MURA105, SURA8105, MURA110, SURA8110 Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.66 V Max @ 1.0 A, TJ = 150°C) SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com ULTRAFAST RECTIFIERS 1 AMPERE, 50−100 VOLTS SMA CASE 403D MARKING DIAGRAM Mechanical Characteristics • Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal U4x AYWW G Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: ♦ Human Body Model > 4000 V (Class 3) ♦ Machine Model > 400 V (Class C) U4x = x = = A = Y = WW = G = Specific Device Code A for MURA105T3G, SURA8105T3G B for MURA110T3G, SURA8110T3G Assembly Location Year Work Week Pb−Free Package ORDERING INFORMATION Package Shipping† MURA105T3G SMA (Pb−Free) 5, 000 / Tape & Reel SURA8105T3G* SMA (Pb−Free) 5, 000 / Tape & Reel MURA110T3G SMA (Pb−Free) 5,000 / Tape & Reel SURA8110T3G* SMA (Pb−Free) 5,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 March, 2014 − Rev. 6 1 Publication Order Number: MURA105T3/D MURA105, SURA8105, MURA110, SURA8110 MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA105T3G, SURA8105T3G MURA110T3G, SURA8110T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 155°C @ TL = 135°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Value Unit V 50 100 A 1.0 2.0 Operating Junction Temperature Range A 50 TJ −65 to +175 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Symbol Max Unit PsiJL (Note 2) RqJA 24 °C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25°C) (iF = 1.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr Max Unit V 0.875 0.66 mA 2.0 50 ns 30 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. http://onsemi.com 2 MURA105, SURA8105, MURA110, SURA8110 IR, REVERSE CURRENT (mA) TJ = 175°C 10 1 TJ = 100°C 0.1 0.01 0.001 IF, INSTANTANEOUS FORWARD CURRENT (A) 100 TJ = 25°C TJ = 175°C 10 TJ = 100°C 1 TJ = 25°C 0.1 0 20 40 60 80 60 80 100 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 100°C TC = 175°C 25°C 1 0.1 0.01 0.4 40 VR, REVERSE VOLTAGE (VOLTS) 10 0.3 20 0 100 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 0.5 0.6 0.7 0.8 0.9 1 1.1 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 3 1.1 MURA105, SURA8105, MURA110, SURA8110 50 60 NOTE: MAXIMUM CAPACITANCE AT 0 V = 48 pF 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 40 35 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 45 30 25 20 15 10 40 30 20 10 5 0 0 4 8 12 16 20 28 24 36 32 0 40 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance IF, AVERAGE FORWARD CURRENT (A) RqJL = 24°C/W TJ = 175°C dc 3 2.5 SQUARE WAVE 2 1.5 1 0.5 0 100 110 8 VR, REVERSE VOLTAGE (VOLTS) 4 3.5 4 VR, REVERSE VOLTAGE (VOLTS) 120 130 140 150 160 170 RqJA = 216°C/W TJ = 175°C dc 1 SQUARE WAVE 0.5 0 0 180 20 40 60 100 120 140 160 Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) 2.5 TJ = 175°C 2 dc SQUARE WAVE 1.5 1 0.5 0 0.5 80 TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Lead 0 36 1.5 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 0 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 4 3.5 40 MURA105, SURA8105, MURA110, SURA8110 PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE F HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.006 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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