NCP551, NCV551 150 mA CMOS Low Iq Low-Dropout Voltage Regulator The NCP551 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP551 series features an ultra−low quiescent current of 4.0 mA. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP551 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 mF. The device is housed in the TSOP−5 surface mount package. Standard voltage versions are 1.4, 1.5, 1.8, 2.5, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.6, 3.8 and 5.0 V. Other voltages are available in 100 mV steps. • Low Quiescent Current of 4.0 mA Typical Maximum Operating Voltage of 12 V Low Output Voltage Option High Accuracy Output Voltage of 2.0% Industrial Temperature Range of −40°C to 85°C (NCV551, TA = −40°C to +125°C) NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant Typical Applications • Battery Powered Instruments • Hand−Held Instruments • Camcorders and Cameras Vin 1 TSOP−5 (SOT23−5, SC59−5) SN SUFFIX CASE 483 1 GND 2 Enable 3 5 Vout 4 N/C (Top View) xxx = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. 1 5 Thermal Shutdown Vin xxxAYWG G • 5 PIN CONNECTIONS AND MARKING DIAGRAM Features • • • • • www.onsemi.com Vout Driver w/ Current Limit Enable ON 3 OFF GND 2 Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2016 January, 2016 − Rev. 19 1 Publication Order Number: NCP551/D NCP551, NCV551 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Vin Description 2 GND 3 Enable 4 N/C No Internal Connection. 5 Vout Regulated output voltage. Positive power supply input voltage. Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. MAXIMUM RATINGS ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Rating Symbol Value Unit Input Voltage Vin 0 to 12 V Enable Voltage VEN −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation PD Internally Limited W Operating Junction Temperature TJ +150 °C TA −40 to +85 −40 to +125 °C Tstg −55 to +150 °C Operating Ambient Temperature NCP551 NCV551 Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V Charge Device Model (CDM) tested C3B per EIA/JESD22−C101. 2. Latchup capability (85°C) "100 mA DC with trigger voltage. THERMAL CHARACTERISTICS ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Rating Symbol Junction−to−Ambient RqJA PSIJ−Lead 2 YJ−L2 NOTE: Test Conditions ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ Typical Value Unit 1 oz Copper Thickness, 100 mm2 250 °C/W 1 oz Copper Thickness, 100 mm2 68 °C/W Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. www.onsemi.com 2 NCP551, NCV551 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, VEN = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C, unless otherwise noted.) Symbol Characteristic Output Voltage (TA = 25°C, Iout = 10 mA) 1.4 V 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 2.9 V 3.0 V 3.1 V 3.2 V 3.3 V 3.6 V 3.8 V 5.0 V Vout Output Voltage (TA = Tlow to Thigh, Iout = 10 mA) 1.4 V 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 2.9 V 3.0 V 3.1 V 3.2 V 3.3 V 3.6 V 3.8 V 5.0 V Vout Min Typ Max 1.358 1.455 1.746 2.425 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.528 3.724 4.90 1.4 1.5 1.8 2.5 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.6 3.8 5.0 1.442 1.545 1.854 2.575 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.672 3.876 5.10 1.344 1.440 1.728 2.400 2.619 2.716 2.813 2.910 3.007 3.104 3.201 3.492 3.686 4.850 1.4 1.5 1.8 2.5 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.6 3.8 5.0 1.456 1.560 1.872 2.600 2.781 2.884 2.987 3.090 3.193 3.296 3.399 3.708 3.914 5.150 Unit V V Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA) Regline − 10 30 mV Load Regulation (Iout = 10 mA to 150 mA, Vin = Vout + 2.0 V) Regload − 40 65 mV Output Current (Vout = (Vout at Iout = 100 mA) −3%) 1.4 V−2.0 V (Vin = 4.0 V) 2.1 V−3.0 V (Vin = 5.0 V) 3.1 V−4.0 V (Vin = 6.0 V) 4.1 V−5.0 V (Vin = 8.0 V) Io(nom.) 150 150 150 150 − − − − − − − − Dropout Voltage (Iout = 10 mA, Measured at Vout −3.0%) 1.4 V 1.5 V, 1.8 V, 2.5 V 2.7 V, 2.8 V, 2.9 V, 3.0 V, 3.1 V, 3.2 V, 3.3 V, 3.6 V, 3.8 V, 5.0 V Vin−Vout − − − 170 130 40 250 220 150 − − 0.1 4.0 1.0 8.0 − "100 − 1.3 − − − − 0.3 Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) 1.4 V−2.0 V options, Vin = 4.0 V 2.1 V−3.0 V options, Vin = 5.0 V 3.1 V−4.0 V options, Vin = 6.0 V 4.1 V−5.0 V options, Vin = 8.0 V mA mV mA IQ Output Voltage Temperature Coefficient Tc Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) www.onsemi.com 3 ppm/°C V Vth(en) NCP551, NCV551 ELECTRICAL CHARACTERISTICS (continued) (Vin = Vout(nom.) + 1.0 V, VEN = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C, unless otherwise noted.) Output Short Circuit Current (Vout = 0 V) 1.4 V−2.0 V (Vin = 4.0 V) 2.1 V−3.0 V (Vin = 5.0 V) 3.1 V−4.0 V (Vin = 6.0 V) 4.1 V−5.0 V (Vin = 8.0 V) mA Iout(max) 160 160 160 160 350 350 350 350 600 600 600 600 3. Maximum package power dissipation limits must be observed. TJ(max) * TA PD + RqJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. Thigh = +85°C 5. NCP551 Tlow = −40°C Thigh = +125°C. NCV551 Tlow = −40°C www.onsemi.com 4 NCP551, NCV551 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. www.onsemi.com 5 NCP551, NCV551 3.35 3.45 Vout = 3.3 V 3.3 GROUND CURRENT (mA) GROUND CURRENT (mA) Vout = 2.8 V 3.25 3.2 3.15 3.1 3.05 3.35 3.3 3.25 3.2 3.15 0 25 50 100 75 125 150 0 100 75 125 Figure 2. Ground Pin Current versus Output Current Figure 3. Ground Pin Current versus Output Current 4 3.5 3.5 3 2.5 2 1.5 Vout(nom) = 2.8 V Iout = 25 mA 1 0.5 150 3 2.5 2 1.5 Vout(nom) = 3.3 V Iout = 25 mA 1 0.5 0 0 2 4 6 8 10 12 0 14 2 4 6 8 10 12 Vin, INPUT VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS) Figure 4. Ground Pin Current versus Input Voltage Figure 5. Ground Pin Current versus Input Voltage Vin, INPUT VOLTAGE (V) 0 8 6 4 OUTPUT VOLTAGE DEVIATION (mV) Vin, INPUT VOLTAGE (V) 50 Iout, OUTPUT CURRENT (mA) 4 OUTPUT VOLTAGE DEVIATION (mV) 25 Iout, OUTPUT CURRENT (mA) GROUND PIN CURRENT (mA) GROUND PIN CURRENT (mA) 3.4 Vin = 3.8 V to 4.8 V Vout = 2.8 V Cout = 1 mF Iout = 10 mA 400 200 14 6 4 Vin = 3.8 V to 4.8 V Vout = 2.8 V Cout = 1 mF Iout = 100 mA 400 200 0 −200 0 −400 −200 −600 −400 0 200 400 600 800 1000 1200 1400 1600 0 200 400 600 800 1000 1200 1400 TIME (ms) TIME (ms) Figure 6. Line Transient Response Figure 7. Line Transient Response www.onsemi.com 6 160 Vin, INPUT VOLTAGE (V) 6 4 Vin = 3.8 V to 4.8 V Vout = 2.8 V Cout = 1 mF Iout = 150 mA 400 200 −200 0 −600 200 400 600 800 1000 1200 1400 0 1600 200 400 600 800 1000 1200 1400 1600 TIME (ms) TIME (ms) Figure 8. Line Transient Response Figure 9. Line Transient Response Vin, INPUT VOLTAGE (V) 0 Vin, INPUT VOLTAGE (V) 200 −400 −600 6 4 800 400 200 OUTPUT VOLTAGE DEVIATION (mV) Vin = 4.3 V to 5.3 V Vout = 3.3 V Cout = 1 mF Iout = 100 mA 600 OUTPUT VOLTAGE DEVIATION (mV) Vin = 4.3 V to 5.3 V Vout = 3.3 V Cout = 1 mF Iout = 10 mA −200 −400 0 −200 6 4 Vin = 4.3 V to 5.3 V Vout = 3.3 V Cout = 1 mF Iout = 150 mA 600 400 200 0 −200 −400 −400 −600 −600 300 500 700 900 1100 1300 1500 1700 1900 800 1200 2000 1600 Figure 10. Line Transient Response Figure 11. Line Transient Response Vout = 2.8 V Cout = 10 mF OUTPUT VOLTAGE DEVIATION (mV) 0 0 −500 −1000 0 400 TIME (ms) Iout = 3.0 mA − 150 mA 150 0 TIME (ms) Iout, OUTPUT CURRENT (mA) 100 Iout, OUTPUT CURRENT (mA) 4 400 0 OUTPUT VOLTAGE DEVIATION (mV) 6 OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (mV) Vin, INPUT VOLTAGE (V) NCP551, NCV551 1 2 3 4 5 6 7 8 9 Iout = 3.0 mA − 150 mA Vout = 2.8 V Cout = 10 mF 150 0 1000 500 0 −500 0 1 2 3 4 5 6 7 8 9 TIME (ms) TIME (ms) Figure 12. Load Transient Response ON Figure 13. Load Transient Response OFF www.onsemi.com 7 Iout, OUTPUT CURRENT (mA) Iout = 3.0 mA − 150 mA Vout = 3.3 V Cout = 10 mF 150 0 1000 OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (mV) Iout, OUTPUT CURRENT (mA) NCP551, NCV551 500 0 −500 0 1 2 3 4 5 6 7 8 9 Iout = 3.0 mA − 150 mA Vout = 3.3 V Cout = 10 mF 150 0 −500 −1000 0 1 2 3 TIME (ms) 7 8 9 ENABLE VOLTAGE (V) 3 2 1 0 3 Co = 1 mF Vin = 4.3 V Vout = 3.3 V RO = 3.3 k VEN = 2.0 V 2 1 Vout, OUTPUT VOLTAGE (V) ENABLE VOLTAGE (V) 6 Figure 15. Load Transient Response ON 3 Vout, OUTPUT VOLTAGE (V) 5 TIME (ms) Figure 14. Load Transient Response OFF Co = 10 mF 0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2 1 0 3 Co = 1 mF Vin = 3.8 V Vout = 2.8 V RO = 2.8 k VEN = 2.0 V 2 1 Co = 10 mF 0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 TIME (ms) TIME (ms) Figure 16. Turn−On Response Figure 17. Turn−On Response 3 3.5 Vout, OUTPUT VOLTAGE (VOLTS) Vout, OUTPUT VOLTAGE (VOLTS) 4 2.5 2 Vin = 0 V to 12 V Vout(nom) = 2.8 V Iout = 10 mA Cin = 1 mF Cout = 1 mF VEN = Vin 1.5 1 0.5 0 3 2.5 Vin = 0 V to 12 V Vout = 3.3 V Iout = 10 mA Cin = 1 mF Cout = 1 mF VEN = Vin 2 1.5 1 0.5 0 0 2 4 6 8 10 12 0 2 4 6 8 10 Vin, INPUT VOLTAGE (VOLTS) Vin, INPUT VOLTAGE (VOLTS) Figure 18. Output Voltage versus Input Voltage Figure 19. Output Voltage versus Input Voltage www.onsemi.com 8 12 NCP551, NCV551 APPLICATIONS INFORMATION Thermal A typical application circuit for the NCP551 series is shown in Figure 20. As power across the NCP551 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP551 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Input Decoupling (C1) A 0.1 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP551 package. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) The NCP551 is a stable Regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3.0 W can thus safely be used. The minimum decoupling value is 0.1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. PD + If junction temperature is not allowed above the maximum 125°C, then the NCP551 can dissipate up to 400 mW @ 25°C. The power dissipated by the NCP551 can be calculated from the following equation: Enable Operation Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout The enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. or P ) Vout * Iout VinMAX + tot IGND ) Iout Hints If a 150 mA output current is needed then the ground current from the data sheet is 4.0 mA. For an NCP551SN30T1 (3.0 V), the maximum input voltage will then be 5.6 V. Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Battery or Unregulated Voltage + Vout 1 5 C1 + C2 2 ON TJ(max) * TA RqJA 3 4 OFF Figure 20. Typical Application Circuit www.onsemi.com 9 NCP551, NCV551 Input Output Q1 R1 Input Output Q1 R2 Q2 R 1 1.0 mF 5 1 1.0 mF 2 3 R3 1.0 mF 5 1.0 mF 2 4 3 Figure 21. Current Boost Regulator 4 Figure 22. Current Boost Regulator with Short Circuit Limit The NCP551 series can be current boosted with a PNP transistor. Resistor R in conjunction with VBE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input/Output differential voltage minimum is increased by VBE of the pass resistor. Short circuit current limit is essentially set by the VBE of Q2 and R1. ISC = ((VBEQ2 − ib * R2) / R1) + IO(max) Regulator Output Input 1 5 1.0 mF 1.0 mF 2 Input Output Q1 1 Enable 3 4 R 1.0 mF Output 1 1.0 mF 1.0 mF 2 3 5 5 4 11 V 1.0 mF 2 3 R 4 C Figure 24. Input Voltages Greater than 12 V A regulated output can be achieved with input voltages that exceed the 12 V maximum rating of the NCP551 series with the addition of a simple pre−regulator circuit. Care must be taken to prevent Q1 from overheating when the regulated output (Vout) is shorted to GND. Figure 23. Delayed Turn−on If a delayed turn−on is needed during power up of several voltages then the above schematic can be used. Resistor R, and capacitor C, will delay the turn−on of the bottom regulator. www.onsemi.com 10 NCP551, NCV551 ORDERING INFORMATION Nominal Output Voltage Marking Package Shipping† 1.5 LAO TSOP−5 (Pb−Free) 3000 / Tape & Reel 1.8 LAP TSOP−5 (Pb−Free) 3000 / Tape & Reel 2.5 LAQ TSOP−5 (Pb−Free) 3000 / Tape & Reel 2.7 LAR TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN28T1G 2.8 LAS TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN29T1G 2.9 LJL TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN30T1G 3.0 LAT TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN31T1G 3.1 LJM TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN32T1G 3.2 LIV TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN33T1G 3.3 LAU TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP551SN50T1G 5.0 LAV TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN14T1G* 1.4 AAT TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN15T1G* 1.5 LFZ TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN18T1G* 1.8 LGA TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN25T1G* 2.5 LGB TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN27T1G* 2.7 LGC TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN28T1G* 2.8 LGD TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN30T1G* 3.0 LGE TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN31T1G* 3.1 LJR TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN32T1G* 3.2 LFR TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN33T1G* 3.3 LGG TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN36T1G* 3.6 AEJ TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN38T1G* 3.8 AD5 TSOP−5 (Pb−Free) 3000 / Tape & Reel NCV551SN50T1G* 5.0 LGF TSOP−5 (Pb−Free) 3000 / Tape & Reel Device NCP551SN15T1G NCP551SN18T1G NCP551SN25T1G NCP551SN27T1G NOTE: Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 11 NCP551, NCV551 PACKAGE DIMENSIONS TSOP−5 SN SUFFIX CASE 483−02 ISSUE K NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 S 3 K B DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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