MC10EL01 D

MC10EL01, MC100EL01
5V ECL 4‐Input OR/NOR
Description
The MC10EL/100EL01 is a 4-input OR/NOR gate. The device is
functionally equivalent to the E101 device with higher performance
capabilities. With propagation delays and output transition times
significantly faster than the E101, the EL01 is ideally suited for those
applications which require the ultimate in AC performance.
The 100 series contains temperature compensation.
•
•
•
•
•
•
•
•
8
1
> 100 V Machine Model
PECL Mode Operating Range: VCC = 4.2 V to 5.7 V
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = −4.2 V to −5.7 V
Internal Input Pulldown Resistors
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 46 devices
Pb−Free Packages are Available
SOIC−8
D SUFFIX
CASE 751
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
8
HEL01
ALYW
G
1
1
8
1
DFN8
MN SUFFIX
CASE 506AA
D0
1
8
VCC
D1
2
7
Q
KEL01
ALYW
G
H = MC10
K = MC100
4M = MC10
2A = MC100
A = Assembly Location
8
HL01
ALYWG
G
1
L
Y
W
M
G
4
1
KL01
ALYWG
G
2A M G
G
• 230 ps Propagation Delay
• ESD Protection: > 1 kV Human Body Model,
MARKING
DIAGRAMS*
4M M G
G
Features
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1
4
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
D2
3
6
Q
D3
4
5
VEE
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Figure 1. Logic Diagram and Pinout Assignment
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 6
1
Publication Order Number:
MC10EL01/D
MC10EL01, MC100EL01
Table 1. PIN DESCRIPTION
PIN
FUNCTION
D0−D3
Q, Q
VCC
VEE
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
EP
(DFN8 only) Thermal exposed pad must be
connected to a sufficient thermal conduit. Electrically connect to the most negative supply
(GND) or leave unconnected, floating open.
Table 2. MAXIMUM RATINGS
Rating
Unit
VCC
Symbol
PECL Mode Power Supply
Parameter
VEE = 0 V
Condition 1
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 SOIC
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
qJC
Thermal Resistance (Junction−to−Case)
35 to 40
°C/W
Pb
Pb−Free
(Note 1)
Condition 2
VI VCC
VI VEE
DFN8
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
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2
MC10EL01, MC100EL01
Table 3. 10EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 2)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
14
17
Min
85°C
Typ
Max
14
17
Min
Typ
Max
Unit
14
17
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 3)
3920
4010
4110
4020
4105
4190
4090
4185
4280
mV
VOL
Output LOW Voltage (Note 3)
3050
3200
3350
3050
3210
3370
3050
3227
3405
mV
VIH
Input HIGH Voltage
3770
4110
3870
4190
3940
4280
mV
VIL
Input LOW Voltage
3050
3500
3050
3520
3050
3555
mV
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
150
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V.
3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 4. 10EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 4)
−40°C
Symbol
Characteristic
Typ
Max
14
17
−1080
−990
−890
Output LOW Voltage (Note 5)
−1950
−1800
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
IIL
Input LOW Current
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 5)
VOL
Min
25°C
Min
85°C
Typ
Max
14
17
−980
−895
−810
−1650
−1950
−1790
−1230
−890
−1950
−1500
Typ
Max
Unit
14
17
mA
−910
−815
−720
mV
−1630
−1950
−1773
−1595
mV
−1130
−810
−1060
−720
mV
−1950
−1480
−1950
−1445
mV
150
mA
150
0.5
Min
150
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V.
5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
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MC10EL01, MC100EL01
Table 5. 100EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 6)
−40°C
Symbol
Characteristic
Min
25°C
Typ
Max
14
17
Min
85°C
Typ
Max
14
17
Min
Typ
Max
Unit
16
20
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 7)
3915
3995
4120
3975
4045
4120
3975
4050
4120
mV
VOL
Output LOW Voltage (Note 7)
3170
3305
3445
3190
3295
3380
3190
3295
3380
mV
VIH
Input HIGH Voltage
3835
4120
3835
4120
3835
4120
mV
VIL
Input LOW Voltage
3190
3525
3190
3525
3190
3525
mV
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
0.5
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.
7. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 6. 100EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 8)
−40°C
Symbol
Characteristic
Typ
Max
14
17
−1085
−1005
−880
Output LOW Voltage (Note 9)
−1830
−1695
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
IIL
Input LOW Current
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 9)
VOL
Min
25°C
Min
85°C
Typ
Max
14
17
−1025
−955
−880
−1555
−1810
−1705
−1165
−880
−1810
−1475
Typ
Max
Unit
16
20
mA
−1025
−955
−880
mV
−1620
−1810
−1705
−1620
mV
−1165
−880
−1165
−880
mV
−1810
−1475
−1810
−1475
mV
150
mA
150
0.5
Min
150
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V.
9. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 7. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −5.0 V (Note 10)
−40°C
Symbol
Characteristic
fMAX
Maximum Toggle Frequency
tPLH
tPHL
Propagation Delay to Output
tJITTER
Cycle−to−Cycle Jitter
tr
tf
Output Rise/Fall Times Q (20% − 80%)
Min
Typ
25°C
Max
Min
TBD
70
220
225
Max
Min
TBD
370
130
TBD
100
Typ
85°C
230
330
150
TBD
350
100
225
Typ
Max
TBD
250
GHz
350
TBD
350
100
225
Unit
ps
ps
350
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
10. 10 Series: VEE can vary +0.25 V / −0.5 V.
100 Series: VEE can vary +0.8 V / −0.5 V.
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MC10EL01, MC100EL01
Zo = 50 W
Q
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device
MC10EL01D
Package
Shipping†
SOIC−8
98 Units / Rail
MC10EL01DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC10EL01DR2
SOIC−8
2500 / Tape & Reel
MC10EL01DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC10EL01DT
TSSOP−8
100 Units / Rail
MC10EL01DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10EL01DTR2
TSSOP−8
2500 / Tape & Reel
MC10EL01DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC10EL01MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
SOIC−8
98 Units / Rail
MC100EL01DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100EL01DR2
SOIC−8
2500 / Tape & Reel
MC100EL01DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100EL01DT
TSSOP−8
100 Units / Rail
MC100EL01DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100EL01DTR2
TSSOP−8
2500 / Tape & Reel
MC100EL01DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100EL01MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
MC10EL01MNR4G
MC100EL01D
MC100EL01MNR4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MC10EL01, MC100EL01
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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MC10EL01, MC100EL01
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8 _
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10EL01, MC100EL01
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
M
T U
V
S
0.25 (0.010)
B
−U−
4
M
A
−V−
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
S
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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8
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC10EL01, MC100EL01
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
TOP VIEW
0.10 C
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your local
Sales Representative
MC10EL01/D