MCP1252/3 Low-Noise, Positive-Regulated Charge Pump Features: Description: • Inductorless, Buck/Boost, DC/DC Converter • Low Power: 80 µA (Typical) • High Output Voltage Accuracy: - ±2.5% (VOUT Fixed) • 120 mA Output Current • Wide Operating Temperature Range: - Industrial Temperature (I): -40°C to +85°C - Extended Temperature (E): -40°C to +125°C • Thermal Shutdown and Short-Circuit Protection • Uses Small Ceramic Capacitors • Switching Frequency: - MCP1252: 650 kHz - MCP1253: 1 MHz • Low-Power Shutdown Mode: 0.1 µA (Typical) • Shutdown Input Compatible with 1.8V Logic • VIN Range: 2.0V to 5.5V • Selectable Output Voltage (3.3V or 5.0V) or Adjustable Output Voltage • Space-Saving, 8-Lead MSOP • Soft-Start Circuitry to Minimize In-Rush Current • AEC-Q100 Qualified The MCP1252/3 are inductorless, positive-regulated charge pump DC/DC converters. The devices generate a regulated fixed (3.3V or 5.0V) or adjustable output voltage. They are specifically designed for applications requiring low noise and high efficiency and are able to deliver up to 120 mA output current. The devices allow the input voltage to be lower or higher than the output voltage, by automatically switching between buck/ boost operation. Applications: • • • • • • • White LED Backlighting Color Display Bias Local 3V-to-5V Conversions Flash Memory Supply Voltage SIM Interface Supply for GSM Phones Smart Card Readers PCMCIA Local 5V Supplies The MCP1252 has a switching frequency of 650 kHz, avoiding interference with sensitive IF bands. The MCP1253 has a switching frequency of 1 MHz and allows the use of smaller capacitors than the MCP1252, thus saving board space and cost. Both devices feature a power-good output that can be used to detect out-of-regulation conditions. Extremely low supply current and low external parts count (three capacitors) make these devices ideal for small, batterypowered applications. A shutdown mode is also provided for further power reduction. The MCP1252 and MCP1253 feature thermal and short-circuit protection and are offered in space-saving, 8-lead, MSOP packages. Package Types MSOP (Fixed) 8 SELECT MCP1252 7 SHDN 3 MCP1253 6 C+ 4 5 C- PGOOD 1 VOUT 2 VIN GND MSOP (Adjustable) 1 8 FB VOUT 2 MCP1252 7 SHDN VIN 3 MCP1253 6 C+ 4 5 C- PGOOD GND 2002-2014 Microchip Technology Inc. DS20001752C-page 1 MCP1252/3 Functional Block Diagram MCP1252-33X50 MCP1253-33X50 PGOOD 140 k SELECT + - 173 k 84 mV + 1.21V + 100 k + + VOUT 200 mV + SHDN C+ C- Switch Control VIN GND MCP1252-ADJ MCP1253-ADJ PGOOD FB + 84 mV + 1.21V + + + VOUT 200 mV + Switch Control SHDN C+ C- VIN GND DS20001752C-page 2 2002-2014 Microchip Technology Inc. MCP1252/3 1.0 ELECTRICAL CHARACTERISTICS †Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Power Supply Voltage, VIN ...............................................6.0V Voltage on Any Pin w.r.t. GND ............... -0.3V to (VIN + 0.3V) Output Short Circuit Duration ................................continuous Storage Temperature Range .........................-65°C to +150°C Ambient Temperature with Power Applied ....-55°C to +125°C Junction Temperature ................................................. +150°C ESD Ratings: Human Body Model (1.5 k in Series with 100 pF) 4 kV Machine Body Model (200 pF, No Series Resistance)400V ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40°C to +85°C ("I" Temperature), TA = -40°C to +125°C ("E" Temperature), SHDN = VIN, CIN = COUT = 10 µF, CFLY = 1 µF, IOUT = 10 mA. Typical values are for TA = +25°C. Parameters Sym. Min. Typ. Max. Units Conditions Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = VIN, VOUT = 3.3V VIN 2.1 — 5.5 V Output Voltage Accuracy VOUT -2.5 ±0.5 +2.5 % Output Current IOUT Supply Voltage SELECT Logic Input Voltage High VIH 2.3V VIN < 2.5V, IOUT 80 mA 2.5V VIN 5.5V, IOUT120 mA 80 100 — mA 2.3V VIN < 2.5V 120 150 — mA 2.5V VIN 5.5V 1.4 — — V MCP1252-33X50, MCP1253-33X50 Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = GND, VOUT = 5.0V VIN 2.7 — 5.5 V Output Voltage Accuracy VOUT -2.5 ±0.5 +2.5 % Output Current IOUT mA Supply Voltage SELECT Logic Input Voltage Low VIL 40 80 — 120 150 — — — 0.4 V V 2.7V VIN < 3.0V, IOUT 40 mA 3.0V VIN5.5V, IOUT120 mA 2.7V VIN < 3.0V 3.0V VIN 5.5V MCP1252-33X50, MCP1253-33X50 Adjustable Output - MCP1252-ADJ, MCP1253-ADJ VIN 2.0 — 5.5 VOUT 1.5 — 5.5 V VOUT(MAX) < 2 x VIN VFB 1.18 1.21 1.24 V MCP1252-ADJ, MCP1253-ADJ Supply Current IDD — 60 120 µA No load Output Short-Circuit Current ISC — 200 — mA VOUT = GND, foldback current ISHDN — 0.1 2.0 µA SHDN = 0V — 81 — % VIN = 3.0V, VOUT = 5V IOUT =120 mA — 68 — Supply Voltage Output Voltage Adjustment Range FB Regulation Voltage ALL DEVICES Shutdown Current Power Efficiency VIN = 3.6V, VOUT = 5V IOUT =120 mA SHDN Logic Input Voltage Low VIL — — 0.4 V SHDN Logic Input Voltage High VIH 1.4 — — V PGOOD_VOL — 0.01 — V PGOOD Threshold Voltage VTH — 0.93VOUT — V PGOOD Hysteresis VHYS — 0.04VOUT — V PGOOD Output Voltage 2002-2014 Microchip Technology Inc. IPGOOD = 0.5 mA DS20001752C-page 3 MCP1252/3 AC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40°C to +85°C ("I" Temperature), TA = -40°C to +125°C ("E" Temperature), SHDN = VIN, CIN = COUT = 10 µF, CFLY = 1 µF, IOUT = 10 mA. Typical values are for TA = +25°C. Parameters Sym. Min. Typ. Max. Units Internal Oscillator Frequency FOSC 520 650 780 kHz 800 1000 1200 Ripple Voltage VRIP — 50 — mVp-p — 45 — mVp-p MCP1253 µsec VIN = 3.6V, IOUT = 10 mA, SHDN = VIH(MIN), VOUT from 0 to 90% Nominal Regulated Output Voltage VOUT Wake-Up Time From Shutdown TWKUP Conditions MCP1252 MCP1253 MCP1252 — 200 — SELECT = VIN — 300 — SELECT = GND TEMPERATURE SPECIFICATIONS Parameters Symbol Min. TA -40 -40 Typ. Max. Units — +85 °C — +125 Conditions Temperature Ranges: Specified Temperature Range "I" Temperature range "E" Temperature range Maximum Operating Junction Temperature TJ — — +125 °C Storage Temperature Range TA -65 — +150 °C JA — 206 — °C/W Thermal Package Resistances: Thermal Resistance, 8 Pin MSOP DS20001752C-page 4 Single-Layer SEMI G42-88 board, Natural Convection 2002-2014 Microchip Technology Inc. MCP1252/3 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10 µF, CFLY = 1 µF, all capacitors X7R ceramic. 5.04 10 mA 5.03 5.02 80 mA 120 mA 5.01 MCP1252-33X50 SELECT = GND OUT V = 5.0V 5.00 Percent Efficiency (%) Output Voltage (V) 5.05 4.99 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 100 90 80 70 60 50 40 30 20 10 0 10 mA MCP1252-33X50 SELECT = GND VOUT = 5.0V 2.0 6.0 80 mA 120 mA 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-1: Output Voltage vs. Supply Voltage (MCP1252-33X50). FIGURE 2-4: Percent Efficiency vs. Supply Voltage (MCP1252-33X50). . Power Efficiency (%) Output Voltage (V) 3.34 80 mA 3.33 120 mA 3.32 10 mA MCP1252-33X50 SELECT = VIN VOUT = 3.3V 3.31 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 100 90 80 70 60 50 40 30 20 10 0 10 mA 80 mA 120 mA MCP1252-33X50 SELECT = VIN VOUT = 3.3V 2.0 6.0 2.5 3.0 Supply Voltage (V) FIGURE 2-2: Output Voltage vs. Supply Voltage (MCP1252-33X50). 10 mA 80 mA MCP1252-ADJ VOUT = 3.0V 2.99 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) FIGURE 2-3: Output Voltage vs. Supply Voltage (MCP1252-ADJ). 2002-2014 Microchip Technology Inc. Power Efficiency (%) Output Voltage (V) 3.01 120 mA 4.0 4.5 5.0 5.5 6.0 FIGURE 2-5: Power Efficiency vs. Supply Voltage (MCP1252-33X50). 3.02 3.00 3.5 Supply Voltage (V) 100 90 80 70 60 50 40 30 20 10 0 10 mA 80 mA 120 mA MCP1252-ADJ VOUT = 3.0V 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) FIGURE 2-6: Power Efficiency vs. Supply Voltage (MCP1252-ADJ). DS20001752C-page 5 MCP1252/3 Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10 mF, CFLY = 1 mF, all capacitors X7R ceramic. 80 Output Voltage (V) MCP1253-33X50 5.02 5.01 MCP1252-33X50 5.00 SELECT = GND VOUT = 5.0V IOUT = 120 mA 4.99 Supply Current (uA) 5.03 70 VIN = 3.6V 65 VIN = 2.7V 60 55 VIN = 2.3V 50 45 MCP1253-33X50 SELECT = GND VOUT = 5.0V, IOUT = 0 mA 40 4.98 -40 -25 -10 5 -40 -25 -10 20 35 50 65 80 95 110 125 Temperature (°C) FIGURE 2-7: Output Voltage vs. Temperature (MCP1252-33X50, MCP1253-33X50). 3.31 MCP1252-33X50 3.30 SELECT = VIN VOUT = 3.3V IOUT = 120 mA 3.29 Supply Current (uA) 3.32 20 35 50 65 80 95 110 125 FIGURE 2-10: Quiescent Current vs. Temperature (MCP1253-33X50). 80 MCP1253-33X50 5 Temperature (°C) 3.33 Output Voltage (V) VIN = 5.5V 75 75 70 VIN = 5.5V VIN = 3.6V 65 60 VIN = 2.7V 55 50 MCP1252-33X50 SELECT = GND VOUT = 5.0V, IOUT = 0 mA VIN = 2.3V 45 40 3.28 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature (°C) Temperature (°C) FIGURE 2-8: Output Voltage vs. Temperature (MCP1252-33X50, MCP1253-33X50). FIGURE 2-11: Quiescent Current vs. Temperature (MCP1252-33X50). FIGURE 2-9: FIGURE 2-12: DS20001752C-page 6 Line Transient Response. Load Transient Response. 2002-2014 Microchip Technology Inc. MCP1252/3 Output Voltage Ripple (mV) Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10mF, CFLY = 1mF, all capacitors X7R ceramic. 70 60 50 40 30 80 mA 10 mA 120 mA 20 MCP1252-33X50 SELECT = GND VOUT = 5.0V 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) FIGURE 2-16: Time. Output Voltage Ripple vs. FIGURE 2-14: Output Voltage Ripple vs. Supply Voltage (MCP1252-33X50). FIGURE 2-17: Time. Output Voltage Ripple vs. FIGURE 2-15: FIGURE 2-18: Start-Up (MCP1253-33X50). FIGURE 2-13: Output Voltage Ripple vs. Supply Voltage (MCP1252-33X50). Output Voltage Ripple (mV) 70 60 50 40 30 120 mA 80 mA 10 mA MCP1252-33X50 SELECT = VIN VOUT = 3.3V 20 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) Start-Up (MCP1252-33X50). 2002-2014 Microchip Technology Inc. DS20001752C-page 7 MCP1252/3 3.0 PIN FUNCTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. Name 1 PGOOD 2 VOUT 3 VIN 4 GND 5 C- Open-Drain Power GOOD Output Regulated Output Voltage Power Supply Input Ground Terminal Flying Capacitor Negative Terminal 6 C+ Flying Capacitor Positive Terminal 7 SHDN Shutdown Mode, Active-Low Input 8 SELECT FB 3.1 Function Output Voltage Select Pin (MCP1252-33X50, MCP1253-33X50) Feedback Input Pin for Adjustable Output (MCP1252-ADJ, MCP1253-ADJ) Open-Drain Power Good Output (PGOOD) 3.6 Flying Capacitor Positive Terminal (C+) PGOOD is a high-impedance when the output voltage is in regulation. A logic-low is asserted when the output falls 7% (typical) below the nominal value. The PGOOD output remains low until VOUT is within 3% (typical) of its nominal value. On start-up, this pin indicates when the output voltage reaches its final value. PGOOD is high-impedance when SHDN is low. The charge pump capacitor (flying capacitor) is used to transfer charge from the input supply to the regulated output. 3.2 Bypass to GND with a filter capacitor. A logic-low signal applied to SHDN disables the device. A logic-high signal applied to this pin allows normal operation. 3.3 3.8 Regulated Output Voltage (VOUT) Power Supply Input (VIN) It is recommended that VIN be tied to a ceramic bypass capacitor. 3.4 Ground (GND) It is recommended that the ground pin be tied to a ground plane for best performance. 3.5 Flying Capacitor Negative Terminal (C-) The charge pump capacitor (flying capacitor) is used to transfer charge from the input supply to the regulated output. Proper orientation is imperative when using a polarized capacitor. 3.7 Shutdown Input (SHDN) Select (SELECT) Input or Feedback (FB) Input MCP1252-33X50, MCP1253-33X50: SELECT: Select Input Pin. Connect SELECT to VIN for 3.3V fixed output. Connect SELECT to GND for a 5.0V fixed output. MCP1252-ADJ, MCP1253-ADJ: FB: Feedback Pin. A resistor divider connected to this pin determines the adjustable VOUT value (1.5V to 5.5V). It is recommended that a low ESR (equivalent series resistance) capacitor be used. DS20001752C-page 8 2002-2014 Microchip Technology Inc. MCP1252/3 4.0 DEVICE OVERVIEW 4.1 Theory of Operation The MCP1252 and MCP1253 family of devices employ a switched capacitor charge pump to buck or boost an input supply voltage (VIN) to a regulated output voltage. Referring to the Functional Block Diagram and Figure 4-1, the devices perform conversion and regulation in three phases. When the devices are not in shutdown mode and a steady-state condition has been reached, the three phases are continuously cycled through. The first phase transfers charge from the input to the flying capacitor (CFLY) connected to pins C+ and C-. This phase always occurs for half of the internal oscillator period. During this phase, switches S1 and S2 are closed. START PHASE 1: Charge Transfer From VIN to CFLY No Yes PHASE 2: Idle State Once the first phase is complete, all switches are opened and the second phase (idle phase) is entered. The device compares the internal or external feedback voltage with an internal reference. If the feedback voltage is below the regulation point, the device transitions to the third phase. The devices automatically transition between buck or boost operation. This provides a low-cost, compact and simple solution for step-down/step-up DC/DC conversion. This is especially true for battery-operated applications that require a fixed output above or below the input. 2002-2014 Microchip Technology Inc. Yes VFB > VREF No The third phase transfers energy from the flying capacitor to the output capacitor connected to VOUT and the load. If regulation is maintained, the device returns to the idle phase. If the charge transfer occurs for half the internal oscillator period, more charge is needed in the flying capacitor and the device transitions back to the first phase. The regulation control is hysteretic, otherwise referred to as a bang-bang control. The output is regulated around a fixed reference with some hysteresis. As a result, typically 50 mV of peak-to-peak ripple will be observed at the output independent of load current. The frequency of the output ripple, however, will be influenced heavily by the load current and output capacitance. The maximum frequency that will be observed is equal to the internal oscillator frequency. 1 t 1 = ---------------2F OSC PHASE 3: Charge Transfer From CFLY to COUT 1 t 3 = ---------------2F OSC Yes No No VFB > VREF Yes FIGURE 4-1: Flow Algorithm. DS20001752C-page 9 MCP1252/3 4.2 Power Efficiency 4.6 Thermal Shutdown The power efficiency, , is determined by the mode of operation. In boost mode, the efficiency is approximately half of a linear regulator. In buck mode, the efficiency is approximately equal to that of a linear regulator. The following formulas can be used to approximate the power efficiency with any significant amount of output current. At light loads, the quiescent current of the device must be taken into consideration. The MCP1252 and MCP1253 feature thermal shutdown with temperature hysteresis. When the die temperature exceeds 160°C, typically, the device shuts down. When the die cools by 15°C, typically, the device automatically turns back on. If high die temperature is caused by output overload and the load is not removed, the device will turn on and off, resulting in a pulse output. EQUATION 4-1: 5.0 BOOST P OUT V OUT I OUT V OUT = ------------- = ------------------------------------ = -----------------PIN VIN 2 I OUT V IN 2 V OUT IOUT V OUT P OUT BUCK = ------------= -------------------------------- = ------------PIN V IN I OUT VIN APPLICATIONS The MCP1252 and MCP1253 are inductorless, positive-regulated, charge pump DC/DC converters. A typical circuit configuration for the fixed output version is depicted in Figure 5-1. The adjustable version is depicted in Figure 5-2. SELECTABLE OUTPUT VOLTAGE MCP1252-33X50 6 4.3 CFLY Shutdown Mode Driving SHDN low places the MCP1252 or MCP1253 in a low-power shutdown mode. This disables the charge pump switches, oscillator and control logic, reducing the quiescent current to 0.1 µA (typical). The PGOOD output is in a high-impedance state during shutdown. 5 2.7V to 5.5V C+ PGOOD Output The PGOOD output is an open-drain output that sinks current when the regulator output voltage falls below 0.93VOUT (typical). The output voltage can either be fixed when the selectable output device is chosen (MCP1252-33X50, MCP1253-33X50) or adjustable from an external resistive divider when the adjustable device is chosen (MCP1252-ADJ, MCP1253-ADJ). If the regulator output voltage falls below 0.93VOUT (typical) for less than 200 µsec and then recovers, glitch-immunity circuits prevent the PGOOD signal from transitioning low. A 10 k to 1 M pull-up resistor from PGOOD to VOUT may be used to provide a logic output. Connect PGOOD to GND or leave unconnected if not used. 4.5 Soft-Start and Short-Circuit Protection The MCP1252 and MCP1253 feature foldback shortcircuit protection. This circuitry provides an internal soft-start function by limiting in-rush current during startup and also limits the output current to 200 mA (typical) if the output is shorted to GND. The internal soft-start circuitry requires approximately 300 µsec, typical with a 5V output, from either initial power-up or release from shutdown for the output voltage to be in regulation. DS20001752C-page 10 + C- RPU 3 V IN + PGOOD CIN 7 SELECT SHDN ON 4.4 +5.0V ±2.5% VOUT 2 1 8 GND 4 OFF Shutdown Control COUT PGOOD Flag To PIC® Microcontroller CFLY = 1 µF CIN = 10 µF COUT = 10 µF RPU = 100 k FIGURE 5-1: Typical Circuit Configuration for Fixed Output Device. ADJUSTABLE OUTPUT VOLTAGE MCP1252-ADJ 6 CFLY 5 2.7V to 5.5V + 7 OFF Shutdown Control VOUT 2 +4.0V RPU C- 3 V IN CIN ON C+ + COUT R1 PGOOD 1 SHDN GND 4 FB 8 VOUT = 1.21V (1 + R1/R2) PGOOD Flag To PIC® Microcontroller R2 CFLY = 1 µF CIN = 10 µF COUT = 10 µF RPU = 100 k R1 = 23.2 k R2 = 10 k FIGURE 5-2: Typical Circuit Configuration for Adjustable Output Device. 2002-2014 Microchip Technology Inc. MCP1252/3 5.1 Capacitor Selection The style and value of capacitors used with the MCP1252 and MCP1253 family of devices determine several important parameters such as output voltage ripple and charge pump strength. To minimize noise and ripple, it is recommended that low ESR (0.1 ) capacitors be used for both CIN and COUT. These capacitors should be either ceramic or tantalum and should be 10 µF or higher. Aluminum capacitors are not recommended because of their high ESR. If the source impedance to VIN is very low, up to several megahertz, CIN may not be required. Alternatively, a somewhat smaller value of CIN may be substituted for the recommended 10 µF, but will not be as effective in preventing ripple on the VIN pin. The value of COUT controls the amount of output voltage ripple present on VOUT. Increasing the size of COUT will reduce output ripple at the expense of a slower turn-on time from shutdown and a higher in-rush current. The flying capacitor (CFLY) controls the strength of the charge pump. In order to achieve the maximum rated output current (120 mA), it is necessary to have at least 1 µF of capacitance for the flying capacitor. A smaller flying capacitor delivers less charge per clock cycle to the output capacitor, resulting in lower output ripple. The output ripple is reduced at the expense of maximum output current and efficiency. 5.2 Output Voltage Setting The MCP1252-33X50 and MCP1253-33X50 feedback controllers select between an internally-set, regulated output voltage (3.3V or 5.0V). Connect SELECT to GND for a regulated 5.0V output and connect SELECT to VIN for a regulated 3.3V output. The MCP1252-ADJ and MCP1253-ADJ utilize an external resistor divider that allows the output voltage to be adjusted between 1.5V and 5.5V. For an adjustable output, connect a resistor between VOUT and FB (R1) and another resistor between FB and GND (R2). In the following equation, choose R2 to be less than or equal to 30 k and calculate R1 from the following formula: Note that the tolerance of the external resistors will have an effect on the accuracy of the output voltage. For optimum results, it is recommended that the external resistors have a tolerance no larger than 1%. 5.3 Recommended Layout The MCP1252 and MCP1253 family of devices transfer charge at high switching frequencies, producing fast, high peak, transient currents. As a result, any stray inductance in the component layout will produce unwanted noise in the system. Proper board layout techniques are required to ensure optimum performance. Figure 5-3 depicts the recommended board layout. The input capacitor connected between VIN and GND, and the output capacitor connected between VOUT and GND, are 10 µF ceramic, X7R dielectric, in 1206 packages. The flying capacitor connected between C+ and C- is a 1 µF ceramic, X7R dielectric in a 0805 package. The layout is scaled 3:1. PGOOD VOUT SELECT SHDN C+ GND C- VIN FIGURE 5-3: Recommended Printed Circuit Board Layout. EQUATION 5-1: R 1 = R 2 V OUT V FB – 1 and: EQUATION 5-2: V OUT = V FB 1 + R 1 R 2 where: VOUT is the desired output voltage from 1.5V to 5.5V VFB is the internal regulation voltage, nominally 1.21V 2002-2014 Microchip Technology Inc. DS20001752C-page 11 MCP1252/3 6.0 TYPICAL APPLICATION CIRCUITS Single Cell Lithium-Ion Battery To 5V Converter 1 µF 5 6 C3 Single Li-Ion Cell + 10 µF - 7 100 k 1 C+ VIN VOUT SHDN SELECT PGOOD GND 2 8 5V 10 µF 4 MCP1252-33X50 White LED Bias 1 µF 5 6 C- C+ UP TO 6 WHITE LEDS 3 Single Li-Ion Cell + 10 µF - 7 100 k 1 VIN VOUT SHDN SELECT PGOOD GND 2 8 10 µF 59 4 59 59 59 59 59 MCP1252-ADJ PWM Contrast Control Alternative White LED Bias 1 µF 5 C- 6 C+ UP TO 6 WHITE LEDS 3 Single Li-Ion Cell + 10 µF - 7 100 k 1 VIN SHDN VOUT SELECT 2 8 10 µF 24k 10k PGOOD GND 4 10 10 10 10 10 10 MCP1252-ADJ PWM Contrast Control DS20001752C-page 12 2002-2014 Microchip Technology Inc. MCP1252/3 7.0 PACKAGING INFORMATION 7.1 Package Marking 8-Lead MSOP (Fixed) Example: 1252SX 412256 8-Lead MSOP (Adjustable) Example: 1253DJ 1253EX 412256 412256 OR Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator (e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2002-2014 Microchip Technology Inc. DS20001752C-page 13 MCP1252/3 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001752C-page 14 2002-2014 Microchip Technology Inc. MCP1252/3 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2002-2014 Microchip Technology Inc. DS20001752C-page 15 MCP1252/3 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001752C-page 16 2002-2014 Microchip Technology Inc. MCP1252/3 APPENDIX A: REVISION HISTORY Revision C (July 2014) The following is the list of modifications: 1. Added the Extended Temperature (E) option and related information throughout the document. Revision B (January 2013) The following is the list of modifications: 1. Added a note to each package outline drawing. 2002-2014 Microchip Technology Inc. DS20001752C-page 17 MCP1252/3 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device -XXX Tape and Reel Option X Temperature Voltage Option Range /XX Package Examples: a) b) MCP1252: Low-Noise, Positive-Regulated Charge Pump MCP1252T: Low-Noise, Positive-Regulated Charge Pump (Tape and Reel) MCP1253: Low-Noise, Positive-Regulated Charge Pump MCP1253T: Low-Noise, Positive-Regulated Charge Pump (Tape and Reel) Tape and Reel Option: T ADJ = Adjustable Voltage 33X50 = Selectable Voltage Temperature Range: I E = -40C to +85C = -40C to +125C Package: MS = DS20001752C-page 18 a) b) = Tape and Reel(1) Output Voltage: c) c) (Industrial) (Extended) (MCP1253 only) Plastic Micro Small Outline (MSOP), 8-lead MCP1252-33X50I/MS: Low-Noise, Positive-Regulated Charge Pump, Fixed Output MCP1252-ADJI/MS: Low-Noise, PositiveRegulated Charge Pump, Adjustable Output MCP1252T-33X50I/MS: Tape and Reel, Low-Noise, Positive-Regulated Charge Pump, Fixed Output MCP1253-33X50I/MS: Low-Noise, Positive-Regulated Charge Pump, Fixed Output MCP1253-ADJI/MS: Low-Noise, Positive-Regulated Charge Pump, Adjustable Output MCP1253T-ADJI/MS: Tape and Reel, Low-Noise, Positive-Regulated Charge Pump, Adjustable Output Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2002-2014 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-373-0 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2002-2014 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS20001752C-page 19 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 DS20001752C-page 20 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Germany - Pforzheim Tel: 49-7231-424750 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Italy - Venice Tel: 39-049-7625286 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Poland - Warsaw Tel: 48-22-3325737 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 03/25/14 2002-2014 Microchip Technology Inc.