MC10E131, MC100E131 5VECL 4-Bit D Flip-Flop Description The MC10E/100E131 is a quad master-slave D-type flip-flop with differential outputs. Each flip-flop may be clocked separately by holding Common Clock (CC) LOW and using the Clock Enable (CE) inputs for clocking. Common clocking is achieved by holding the CE inputs LOW and using CC to clock all four flip-flops. In this case, the CE inputs perform the function of controlling the common clock, to each flip-flop. Individual asynchronous resets are provided (R). Asynchronous set controls (S) are ganged together in pairs, with the pairing chosen to reflect physical chip symmetry. Data enters the master when both CC and CE are LOW, and transfers to the slave when either CC or CE (or both) go HIGH. The 100 Series contains temperature compensation. http://onsemi.com PLCC−28 FN SUFFIX CASE 776 Features • • • • • • • • • • • • • • • 1100 MHz Min. Toggle Frequency Differential Outputs Individual and Common Clocks Individual Resets (asynchronous) Paired Sets (asynchronous) PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Metastability Time Constant is 200 ps. Internal Input 50 kW Pulldown Resistors ESD Protection: Human Body Model; > 2 kV, Machine Model; > 200 V Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level: Pb = 1 Pb−Free = 3 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 0.125 in, Oxygen Index: 28 to 34 Transistor Count = 240 devices Pb−Free Packages are Available* MARKING DIAGRAM* 1 MCxxxE131G AWLYYWW xxx A WL YY WW G = 10 or 100 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 11 1 Publication Order Number: MC10E131/D MC10E131, MC100E131 D3 D CE3 R3 D2 CE2 R2 25 24 23 22 VCCO Q3 21 20 Q3 26 18 Q2 D2 D3 27 17 Q2 CE2 S12 28 16 VCC VEE 1 15 Q1 CC 2 14 Q1 S03 3 13 Q0 D0 4 12 Q0 CE0 6 R0 7 8 9 10 D1 CE1 R1 NC D S R Q3 Q Q3 Q Q2 Q Q2 Q Q1 Q Q1 Q Q0 Q Q0 R2 S03 S12 CC R1 R CE1 D1 11 D S R0 VCCO R CE0 * All VCC and VCCO pins are tied together on the die. D0 Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. Pinout Diagram D S Figure 2. Logic Diagram Table 1. PIN DESCRIPTION PIN D0 − D3 CE0 − CE3 R0 − R3 CC S03, S12 Q0 − Q3, Q0 − Q3 VCC, VCCO VEE NC Q R3 CE3 5 R 19 Pinout: 28-Lead PLCC (Top View) S FUNCTION ECL Data Inputs ECL Clock Enables (Individual) ECL Resets ECL Common Clock ECL Sets (paired) ECL Differential Outputs Positive Supply Negative Supply No Connect http://onsemi.com 2 MC10E131, MC100E131 Table 2. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 Condition 2 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range 0 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm PLCC−28 PLCC−28 63.5 43.5 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board PLCC−28 22 to 26 °C/W Tsol Wave Solder 265 265 °C VI v VCC VI w VEE Pb Pb−Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 1) −40°C Symbol Min Characteristic 0°C Typ Max 58 70 Min 25°C Typ Max 58 70 Min 85°C Typ Max 58 70 Min Typ Max Unit 58 70 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 3980 4070 4160 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 2) 3050 3210 3370 3050 3210 3370 3050 3227 3405 mV VIH Input HIGH Voltage 3830 3995 4160 3870 4030 4190 3940 4110 4280 mV VIL Input LOW Voltage 3050 3285 3520 3050 3285 3520 3050 3302 3555 mV IIH Input HIGH Current 350 450 300 150 mA IIL Input LOW Current CC S R, CE D 350 450 300 150 350 450 300 150 0.5 0.3 350 450 300 150 0.5 0.25 0.3 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 3 MC10E131, MC100E131 Table 4. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 3) −40°C Symbol Min Characteristic 0°C Typ Max 58 70 Min 25°C Typ Max 58 70 Min 85°C Typ Max 58 70 Min Typ Max Unit 58 70 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 4) −1020 −930 −840 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 4) −1950 −1790 −1630 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage −1170 −1005 −840 −1130 −970 −810 −1060 −890 −720 mV VIL Input LOW Voltage −1950 −1715 −1480 −1950 −1715 −1480 −1950 −1698 −1445 mV IIH Input HIGH Current CC S R, CE D IIL Input LOW Current 350 450 300 150 350 450 300 150 0.5 350 450 300 150 0.3 0.5 350 450 300 150 0.065 0.3 0.2 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.06 V. 4. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 5. 100E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 5) −40°C Symbol Characteristic IEE Power Supply Current VOH Output HIGH Voltage (Note 6) VOL Output LOW Voltage (Note 6) VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current IIL Input LOW Current CC S R, CE D Min 0°C Typ Max 58 70 Min 25°C Typ Max 58 70 3975 4050 4120 3190 3295 3975 3835 3355 3190 Typ Max 58 70 3975 4050 4120 3380 3190 3255 3975 4120 3835 3355 3525 3190 350 450 300 150 Min Typ Max Unit 67 81 mA 3975 4050 4120 mV 3380 3190 3260 3380 mV 3975 4120 3835 3975 4120 mV 3355 3525 3190 3355 3525 mV 350 450 300 150 mA 350 450 300 150 0.5 85°C 0.3 Min 350 450 300 150 0.5 0.25 0.5 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V. 6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 4 MC10E131, MC100E131 Table 6. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = −5.0 V (Note 7) −40°C Symbol Characteristic Min 0°C Typ Max 58 70 Min 25°C Typ Max 58 70 Min 85°C Typ Max 58 70 Min Typ Max Unit 67 81 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 8) −1025 −950 −880 −1025 −950 −880 −1025 −950 −880 mV VOL Output LOW Voltage (Note 8) −1810 −1705 −1620 −1810 −1745 −1620 −1810 −1740 −1620 mV VIH Input HIGH Voltage −1025 −1165 −1025 −880 −1165 −1025 −880 −1165 −1025 −880 mV VIL Input LOW Voltage −1645 −1810 −1645 −1475 −1810 −1645 −1475 −1810 −1645 −1475 mV IIH Input HIGH Current CC S R, CE D IIL mA 350 450 300 150 Input LOW Current 350 450 300 150 0.5 0.3 350 450 300 150 0.5 0.25 350 450 300 150 0.5 0.2 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V. 8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 7. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 7) −40°C Min Typ 1100 1400 CE 310 275 400 300 600 600 635 550 Setup Time (Note 10) D 200 tH Hold Time (Note 10) D tRR Reset Recovery Time tPW Minimum Pulse Width R, S tSKEW Within-Device Skew (Note 11) tJITTER Random Clock Jitter tr/tf Rise/Fall Time (20−80%) Symbol Characteristic fMAX Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output CC R S tS CLK 25°C Max Min Typ 1100 1400 360 325 450 350 500 500 640 550 20 150 225 −20 450 150 750 725 875 775 400 400 275 85°C Min Typ 1100 1400 360 325 450 350 500 500 640 550 20 150 20 ps 175 −20 175 −20 ps 400 150 400 150 ps 400 400 Max 700 675 825 725 Max Unit MHz 700 675 825 725 400 400 ps ps 60 60 60 ps <1 <1 <1 ps 460 725 300 480 300 480 675 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. 10 Series: VEE can vary −0.46 V / +0.06 V. 100 Series: VEE can vary −0.46 V / +0.8 V. 10. Setup/hold times guaranteed for both CC and CE. 11. Within-device skew is defined as identical transitions on similar paths through a device. http://onsemi.com 5 MC10E131, MC100E131 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping † MC10E131FN PLCC−28 37 Units / Rail MC10E131FNG PLCC−28 (Pb−Free) 37 Units / Rail MC10E131FNR2 PLCC−28 500 / Tape & Reel MC10E131FNR2G PLCC−28 (Pb−Free) 500 / Tape & Reel MC100E131FN PLCC−28 37 Units / Rail MC100E131FNG PLCC−28 (Pb−Free) 37 Units / Rail MC100E131FNR2 PLCC−28 500 / Tape & Reel MC100E131FNR2G PLCC−28 (Pb−Free) 500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 6 MC10E131, MC100E131 PACKAGE DIMENSIONS PLCC−28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 776−02 ISSUE E −N− 0.007 (0.180) B Y BRK T L−M M 0.007 (0.180) U M N S T L−M S S N S D Z −M− −L− W 28 D X V 1 A 0.007 (0.180) R 0.007 (0.180) C M M T L−M T L−M S S N S N S 0.007 (0.180) H N S S G J 0.004 (0.100) −T− SEATING T L−M S N T L−M S N S K PLANE F VIEW S G1 M K1 E S T L−M S VIEW D−D Z 0.010 (0.250) 0.010 (0.250) G1 VIEW S S NOTES: 1. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10_ 0.410 0.430 0.040 −−− http://onsemi.com 7 MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10_ 10.42 10.92 1.02 −−− 0.007 (0.180) M T L−M S N S MC10E131, MC100E131 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10E131/D