NCP1653, NCP1653A Compact, Fixed-Frequency, Continuous Conduction Mode PFC Controller The NCP1653 is a controller designed for Continuous Conduction Mode (CCM) Power Factor Correction (PFC) boost circuits. It operates in the follower boost or constant output voltage in 67 or 100 kHz fixed switching frequency. Follower boost offers the benefits of reduction of output voltage and hence reduction in the size and cost of the inductor and power switch. Housed in a DIP−8 or SO−8 package, the circuit minimizes the number of external components and drastically simplifies the CCM PFC implementation. It also integrates high safety protection features. The NCP1653 is a driver for robust and compact PFC stages. Features • • • • • • • • • • • • • • IEC1000−3−2 Compliant Continuous Conduction Mode Average Current−Mode or Peak Current−Mode Operation Constant Output Voltage or Follower Boost Operation Very Few External Components Fixed Switching Frequency: 67 kHz = NCP1653A, Fixed Switching Frequency: 100 kHz = NCP1653 Soft−Start Capability VCC Undervoltage Lockout with Hysteresis (8.7 / 13.25 V) Overvoltage Protection (107% of Nominal Output Level) Undervoltage Protection or Shutdown (8% of Nominal Output Level) Programmable Overcurrent Protection Programmable Overpower Limitation Thermal Shutdown with Hysteresis (120 / 150_C) This is a Pb−Free Device Typical Applications • • • • MARKING DIAGRAMS 8 8 NCP1653 AWL YYWWG 8 1 PDIP−8 P SUFFIX CASE 626 1 8 8 1 SO−8 D SUFFIX CASE 751 NCP1653A AWL YYWWG 1 8 N1653 ALYW G 1 1653A ALYW G 1 A suffix A WL, L YY, Y WW, W G or G = 67 kHz option = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package PIN CONNECTIONS FB 1 8 VCC Vcontrol 2 7 Drv In 3 TV & Monitors PC Desktop SMPS AC Adapters SMPS White Goods AC Input www.onsemi.com 6 GND CS 4 5 VM (Top View) ORDERING INFORMATION EMI Filter Output See detailed ordering and shipping information on page 19 of this data sheet. 15 V FB VCC Vcontrol Drv In Gnd CS VM NCP1653 Figure 1. Typical Application Circuit © Semiconductor Components Industries, LLC, 2015 May, 2015 − Rev. 10 1 Publication Order Number: NCP1653/D NCP1653, NCP1653A Iin EMI Filter AC Input L Vin Output Voltage (Vout) IL Cbulk Cfilter RCS RFB on IL off IFB Vcontrol 1 FB / SD Vreg Current Mirror 2 300 k 9V 96% I ref 13.25 V / 8.7 V VCC VCC Overvoltage Protection (IFB > 107% Iref) UVLO + 18 V Vcontrol R1 R1 = constant Shutdown / UVP (IFB < 8% Iref) 4% Iref Hysteresis & Current Mirror Overpower Limitation (IS Ivac > 3 nA2) Reference Block Turn on VM VM = 5 Thermal Shutdown (120 / 150 °C) Vref + Cramp Gnd 6 0 1 − 12 k In 3 RMISIvac 2 Icontrol PFC Modulation OR Vramp R S 67 or 100 kHz clock Figure 2. Functional Block Diagram www.onsemi.com 2 Cvac CS Current Mirror VCC + Ivac x Overcurrent Protection (IS > 200 mA) RM Ich Rvac 9V Internal Bias 9V CM Ccontrol 0 Icontrol = VCC IM 9V 1 1 Regulation Block − 8 I ref I FB 0 4 IS RS 9V Drv 7 Q Output Driver NCP1653, NCP1653A PIN FUNCTION DESCRIPTION Pin Symbol Name Function 1 FB / SD Feedback / Shutdown This pin receives a feedback current IFB which is proportional to the PFC circuit output voltage. The current is for output regulation, output overvoltage protection (OVP), and output undervoltage protection (UVP). When IFB goes above 107% Iref, OVP is activated and the Drive Output is disabled. When IFB goes below 8% Iref, the device enters a low−consumption shutdown mode. 2 Vcontrol Control Voltage / Soft−Start The voltage of this pin Vcontrol directly controls the input impedance and hence the power factor of the circuit. This pin is connected to an external capacitor Ccontrol to limit the Vcontrol bandwidth typically below 20 Hz to achieve near unity power factor. The device provides no output when Vcontrol = 0 V. Hence, Ccontrol also works as a soft−start capacitor. 3 In Input Voltage Sense This pin sinks an input−voltage current Ivac which is proportional to the RMS input voltage Vac. The current Ivac is for overpower limitation (OPL) and PFC duty cycle modulation. When the product (IS⋅Ivac) goes above 3 nA2, OPL is activated and the Drive Output duty ratio is reduced by pulling down Vcontrol indirectly to reduce the input power. 4 CS Input Current Sense This pin sources a current IS which is proportional to the inductor current IL. The sense current IS is for overcurrent protection (OCP), overpower limitation (OPL) and PFC duty cycle modulation. When IS goes above 200 mA, OCP is activated and the Drive Output is disabled. 5 VM Multiplier Voltage This pin provides a voltage VM for the PFC duty cycle modulation. The input impedance of the PFC circuit is proportional to the resistor RM externally connected to this pin. The device operates in average current−mode if an external capacitor CM is connected to the pin. Otherwise, it operates in peak current−mode. 6 GND The IC Ground 7 Drv Drive Output 8 VCC Supply Voltage − This pin provides an output to an external MOSFET. This pin is the positive supply of the device. The operating range is between 8.75 V and 18 V with UVLO start threshold 13.25 V. MAXIMUM RATINGS Symbol Value Unit FB, Vcontrol, In, CS, VM Pins (Pins 1−5) Maximum Voltage Range Maximum Current Rating Vmax Imax −0.3 to +9 100 V mA Drive Output (Pin 7) Maximum Voltage Range Maximum Current Range (Note 3) Vmax Imax −0.3 to +18 1.5 V A Power Supply Voltage (Pin 8) Maximum Voltage Range Maximum Current Vmax Imax −0.3 to +18 100 V mA 25 V PD RqJA 800 100 mW °C/W PD RqJA 450 178 mW °C/W Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Transient Power Supply Voltage, Duration < 10 ms, IVCC < 20 mA Power Dissipation and Thermal Characteristics P suffix, Plastic Package, Case 626 Maximum Power Dissipation @ TA = 70°C Thermal Resistance Junction−to−Air D suffix, Plastic Package, Case 751 Maximum Power Dissipation @ TA = 70°C Thermal Resistance Junction−to−Air Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Pins 1−8: Human Body Model 2000 V per JEDEC Standard JESD22, Method A114. Machine Model Method 190 V per JEDEC Standard JES222, Method A115A. 2. This device contains Latchup protection and exceeds ±100 mA per JEDEC Standard JESD78. 3. Guaranteed by design. www.onsemi.com 3 NCP1653, NCP1653A ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C. For min/max values, TJ = −40°C to +125°C, VCC = 15 V, IFB = 100 mA, Ivac = 30 mA, IS = 0 mA, unless otherwise specified) Characteristics Pin Symbol Min Typ Max Unit 7 fSW 90 60.3 102 67 110 73.7 kHz 7 Dmax 94 − − % ROH ROL 5.0 2.0 9.0 6.6 20 18 W W OSCILLATOR Switching Frequency NCP1653 NCP1653A Maximum Duty Cycle (VM = 0 V) (Note 3) GATE DRIVE Gate Drive Resistor Output High and Draw 100 mA out of Drv pin (Isource = 100 mA) Output Low and Insert 100 mA into Drv pin (Isink = 100 mA) 7 Gate Drive Rise Time from 1.5 V to 13.5 V (Drv = 2.2 nF to Gnd) 7 tr − 88 − ns Gate Drive Fall Time from 13.5 V to 1.5 V (Drv = 2.2 nF to Gnd) 7 tf − 61.5 − ns FEEDBACK / OVERVOLTAGE PROTECTION / UNDERVOLTAGE PROTECTION Reference Current (VM = 3 V) 1 Iref 192 204 208 mA Regulation Block Ratio 1 IregL/Iref 95 96 98 % Vcontrol Pin Internal Resistor 2 Rcontrol − 300 − kW Maximum Control Voltage (IFB = 100 mA) 2 Vcontrol(max) − 2.4 − V Maximum Control Current (Icontrol(max) = Iref / 2) 2 Icontrol(max) − 100 − mA Feedback Pin Voltage (IFB = 100 mA) Feedback Pin Voltage (IFB = 200 mA) 1 VFB1 1.0 1.3 1.5 1.8 1.9 2.2 V V Overvoltage Protection OVP Ratio Current Threshold Propagation Delay 1 IOVP/Iref IOVP tOVP 104 − − 107 214 500 − 230 − % mA ns Undervoltage Protection (VM = 3 V) UVP Activate Threshold Ratio UVP Deactivate Threshold Ratio UVP Lockout Hysteresis Propagation Delay 1 IUVP(on)/Iref IUVP(off)/Iref IUVP(H) tUVP 4.0 7.0 4.0 − 8.0 12 8.0 500 15 20 − − % % mA ns CURRENT SENSE Current Sense Pin Offset Voltage (IS = 100 mA) 4 VS 0 10 30 mV Overcurrent Protection Threshold (VM = 1 V) 4 IS(OCP) 185 200 215 mA OVERPOWER LIMITATION Input Voltage Sense Pin Internal Resistor 4 Rvac(int) − 12 − kW 3−4 IS × Ivac − 3.0 − nA2 4 IS(OPL1) IS(OPL2) 80 24 100 32 140 48 mA mA PWM Comparator Reference Voltage 5 Vref 2.25 2.62 2.75 V Multiplier Current (Vcontrol = Vcontrol(max), Ivac = 30 mA, IS = 25 mA) Multiplier Current (Vcontrol = Vcontrol(max), Ivac = 30 mA, IS = 75 mA) Multiplier Current (Vcontrol = Vcontrol(max) / 10, Ivac = 30 mA, IS = 25 mA) Multiplier Current (Vcontrol = Vcontrol(max) / 10, Ivac = 30 mA, IS = 75 mA) 5 IM1 IM2 IM3 IM4 1.0 3.2 10 30 2.85 9.5 35 103.5 5.8 18 58 180 mA mA mA mA Thermal Shutdown Threshold (Note 4) − TSD 150 − − °C Thermal Shutdown Hysteresis − − − 30 − °C Over Power Limitation Threshold Sense Current Threshold (Ivac = 30 mA, VM = 3 V) Sense Current Threshold (Ivac = 100 mA, VM = 3 V) CURRENT MODULATION THERMAL SHUTDOWN 4. Guaranteed by design. www.onsemi.com 4 NCP1653, NCP1653A ELECTRICAL CHARACTERISTICS (For typical values TJ = 25°C. For min/max values, TJ = −40°C to +125°C, VCC = 15 V, IFB = 100 mA, Ivac = 30 mA, IS = 0 mA, unless otherwise specified) Characteristics Pin Symbol Min Typ Max Unit VCC(on) VCC(off) VCC(H) 12.25 8.0 4.0 13.25 8.7 4.55 14.5 9.5 − V V V Istup Istup1 Istup2 Istup3 ICC1 ICC2 Istdn − − − − − − − 18 0.95 21 21 3.7 4.7 33 50 1.5 50 50 5.0 6.0 50 mA mA mA mA mA mA mA SUPPLY SECTION Supply Voltage UVLO Startup Threshold Minimum Operating Voltage after Startup UVLO Hysteresis 8 Supply Current: Startup (VCC = VCC(on) − 0.2 V) Startup (VCC < 8.0 V, IFB = 200 mA) Startup (8.0 V < VCC < VCC(on) − 0.2 V, IFB = 200 mA) Startup (VCC < VCC(on) − 0.2 V, IFB = 0 mA) (Note 5) Operating (VCC = 15 V, Drv = open, VM = 3 V) Operating (VCC = 15 V, Drv = 1 nF to Gnd, VM = 1 V) Shutdown (VCC = 15 V and IFB = 0 A) 8 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Please refer to the “Biasing the Controller” Section in the Functional Description. www.onsemi.com 5 NCP1653, NCP1653A TYPICAL CHARACTERISTICS 100 NCP1653 Dmax, MAXIMUM DUTY CYCLE (%) fSW, SWITCHING FREQUENCY (kHz) 110 105 100 95 90 85 80 75 NCP1653A 70 65 60 −50 −25 0 25 50 75 100 99 98 97 96 95 94 93 VM = 0 V 92 91 90 −50 125 −25 TJ, JUNCTION TEMPERATURE (°C) 50 75 100 125 Figure 4. Maximum Duty Cycle vs. Temperature 14 205 12 Iref, REFERENCE CURRENT (mA) ROH & ROL, GATE DRIVE RESISTANCE (W) 25 TJ, JUNCTION TEMPERATURE (°C) Figure 3. Switching Frequency vs. Temperature ROH 10 8 ROL 6 4 2 0 −50 0 −25 0 25 50 75 100 125 204 203 202 201 200 199 198 197 196 195 −50 TJ, JUNCTION TEMPERATURE (°C) −25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) Figure 5. Gate Drive Resistance vs. Temperature Figure 6. Reference Current vs. Temperature www.onsemi.com 6 NCP1653, NCP1653A TYPICAL CHARACTERISTICS 100 TJ = 25°C 2.5 REGULATION BLOCK RATIO (%) Vcontrol, CONTROL VOLTAGE (V) 3 TJ = 125°C 2 TJ = −40°C 1.5 1 0.5 0 100 120 140 160 180 200 220 98 97 96 95 94 93 92 91 90 −50 0 −25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) Figure 7. Regulation Block Figure 8. Regulation Block Ratio vs. Temperature 125 2.5 FEEDBACK PIN VOLTAGE (V) 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2.0 −50 0 −25 25 50 75 100 2 1.5 IFB = 100 mA 1 0.5 0 −50 125 IFB = 200 mA −25 Figure 9. Maximum Control Voltage vs. Temperature OVERVOLTAGE PROTECTION RATIO (%) TJ = −40°C 1.5 TJ = 25°C 1 TJ = 125°C 0.5 0 0 50 100 150 200 25 50 75 100 125 Figure 10. Feedback Pin Voltage vs. Temperature 2.5 2 0 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) FEEDBACK PIN VOLTAGE (V) 25 IFB, FEEDBACK CURRENT (mA) 3.0 MAXIMUM CONTROL VOLTAGE (V) 99 250 120 118 116 114 112 110 108 106 104 102 100 −50 IFB, FEEDBACK PIN CURRENT (mA) −25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) Figure 11. Feedback Pin Voltage vs. Feedback Current Figure 12. Overvoltage Protection Ratio vs. Temperature www.onsemi.com 7 125 NCP1653, NCP1653A 16 UNDERVOLTAGE PROTECTION THRESHOLD RATIO (%) 230 225 220 215 210 205 200 −50 0 −25 25 50 75 100 14 12 8 6 IUVP(on)/Iref 4 2 25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) Figure 13. Overvoltage Protection Threshold vs. Temperature Figure 14. Undervoltage Protection Thresholds vs. Temperature 210 90 208 80 70 60 50 40 30 TJ = −40 °C 20 TJ = 125 °C TJ = 25 °C 10 0 100 50 150 200 204 202 200 198 196 194 192 190 −50 250 0 −25 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) Figure 15. Current Sense Pin Voltage vs. Sense Current Figure 16. Overcurrent Protection Threshold vs. Temperature 4 7 3.5 Vvac, IN PIN VOLTAGE (V) Ivac = 100 mA 3 Ivac = 30 mA 2.5 2 1.5 1 0.5 0 −50 125 206 IS, SENSE CURRENT (mA) OVERPOWER LIMITATION THRESHOLD (nA2) 0 −25 TJ, JUNCTION TEMPERATURE (°C) 100 0 IUVP(off)/Iref 10 0 −50 125 OVERCURRENT PROTECTION THRESHOLD (mA) CURRENT SENSE PIN VOLTAGE (mV) OVERVOLTAGE PROTECTION THRESHOLD (mA) TYPICAL CHARACTERISTICS −25 0 25 50 75 100 6 5 4 TJ = 25 °C 3 TJ = 125 °C 2 1 0 125 TJ = −40 °C TJ, JUNCTION TEMPERATURE (°C) 0 50 100 150 Ivac, INPUT−VOLTAGE CURRENT (mA) Figure 17. Overpower Limitation Threshold vs. Temperature Figure 18. In Pin Voltage vs. Input−Voltage Current www.onsemi.com 8 200 NCP1653, NCP1653A 3 MAXIMUM CONTROL CURRENT (mA) 200 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2 −50 −25 0 25 50 75 100 125 IS = 25 mA 180 160 140 IS = 75 mA 120 100 80 60 40 Ivac = 30 mA Vcontrol = Vcontrol(max) IS Ivac 20 Icontrol = 0 −50 2IM 0 −25 derived from the (eq.8) 25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 19. PWM Comparator Reference Voltage vs. Temperature Figure 20. Maximum Control Current vs. Temperature 20 125 SUPPLY VOLTAGE UNDERVOLTAGE LOCKOUT THRESHOLDS (V) 20 18 16 14 12 IS = 75 mA 10 IS = 25 mA 8 Ivac = 30 mA Vcontrol = 10 % Vcontrol(max) 6 4 IS Ivac Icontrol = 2 0 −50 2IM 0 −25 derived from the (eq.8) 25 50 75 100 125 18 16 VCC(on) 14 12 10 8 VCC(off) 6 4 2 0 −50 0 −25 25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 21. 10% of Maximum Control Current vs. Temperature Figure 22. Supply Voltage Undervoltage Lockout Thresholds vs. Temperature 80 OPERATING SUPPLY CURRENT (mA) SUPPLY CURRENT IN STARTUP AND SHUTDOWN MODE (mA) 10% OF MAXIMUM CONTROL CURRENT (mA) PWM COMPARATOR REF. VOLTAGE (V) TYPICAL CHARACTERISTICS 70 60 50 40 Istdn 30 20 Istup 10 0 −50 −25 0 25 50 75 100 125 6 5 ICC2, 1 nF Load 4 ICC1, No Load 3 2 1 0 −50 TJ, JUNCTION TEMPERATURE (°C) VCC = 15 V −25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (°C) Figure 23. Supply Current in Startup and Shutdown Mode vs. Temperature Figure 24. Operating Supply Current vs. Temperature www.onsemi.com 9 125 125 NCP1653, NCP1653A FUNCTIONAL DESCRIPTION Introduction 5. Thermal Shutdown (TSD) is activated and the Drive Output (Pin 7) is disabled when the junction temperature exceeds 150_C. The operation resumes when the junction temperature falls down by typical 30_C. The NCP1653 is a Power Factor Correction (PFC) boost controller designed to operate in fixed−frequency Continuous Conduction Mode (CCM). It can operate in either peak current−mode or average current−mode. Fixed−frequency operation eases the compliance with EMI standards and the limitation of the possible radiated noise that may pollute surrounding systems. The CCM operation reduces the application di/dt and the resulting interference. The NCP1653 is designed in a compact 8−pin package which offers the minimum number of external components. It simplifies the design and reduces the cost. The output stage of the NCP1653 incorporates ±1.5 A current capability for direct driving of the MOSFET in high−power applications. The NCP1653 is implemented in constant output voltage or follower boost modes. The follower boost mode permits one to significantly reduce the size of the PFC circuit inductor and power MOSFET. With this technique, the output voltage is not set at a constant level but depends on the RMS input voltage or load demand. It allows lower output voltage and hence the inductor and power MOSFET size or cost are reduced. Hence, NCP1653 is an ideal candidate in high−power applications where cost−effectiveness, reliability and high power factor are the key parameters. The NCP1653 incorporates all the necessary features to build a compact and rugged PFC stage. CCM PFC Boost A CCM PFC boost converter is shown in Figure 25. The input voltage is a rectified 50 or 60 Hz sinusoidal signal. The MOSFET is switching at a high frequency (typically 102 kHz in the NCP1653) so that the inductor current IL basically consists of high and low−frequency components. Filter capacitor Cfilter is an essential and very small value capacitor in order to eliminate the high−frequency component of the inductor current IL. This filter capacitor cannot be too bulky because it can pollute the power factor by distorting the rectified sinusoidal input voltage. Iin IL L Vout Vin Cfilter Cbulk Figure 25. CCM PFC Boost Converter PFC Methodology The NCP1653 uses a proprietary PFC methodology particularly designed for CCM operation. The PFC methodology is described in this section. The NCP1653 provides the following protection features: 1. Overvoltage Protection (OVP) is activated and the Drive Output (Pin 7) goes low when the output voltage exceeds 107% of the nominal regulation level which is a user−defined value. The circuit automatically resumes operation when the output voltage becomes lower than the 107%. 2. Undervoltage Protection (UVP) is activated and the device is shut down when the output voltage goes below 8% of the nominal regulation level. The circuit automatically starts operation when the output voltage goes above 12% of the nominal regulation level. This feature also provides output open−loop protection, and an external shutdown feature. 3. Overpower Limitation (OPL) is activated and the Drive Output (Pin 7) duty ratio is reduced by pulling down an internal signal when a computed input power exceeds a permissible level. OPL is automatically deactivated when this computed input power becomes lower than the permissible level. 4. Overcurrent Protection (OCP) is activated and the Drive Output (Pin 7) goes low when the inductor current exceeds a user−defined value. The operation resumes when the inductor current becomes lower than this value. IL Iin t1 t2 time T Figure 26. Inductor Current in CCM As shown in Figure 26, the inductor current IL in a switching period T includes a charging phase for duration t1 and a discharging phase for duration t2. The voltage conversion ratio is obtained in (eq.1). t ) t2 Vout T + 1 + t2 T * t1 Vin Vin + www.onsemi.com 10 T * t1 Vout T (eq.1) NCP1653, NCP1653A The input filter capacitor Cfilter and the front−ended EMI filter absorbs the high−frequency component of inductor current IL. It makes the input current Iin a low−frequency signal only of the inductor current. Iin + IL−50 t1 CrampVref T * t1 VM + Vref * + Vref Cramp T T From (eq.3) and (eq.6), the input impedance Zin is re−formulated in (eq.7). (eq.2) Zin + The suffix 50 means it is with a 50 or 60 Hz bandwidth of the original IL. From (eq.1) and (eq.2), the input impedance Zin is formulated. T * t1 Vout V Zin + in + Iin T IL−50 VM + Cramp 0 1 Vref (eq.3) PFC Modulation − R + Vramp VM Vout Vref IL−50 (eq.7) Because Vref and Vout are roughly constant versus time, the multiplier voltage VM is designed to be proportional to the IL−50 in order to have a constant Zin for PFC purpose. It is illustrated in Figure 28. Power factor is corrected when the input impedance Zin in (eq.3) is constant or slowly varying in the 50 or 60 Hz bandwidth. Ich (eq.6) V in I in Q time IL time S VM clock time Vref Figure 28. Multiplier Voltage Timing Diagram It can be seen in the timing diagram in Figure 27 that VM originally consists of a switching frequency ripple coming from the inductor current IL. The duty ratio can be inaccurately generated due to this ripple. This modulation is the so−called “peak current−mode”. Hence, an external capacitor CM connected to the multiplier voltage VM pin (Pin 5) is essential to bypass the high−frequency component of VM. The modulation becomes the so−called “average current−mode” with a better accuracy for PFC. Vramp VM VM without filtering Clock Latch Set Latch Reset VM Output 5 IM Inductor Current Figure 27. PFC Duty Modulation and Timing Diagram CM The PFC duty modulation and timing diagram is shown in Figure 27. The MOSFET on time t1 is generated by the intersection of reference voltage Vref and ramp voltage Vramp. A relationship in (eq.4) is obtained. I t Vramp + VM ) ch 1 + Vref Cramp Cramp Vref T RM Ivac IS 2Icontrol PFC Duty Modulation RM Figure 29. External Connection on the Multiplier Voltage Pin (eq.4) The multiplier voltage VM is generated according to (eq.8). The charging current Ich is specially designed as in (eq.5). The multiplier voltage VM is therefore expressed in terms of t1 in (eq.6). Ich + VM = RM Ivac IS VM + 2 Icontrol (eq.8) Input−voltage current Ivac is proportional to the RMS input voltage Vac as described in (eq.9). The suffix ac (eq.5) www.onsemi.com 11 NCP1653, NCP1653A over the bandwidth of 50 or 60 Hz and power factor is corrected. Practically, the differential−mode inductance in the front−ended EMI filter improves the filtering performance of capacitor Cfilter. Therefore, the multiplier capacitor CM is generally with a larger value comparing to the filter capacitor Cfilter. Input and output power (Pin and Pout) are derived in (eq.13) when the circuit efficiency η is obtained or assumed. The variable Vac stands for the RMS input voltage. stands for the RMS. Ivac is a constant in the 50 or 60 Hz bandwidth. Multiplier resistor RM is the external resistor connected to the multiplier voltage VM pin (Pin 5). It is also constant. RM directly limits the maximum input power capability and hence its value affects the NCP1653 to operate in either “follower boost mode” or “ constant output voltage mode”. Ivac + ǒ Ǹ2 V * 4 V ac V [ ac Ǔ RȀ Rvac ) 12 kW vac (eq.9) Sense current IS is proportional to the inductor current IL as described in (eq.10). IL consists of the high−frequency component (which depends on di/dt or inductor L) and low−frequency component (which is IL−50). R IS + CS IL RS 2 RS RȀvac Icontrol Vref Vac V 2 Pin + ac + Zin RM RCS Vout T (eq.10) Control current Icontrol is a roughly constant current that comes from the PFC output voltage Vout that is a slowly varying signal. The bandwidth of Icontrol can be additionally limited by inserting an external capacitor Ccontrol to the control voltage Vcontrol pin (Pin 2) in Figure 30. It is recommended to limit fcontrol, that is the bandwidth of Vcontrol (or Icontrol), below 20 Hz typically to achieve power factor correction purpose. Typical value of Ccontrol is between 0.1 mF and 0.33 mF. Pout + hPin + h I control = 96% I ref I ref IFB Regulation Block Vcontrol (eq.13a) 2 RS RȀvac Icontrol Vref Vac RM RCS Vout Icontrol Vac T Vout (eq.13b) Follower Boost The NCP1653 operates in follower boost mode when Icontrol is constant. If Icontrol is constant based on (eq.13), for a constant load or power demand the output voltage Vout of the converter is proportional to the RMS input voltage Vac. It means the output voltage Vout becomes lower when the RMS input voltage Vac becomes lower. On the other hand, the output voltage Vout becomes lower when the load or power demand becomes higher. It is illustrated in Figure 31. Vreg 300 k Icontrol Vac Vout Vcontrol R1 2 V out (Traditional boost) Ccontrol V out (Follower boost) Figure 30. Vcontrol Low−Pass Filtering 1 Ccontrol u 2 p 300 kW fcontrol V in (eq.11) From (eq.7)−(eq.10), the input impedance Zin is re−formulated in (eq.12). Zin + Zin + time RM RCS Vac Vout IL 2 RS RȀvac Icontrol Vref IL−50 RM RCS Vac Vout whenIL + IL−50 2 RS RȀvac Icontrol Vref P out time (eq.12) Figure 31. Follower Boost Characteristics The multiplier capacitor CM is the one to filter the high−frequency component of the multiplier voltage VM. The high−frequency component is basically coming from the inductor current IL. On the other hand, the filter capacitor Cfilter similarly removes the high−frequency component of inductor current IL. If the capacitors CM and Cfilter match with each other in terms of filtering capability, IL becomes IL−50. Input impedance Zin is roughly constant Follower Boost Benefits The follower boost circuit offers an opportunity to reduce the output voltage Vout whenever the RMS input voltage Vac is lower or the power demand Pout is higher. Because of the step−up characteristics of boost converter, the output voltage Vout will always be higher than the input voltage Vin even though Vout is reduced in follower boost operation. www.onsemi.com 12 NCP1653, NCP1653A As a result, the on time t1 is reduced. Reduction of on time makes the loss of the inductor and power MOSFET smaller. Hence, it allows cheaper cost in the inductor and power MOSFET or allows the circuit components to operate at a lower stress condition in most of the time. depending on different values of Vac and Pout. The follower boost operating area is illustrated in Figure 33. Vout 96% Iref RFB Pout(min) 1 Output Feedback The output voltage Vout of the PFC circuit is sensed as a feedback current IFB flowing into the FB pin (Pin 1) of the device. Since the FB pin voltage VFB1 is much smaller than Vout, it is usually neglected. V * VFB1 V IFB + out [ out RFB RFB Vac(min) When IFB is between 96% and 100% of Iref (i.e., 96% RFB × Iref < Vout < RFB × Iref), the NCP1653 operates in constant output voltage mode which is similar to the follower boost mode characteristic but with narrow output voltage range. The regulation block output Vreg decreases linearly with IFB in the range from 96% of Iref to Iref. It gives a linear function of Icontrol in (eq.16). Icontrol + Vout + IFB Figure 32. Regulation Block Region (1): IFB < 96% × Iref ǒ Vac RM RCS Pout 0.04 2 RS RȀvac Vref Icontrol(max) h Vout Iref RFB When IFB is less than 96% of Iref (i.e., Vout < 96% RFB × Iref), the NCP1653 operates in follower boost mode. The regulation block output Vreg is at its maximum value. Icontrol becomes its maximum value (i.e., Icontrol = Icontrol(max) = Iref/2 = 100 mA) which is a constant. (eq.13) becomes (eq.15). (eq.16) Vac FB Iref )R Ǔ (eq.17) Pout(min) 1 Pout(max) 2 96% Iref RFB 1. Pout increases, Vout decreases 2. Vac decreases, Vout decreases V ac(min) 2 RS RȀvac Icontrol(max) Vref Vac Vac Pout Ǔ According to (eq.17), output voltage Vout becomes RFB × Iref when power is low (Pout ≈ 0). It is the maximum value of Vout in this operating region. Hence, it can be concluded that output voltage increases when power decreases. It is similar to the follower boost characteristic in (eq.15). On the other hand in (eq.17), output voltage Vout becomes RFB × Iref when RMS input voltage Vac is very high. It is the maximum value of Vout in this operating region. Hence, it can also be concluded that output voltage increases when RMS input voltage increases. It is similar to another follower boost characteristic in (eq.15). This characteristic is illustrated in Figure 34. Icontrol(max) T ǒ Icontrol(max) Vout 1* 0.04 RFB Iref Resolving (eq.16) and (eq.13), Icontrol RM RCS Pout Vac Region (2): 96% × Iref < IFB < Iref Feedback current IFB which represents the output voltage Vout is processed in a function with a reference current (Iref = 200 mA typical) as shown in regulation block function in Figure 32. The output of the voltage regulation block, low−pass filter on Vcontrol pin and the Icontrol = Vcontrol / R1 block is in Figure 30 is control current Icontrol. And the input is feedback current IFB. It means that Icontrol is the output of IFB and it can be described as in Figure 32. There are three linear regions including: (1) IFB < 96% × Iref, (2) 96% × Iref <IFB < Iref, and (3) IFB > Iref. They are discussed separately as follows: Vout + h Vac(max) Figure 33. Follower Boost Region (eq.14) Output Voltage Regulation Iref 1. Pout increases, Vout decreases 2. Vac decreases, Vout decreases V in where RFB is the feedback resistor across the FB pin (Pin 1) and the output voltage referring to Figure 2. Then, the feedback current IFB represents the output voltage Vout and will be used in the output voltage regulation, undervoltage protection (UVP), and overvoltage protection (OVP). 96% Iref 2 Pout(max) Vac(max) Vac Figure 34. Constant Output Voltage Region (eq.15) Region (3): IFB > Iref When IFB is greater than Iref (i.e., Vout > RFB × Iref), the NCP1653 provides no output or zero duty ratio. The regulation block output Vreg becomes 0 V. Icontrol also becomes zero. The multiplier voltage VM in (eq.8) The output voltage Vout is regulated at a particular level with a particular value of RMS input voltage Vac and output power Pout. However, this output level is not constant and www.onsemi.com 13 NCP1653, NCP1653A becomes its maximum value and generates zero on time t1. Then, Vout decreases and the minimum can be Vout = Vin in a boost converter. Going down to Vin, Vout automatically enters the previous two regions (i.e., follower boost region or constant output voltage region) and hence output voltage Vout cannot reach input voltage Vin as long as the NCP1653 provides a duty ratio for the operation of the boost converter. In conclusion, the NCP1653 circuit operates in one of the following conditions: Constant output voltage mode: The output voltage is regulated around the range between 96% and 100% of RFB × Iref. The output voltage is described in (eq.16). Its behavior is similar to a follower boost. Follower boost mode: The output voltage is regulated under 96% of RFB × Iref and Icontrol = Icontrol(max) = Iref/2 = 100 mA. The output voltage is described in (eq.15). to enable the NCP1653 to operate. Hence, UVP happens when the output voltage is abnormally undervoltage, the FB pin (Pin 1) is opened, or the FB pin (Pin 1) is manually pulled low. Soft−Start The device provides no output (or no duty ratio) when the Vcontrol (Pin 2) voltage is zero (i.e., Vcontrol = 0 V). An external capacitor Ccontrol connected to the Vcontrol pin provides a gradually increment of the Vcontrol voltage (or the duty ratio) in the startup and hence provides a soft−start feature. Current Sense The device senses the inductor current IL by the current sense scheme in Figure 36. The device maintains the voltage at the CS pin (Pin 4) to be zero voltage (i.e., VS ≈ 0 V) so that (eq.10) can be formulated. Overvoltage Protection (OVP) IL When the feedback current IFB is higher than 107% of the reference current Iref (i.e., Vout > 107% RFB × Iref ), the Drive Output (Pin 7) of the device goes low for protection. The circuit automatically resumes operation when the feedback current becomes lower than 107% of the reference current Iref. The maximum OVP threshold is limited to 230 mA which corresponds to 230 mA × 1.92 MW + 2.5 V = 444.1 V when RFB = 1.92 MW (680 kW + 680 kW + 560 kW) and VFB1 = 2.5 V (for the worst case referring to Figure 11). Hence, it is generally recommended to use 450 V rating output capacitor to allow some design margin. RS IS RCS IL CS + NCP1653 VS − Gnd Figure 36. Current Sensing This scheme has the advantage of the minimum number of components for current sensing and the inrush current limitation by the resistor RCS. Hence, the sense current IS represents the inductor current IL and will be used in the PFC duty modulation to generate the multiplier voltage VM, Overpower Limitation (OPL), and overcurrent protection. Undervoltage Protection (UVP) ICC Overcurrent Protection (OCP) ICC2 Shutdown Overcurrent protection is reached when IS is larger than IS(OCP) (200 mA typical). The offset voltage of the CS pin is typical 10 mV and it is neglected in the calculation. Hence, the maximum OCP inductor current threshold IL(OCP) is obtained in (eq.15). Operating Istdn 8% I ref 12% I ref I IL(OCP) + FB RSIS(OCP) R + S RCS RCS 200 mA (eq.18) When overcurrent protection threshold is reached, the Drive Output (Pin 7) of the device goes low. The device automatically resumes operation when the inductor current goes below the threshold. Figure 35. Undervoltage Protection When the feedback current IFB is less than 8% of the reference current Iref (i.e., the output voltage Vout is less than 8% of its nominal value), the device is shut down and consumes less than 50 mA. The device automatically starts operation when the output voltage goes above 12% of the nominal regulation level. In normal situation of boost converter configuration, the output voltage Vout is always greater than the input voltage Vin and the feedback current IFB is always greater than 8% and 12% of the nominal level Input Voltage Sense The device senses the RMS input voltage Vac by the sensing scheme in Figure 37. The internal current mirror is with a typical 4 V offset voltage at its input so that the current Ivac can be derived in (eq.9). An external capacitor Cvac is to maintain the In pin (Pin 3) voltage in the www.onsemi.com 14 NCP1653, NCP1653A limited. The OPL is automatically deactivated when the product (IS × Ivac) becomes lower than the 3 nA2 level. This 3 nA2 level corresponds to the approximated input power (IL × Vac) to be smaller than the particular expression in (eq.20). calculation to always be the peak of the sinusoidal voltage due to very little current consumption (i.e., Vin = √2 Vac and Ivac ≈ 0). This Ivac current represents the RMS input voltage Vac and will be used in overpower limitation (OPL) and the PFC duty modulation. V in IS Ivac t 3 nA2 Current Mirror Rvac 12 k In Ivac ǒIL @ RRCS Ǔ S Ǔ Ǹ2 Vac @ t 3 nA2 Rvac ) 12 kW R Rvac ) 12 kW IL @ Vac t S 3 nA2 Ǹ2 RCS 4V 3 Cvac ǒ Biasing the Controller 9V It is recommended to add a typical 1 nF to 100 nF decoupling capacitor next to the VCC pin for proper operation. When the NCP1653 operates in follower boost mode, the PFC output voltage is not always regulated at a particular level under all application range of input voltage and load power. It is not recommended to make a low−voltage bias supply voltage by adding an auxiliary winding on the PFC boost inductor. Alternatively, it is recommended to get the VCC biasing supply from the second−stage power conversion stage as shown in Figure 39. Figure 37. Input Voltage Sensing There is an internal 9 V ESD Zener Diode on the pin. Hence, the value of Rvac is recommended to be at least 938 kW for possibly up to 400 V instantaneous input voltage. 12 kW Rvac u 9 V*4 V 400 V * 9 V (eq.19) Rvac u 938 kW Vbulk Overpower Limitation (OPL) Sense current IS represents the inductor current IL and hence represents the input current approximately. Input−voltage current Ivac represents the RMS input voltage Vac and hence represents the input voltage. Their product (IS × Ivac) represents an approximated input power (IL × Vac). AC EMI Input Filter Vcc V reg 300 k 96% I ref I ref I FB 0 (eq.20) NCP1653 2 Output Voltage Second−stage Power Converter Vcontrol 1 Figure 39. Recommended Biasing Scheme in Follower Boost Mode Regulation Block When the NCP1653 operates in constant output voltage mode, it is possible to make a low−voltage bias supply by adding an auxiliary winding on the PFC boost inductor in Figure 40. In PFC boost circuit, the input is the rectified AC voltage and it is non−constant versus time that makes the auxiliary winding voltage also non−constant. Hence, the configuration in Figure 40 charges the voltages in capacitors C1 and C2 to n×(Vout − Vin) and n×Vin and n is the turn ratio. As a result, the stack of the voltages is n×Vout that is constant and can be used as a biasing voltage. Overpower Limitation Figure 38. Overpower Limitation Reduces Vcontrol When the product (IS × Ivac) is greater than a permissible level 3 nA2, the output Vreg of the regulation block is pulled to 0 V. It makes Vcontrol to be 0 V indirectly and VM is pulled to be its maximum. It generates the minimum duty ratio or no duty ratio eventually so that the input power is www.onsemi.com 15 NCP1653, NCP1653A Vout Vin C2 VCC Undervoltage Lockout (UVLO) The device typically starts to operate when the supply voltage VCC exceeds 13.25 V. It turns off when the supply voltage VCC goes below 8.7 V. An 18 V internal ESD Zener Diode is connected to the VCC pin (Pin 8) to prevent excessive supply voltage. After startup, the operating range is between 8.7 V and 18 V. C1 Thermal Shutdown VCC An internal thermal circuitry disables the circuit gate drive and then keeps the power switch off when the junction temperature exceeds 150_C. The output stage is then enabled once the temperature drops below typically 120_C (i.e., 30_C hysteresis). The thermal shutdown is provided to prevent possible device failures that could result from an accidental overheating. Figure 40. Self−biasing Scheme in Constant Output Voltage Mode When the NCP1653 circuit is required to be startup independently from the second−stage converter, it is recommended to use a circuit in Figure 41. When there is no feedback current (IFB = 0 mA) applied to FB pin (Pin 1), the NCP1653 VCC startup current is as low (50 mA maximum). It is good for saving the current to charge the VCC capacitor. However, when there is some feedback current the startup current rises to as high as 1.5 mA in the VCC < 4 V region. That is why the circuit of Figure 41 can be implemented: a PNP bipolar transistor derives the feedback current to ground at low VCC levels (VCC < 4 V) so that the startup current keeps low and an initial voltage can be quickly built up in the VCC capacitor. The values in Figure 41 are just for reference. Input Output Drive The output stage of the device is designed for direct drive of power MOSFET. It is capable of up to ±1.5 A peak drive current and has a typical rise and fall time of 88 and 61.5 ns with a 2.2 nF load. Output 180k 180k 180k 1.5M 100uF NCP1653 560k BC556 Figure 41. Recommended Startup Biasing Scheme www.onsemi.com 16 NCP1653, NCP1653A Application Schematic 680 k Fuse Input 90 Vac to 265 Vac KBU6K 150 mH 600 mH 560 k CSD04060 100 nF 680 nF 1 mF 680 k 100 mF 450 V Output 390 V 4.7 M SPP20N60S 33 nF 2 x 3.9 mH 470 k 0.1 NCP1653 2.85 k 330 nF 15 V 4.5 1 nF 1 nF 56 k 330 pF 10 k Figure 42. 300 W 100 kHz Power Factor Correction Circuit Table 1. Total Harmonic Distortion and Efficiency Input Voltage (V) Input Power (W) Output Voltage (V) Output Current (A) Power Factor Total Harmonic Distortion (%) Efficiency (%) 110 331.3 370.0 0.83 0.998 4 93 110 296.7 373.4 0.74 0.998 4 93 110 157.3 381.8 0.38 0.995 7 92 110 109.8 383.5 0.26 0.993 9 91 110 80.7 384.4 0.19 0.990 10 91 110 67.4 385.0 0.16 0.988 10 91 220 311.4 385.4 0.77 0.989 9 95 220 215.7 386.2 0.53 0.985 8 95 220 157.3 386.4 0.38 0.978 9 93 220 110.0 386.7 0.27 0.960 11 95 220 80.2 386.5 0.19 0.933 14 92 220 66.9 386.6 0.16 0.920 15 92 www.onsemi.com 17 NCP1653, NCP1653A APPENDIX I – SUMMARY OF EQUATIONS IN NCP1653 BOOST PFC Description Boost Converter Follower Boost Mode Constant Output Voltage Mode Same as Follower Boost Mode t ) t2 Vout T + 1 + t2 T * t1 Vin ³ Vout * Vin + t t1 t + 1 1 ) t2 T Vout Input Current Averaged by Filter Capacitor Iin + IL * 50 Same as Follower Boost Mode Nominal Output Voltage (IFB = 200 mA) Vout(nom) + IFBRFB ) VFB1 [ IFBRFB + 200 mA @ RFB Same as Follower Boost Mode Feedback Pin Voltage VFB1 Please refer to Figure 11. Same as Follower Boost Mode Output Voltage Vin t Vout t 192 mA @ RFB 192 mA @ RFB t Vout t 200 mA @ RFB Inductor Current Peak−Peak Ripple DIL(pk * pk) t 2 @ IL * 50 Same as Follower Boost Mode Control Current I Icontrol + Icontrol(max) + ref + 100 mA 2 Icontrol + ǒ Ǔ Icontrol(max) Vout 1* 0.04 RFBIref and Icontrol t Icontrol(max) + 100 mA Switching Frequency f + 67 or 100 kHz Same as Follower Boost Mode Minimum Inductor for CCM V * Vin Vin 1 L u L(CRM) + out Vout DIL(pk * pk) f Same as Follower Boost Mode Input Impedance R R V V Zin + M CS ac out RSRȀvacIrefVref Input Power Output Power Maximum Input Power when Icontrol = 100 mA Current Limit Power Limit Pin + Zin + RS RȀvac Iref Vref Vac Vout RM RCS Pout + hPin + Pin + hRS RȀvac Iref Vref Vac Vout RM RCS Pin(max) + Pin + RS RȀvac Iref Vref Vac Vout RM RCS RM RCS Vac Vout 2RS RȀvac Icontrol Vref 2RSRȀvacVref IcontrolVac RMRCS Vout Pout + h2 RS RȀvac Vref Icontrol Vac RM RCS Circuit will enter follower boost region when maximum power is reached. IL(OCP) + RS @ 200 mA RCS Same as Follower Boost Mode IL @ VAC t RS Rvac ) 12 kW @ 3 nA2 Ǹ2 RCS Same as Follower Boost Mode Output Overvoltage Vout(OVP) + 107% @ Vout(nom) [ 214 mA @ RFB Same as Follower Boost Mode Output Undervoltage Vout(UVP * on) + 8% @ Vout(nom) [ 16 mA @ RFB Vout(UVP * off) + 12% @ Vout(nom) [ 24 mA @ RFB Same as Follower Boost Mode Input Voltage Sense Pin Resistor Rvac PWM Comparator Reference Voltage Rvac u 938 kW and RȀvac + Rvac ) 12 kW Ǹ2 Same as Follower Boost Mode Same as Follower Boost Mode Vref + 2.62 V www.onsemi.com 18 Vout NCP1653, NCP1653A ORDERING INFORMATION Package Shipping† Switching Frequency NCP1653PG PDIP−8 (Pb−Free) 50 Units / Rail 100 kHz NCP1653DR2G SO−8 (Pb−Free) 2500 Units / Tape & Reel NCP1653APG PDIP−8 (Pb−Free) 50 Units / Rail NCP1653ADR2G SO−8 (Pb−Free) 2500 Units / Tape & Reel Device 67 kHz †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 19 NCP1653, NCP1653A PACKAGE DIMENSIONS PDIP−8 P SUFFIX CASE 626−05 ISSUE N D A E H 8 5 E1 1 4 NOTE 8 b2 c B END VIEW TOP VIEW WITH LEADS CONSTRAINED NOTE 5 A2 A e/2 NOTE 3 L SEATING PLANE A1 C D1 e 8X SIDE VIEW b 0.010 M eB END VIEW M C A M B M NOTE 6 www.onsemi.com 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY. 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). DIM A A1 A2 b b2 C D D1 E E1 e eB L M INCHES MIN MAX −−−− 0.210 0.015 −−−− 0.115 0.195 0.014 0.022 0.060 TYP 0.008 0.014 0.355 0.400 0.005 −−−− 0.300 0.325 0.240 0.280 0.100 BSC −−−− 0.430 0.115 0.150 −−−− 10 ° MILLIMETERS MIN MAX −−− 5.33 0.38 −−− 2.92 4.95 0.35 0.56 1.52 TYP 0.20 0.36 9.02 10.16 0.13 −−− 7.62 8.26 6.10 7.11 2.54 BSC −−− 10.92 2.92 3.81 −−− 10 ° NCP1653, NCP1653A PACKAGE DIMENSIONS SO−8 D SUFFIX CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 _ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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