NOM02B4-DR11G 200DPI Contact Image Sensor Module with Binary Output Description The NOM02B4−DR11G contact image sensor (CIS) module integrates a red LED light source, lens and image sensor in a compact housing. The module is designed for document scanning, mark reading, gaming and office automation equipment applications and is suitable for scanning documents up to 256 mm wide with a scanning rate of 410 msec/line. The analog output signal is processed by a digitizing comparator referenced to an externally supplied voltage level to produce a serial digital output. The NOM02B4−DR11G module employs proprietary CMOS image sensing technology from ON Semiconductor to achieve high−speed performance and high sensitivity. http://onsemi.com IMAGE SENSOR MODULE B4 CASE MODAJ Features FIFO Buffer Scan System Timing and Control Motor Motor Controller and Driver THR SP+ VDD DVOUT+ 11 9 7 5 3 1 14 12 10 8 6 4 2 − SP− GND − DVOUT− ORDERING INFORMATION LED Drivers Paper Insertion Sensing Switch 13 GND Parallel Port Transceiver CONNECTOR PIN ASSIGNMENT CP+ Contact Image Sensor Module = Year = Month = Serial Number = Pb−Free Package CP− − • • Machines Document Scanning Office Automation Equipment YY MM SSSSSS G VLED • Mark Readers Including Balloting, Test Scoring and Gaming NOM02B4−DR11G YYMMSSSSSS GLED Applications MARKING DIAGRAM VLED Light Source, Lens and Sensor are Integrated Into a Single Module 256 mm Scanning Width at 8 dots per mm Resolution 410 msec/Line Scanning Speed @ 5.0 MHz Pixel Rate Two−Level Tracking Digital Output Differential LVDS Input and Output Signals Supports B4 Paper Size at up to 52 Pages per Minute Red LED Light Source Wide Dynamic Range, Low Power Compact 272.0 mm x 24.3 mm x 21.5 mm Module Housing Light Weight 2.4 oz Packaging These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant GLED • • • • • • • • • • • See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Figure 1. Typical Scanner Application © Semiconductor Components Industries, LLC, 2012 June, 2012 − Rev. 1 1 Publication Order Number: NOM02B4−DR11G/D NOM02B4−DR11G Table 1. ORDERING INFORMATION Part Number NOM02B4−DR11G Package Shipping Configuration (Pb−Free) 100 per packing carton Red LED Light Bar VLED GLED VDD Rod Lens GND Photo Sensor Array SP+ SP− Buf CP+ CP− Buf 1 2 3 4 2048 Shift Register THR Pixel 1 corresponds to connector end of the module Figure 2. Simplified Block Diagram Table 2. PIN FUNCTION DESCRIPTION Pin Pin Name Description 1 DVOUT+ Digital Video Output (+) 2 DVOUT− Digital Video Output (−) 3 VDD +5 V power supply 4 GND Ground 5 SP+ Shift register start pulse (+) 6 SP− Shift register start pulse (−) 7 THR Reference voltage input 8 GND Ground 9 CP+ Sampling clock pulse (+) 10 CP− Sampling clock pulse (−) 11 VLED Power supply for the LED light source 12 GLED Ground for the LED light source 13 VLED Power supply for the LED light source 14 GLED Ground for the LED light source http://onsemi.com 2 Comparator DVOUT+ DVOUT− NOM02B4−DR11G Table 3. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit VDD 7 V VLED 6 V Power supply current ILED 980 mA Input voltage range for SP±, CP± Vin −0.5 to VDD + 0.5 V Vin_thr 0 to VDD V Storage Temperature TSTG −20 to 75 °C Storage Humidity, Non−Condensing HSTG 10 to 90 % ESDHBM $2 kV Power supply voltage Input voltage range for THR ESD Capability, Contact Discharge (Note 1) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This module assembly has been ESD tested to IEC61000−4−2 (HBM) Contact Discharge Table 4. RECOMMENDED OPERATING RANGES (Unless otherwise specified, these specifications apply TA = 25°C) (Note 2) Parameter Symbol Min Typ Max Unit VDD 4.5 5 5.5 V VLED 4.5 5 5.5 V IDD 86 96 106 mA ILED 630 650 670 mA Low level input voltage for SP±, CP± VIL 0 0 0.8 V High level input voltage for SP±, CP± VIH 4.5 5.0 VDD + 0.3 V VTHR 1.2 1.75 2.3 V Power supply voltage (Note 3) Power supply current Threshold voltage level Low level output voltage (digital output level for dark) VOL 0.8 V High level output voltage (digital output level for white) VOH 4.0 V Line scanning rate (Note 4) Tint 372 410 1024 ms Clock frequency (Note 5) f 2.0 5.0 5.5 MHz Clock period to 182 200 500 ns Clock pulse width (Note 6) tw 46 50 125 ns Clock pulse high duty cycle DCCP 20 25 75 % twSP 150 180 480 ns Start pulse setup time tsu 20 ns Start pulse hold time th 20 ns Prohibit crossing time (Note 7) tprh 20 ns Clock to Video output propagation delay rising tpcor 115 ns Clock to Video output propagation delay falling tpcof 20 Operating Temperature Top 0 50 °C Operating Humidity, Non−Condensing Hop 10 60 % Start pulse width (Note 6) 2. 3. 4. 5. 6. 7. ns Refer to Figure 3 for more information on AC characteristics VLED directly affects illumination intensity, which directly affects DVOUT. Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses. The clock is proportional to Tint. Main clock frequency (f) corresponds to the video sampling frequency. Min, Typ, Max specifications reflect operation at the corresponding Min, Typ, Max clock frequency. Prohibit crossing time is to insure that two start pulses are not supplied in the same scan line time. SP may only be active high during one falling edge of CP for any given scan. http://onsemi.com 3 NOM02B4−DR11G Table 5. PHYSICAL SPECIFICATIONS Symbol Typ Unit Scan width Parameter PDw 256 mm Number of Photo Detector Arrays PDAn 32 arrays PDn 2048 elements Number of Photo Detectors Table 6. PHYSICAL CHARACTERISTICS Parameter Pixel pitch Symbol Min PDsp Typ Max 125 Unit mm Inter−array spacing PDAsp 150 180 210 mm Inter−array vertical alignment PDAvxp −40 0 40 mm lp 634 644 nm Red LED peak wavelength Table 7. ELECTRO−OPTICAL CHARACTERISTICS TEST CONDITIONS Parameter Value Unit VDD 5.0 V VSS −5.0 V VLED 5.0 V f 5.0 MHz DCCP 25 % Line scanning rate Tint 410 ms Operating Temperature Top 25 °C Power supply voltage Clock frequency Clock pulse high duty cycle Symbol http://onsemi.com 4 NOM02B4−DR11G Table 8. ELECTRO−OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications were achieved with the test conditions defined in Table 7) Symbol Parameter Min Typ Max 1.0 1.2 V 30 % Bright analog output voltage (Note 8) Vpavg 0.8 Bright output non−uniformity (Note 9) Up −30 Unit Bright output non−uniformity total (Note 10) Uptotal 60 % Adjacent pixel non−uniformity (Note 11) Upadj 25 % Dark output voltage (Note 12) Vd 1500 mV Dark non−uniformity (Note 13) Ud 60 mV Modulation transfer function at 50 line pairs per in (lp/in) (Note 14) MTF50 40 % Modulation transfer function at 100 line pairs per in (lp/in) (Notes 14, 15) MTF100 20 % 8. Vpavg = Ȍ Vp(n)/2048, where Vp is the pixel amplitude value for a bright signal defined as a white document with LEDs turned on, n is the sequential pixel number in one scan line. 9. Up = [(Vpmax – Vpavg)/Vpavg] x 100%, or [Vpavg – Vpmin)/Vpavg] x 100%, whichever is greater, where Vpmax is the maximum pixel voltage of any pixel at full bright Vpmin is the minimum pixel voltage of any pixel at full bright 10. Uptotal = [(Vpmax – Vpmin)/Vpavg] x 100%, 11. Upadj = MAX [ | (Vp(n) – Vp(n+1) | / Vp(n)] x 100%, where Upadj is the nonuniformity in percent between adjacent pixels for a bright background 12. Vd is the pixel amplitude value for a dark signal defined as a black document with LEDs turned off 13. Ud = Vdmax – Vdmin, where Vdmax is the maximum pixel voltage of any dark pixel with the LEDs turned off Vdmin is the minimum pixel voltage of any dark pixel with the LEDs turned off 14. MTF = [(Vmax – Vmin)/(Vmax + Vmin)] x 100%, where Vmax is the maximum output voltage at the specified line pairs per inch (lp/in) Vmin is the minimum output voltage at the specified lp/in 15. For information only. to tw CP tprh tprh th SP tsu tpcof twSP Vd VOUT GND Vp tpcor Pixel 1 Pixel 2 Figure 3. Timing Diagram http://onsemi.com 5 Pixel 3 Pixel 4 NOM02B4−DR11G DESCRIPTION OF OPERATION be digitized is fed into the scanner where a sensor detects its The NOM02B4−DR11G module consists of 32 contact presence. The scanner then operates the motor to move the image sensors, each with 64 pixel elements, that are paper under the contact image sensor module. The module cascaded to provide 2048 photo−detectors with their illuminates the paper with internal LEDs and the image associated multiplex switches and double−buffered digital sensor pixel array detects the amount of reflected light and shift register that controls its sequential readout. The analog simultaneously measures a full line of pixels which are pixel signal is proportional to the exposure on the sampled and transferred to a FIFO for storage and corresponding picture elements on the document. A conversion to a parallel output format. Once the pixel line is comparator digitizes the analog pixels into a serial binary bit processed, the motor advances the paper and the next scan stream as each pixel is compared to the external reference line is captured. voltage THR as shown in Figure 2. In operation, the sensor Initialization module produces a binary one for each pixel with a voltage above THR and a binary zero for each pixel with a voltage below THR. The DVOUT signal outputs 2048 pixels for Document no each scan line. The first bit shifted out from DVOUT during Detected? each scan represents the first pixel on the connector end of the module. Start Scan A pictorial of the NOM02B4−DR11G cross section view SP= , CP= CTR=0 is shown in Figure 4. Mounted in the module is a one−to−one graded−index micro lens array that focuses the scanned CP= document image onto the sensing plane. Illumination is accomplished by means of an integrated LED light source. Read Pixel into Memory All components are housed in a small plastic housing, which has a glass cover. The top surface of the glass acts as the focal no point for the object being scanned and protects the imaging CTR++ == 2048 array, micro lens assembly and LED light source from dust. Functional Description Glass Window Document Surface Transfer Scan Line Data Light Path Rod Lens Module Housing Document Detected? LED Bar yes Done Figure 5. Typical Scanner Algorithm Sensors Figure 5 outlines the basic steps in the scanner control sequence. First the circuits are initialized and the scanner waits for a document to be detected, usually by a paper sensing switch. Then a start pulse and clock pulse are supplied to capture a line image. At the next clock pulse the first pixel value appears on the output. The pixel can be stored in a local line buffer memory. Subsequent clocks cause the remaining pixels to be shifted out and stored in the line buffer. Once the complete line has been shifted out it can be transferred to the host application and the system advances the paper and the line scan process repeats until the paper sensing switch indicates the document has passed completely through the scanner. PCB Figure 4. Module Cross Section View Digital Video Output The NOM02B4−DR11G module only presents a digital output, however module performance is best understood by analyzing the analog nature of the internal circuitry. Characterization of the analog signal is presented in Table 4. Connector Pin Out Description Connections to the module are via a 9.14x25.40mm 14−pin connector (AMP part number 103308−2) located at one end of the module as shown in the package drawing on page 8. The location of pin number 1 is indicated on the package drawing. Scanner Applications A typical use of the NOM02B4−DR11G module in scanner applications is shown in Figure 6. The document to http://onsemi.com 6 NOM02B4−DR11G Device Marking and Barcode Description where Each module is marked with a tag that contains the part number, a number combining the manufacturing date code and serial number and a barcode. The barcode presents the date code and serial number in Interleave 2 of 5 barcode format as follows YYMMSSSSSS YY is the year, MM is the month, and SSSSSS is the serial number. Glass Lens Care Precautions should be taken to avoid scratching or touching the glass lens. The glass lens may be cleaned with alcohol. Figure 6. Typical Scanner Assembly http://onsemi.com 7 NOM02B4−DR11G PACKAGE DIMENSIONS IMAGE SENSOR MODULE B4 CASE MODAJ ISSUE O MILLIMETERS DIM MIN MAX A 12.60 13.20 A1 5.63 5.93 A2 1.90 2.10 A3 5.98 6.18 A4 21.45 REF B 17.70 18.30 B1 24.32 REF B2 5.50 6.50 B3 15.85 16.15 B4 13.85 14.15 C 15.35 15.65 D 271.50 272.50 D1 256.00 REF E 2.05 2.35 F 1.51 REF H 16.00 REF J 2.00 REF K 7.00 9.00 L 6.80 REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEADING EDGE OF THE APPROACH ANGLE ON THE GLASS IS LOWER THAN THE TOP OF THE HOUSING. 4. BORE DEPTH IS 6.0. 5. CONNECTOR, AMP MODEL NUMBER 103308−2, 2X7 PIN, PITCH 2.54. 6. GLASS IS GLUED ON ALL 4 SIDES. 7. GLASS THICKNESS IS 1.85. 8. USE M2.3 SELF TAPPING SCREWS FOR MOUNTING. TORQUE SCREWS BETWEEN 1.80 KGF−CM AND 2.00 KGF−CM. 9. DIMENSION D1 DENOTES THE SCAN LENGTH. 10. DIMENSION K DENOTES THE POSITION OF THE FIRST PIXEL. http://onsemi.com 8 NOM02B4−DR11G PACKING DIMENSIONS NO. NAME MATERIAL 1 Shockproof Pad EPE 2 Packing Tray POLYFOAM 3 Conduct Electricity Sheet PE + CONDUCTIVE SHEET 4 Waterproof Bag PE 5 Packing Box−Carton KRAFT PAPER ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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