Ordering number : ENA2035
LB1947VC
Monolithic Digital IC
PWM Current Control Type
http://onsemi.com
Forward/Reverse Motor Driver
Overview
The LB1947VC is a PWM current control type forward/reverse motor driver IC. The IC is optimal for use in driving
brushed DC motors for printers.
Features
• PWM current control (fixed OFF time)
• Selectable current decay pattern (FAST, SLOW, and MIX DECAY modes)
• Simultaneous ON prevention function (feed-through current prevention)
• Built-in thermal shutdown circuit
• Built-in noise canceler
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Symbol
Conditions
Ratings
Unit
Maximum motor supply voltage
VBB max
Output peak current
IO peak
Output continuous current
IO max
2.0
A
Logic supply voltage
VCC max
7.0
V
Logic input voltage range
VIN
Emitter output voltage
VE max
Reference voltage
VREF
Allowable power dissipation
Pd max
1.3
W
Operating temperature
Topr
-20 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
tw ≤ 20μs
Independent IC
50
V
2.25
A
-0.3 to VCC
V
1.1
V
-0.3 to VCC
V
Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time.
Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current,
high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Semiconductor Components Industries, LLC, 2013
May, 2013
32112 SY 20120312-S00003 No.A2035-1/11
LB1947VC
Allowable Operating Ranges at Ta = 25°C
Parameter
Symbol
Conditions
Ratings
Unit
Motor supply voltage
VBB
10 to 45
V
Logic supply voltage
VCC
4.75 to 5.25
V
Reference voltage
VREF
0 to VCC-2
V
Electrical Characteristics at Ta = 25°C, VCC = 5V
Parameter
Symbol
Ratings
Conditions
min
typ
Unit
max
Output Block
Output stage supply current
Output saturation voltage
IBB ON
No-load state, Forward
0.4
0.6
1.0
mA
IBB BR
No-load state, Brake
0.2
0.4
0.8
mA
IBB OFF
No-load state, Output off
0.2
0.4
0.8
mA
IBB wt
No-load state, Standby mode
0.1
mA
VOsat1
IO = +1.0A, Sink
1.2
1.5
V
VOsat2
IO = +2.0A, Sink
1.6
1.9
V
VOsat3
IO = -1.0A, Source
1.8
2.2
V
VOsat4
IO = -2.0A, Source
2.1
2.4
V
Output leak current
IO1(leak)
VO = VBB, Sink
50
μA
IO2(leak)
VO = 0V, Source
-50
μA
Output sustain voltage
VSUS
L = 3.9mH, IO = 2.0A, Design guarantee value*
50
V
ICC ON
IN1: High, IN2: Low, ST: High
11
16
21
ICC BR
IN1: Low, IN2: High, ST: High
11
16
21
mA
ICC OFF
IN1: Low, IN2: Low, ST: High
11
16
21
mA
1.0
2
3.0
mA
Logic Block
Logic supply current
ICC wt
ST: Low
Logic pin input voltage
VINH
High level voltage
(ST, IN1, IN2, VI)
VINL
Low level voltage
Logic pin input current
IINH
VIN = 5V
(ST, IN1, IN2, VI)
IINL
VIN = 0.8V
Sensing voltage
VE
Sensing voltage 25H
VEH25
2
mA
V
60
90
6
10
0
VI = High, VREF = 2.5V
0.970
1.0
0.8
V
120
μA
13
μA
1.1
V
1.030
V
Sensing voltage 25L
VEL25
VI = Low, VREF = 2.5V
0.483
0.5
0.513
V
Sensing voltage 15H
VEH15
VI = High, VREF = 1.5V
0.385
0.4
0.410
V
Sensing voltage 15L
VEL15
VI = Low, VREF = 1.5V
0.190
0.2
0.210
V
Sensing voltage 05H
VEH05
VI = High, VREF = 0.5V
0.190
0.2
0.210
V
Sensing voltage 05L
VEL05
VI = Low, VREF = 0.5V
0.092
0.1
0.108
V
Reference current
Iref
VREF = 1.0V
+0.5
μA
CR pin current
ICR
CR = 1.0V
-1.04
mA
MD pin input voltage
VMDH
High level voltage
VMDM
Middle level voltage
MD pin input current
Thermal shutdown temperature
-0.5
-1.56
-1.3
VCC-0.3
V
0.3VCC
VCC-1.0
.0.4
V
+1.0
μA
VMDL
Low level voltage
IMDH
MD = VCC-0.5V, CR = 1.0V
-1.0
IMDL
MD = 0.4V, CR = 2.0V
-5.0
TSD
Design guarantee value*
V
μA
170
°C
* Design guarantee value, Do not measurement.
No.A2035-2/11
LB1947VC
Package Dimensions
unit : mm (typ)
3336
21.6
HEAT SPREADER
(20.0)
3.0
(11.0)
(11.0)
3.35
12.4
(9.05)
17.9
(14.55)
(8.6)
(R1.75)
1
(1.91)
0.4
15
1.27
2.54 2.54
0.7
SANYO : HZIP15
Pd max -- Ta
Allowable power dissipation, Pd max -- W
2.0
1.6
1.2
0.8
0.4
0
-20
0
20
40
60
80 85
100
Ambient temperature, Ta -- C
Pin Assignment
LB1947VC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
GND
MD
CR
VREF
NC
IN2
IN1
VCC
VBB
ST
NC
VI
OUTA
E
OUTA
Top view
No.A2035-3/11
LB1947VC
Block Diagram
OUTA
3
OUTA
1
VBB
7
MD 14
8 VCC
IN1 9
Control
logic
IN2 10
circuit
ST 6
VI 4
Thermal
shutdown circuit
UVLO
VREF 12
One-shot
multi-
Current
select
circuit
blanking
time
GND 15
13
CR
2
E
Truth Table
IN1
IN2
ST
VI
MD
OUTA
OUTA
H
L
H
H
L
H
L
Operating mode
Forward, 2/5 times, FAST
H
L
H
H
M
H
L
Forward, 2/5 times, MIX
H
L
H
H
H
H
L
Forward, 2/5 times, SLOW
H
L
H
L
L
H
L
Forward, 1/5 times, FAST
H
L
H
L
M
H
L
Forward, 1/5 times, MIX
H
L
H
L
H
H
L
Forward, 1/5 times, SLOW
H
H
H
H
L
L
H
Reverse, 2/5 times, FAST
H
H
H
H
M
L
H
Reverse, 2/5 times, MIX
H
H
H
H
H
L
H
Reverse, 2/5 times, SLOW
H
H
H
L
L
L
H
Reverse, 1/5 times, FAST
H
H
H
L
M
L
H
Reverse, 1/5 times, MIX
H
H
H
L
H
L
H
Reverse, 1/5 times, SLOW
L
H
H
H
L
L
L
Brake, 2/5 times, FAST
L
H
H
H
M
L
L
Brake, 2/5 times, MIX
L
H
H
L
L
L
L
Brake, 1/5 times, FAST
L
H
H
L
M
L
L
Brake, 1/5 times, MIX
L
H
H
X
H
L
L
Brake, no current limiting
L
L
H
X
X
OFF
OFF
Output OFF
X
X
L or OPEN
X
X
OFF
OFF
Standby mode (circuit OFF)
Except for MD pin, Low at input OPEN.
MD M: determined by external voltage.
No.A2035-4/11
LB1947VC
Pin Function
Pin No.
1
3
Pin name
OUTA
OUTA
Function
Equivalent circuit
Output pin.
2
E
Sense voltage control pin.
4
VI
High: sense voltage is 2/5 of VREF
VCC
Low: sense voltage is 1/5 of VREF
100μA
6
ST
High: circuit operation ON
Low: standby mode
9
IN1
50kΩ
High: rotation mode
Low: brake mode
10
IN2
High: reverse mode
4
VI
40kΩ
Low: forward mode
7
VBB
Motor power supply voltage.
8
VCC
Logic power supply voltage.
12
VREF
Output current setting reference pin.
VCC
Setting range: 0 to (VCC−2V)
3s
1s
12
VREF
13
CR
Oscillator with self-excitation.
14
MD
Current attenuation switching pin.
Low : FAST DECAY
High: SLOW DECAY
M : MIX DECAY
M is set by external power supply voltage.
Range : 1.1 to 4.0V
15
5, 11
GND
Ground pin
NC
No connect
No.A2035-5/11
LB1947VC
Sample Application Circuits
1. Forward/reverse motor with current limiter
24V
M
*Schottky barrier type for external diodes.
OUTA
OUTA
3
MD
IN1
IN2
ST
VI
VREF
1
VBB
7
14
8
VCC
5V
9
Control
logic
circuit
10
6
4
Thermal
shutdown circuit
UVLO
12
Current
select
circuit
One-shot
multiblanking
time
GND
15
13
CR
RE
E
I = VREF/ (5 × RE)
Limiter current setting method
IN1
2
IN2
ST
OUTA
OUTA
Mode
H
L
H
H
L
H
H
H
L
H
Reverse
L
H
H
L
L
Brake
L
L
H
OFF
OFF
Output OFF
−
−
L
OFF
OFF
Standby mode
Forward
No.A2035-6/11
LB1947VC
2. Forward/reverse motor
24V
M
*Schottky barrier type for external diodes.
OUTA
OUTA
3
MD
IN1
IN2
ST
VI
VREF
1
VBB
7
14
8
VCC
5V
9
Control
logic
circuit
10
6
4
Thermal
shutdown circuit
UVLO
12
Current
select
circuit
One-shot
multiblanking
time
GND
15
13
CR
IN1
IN2
ST
OUTA
OUTA
H
L
H
H
L
2
E
Mode
Forward
H
H
H
L
H
Reverse
L
H
H
L
L
Brake
L
L
H
OFF
OFF
Output OFF
−
−
L
OFF
OFF
Standby mode
No.A2035-7/11
LB1947VC
3. PWM current control forward/reverse motor (MIX DECAY)
24V
M
*Schottky barrier type for external diodes.
OUTA
OUTA
3
MD
IN1
IN2
ST
VI
VREF
1
VBB
7
14
8
VCC
5V
9
10
Control
logic
circuit
6
4
Thermal
shutdown circuit
UVLO
12
Current
select
circuit
One-shot
multiblanking
time
GND
RE
15
13
CR
2
E
No.A2035-8/11
LB1947VC
Notes on Usage
1. VREF pin
Because the VREF pin serves for input of the set current reference voltage, precautions against noise must be taken.
2. GND pin
The ground circuit for this IC must be designed so as to allow for high-current switching. Blocks where high current
flows must use low-impedance patterns and must be removed from small-signal lines. Especially the ground
connection for the sensing resistor RE at pin E, and the ground connection for the Schottky barrier diodes should be in
close proximity to the IC ground.
The capacitors between VCC and ground, and VBB and ground should be placed close to the VCC and VBB pins,
respectively.
3. CR pin setting (Switching off time, Noise cancel time)
The noise cancel time (Tn) and the switching off time (Toff) are set by the following expressions:
Noise cancel time: Tn ≈ C × R × ln {(1.0 − RI) / (4.0 − RI) [sec]
CR charge current: 1.3mA
Switching off time: Toff ≈ −C × R × ln (1.0 / 4.8) [sec]
Internal configuration at CR pin
VCC line
One-shot multi-blanking
time circuit
CR
C:680pF
CR constant range: R = 4.7k to 100kΩ
C = 330pF to 2200pF
No.A2035-9/11
LB1947VC
Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A2035-10/11
LB1947VC
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PS No.A2035-11/11