NOM02A4-AR03G 200DPI High-Speed Contact Image Sensor Module Description The NOM02A4−AR03G contact image sensor (CIS) module integrates a red LED light source, lens and image sensor in a compact housing. The module is designed for document scanning, mark reading, gaming and office automation equipment applications and is suitable for scanning documents up to 216 mm wide. An analog video output achieves a scanning rate of 346 msec/line. The NOM02A4−AR03G module employs proprietary CMOS image sensing technology from ON Semiconductor to achieve high−speed performance and high sensitivity. http://onsemi.com Features • • • • • • • • • • • Light Source, Lens and Sensor are Integrated Into a Single Module 216 mm Scanning Width at 7.9 dots per mm Resolution 346 msec/Line Scanning Speed @ 5.0 MHz Pixel Rate Analog Video Output Supports A4 Paper Size at up to 74 Pages per Minute Red LED Light Source Wide Dynamic Range Compact 232.1 mm x 19.2 mm x 13.7 mm Module Housing Low Power Light Weight 2.1 oz Packaging These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant IMAGE SENSOR MODULE A4 CASE MODAC MARKING DIAGRAM NOM02A4−AR03G YYMMSSSSSS YY MM SSSSSS G = Year = Month = Serial Number = Pb−Free Package CONNECTOR PIN ASSIGNMENT • Contact Image Sensor Module Analog to Digital Converters DSP LED Drivers Parallel Port Transceiver Paper Insertion Sensing Switch Scan System Timing and Control Motor Motor Controller and Driver VDD VSS GND SP GND CP GLED VLED Machines Office Automation Equipment GND • Currency Verification • Document Scanning • Mark Readers Including Balloting, Test Scoring and Gaming VOUT Applications 1 2 3 4 5 6 7 8 9 10 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Typical Scanner Application © Semiconductor Components Industries, LLC, 2012 March, 2012 − Rev. 1 1 Publication Order Number: NOM02A4−AR03G/D NOM02A4−AR03G Table 1. ORDERING INFORMATION Part Number NOM02A4−AR03G Package Shipping Configuration (Pb−free) 100 per packing carton Red LED Light Bar VLED GLED VDD (+5 V) Rod Lens GND VSS (−5 V) Photo Sensor Array SP Buf CP Buf 1 2 3 4 1728 Amp Shift Register Pixel 1 corresponds to connector end of the module Figure 2. Simplified Block Diagram Table 2. PIN FUNCTION DESCRIPTION Pin Pin Name Description 1 VOUT Analog Video Output 2 GND Ground 3 VDD +5 V power supply 4 VSS −5 V to −12 V power supply 5 GND Ground 6 SP 7 GND Shift register start pulse Ground 8 CP 9 GLED Sampling clock pulse Ground for the LED light source 10 VLED Power supply for the LED light source http://onsemi.com 2 VOUT NOM02A4−AR03G Table 3. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit VDD 7 V VSS −15 V VLED 6 V Power supply current ILED 600 mA Input voltage range for SP, CP Vin −0.5 to VDD + 0.5 V Storage Temperature TSTG −20 to 75 °C Storage Humidity, Non−Condensing HSTG 10 to 90 % ESDHBM $2 kV Power supply voltage ESD Capability, Contact Discharge (Note 1) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This module assembly has been ESD tested to IEC61000−4−2 (HBM) Contact Discharge Table 4. RECOMMENDED OPERATING RANGES (Unless otherwise specified, these specifications apply TA = 25°C) (Note 2) Parameter Power supply voltage (Note 3) Min Typ Max Unit VDD 4.5 5 5.5 V VSS −12 −5 −4.5 V VLED 4.5 5 5.5 V IDD 53 60 67 mA ISS 5.0 6.0 7.0 mA ILED 400 450 500 mA Low level input voltage for SP, CP VIL 0 0 0.8 V High level input voltage for SP, CP VIH 4.5 5.0 VDD + 0.3 V Line scanning rate (Note 4) Tint 314 346 864 ms Clock frequency (Note 5) f 2.0 5.0 5.5 MHz Clock period to 182 200 500 ns Clock pulse width (Note 6) tw 46 50 125 ns Clock pulse high duty cycle DCCP 20 25 60 % 180 480 ns Power supply current Start pulse width (Note 6) 2. 3. 4. 5. 6. 7. Symbol twSP 150 Start pulse setup time tsu 20 ns Start pulse hold time th 20 ns Prohibit crossing time (Note 7) tprh 20 ns Clock to Video output propagation delay rising tpcor 115 ns Clock to Video output propagation delay falling tpcof 20 ns Operating Temperature Top 0 50 °C Operating Humidity, Non−Condensing Hop 10 60 % Refer to Figure 3 for more information on AC characteristics VLED directly affects illumination intensity, which directly affects VOUT. Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses. The clock is proportional to Tint. Main clock frequency (f) corresponds to the video sampling frequency. Min, Typ, Max specifications reflect operation at the corresponding Min, Typ, Max clock frequency. Prohibit crossing time is to insure that two start pulses are not supplied in the same scan line time. SP may only be active high during one falling edge of CP for any given scan. http://onsemi.com 3 NOM02A4−AR03G Table 5. PHYSICAL SPECIFICATIONS Symbol Typ Unit Scan width Parameter PDw 216 mm Number of Photo Detector Arrays PDAn 27 arrays PDn 1728 elements Number of Photo Detectors Table 6. PHYSICAL CHARACTERISTICS Parameter Pixel pitch Symbol Min PDsp Typ Max 125 Unit mm Inter−array spacing PDAsp 150 180 210 mm Inter−array vertical alignment PDAvxp −40 0 40 mm Green LED peak wavelength lp 634 644 nm Table 7. ELECTRO−OPTICAL CHARACTERISTICS TEST CONDITIONS Parameter Power supply voltage Clock frequency Clock pulse high duty cycle Line scanning rate Symbol Value Unit VDD 5.0 V VSS −5.0 V VLED 5.0 V f 5.0 MHz DCCP 25 % Tint 346 ms LED arrays pulsed time on (Note 8) LED_Ton 26 ms LED arrays pulsed time off (Note 8) LED_Toff 356 ms Top 25 °C Operating Temperature 8. Production tested with pulsing LEDs. http://onsemi.com 4 NOM02A4−AR03G Table 8. ELECTRO−OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications were achieved with the test conditions defined in Table 7) Symbol Parameter Bright analog output voltage (Note 9) Bright output non−uniformity (Note 10) Min Typ Max Unit Vpavg 0.9 1.0 1.1 V Up −30 30 % Bright output non−uniformity total (Note 11) Uptotal 60 % Adjacent pixel non−uniformity (Note 12) Upadj 25 % Dark output voltage (Note 13) Vd 150 mV Dark non−uniformity (Note 14) Ud 100 mV Modulation transfer function at 50 line pairs per in (lp/in) (Note 15) MTF50 40 % Modulation transfer function at 100 line pairs per in (lp/in) (Notes 15, 16) MTF100 20 % 9. Vpavg = Ȍ Vp(n)/1728, where Vp is the pixel amplitude value of VOUT for a bright signal defined as a white document with LEDs turned on, n is the sequential pixel number in one scan line. 10. Up = [(Vpmax – Vpavg)/Vpavg] x 100%, or [Vpavg – Vpmin)/Vpavg] x 100%, whichever is greater, where Vpmax is the maximum pixel voltage of any pixel at full bright Vpmin is the minimum pixel voltage of any pixel at full bright 11. Uptotal = [(Vpmax – Vpmin)/Vpavg] x 100%, 12. Upadj = MAX [ | (Vp(n) – Vp(n+1) | / Vp(n)] x 100%, where Upadj is the nonuniformity in percent between adjacent pixels for a bright background 13. Vd is the pixel amplitude value of VOUT for a dark signal defined as a black document with LEDs turned off 14. Ud = Vdmax – Vdmin, where Vdmax is the maximum pixel voltage of any dark pixel with the LEDs turned off Vdmin is the minimum pixel voltage of any dark pixel with the LEDs turned off 15. MTF = [(Vmax – Vmin)/(Vmax + Vmin)] x 100%, where Vmax is the maximum output voltage at the specified line pairs per inch (lp/in) Vmin is the minimum output voltage at the specified lp/in 16. For information only. to tw CP tprh tprh th SP tsu tpcof twSP Vd VOUT GND Vp tpcor Pixel 1 Pixel 2 Figure 3. Timing Diagram http://onsemi.com 5 Pixel 3 Pixel 4 NOM02A4−AR03G DESCRIPTION OF OPERATION Functional Description Initialization The NOM02A4−AR03G module consists of 27 contact image sensors, each with 64 pixel elements, that are cascaded to provide 1728 photo−detectors with their associated multiplex switches and double−buffered digital shift register that controls its sequential readout. A buffer amplifies the video pixels from the image sensors and output the analog video signal of the module as shown in Figure 2. In operation, the sensors produce an analog image pixel signal (or video signal) proportional to the exposure on the corresponding picture elements on the document. The VOUT signal outputs 1728 pixels for each scan line. The first bit shifted out from VOUT during each scan represents the first pixel on the connector end of the module. A pictorial of the NOM02A4−AR03G cross section view is shown in Figure 4. Mounted in the module is a one−to−one graded−index micro lens array that focuses the scanned document image onto the sensing plane. Illumination is accomplished by means of an integrated LED light source. All components are housed in a small plastic housing, which has a glass cover. The top surface of the glass acts as the focal point for the object being scanned and protects the imaging array, micro lens assembly and LED light source from dust. Document Detected? Start Scan , CP= CTR=0 SP= CP= Read Pixel into Memory CTR++ == 1728 no Transfer Scan Line Data Document Detected? yes Done Glass Window Document Surface no Figure 5. Typical Scanner Algorithm Figure 5 outlines the basic steps in the scanner control sequence. First the circuits are initialized and the scanner waits for a document to be detected, usually by a paper sensing switch. Then a start pulse and clock pulse are supplied to capture a line image. At the next clock pulse the first pixel value appears on the output. The pixel can be stored in a local line buffer memory. Subsequent clocks cause the remaining pixels to be shifted out and stored in the line buffer. Once the complete line has been shifted out it can be transferred to the host application and the system advances the paper and the line scan process repeats until the paper sensing switch indicates the document has passed completely through the scanner. Light Path Rod Lens Module Housing LED Bar Sensors PCB Figure 4. Module Cross Section View Connector Pin Out Description Connections to the module are via a 2.4x14.50mm 10−pin connector (ECE part number EBW−PK23−P010L2−3Z) located at one end of the module as shown in the package drawing on page 8. The location of pin number 1 is indicated on the package drawing. Device Marking and Barcode Description Each module is marked with a tag that contains the part number, a number combining the manufacturing date code and serial number and a barcode. The barcode presents the date code and serial number in Interleave 2 of 5 barcode format as follows YYMMSSSSSS where YY is the year, MM is the month, and SSSSSS is the serial number. Scanner Applications A typical use of the NOM02A4−AR03G module in scanner applications is shown in Figure 6. The document to be digitized is fed into the scanner where a sensor detects its presence. The scanner then operates the motor to move the paper under the contact image sensor module. The module illuminates the paper with internal LEDs and the image sensor pixel array detects the amount of reflected light and simultaneously measures a full line of pixels which are sampled and transferred to a FIFO for storage and conversion to a parallel output format. Once the pixel line is processed, the motor advances the paper and the next scan line is captured. Glass Lens Care Precautions should be taken to avoid scratching or touching the glass lens. The glass lens may be cleaned with alcohol. http://onsemi.com 6 NOM02A4−AR03G Figure 6. Typical Scanner Assembly http://onsemi.com 7 NOM02A4−AR03G PACKAGE DIMENSIONS IMAGE SENSOR MODULE A4 CASE MODAC ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEADING EDGE OF THE APPROACH ANGLE ON THE GLASS IS LOWER THAN THE TOP OF THE HOUSING. 4. BORE DEPTH IS 6.0 WITH A 0.3 LEAD−IN CHAMFER. 5. PIN HEADER, MODEL NUMBER EBW−PK23−P010L2−3Z, 1X10 PIN, PITCH 1.25. 6. GLASS IS GLUED ON ALL 4 SIDES. 7. GLASS THICKNESS IS 1.85. 8. USE M2.3 SELF TAPPING SCREWS FOR MOUNTING. TORQUE SCREWS BETWEEN 1.80 KGF−CM AND 2.00 KGF−CM. 9. DIMENSION D1 DENOTES THE SCAN LENGTH. 10. DIMENSION K DENOTES THE POSITION OF THE FIRST PIXEL. MILLIMETERS DIM MIN MAX A 12.60 13.60 A1 5.45 6.45 A2 13.20 14.20 B 17.70 18.30 B1 18.90 19.50 B2 5.50 6.50 C 15.40 15.60 D 231.60 232.60 D1 216.00 REF E 2.10 2.30 F 112.50 113.50 H 34.80 35.80 J 5.70 6.30 K 5.30 7.30 L 6.00 REF http://onsemi.com 8 NOM02A4−AR03G PACKING DIMENSIONS NO. NAME MATERIAL 1 Shockproof Pad EPE 2 Packing Tray POLYFOAM 3 Conduct Electricity Sheet PE + CONDUCTIVE SHEET 4 Waterproof Bag PE 5 Packing Box−Carton KRAFT PAPER ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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