRANSMITTER 1 V MODE
2.50
TRANSMIT POWER (dBm)
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
2.405 2.415 2.425 2.435 2.445 2.455
2.465 2.475
(GHz)
Figure 20. 1 V Mode Transmitter Output Power
in CW Mode
TRANSMITTER CURRENT (mA)
TRANSMIT POWER (dBm)
5
−5
−10
−15
−20
0
2
4
6
8
10
12
14
16
18
7
6.5
6
5.5
5
4.5
20
0
2
4
6
8
10
12
14
16
18
TRANSMIT POWER SETTING CODE
TRANSMIT POWER SETTING CODE
Figure 21. 1 V Mode Transmit Power in CW
Mode, 2.4425 GHz
Figure 22. 1 V Mode Transmitter Current
versus Power Setting
www.onsemi.com
29
20
NCS36510
APPLICATION SECTION
TYPICAL APPLICATION DIAGRAMS
Application drawings for 3 V and 1 V mode systems and
their recommended components are shown below. Because
the RF matching components are system dependent their
values are not specified.
The back of the NCS36510 package has an exposed
conductive pad that is required to be soldered to a ground
plane for proper operation. This pad is the ground for all of
the power domains on NCS36510, including the RF
circuitry.
3 V System
3.3V
3V
C6
C8
TXD
DIO [0]
RXD
UART1
SWD
Debug
DIO [1]
CTS
DIO [2]
RTS
DIO [3]
SWO
DIO [11]
SWCLK
DIO [12]
SWDIO
DIO [13]
SWD_RESET
RESETN
C9
VPA
DVDD
VDDIO
FVDDH
C5
17,18
5
16
34
RFPWR
14
33
C1
13
L1
12
L2
TX
32
L3
11
C4
NCS36510
39
31
C2
RX
C3
38
26
37
X32MI
X1
36
25
20
C12
V3V
V1VI
C11
L4
22
V1VO
21
DC20151130
X32MO
3V
C10
Figure 23. 3 V System Application Diagram
Table 12. COMPONENT LIST
Component
C1
C2, C3
Description
Decoupling RFPWR
Value
100 pF
RF match and harmonic filter
C4
RF DC Block
100 pF
C5
Decoupling VDDIO
220 nF
C6
Decoupling FVDDH
33 nF
C7
Decoupling FVDDL
33 nF
C8
Decoupling DVDD
33 nF
C9
VPA
220 nF
C10
Decoupling V3V
220 nF
V1V LC filter
220 nF
C11, C12
L1
RF power amplifier bias
L2
RF match and harmonic filter
L3
RF match
L4
V1V LC filter
X1
32 MHz crystal
22 mH
www.onsemi.com
30
NCS36510
1 V System
3.3V
1V
TXD
UART1
SWD
Debug
DIO[0]
RXD
DIO[1]
CTS
DIO[2]
RTS
DIO[3]
SWO
DIO[11]
SWCLK
DIO[12]
SWDIO
DIO[13]
SWD_RESET
RESETN
C8
VPA
V1V
5
C9
DVDD
C6
VDDIO
C5
21,20
16
34
RFPWR
14
33
C1
13
L1
12
L2
TX
32
L3
11
C4
NCS36510
39
31
C2
RX
C3
38
26
37
X32MI
X1
36
25
18
C11
C12
V3V
FVDDHI
L4
22
FVDDHO
17
DC20151130
X32MO
1V
C10
Figure 24. 1V System Application Diagram
Component
C1
C2, C3
Description
Decoupling RFPWR
Value
100 pF
RF match and harmonic filter
C4
RF DC Block
100 pF
C5
Decoupling VDDIO
220 nF
C6
Decoupling V1V
1 mF
C7
Decoupling FVDDL
33 nF
C8
Decoupling DVDD
33 nF
C9
VPA
220 nF
C10
Decoupling V3V
220 nF
C11, C12
FVDDH LC filter
220 nF
L1
RF power amplifier bias
L2
RF match and harmonic filter
L3
RF match
L4
FVDDH LC filter
X1
32 MHz crystal
22 mH
www.onsemi.com
31
NCS36510
DEBUG PORT CONNECTION
To connect the Serial Wire Debug interface, TEST pin
needs to be tied to logical ‘1’ level and the debugger pins are
wired per below.
VDDIO
100 kW
5
DIO[13]
4
SWDIO
SWDCLK
6
SWO
DIO[11 ]
10
SWD_RESET
1
2
3
5
DIO[12]
37
38
39
NCS 36510
35
TEST
100 nF
RESETN
36
16
10 pins
SWD debugger
RESET
DVSS
DC20151130
GND
Figure 25. Debugger Connection Diagram
Table 13. DEBUGGER CONNECTIONS
TEST
State
Part Pin
Name
Part Direction
Debugger Pin
Name
Debugger Pin
Number
Function
1
DIO[13]
Input/Output
SWDIO
2
Serial wire data in & out
1
DIO[12]
Input
SWCLK
4
Serial wire clock
1
DIO[11]
Output
SWO
6
Trace output
RESETN
Input
RESETn
10
Resets the target
Note that when the debugger is connected, most of the
power saving modes are disabled. Only deep sleep mode
with all FLASH banks powered is supported, when the
power management unit is configured accordingly.
Not all debuggers will work down to 1 V. So it’s
recommended to do debugging at higher voltages to
maintain fast and functional operation.
www.onsemi.com
32
NCS36510
ORDERING INFORMATION
Device
NCS36510MNTXG
Package
Shipping†
QFN40
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
33
NCS36510
PACKAGE DIMENSIONS
QFN40 6x6, 0.5P
CASE 488AR
ISSUE A
PIN ONE
LOCATION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
DIM
A
A1
A3
b
D
D2
E
E2
e
L
K
0.15 C
2X
2X
TOP VIEW
0.15 C
(A3)
0.10 C
A
40X
0.08 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
6.00 BSC
4.00
4.20
6.00 BSC
4.00
4.20
0.50 BSC
0.30
0.50
0.20
−−−
SIDE VIEW A1
C
6.30
D2
L
40X
11
SOLDERING FOOTPRINT*
SEATING
PLANE
K
20
4.20
40X
40X
21
10
0.65
EXPOSED PAD
1
E2
40X b
0.10 C A B
0.05 C
4.20 6.30
30
1
40
31
e
36X
BOTTOM VIEW
40X
0.30
36X
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. WirelessHART is a registered trademark of the
FieldComm Group. ZigBee is a registered trademark of ZigBee Alliance. Thread is a trademark of Thread Group, Inc.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
34
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCS36510/D