MC14536B Programmable Timer The MC14536B programmable timer is a 24−stage binary ripple counter with 16 stages selectable by a binary code. Provisions for an on−chip RC oscillator or an external clock are provided. An on−chip monostable circuit incorporating a pulse−type output has been included. By selecting the appropriate counter stage in conjunction with the appropriate input clock frequency, a variety of timing can be achieved. http://onsemi.com Features • • • • • • • • • • • • • 24 Flip−Flop Stages − Will Count From 20 to 224 Last 16 Stages Selectable By Four−Bit Select Code 8−Bypass Input Allows Bypassing of First Eight Stages Set and Reset Inputs Clock Inhibit and Oscillator Inhibit Inputs On−Chip RC Oscillator Provisions On−Chip Monostable Output Provisions Clock Conditioning Circuit Permits Operation with Very Long Rise and Fall Times Test Mode Allows Fast Test Sequence Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving Two Low−Power TTL Loads or One Low−Power Schottky TTL Load over the Rated Temperature Range NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant 1 1 1 SOIC−16 WB DW SUFFIX CASE 751G SOEIAJ−16 F SUFFIX CASE 966 TSSOP−16 DT SUFFIX CASE 948F PIN ASSIGNMENT SET 1 16 VDD RESET 2 15 MONO−IN IN 1 3 14 OSC INH OUT 1 4 13 DECODE OUT 2 5 12 D 8−BYPASS 6 11 C CLOCK INH 7 10 B VSS 8 9 A MARKING DIAGRAMS MAXIMUM RATINGS (Voltages Referenced to VSS) 16 Symbol Value Unit DC Supply Voltage Range VDD −0.5 to +18.0 V Input or Output Voltage Range (DC or Transient) Vin, Vout −0.5 to VDD + 0.5 V Iin, Iout ±10 mA Rating Input or Output Current (DC or Transient) per Pin 1 1 Power Dissipation per Package (Note 1) PD 500 mW Ambient Temperature Range TA −55 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Lead Temperature, (8−Second Soldering) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C from 65_C to 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. 14 536B ALYWG G 14536B AWLYWWG TSSOP−16 SOIC−16 WB MC14536B ALYWG 1 SOEIAJ−16 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. © Semiconductor Components Industries, LLC, 2014 November, 2014 − Rev. 14 1 Publication Order Number: MC14536B/D MC14536B CLOCK INH. 7 RESET SET 8 BYPASS 2 1 6 OSC. INHIBIT14 IN1 STAGES 9 THRU 24 Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q Q 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 STAGES 1 THRU 8 3 4 OUT1 5 OUT2 A9 B10 C11 D12 VDD = PIN 16 VSS = PIN 8 DECODER MONO-IN15 MONOSTABLE MULTIVIBRATOR Figure 1. Block Diagram FUNCTION TABLE Set Reset Clock Inh OSC Inh 0 0 0 0 No Change 0 0 0 0 Advance to next state X 1 0 0 0 0 1 1 X 0 1 0 0 0 1 0 X 0 0 1 0 − − No Change X 0 0 0 1 0 1 No Change 0 0 0 0 X 0 1 No Change 1 0 0 0 In1 Out 1 Out 2 Decode Out Advance to next state X = Don’t Care http://onsemi.com 2 13 DECODE OUT MC14536B ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) − 55_C 25_C 125_C Min Max Min Typ (Note 2) Max Min Max Unit “0” Level VOL 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc “1” Level VOH 5.0 10 15 4.95 9.95 14.95 − − − 4.95 9.95 14.95 5.0 10 15 − − − 4.95 9.95 14.95 − − − Vdc “0” Level VIL 5.0 10 15 − − − 1.5 3.0 4.0 − − − 2.25 4.50 6.75 1.5 3.0 4.0 − − − 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 − − − 3.5 7.0 11 2.75 5.50 8.25 − − − 3.5 7.0 11 − − − Source Pins 4 & 5 5.0 5.0 10 15 –1.2 –0.25 –0.62 –1.8 − − − − –1.0 –0.25 –0.5 –1.5 –1.7 –0.36 –0.9 –3.5 − − − − –0.7 –0.14 –0.35 –1.1 − − − − Source Pin 13 5.0 5.0 10 15 –3.0 –0.64 –1.6 –4.2 − − − − –2.4 –0.51 –1.3 –3.4 –4.2 –0.88 –2.25 –8.8 − − − − –1.7 –0.36 –0.9 –2.4 − − − − mAdc IOL 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 0.88 2.25 8.8 − − − 0.36 0.9 2.4 − − − mAdc Input Current Iin 15 − ±0.1 − ±0.00001 ±0.1 − ±1.0 mAdc Input Capacitance (Vin = 0) Cin − − − − 5.0 7.5 − − pF Quiescent Current (Per Package) IDD 5.0 10 15 − − − 5.0 10 20 − − − 0.010 0.020 0.030 5.0 10 20 − − − 150 300 600 mAdc IT 5.0 10 15 Symbol Characteristic Output Voltage Vin = VDD or 0 Vin = 0 or VDD Input Voltage (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) “1” Level (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) Vdc VIH (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) VDD Vdc Vdc IOH (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Total Supply Current (Note 3, 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) Sink mAdc IT = (1.50 mA/kHz) f + IDD IT = (2.30 mA/kHz) f + IDD IT = (3.55 mA/kHz) f + IDD mAdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.003. http://onsemi.com 3 MC14536B SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise and Fall Time (Pin 13) tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns tTLH, tTHL Propagation Delay Time Clock to Q1, 8−Bypass (Pin 6) High tPLH, tPHL = (1.7 ns/pF) CL + 1715 ns tPLH, tPHL = (0.66 ns/pF) CL + 617 ns tPLH, tPHL = (0.5 ns/pF) CL + 425 ns tPLH, tPHL 5.0 10 15 − − − 100 50 40 200 100 80 ns ns 5.0 10 15 − − − 3.8 1.5 1.1 7.6 3.0 2.3 5.0 10 15 − − − 7.0 3.0 2.2 14 6.0 4.5 5.0 10 15 − − − 1500 600 450 3000 1200 900 tWH 5.0 10 15 600 200 170 300 100 85 − − − ns fcl 5.0 10 15 − − − 1.2 3.0 5.0 0.4 1.5 2.0 MHz tTLH, tTHL 5.0 10 15 tWH 5.0 10 15 Reset to Qn tPHL = (1.7 ns/pF) CL + 1415 ns tPHL = (0.66 ns/pF) CL + 567 ns tPHL = (0.5 ns/pF) CL + 425 ns tPHL ms ms ns − No Limit 1000 400 300 500 200 150 − − − 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance. http://onsemi.com 4 Unit 3600 1300 1000 tPLH, tPHL Reset Pulse Width Max 1800 650 450 Clock to Q16 tPHL, tPLH = (1.7 ns/pF) CL + 6915 ns tPHL, tPLH = (0.66 ns/pF) CL + 2967 ns tPHL, tPLH = (0.5 ns/pF) CL + 2175 ns Clock Rise and Fall Time Typ (Note 6) − − − tPLH, tPHL Clock Pulse Frequency (50% Duty Cycle) Min 5.0 10 15 Clock to Q1, 8−Bypass (Pin 6) Low tPLH, tPHL = (1.7 ns/pF) CL + 3715 ns tPLH, tPHL = (0.66 ns/pF) CL + 1467 ns tPLH, tPHL = (0.5 ns/pF) CL + 1075 ns Clock Pulse Width VDD ns MC14536B PIN DESCRIPTIONS INPUTS OSC INHIBIT (Pin 14) − A high level on this pin stops the RC oscillator which allows for very low−power standby operation. May also be used, in conjunction with an external clock, with essentially the same results as the Clock Inhibit input. MONO−IN (Pin 15) − Used as the timing pin for the on−chip monostable multivibrator. If the Mono−In input is connected to VSS, the monostable circuit is disabled, and Decode Out is directly connected to the selected Q output. The monostable circuit is enabled if a resistor is connected between Mono−In and VDD. This resistor and the device’s internal capacitance will determine the minimum output pulse widths. With the addition of an external capacitor to VSS, the pulse width range may be extended. For reliable operation the resistor value should be limited to the range of 5 kW to 100 kW and the capacitor value should be limited to a maximum of 1000 pf. (See figures 4, 5, 6, and 11). A, B, C, D (Pins 9, 10, 11, 12) − These inputs select the flip−flop stage to be connected to Decode Out. (See the truth tables.) SET (Pin 1) − A high on Set asynchronously forces Decode Out to a high level. This is accomplished by setting an output conditioning latch to a high level while at the same time resetting the 24 flip−flop stages. After Set goes low (inactive), the occurrence of the first negative clock transition on IN1 causes Decode Out to go low. The counter’s flip−flop stages begin counting on the second negative clock transition of IN1. When Set is high, the on−chip RC oscillator is disabled. This allows for very low−power standby operation. RESET (Pin 2) − A high on Reset asynchronously forces Decode Out to a low level; all 24 flip−flop stages are also reset to a low level. Like the Set input, Reset disables the on−chip RC oscillator for standby operation. IN1 (Pin 3) − The device’s internal counters advance on the negative−going edge of this input. IN1 may be used as an external clock input or used in conjunction with OUT1 and OUT2 to form an RC oscillator. When an external clock is used, both OUT1 and OUT2 may be left unconnected or used to drive 1 LSTTL or several CMOS loads. 8−BYPASS (Pin 6) − A high on this input causes the first 8 flip−flop stages to be bypassed. This device essentially becomes a 16−stage counter with all 16 stages selectable. Selection is accomplished by the A, B, C, and D inputs. (See the truth tables.) CLOCK INHIBIT (Pin 7) − A high on this input disconnects the first counter stage from the clocking source. This holds the present count and inhibits further counting. However, the clocking source may continue to run. Therefore, when Clock Inhibit is brought low, no oscillator startup time is required. When Clock Inhibit is low, the counter will start counting on the occurrence of the first negative edge of the clocking source at IN1. OUTPUTS OUT1, OUT2 (Pin 4, 5) − Outputs used in conjunction with IN1 to form an RC oscillator. These outputs are buffered and may be used for 20 frequency division of an external clock. DECODE OUT (Pin 13) − Output function depends on configuration. When the monostable circuit is disabled, this output is a 50% duty cycle square wave during free run. TEST MODE The test mode configuration divides the 24 flip−flop stages into three 8−stage sections to facilitate a fast test sequence. The test mode is enabled when 8−Bypass, Set and Reset are at a high level. (See Figure 9.) TRUTH TABLES Input Input Stage Selected for Decode Out 8−Bypass D C B A Stage Selected for Decode Out 8−Bypass D C B A 0 0 0 0 0 9 1 0 0 0 0 1 0 0 0 0 1 10 1 0 0 0 1 2 0 0 0 1 0 11 1 0 0 1 0 3 0 0 0 1 1 12 1 0 0 1 1 4 0 0 1 0 0 13 1 0 1 0 0 5 0 0 1 0 1 14 1 0 1 0 1 6 0 0 1 1 0 15 1 0 1 1 0 7 0 0 1 1 1 16 1 0 1 1 1 8 0 1 0 0 0 17 1 1 0 0 0 9 0 1 0 0 1 18 1 1 0 0 1 10 0 1 0 1 0 19 1 1 0 1 0 11 0 1 0 1 1 20 1 1 0 1 1 12 0 1 1 0 0 21 1 1 1 0 0 13 0 1 1 0 1 22 1 1 1 0 1 14 0 1 1 1 0 23 1 1 1 1 0 15 0 1 1 1 1 24 1 1 1 1 1 16 http://onsemi.com 5 IN1 3 SET 1 4 OUT 1 OSC INHIBIT 14 OUT 2 http://onsemi.com 6 7 CLOCK INHIBIT 5 En R C S Q T 1 RESET 2 STAGES 2 THRU 7 8 15 MONO-IN A9 B10 C11 D12 T 9 6 8-BYPASS STAGES 10 THRU 15 16 DECODER OUT 13 DECODER STAGES 18 THRU 23 VSS = PIN 8 VDD = PIN 16 17 24 MC14536B LOGIC DIAGRAM MC14536B TYPICAL RC OSCILLATOR CHARACTERISTICS (For Circuit Diagram See Figure 12 In Application) 8.0 100 4.0 0 10 V -4.0 -8.0 5.0 V -12 RTC = 56 kW, C = 1000 pF -16 -55 -25 *Device Only. VDD = 10 V 50 f, OSCILLATOR FREQUENCY (kHz) FREQUENCY DEVIATION (%) VDD = 15 V RS = 0, f = 10.15 kHz @ VDD = 10 V, TA = 25°C RS = 120 kW, f = 7.8 kHz @ VDD = 10 V, TA = 25°C 0 25 50 75 TA, AMBIENT TEMPERATURE (°C)* 100 f AS A FUNCTION OF RTC (C = 1000 pF) (RS ≈ 2RTC) 20 10 5.0 2.0 1.0 0.5 f AS A FUNCTION OF C (RTC = 56 kW) (RS = 120 k) 0.2 0.1 1.0 k 125 10 k 100 k RTC, RESISTANCE (W) 0.001 0.01 C, CAPACITANCE (mF) 0.0001 Figure 2. RC Oscillator Stability 1.0 M 0.1 Figure 3. RC Oscillator Frequency as a Function of RTC and C MONOSTABLE CHARACTERISTICS (For Circuit Diagram See Figure 11 In Application) 100 10 t W, PULSE WIDTH ( μs) FORMULA FOR CALCULATING tW IN MICROSECONDS IS AS FOLLOWS: tW = 0.00247 • RX • (CX)0.85 WHERE R IS IN kW, CX IN pF. RX = 100 kW 50 kW 1.0 10 kW 5 kW 10 FORMULA FOR CALCULATING tW IN MICROSECONDS IS AS FOLLOWS: tW = 0.00247 • RX • (CX)0.85 WHERE R IS IN kW, CX IN pF. RX = 100 kW 50 kW 1.0 10 kW 5 kW TA = 25°C VDD = 5 V TA = 25°C VDD = 10 V 0.1 0.1 1.0 10 100 CX, EXTERNAL CAPACITANCE (pF) 1.0 1000 10 100 CX, EXTERNAL CAPACITANCE (pF) Figure 5. Typical CX versus Pulse Width @ VDD = 10 V Figure 4. Typical CX versus Pulse Width @ VDD = 5.0 V 100 t W, PULSE WIDTH ( μs) t W, PULSE WIDTH ( μs) 100 10 FORMULA FOR CALCULATING tW IN MICROSECONDS IS AS FOLLOWS: tW = 0.00247 • RX • (CX)0.85 WHERE R IS IN kW, CX IN pF. RX = 100 kW 50 kW 1.0 10 kW 5 kW TA = 25°C VDD = 15 V 0.1 1.0 10 100 CX, EXTERNAL CAPACITANCE (pF) Figure 6. Typical CX versus Pulse Width @ VDD = 15 V http://onsemi.com 7 1000 1000 MC14536B VDD 500 mF 0.01 mF CERAMIC ID SET RESET OUT 1 8-BYPASS IN1 C INH MONO-IN OUT 2 OSC INH PULSE GENERATOR A B C D CL VDD CL DECODE OUT CL VSS 20 ns 50% IN1 tWL SET OUT 1 RESET 8-BYPASS IN1 C INH MONO-IN OUT 2 OSC INH A B C DECODE OUT D PULSE GENERATOR 20 ns 20 ns 20 ns OUT tPLH tWH 90% 10% 50% tTLH tTHL CL VSS 90% 50% 10% 50% DUTY CYCLE Figure 7. Power Dissipation Test Circuit and Waveform Figure 8. Switching Time Test Circuit and Waveforms VDD FUNCTIONAL TEST SEQUENCE Test function (Figure 9) has been included for the reduction of test time required to exercise all 24 counter stages. This test function divides the counter into three 8−stage sections and 255 counts are loaded in each of the 8−stage sections in parallel. All flip−flops are now at a “1”. The counter is now returned to the normal 24−stages in series configuration. One more pulse is entered into In1 which will cause the counter to ripple from an all “1” state to an all “0” state. PULSE GENERATOR SET RESET OUT 1 8-BYPASS IN1 C INH MONO-IN OUT 2 OSC INH A B C D Figure 9. Functional Test Circuit DECODE OUT VSS FUNCTIONAL TEST SEQUENCE Inputs Outputs Comments All 24 stages are in Reset mode. In1 Set Reset 8−Bypass Decade Out Q1 thru Q24 1 0 1 1 0 1 1 1 1 0 Counter is in three 8 stage sections in parallel mode. 0 1 1 1 0 First “1” to “0” transition of clock. 1 0 − − − 1 1 1 0 1 1 1 1 The 255 “1” to “0” transition. 0 0 0 0 1 Counter converted back to 24 stages in series mode. Set and Reset must be connected together and simultaneously go from “1” to “0”. 1 0 0 0 1 In1 Switches to a “1”. 0 0 0 0 0 Counter Ripples from an all “1” state to an all “0” state. 255 “1” to “0” transitions are clocked in the counter. http://onsemi.com 8 tPHL MC14536B +V 16 6 8-BYPASS VDD 9 OUT 1 A 10 B 11 C 12 2 14 15 1 PULSE GEN. 7 3 PULSE GEN. 4 D RESET OUT 2 5 DECODE OUT 13 OSC INH MONO-IN SET CLOCK INH IN1 CLOCK VSS 8 IN1 SET CLOCK INH DECODE OUT POWERUP NOTE: When power is first applied to the device, DECODE OUT can be either at a high or low state. On the rising edge of a SET pulse the output goes high if initially at a low state. The output remains high if initially at a high state. Because CLOCK INH is held high, the clock source on the input pin has no effect on the output. Once CLOCK INH is taken low, the output goes low on the first negative clock transition. The output returns high depending on the 8−BYPASS, A, B, C, and D inputs, and the clock input period. A 2n frequency division (where n = the number of stages selected from the truth table) is obtainable at DECODE OUT. A 20–divided output of IN1 can be obtained at OUT1 and OUT2. Figure 10. Time Interval Configuration Using an External Clock, Set, and Clock Inhibit Functions (Divide−by−2 Configured) http://onsemi.com 9 MC14536B +V 6 RX 9 2 1 7 15 14 3 CLOCK OUT 1 A 10 B 11 C 12 PULSE GEN. 8-BYPASS 16 VDD 4 D OUT 2 5 DECODE OUT 13 RESET SET CLOCK INH MONO-IN OSC INH IN1 VSS CX 8 IN1 RESET *tw ≈ .00247 • RX • CX0.85 tw in msec RX in kW CX in pF DECODE OUT *tw POWERUP NOTE: When Power is first applied to the device with the RESET input going high, DECODE OUT initializes low. Bringing the RESET input low enables the chip’s internal counters. After RESET goes low, the 2n/2 negative transition of the clock input causes DECODE OUT to go high. Since the MONO−IN input is being used, the output becomes monostable. The pulse width of the output is dependent on the external timing components. The second and all subsequent pulses occur at 2n x (the clock period) intervals where n = the number of stages selected from the truth table. Figure 11. Time Interval Configuration Using an External Clock, Reset, and Output Monostable to Achieve a Pulse Output (Divide−by−4 Configured) http://onsemi.com 10 MC14536B +V RS 16 6 8-BYPASS VDD 9 OUT 1 A 10 B 11 C 12 PULSE GEN. 2 14 15 1 7 3 4 C RTC D OUT 2 RESET 5 OSC INH MONO-IN SET CLOCK INH IN1 VSS 8 DECODE OUT 13 RESET OUT 1 1 fosc ^ 2.3 Rtc C Rs ≥ Rtc F = Hz R = Ohms C = FARADS OUT 2 DECODE OUT POWERUP tw NOTE: This circuit is designed to use the on−chip oscillation function. The oscillator frequency is determined by the external R and C components. When power is first applied to the device, DECODE OUT initializes to a high state. Because this output is tied directly to the OSC INH input, the oscillator is disabled. This puts the device in a low−current standby condition. The rising edge of the RESET pulse will cause the output to go low. This in turn causes OSC INH to go low. However, while RESET is high, the oscillator is still disabled (i.e.: standby condition). After RESET goes low, the output remains low for 2n/2 of the oscillator’s period. After the part times out, the output again goes high. Figure 12. Time Interval Configuration Using On−Chip RC Oscillator and Reset Input to Initiate Time Interval (Divide−by−2 Configured) http://onsemi.com 11 MC14536B ORDERING INFORMATION Package Shipping† MC14536BDWG SOIC−16 WB (Pb−Free) 47 Units / Rail NLV14536BDWG* SOIC−16 WB (Pb−Free) 47 Units / Rail MC14536BDWR2G SOIC−16 WB (Pb−Free) 1000 / Tape & Reel NLV14536BDWR2G* SOIC−16 WB (Pb−Free) 1000 / Tape & Reel NLV14536BDTR2G* (In Development) TSSOP−16 (Pb−Free) 2500 / Tape & Reel MC14536BFELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 12 MC14536B PACKAGE DIMENSIONS SOIC−16 WB CASE 751G−03 ISSUE D A D 9 1 8 16X M T A h X 45 _ MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ S B S L A 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. B B 14X e A1 H E 0.25 8X M B M 16 q C T SEATING PLANE SOLDERING FOOTPRINT 16X 0.58 11.00 1 16X 1.27 PITCH 1.62 DIMENSIONS: MILLIMETERS http://onsemi.com 13 MC14536B PACKAGE DIMENSIONS TSSOP−16 CASE 948F ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 0.25 (0.010) 8 1 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC14536B PACKAGE DIMENSIONS SOEIAJ−16 CASE 966 ISSUE A 16 LE 9 Q1 M_ E HE 1 L 8 DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.031 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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