MURA115T3 D

MURA115T3G,
MURA120T3G,
SURA8120T3G
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
•
•
•
•
•
•
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ULTRAFAST RECTIFIERS
1 AMPERE, 100−200 VOLTS
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.71 V Max @ 1.0 A, TJ = 150°C)
SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
U4x
AYWW G
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
U4x = Device Code
x = C for MURA115T3
= D for MURA120T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection:
♦
♦
Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
ORDERING INFORMATION
Package
Shipping†
MURA115T3G
SMA
(Pb−Free)
5,000/Tape & Reel
MURA120T3G
SMA
(Pb−Free)
5,000/Tape & Reel
SURA8120T3G
SMA
(Pb−Free)
5,000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
January, 2013 − Rev. 8
1
Publication Order Number:
MURA115T3/D
MURA115T3G, MURA120T3G, SURA8120T3G
MAXIMUM RATINGS
Rating
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA115T3G
MURA120T3G/SURA8120T3G
VRRM
VRWM
VR
Average Rectified Forward Current
@ TL = 155°C
@ TL = 135°C
IF(AV)
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Operating Junction Temperature Range
TJ
Value
Unit
V
150
200
1.0
2.0
40
−65 to +175
A
A
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Max
Unit
PsiJL
(Note 2)
RqJA
24
°C/W
216
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL.
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 1.0 A, TJ = 25°C)
(iF = 1.0 A, TJ = 150°C)
vF
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
iR
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
trr
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
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2
Max
0.875
0.71
2.0
50
35
Unit
V
mA
ns
MURA115T3G, MURA120T3G, SURA8120T3G
TYPICAL CHARACTERISTICS
100
TJ = 175°C
IR, REVERSE CURRENT (mA)
IR, REVERSE CURRENT (mA)
100
10
TJ = 150°C
1
TJ = 100°C
0.1
0.01
TJ = 175°C
10
TJ = 150°C
1
TJ = 100°C
0.1
TJ = 25°C
TJ = 25°C
0
20
40
60
80
40
60
80
100 120 140 160 180 200
Figure 1. Typical Reverse Current
Figure 2. Maximum Reverse Current
TC = 175°C
150°C 100°C
0.4
20
VR, REVERSE VOLTAGE (VOLTS)
0.1
0.01
0.3
0
VR, REVERSE VOLTAGE (VOLTS)
10
1
0.01
100 120 140 160 180 200
0.5
25°C
0.6
−65°C
0.7
0.8
0.9
1.0
1.1
IF, INSTANTANEOUS FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD CURRENT (A)
0.001
10
TC = 175°C
1
0.1
0.01
150°C 100°C
0.3
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.4
0.5
0.6
25°C
0.7
−65°C
0.8
0.9
1
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 4. Maximum Forward Voltage
Figure 3. Typical Forward Voltage
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3
1.1
MURA115T3G, MURA120T3G, SURA8120T3G
TYPICAL CHARACTERISTICS
50
50
NOTE: TYPICAL
CAPACITANCE AT
0 V = 45 pF
35
30
25
20
15
10
35
30
25
20
15
10
5
0
0
8
12
16
20
24
28
32
36
40
8
12
16
20
24
28
32
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
dc
SQUARE WAVE
2
1
80 90
4
VR, REVERSE VOLTAGE (VOLTS)
4
3
0
VR, REVERSE VOLTAGE (VOLTS)
100 110 120 130 140 150 160 170 180
IF(AV), AVERAGE FORWARD CURRENT (A)
4
5
0
40
5
0
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 47 pF
45
C, CAPACITANCE (pF)
40
1.25
0.5
0.25
0
20
0
40
60
80
100
120
140
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Current Derating, Ambient
(FR−4 Board with Minimum Pad)
dc
2
SQUARE WAVE
1
0.5
0.5
180
0.75 SQUARE WAVE
2.5
0
160
1
3
0
40
dc
Figure 7. Current Derating, Lead
1.5
36
1.5
TL, LEAD TEMPERATURE (°C)
PF, AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
C, CAPACITANCE (pF)
45
1
1.5
2
2.5
3
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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4
3.5
MURA115T3G, MURA120T3G, SURA8120T3G
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE F
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.006
0.064
0.016
0.115
0.180
0.220
0.060
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
L
A1
c
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your local
Sales Representative
MURA115T3/D