MC14007UB Dual Complementary Pair Plus Inverter The MC14007UB multipurpose device consists of three N−Channel and three P−Channel enhancement mode devices packaged to provide access to each device. These versatile parts are useful in inverter circuits, pulse−shapers, linear amplifiers, high input impedance amplifiers, threshold detectors, transmission gating, and functional gating. http://onsemi.com Features • Diode Protection on All Inputs • Supply Voltage Range = 3.0 Vdc to 18 Vdc • Capable of Driving Two Low−power TTL Loads or One Low−power • • • • Schottky TTL Load Over the Rated Temperature Range Pin−for−Pin Replacement for CD4007A or CD4007UB This device has 2 outputs without ESD Protection. Antistatic precautions must be taken. NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable This Device is Pb−Free and is RoHS Compliant SOIC−14 D SUFFIX CASE 751A PIN ASSIGNMENT D−PB 1 14 VDD S−PB 2 13 D−PA GATEB 3 12 OUTC S−NB 4 11 S−PC D−NB 5 10 GATEC GATEA 6 9 S−NC VSS 7 8 D−NA MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol VDD Parameter Unit −0.5 to +18.0 V −0.5 to VDD +0.5 V Input or Output Current (DC or Transient) per Pin ± 10 mA PD Power Dissipation, per Package (Note 1) 500 mW TA Ambient Temperature Range −55 to +125 °C Tstg Storage Temperature Range −65 to +150 °C TL Lead Temperature (8 second Soldering) 260 °C Vin, Vout Iin, Iout DC Supply Voltage Range Value Input or Output Voltage Range (DC or Transient) July, 2014 − Rev. 11 MARKING DIAGRAM 14 14007UG AWLYWW 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Temperature Derating: “D/DW” Package: –7.0 mW/°C from 65°C 5o 125°C. © Semiconductor Components Industries, LLC, 2014 D = DRAIN S = SOURCE 1 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Indicator ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: MC14007UB/D MC14007UB A A 12 B 9 B 1 C 2 3 INPUT 4 5 VDD 14 C 11 INPUT 1 0 OUTPUT CONDITION 13 INPUT 6 A = C, B = OPEN A = B, C = OPEN 10 8 7 Substrates of P−Channel devices internally connected to VDD; substrates of N−Channel devices internally connected to VSS. VSS Figure 1. Typical Application: 2−Input Analog Multiplexer 14 13 2 1 11 6 12 7 8 3 4 5 10 VDD = PIN 14 VSS = PIN 7 Figure 2. Schematic http://onsemi.com 2 9 MC14007UB ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) −55°C Symbol Characteristic 25°C VDD Vdc Min Max Min Typ (Note 2) 125°C Max Min Max Unit VOL Output Voltage Vin = VDD or 0 “0” Level 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc VOH Vin = 0 or VDD “1” Level 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc 5.0 10 15 − − − 1.0 2.0 2.5 − − − 2.25 4.50 6.75 1.0 2.0 2.5 − − − 1.0 2.0 2.5 “1” Level 5.0 10 15 4.0 8.0 12.5 − − − 4.0 8.0 12.5 2.75 5.50 8.25 − − − 4.0 8.0 12.5 − − − Source 5.0 5.0 10 15 –3.0 –0.64 –1.6 –4.2 − − − − –2.4 –0.51 −1.3 −3.4 –5.0 –1.0 –2.5 –10 − − − − –1.7 −0.36 –0.9 −2.4 − − − − Sink 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 1.0 2.5 10 − − − 0.36 0.9 2.4 − − − mAdc VIL Input Voltage (VO = 4.5 Vdc) (VO = 9.0 Vdc) (VO = 13.5 Vdc) VIH (VO = 0.5 Vdc) (VO = 1.0 Vdc) (VO = 1.5 Vdc) IOH Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) IOL (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) “0” Level Vdc Vdc mAdc Iin Input Current 15 − ±0.1 − ±0.00001 ±0.1 − ±1.0 mAdc Cin Input Capacitance (Vin = 0) − − − − 5.0 7.5 − − pF IDD Quiescent Current (Per Package) 5.0 10 15 − − − 0.25 0.5 1.0 − − − 0.0005 0.0010 0.0015 0.25 0.5 1.0 − − − 7.5 15 30 mAdc Total Supply Current (Notes 3 and 4) (Dynamic plus Quiescent, Per Gate) (CL = 50 pF) 5.0 10 15 IT IT = (0.7 mA/kHz) f + IDD/6 IT = (1.4 mA/kHz) f + IDD/6 IT = (2.2 mA/kHz) f + IDD/6 mAdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 3. The formulas given are for the typical characteristics only at 25°C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL − 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.003. http://onsemi.com 3 MC14007UB SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25°C) VDD Vdc Min Typ (Note 6) Max Output Rise Time tTLH = (1.2 ns/pF) CL + 30 ns tTLH = (0.5 ns/pF) CL + 20 ns tTLH = (0.4 ns/pF) CL + 15 ns 5.0 10 15 − − − 90 45 35 180 90 70 Output Fall Time tTHL = (1.2 ns/pF) CL + 15 ns tTHL = (0.5 ns/pF) CL + 15 ns tTHL = (0.4 ns/pF) CL + 10 ns 5.0 10 15 − − − 75 40 30 150 80 60 Turn−Off Delay Time tPLH = (1.5 ns/pF) CL + 35 ns tPLH = (0.2 ns/pF) CL + 20 ns tPLH = (0.15 ns/pF) CL + 17.5 ns 5.0 10 15 − − − 60 30 25 125 75 55 Turn−On Delay Time tPHL = (1.0 ns/pF) CL + 10 ns tPHL = (0.3 ns/pF) CL + 15 ns tPHL = (0.2 ns/pF) CL + 15 ns 5.0 10 15 − − − 60 30 25 125 75 55 Symbol tTLH tTHL tPLH tPHL Characteristic Unit ns ns ns ns 5. The formulas given are for the typical characteristics only. Switching specifications are for device connected as an inverter. 6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. VDD = -VGS VDD = VGS 14 IOH 7 14 VDS = VOH - VDD IOL VSS 7 All unused inputs connected to ground. a TA = -55°C b TA = +25°C c TA = +125°C -8.0 b a c b -12 b c -10 Vdc -16 -15 Vdc a a -20 -10 a VGS = 15 Vdc b c IOL , DRAIN CURRENT (mAdc) IOH , DRAIN CURRENT (mAdc) 20 VGS = -5.0 Vdc VSS All unused inputs connected to ground. 0 -4.0 VDS = VOL c 16 a 10 Vdc 12 b c a TA = -55°C b TA = +25°C c TA = +125°C 8.0 a 4.0 b 5.0 Vdc c 0 -8.0 -6.0 -4.0 VDS, DRAIN VOLTAGE (Vdc) -2.0 -0 0 Figure 3. Typical Output Source Characteristics 2.0 4.0 6.0 VDS, DRAIN VOLTAGE (Vdc) 8.0 Figure 4. Typical Output Sink Characteristics These typical curves are not guarantees, but are design aids. Caution: The maximum current rating is 10 mA per pin. http://onsemi.com 4 10 MC14007UB VDD 500mF PULSE GENERATOR 20 ns 0.01 mF CERAMIC ID VSS tPHL Vout 7 VDD 90% 50% 10% Vin 14 Vin 20 ns VSS tPLH CL VOH 90% 50% 10% Vout VOL tTHL tTLH Figure 5. Switching Time and Power Dissipation Test Circuit and Waveforms APPLICATIONS The MC14007UB dual pair plus inverter, which has access to all its elements offers a number of unique circuit applications. Figures 1, 6, and 7 are a few examples of the device flexibility. +VDD 2 VDD 14 1 13 OUT = A+B•C DISABLE3 11 INPUT10 11 12 10 12OUTPUT 2 B 1 8 OUTPUT 9 9 8 7 5 DISABLE6 3 7 C 4 INPUT DISABLE OUTPUT 1 0 X 0 0 1 0 1 OPEN 6 A Substrates of P−Channel devices internally connected to VDD; Substrates of N−Channel devices internally connected to VSS. X = Don’t Care Figure 7. AOI Functions Using Tree Logic Figure 6. 3−State Buffer http://onsemi.com 5 MC14007UB ORDERING INFORMATION Package Shipping† MC14007UBDG SOIC−14 (Pb−Free) 55 Units / Rail MC14007UBDR2G SOIC−14 (Pb−Free) 2500 / Tape & Reel NLV14007UBDR2G* SOIC−14 (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 6 MC14007UB PACKAGE DIMENSIONS D SOIC−14 NB CASE 751A−03 ISSUE K A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S e DETAIL A h A X 45 _ M A1 C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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