MC74AC14 D

MC74AC14, MC74ACT14
Hex Inverter Schmitt
Trigger
High−Performance Silicon−Gate CMOS
The MC74AC14/74ACT14 contains six logic inverters which
accept standard CMOS Input signals (TTL levels for MC74ACT14)
and provide standard CMOS output levels. They are capable of
transforming slowly changing input signals into sharply defined,
jitter−free output signals. In addition, they have a greater noise margin
then conventional inverters.
The MC74AC14/74ACT14 has hysteresis between the
positive−going and negative−going input thresholds (typically 1.0 V)
which is determined internally by transistor ratios and is essentially
insensitive to temperature and supply voltage variations.
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MARKING
DIAGRAMS
14
14
SOIC−14
D SUFFIX
CASE 751A
xxx14G
AWLYWW
1
1
14
Features
•
•
•
•
•
Schmitt Trigger Inputs
Outputs Source/Sink 24 mA
MC74ACT14 Has TTL Compatible Inputs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
xxx
14
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
1
14
1
xxx
= AC or ACT
A
= Assembly Location
WL or L = Wafer Lot
Y
= Year
WW or W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
VCC
14
13
12
11
10
9
8
1
2
3
4
5
6
7
GND
(Top View)
Figure 1. Pinout: 14−Lead Packages
Conductors
FUNCTION TABLE
Input
A
Output
O
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 10
1
Publication Order Number:
MC74AC14/D
MC74AC14, MC74ACT14
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
*0.5 to )7.0
V
*0.5 v VI v VCC )0.5
V
*0.5 v VO v VCC )0.5
V
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$50
mA
IO
DC Output Sink/Source Current
$50
mA
ICC
DC Supply Current per Output Pin
$50
mA
IGND
DC Ground Current per Output Pin
$50
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction temperature under Bias
)150
°C
qJA
Thermal Resistance (Note 2)
SOIC
TSSOP
125
170
°C/W
PD
Power Dissipation in Still Air at 85°C
SOIC
TSSOP
125
170
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
> 1000
V
ILatch−Up
Latch−Up Performance
Above VCC and Below GND at 85°C (Note 6)
$100
mA
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
(Note 1)
Level 1
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
tr, tf
Parameter
Supply Voltage
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
Unit
V
V
ns/V
ns/V
−
−
140
°C
−40
25
85
°C
Output Current − High
−
−
−24
mA
Output Current − Low
−
−
24
mA
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
IOL
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74AC14, MC74ACT14
DC CHARACTERISTICS
Symbol
Parameter
74AC
74AC
VCC
(V)
TA = +25°C
TA = −40°C to +85°C
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
5.5
−
5.5
−
Typ
VOH
VOL
IIN
IOLD
Minimum High Level Output Voltage
Maximum Low Level Output Voltage
Maximum Input Leakage Current
†Minimum Dynamic Output Current
IOHD
Unit
Conditions
Guaranteed Limits
IOUT = −50 mA
V
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 mA
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
±1.0
mA
VI = VCC, GND
−
75
mA
VOLD = 1.65 V Max
−
−75
mA
VOHD = 3.85 V Min
ICC
Maximum Quiescent Supply Current
5.5
−
4.0
40
VIN = VCC or GND
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS
Symbol
Parameter
tPLH
Propagation Delay
tPHL
Propagation Delay
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
VCC*
(V)
74AC
74AC
TA = +25°C CL = 50 pF
TA = −40°C to
+85°C CL = 50 pF
Unit
Figure
No.
Min
Typ
Max
Min
Max
1.5
1.5
9.5
7.0
13.5
10.0
1.5
1.5
15.0
11.0
ns
3−5
3.3
1.5
5.0
1.5
Voltage Range 5.0 V is 5.0 V ±0.5 V.
7.5
6.0
11.5
8.5
1.5
1.5
13.0
9.5
ns
3−5
3.3
5.0
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3
MC74AC14, MC74ACT14
INPUT CHARACTERISTICS (unless otherwise specified)
Parameter
Symbol
VCC
(V)
74AC
74ACT
Test Conditions
Vt +
Maximum Positive Threshold
3.0
4.5
5.5
2.2
3.2
3.9
−
2.0
2.0
V
TA = Worst Case
Vt −
Minimum Negative Threshold
3.0
4.5
5.5
0.5
0.9
1.1
−
0.8
0.8
V
TA = Worst Case
Vh(max)
Maximum Hysteresis
3.0
4.5
5.5
1.2
1.4
1.6
−
1.2
1.2
V
TA = Worst Case
Vh(min)
Minimum Hysteresis
3.0
4.5
5.5
0.3
0.4
0.5
−
0.4
0.4
V
TA = Worst Case
DC CHARACTERISTICS
74ACT
Symbol
Parameter
VCC
(V)
74ACT
TA = +25°C
Typ
VOH
VOL
IIN
DICCT
IOLD
Minimum High Level Output Voltage
TA = −40°C to +85°C
Unit
Conditions
Guaranteed Limits
IOUT = −50 mA
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
†Minimum Dynamic Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
Maximum Low Level Output Voltage
Maximum Input Leakage Current
IOHD
V
*VIN = VIL or VIH
IOH −24 mA
−24 mA
V
IOUT = 50 mA
V
ICC
Maximum Quiescent Supply Current
5.5
−
4.0
40
VIN = VCC or GND
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
Symbol
Parameter
VCC*
(V)
74ACT
74ACT
TA = +25°C CL = 50 pF
TA = −40°C to
+85°C CL = 50 pF
Unit
Figure
No.
Min
Typ
Max
Min
Max
tPLH
Propagation Delay
5.0
1.5
−
11.5
1.0
12.5
ns
3−5
tPHL
Propagation Delay
5.0
1.5
−
10.0
1.0
11.0
ns
3−5
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Value Typ
Unit
Test Conditions
CIN
Input Capacitance
Parameter
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
25
pF
VCC = 5.0 V
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4
MC74AC14, MC74ACT14
ORDERING INFORMATION
Device
Package
MC74AC14DG
MC74AC14DR2G
55 Units / Rail
SOIC−14
(Pb−Free)
NLV74AC14DR2G*
TSSOP−14
(Pb−Free)
MC74ACT14DG
SOIC−14
(Pb−Free)
MC74ACT14DTR2G
2500 / Tape & Reel
2500 / Tape & Reel
MC74AC14DTR2G
MC74ACT14DR2G
Shipping†
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
55 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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5
MC74AC14, MC74ACT14
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
D
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
DETAIL A
h
A
X 45 _
M
A1
e
DIM
A
A1
A3
b
D
E
e
H
h
L
M
C
SEATING
PLANE
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
MC74AC14, MC74ACT14
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
ON Semiconductor and the
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7
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For additional information, please contact your local
Sales Representative
MC74AC14/D