MC10EP01, MC100EP01 3.3V / 5VECL 4−Input OR/NOR The MC10EP01 is a 4−input OR/NOR gate. The device is functionally equivalent to the EL01 device, LVEL01, and E101 (a quad version). With AC performance much faster than the LVEL01 device, the EP01 is ideal for applications requiring the fastest AC performance available. The 100 Series contains temperature compensation. • 230 ps Typical Propagation Delay • Maximum Frequency > 3 GHz Typical • PECL Mode Operating Range: • http://onsemi.com MARKING DIAGRAMS* 8 8 8 HEP01 ALYW 1 VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −5.5 V Open Input Default State SOIC−8 D SUFFIX CASE 751 • • Pb−Free Package is Available 1 1 8 8 8 1 TSSOP−8 DT SUFFIX CASE 948R H K A L Y W KEP01 ALYW KP01 ALYW HP01 ALYW 1 1 = MC10 = MC100 = Assembly Location = Wafer Lot = Year = Work Week *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Semiconductor Components Industries, LLC, 2004 June, 2004 − Rev. 6 1 Publication Order Number: MC10EP01/D MC10EP01, MC100EP01 Table 1. PIN DESCRIPTION D0 D1 D2 1 8 2 7 3 6 VCC Pin Q Function D0 − D3 ECL Data Inputs Q, Q ECL Data Outputs VCC Positive Supply VEE Negative Supply Q Table 2. TRUTH TABLE D3 4 5 VEE Figure 1. 8−Lead Pinout (Top View) and Logic Diagram D0* D1* D2* D3* Q Q L L L L L H H X X X H L X H X X H L X X H X H L X X X H H L H H H H H L *Pins will default LOW when left open. Table 3. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 k Internal Input Pullup Resistor ESD Protection N/A Human Body Model Machine Model Charged Device Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 4 kV > 200 V > 2 kV Level 1 UL 94 V−0 @ 0.125 in 115 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. http://onsemi.com 2 MC10EP01, MC100EP01 Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C JA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W JC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W JA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W JC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W Tsol Wave Solder < 2 to 3 sec @ 248°C 265 °C VI VCC VI VEE Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. http://onsemi.com 3 MC10EP01, MC100EP01 Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 20 24 31 20 24 31 20 24 31 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 3) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV VOL Output LOW Voltage (Note 3) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV VIH Input HIGH Voltage (Single−Ended) 2090 2415 2155 2480 2215 2540 mV VIL Input LOW Voltage (Single−Ended) 1365 1690 1430 1755 1490 1815 mV IIH Input HIGH Current 150 A IIL Input LOW Current 150 150 0.5 0.5 A 0.5 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 3. All loading with 50 to VCC − 2.0 V. Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 4) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 20 24 31 20 24 31 20 24 31 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 5) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV VOL Output LOW Voltage (Note 5) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV VIH Input HIGH Voltage (Single−Ended) 3790 4115 3855 4180 3915 4240 mV VIL Input LOW Voltage (Single−Ended) 3065 3390 3130 3455 3190 3515 mV IIH Input HIGH Current 150 A IIL Input LOW Current 150 150 0.5 0.5 A 0.5 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 5. All loading with 50 to VCC − 2.0 V. Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 6) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 20 24 31 20 24 31 20 24 31 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 7) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV VOL Output LOW Voltage (Note 7) −1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV VIH Input HIGH Voltage (Single−Ended) −1210 −885 −1145 −820 −1085 −760 mV VIL Input LOW Voltage (Single−Ended) −1935 −1610 −1870 −1545 −1810 −1485 mV IIH Input HIGH Current 150 A IIL Input LOW Current 150 0.5 150 0.5 0.5 A NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters vary 1:1 with VCC. 7. All loading with 50 to VCC − 2.0 V. http://onsemi.com 4 MC10EP01, MC100EP01 Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 8) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 15 24 32 17 26 36 19 28 38 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 9) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 9) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV VIH Input HIGH Voltage (Single−Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single−Ended) 1355 1675 1355 1675 1355 1675 mV IIH Input HIGH Current 150 A IIL Input LOW Current 150 150 0.5 0.5 A 0.5 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 9. All loading with 50 to VCC − 2.0 V. Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 10) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 15 24 32 17 26 36 19 28 38 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 11) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV VOL Output LOW Voltage (Note 11) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV VIH Input HIGH Voltage (Single−Ended) 3775 4120 3775 4120 3775 4120 mV VIL Input LOW Voltage (Single−Ended) 3055 3375 3055 3375 3055 3375 mV IIH Input HIGH Current 150 A IIL Input LOW Current 150 150 0.5 0.5 A 0.5 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 11. All loading with 50 to VCC − 2.0 V. Table 10. 100EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 12) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 15 24 32 17 26 36 19 28 38 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 13) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 13) −1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV VIH Input HIGH Voltage (Single−Ended) −1225 −880 −1225 −880 −1225 −880 mV VIL Input LOW Voltage (Single−Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV IIH Input HIGH Current 150 A IIL Input LOW Current 150 0.5 150 0.5 0.5 A NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 12. Input and output parameters vary 1:1 with VCC. 13. All loading with 50 to VCC − 2.0 V. http://onsemi.com 5 MC10EP01, MC100EP01 Table 11. AC CHARACTERISTICS VCC = 3.0 V to 5.5 V; VEE = 0 V or VCC = 0 V; VEE = −3.0 V to −5.5 V (Note 14) −40°C Symbol Min Characteristic fmax Maximum Frequency (See Figure 2. Fmax/JITTER) tPLH, tPHL Propagation Delay tJITTER Cycle−to−Cycle Jitter (See Figure 2. Fmax/JITTER) tr tf Output Rise/Fall Times (20% − 80%) 25°C Typ Max Min >3 D to Q, Q Q, Q 150 50 Typ 85°C Max Min Typ >3 260 330 0.2 <1 120 170 150 60 Max >3 270 330 0.2 <1 130 180 200 70 Unit GHz 300 350 ps 0.2 <1 ps 150 200 ps 900 8 800 7 700 6 600 5 500 ÉÉ ÉÉ ÉÉ 4 400 3 300 2 200 ÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉ 1 100 (JITTER) 0 0 1000 2000 3000 4000 FREQUENCY (MHz) Figure 2. Fmax/Jitter http://onsemi.com 6 JITTEROUT (ps) (RMS) VOUTpp (mV) NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 14. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 to VCC − 2.0 V. 5000 6000 MC10EP01, MC100EP01 Zo = 50 Q D Receiver Device Driver Device Zo = 50 Q D 50 50 VTT VTT = VCC − 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC10EP01D Package Shipping† SOIC−8 98 Units / Rail MC10EP01DG SOIC−8 (Pb−Free) 98 Units / Rail MC10EP01DR2 SOIC−8 2500 / Tape & Reel MC10EP01DT TSSOP−8 100 Units / Rail MC10EP01DTR2 TSSOP−8 2500 / Tape & Reel MC100EP01D SOIC−8 98 Units / Rail MC100EP01DR2 SOIC−8 2500 / Tape & Reel MC100EP01DT TSSOP−8 100 Units / Rail MC100EP01DTR2 TSSOP−8 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 MC10EP01, MC100EP01 Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPS I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1642/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 8 MC10EP01, MC100EP01 PACKAGE DIMENSIONS SOIC−8 NB D SUFFIX PLASTIC SOIC PACKAGE CASE 751−07 ISSUE AB −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 0.25 (0.010) S B 1 M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 MC10EP01, MC100EP01 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U K REF 0.10 (0.004) S 2X L/2 8 1 PIN 1 IDENT S T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S 5 0.25 (0.010) B −U− L 0.15 (0.006) T U M M 4 A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0 6 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0 6 ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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