EMI8041, EMI8042, EMI8043 Product Preview Common Mode Filter with ESD Protection www.onsemi.com Functional Description The EMI804x is a family of Common Mode Filters (CMF) with integrated ESD protection, a first in the industry. Differential signaling I/Os can now have both common mode filtering and ESD protection in one package. The EMI804x protects against ESD pulses up to ±15 kV contact per the IEC61000−4−2 standard. The EMI804x is well−suited for protecting systems using high−speed differential ports such as USB 3.0, HDMI 1.3/1.4/2.0; corresponding ports in removable storage and other applications. The EMI804x is available in a RoHS−compliant, XDFN6 for 1 Differential Pair, XDFN10 for 2 Differential Pair and XDFN16 package for 3 Differential Pair. XDFN6 CASE 711AY 1 MARKING DIAGRAMS WA M G • Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz • Large Differential Mode Cutoff Frequency f3dB > 5 GHz • High Common Mode Stop Band Attenuation: W2 M G 1 15 dB at 700 MHz, 30 dB at 2.4 GHz Low Channel Resistance 6.0 W Provides ESD Protection to IEC61000−4−2 Level 4, ±15 kV Contact These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant XDFN16 CASE 711AZ UDFN6 CASE 517DG Features • • • XDFN10 CASE 711AX 1 1 1 XXXMG G W3 M G XX = Specific Device Code M = Date Code G = Pb−Free Package ELECTRICAL SCHEMATICS Applications • • • • USB 3.0 HDMI 1.3/1.4/2.0 MHL 2.0 eSATA EMI8042 Figure 1. EMI8041 Electrical Schematic EMI8043 This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2015 November, 2015 − Rev. P2 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: EMI8041/D EMI8041, EMI8042, EMI8043 PIN FUNCTION DESCRIPTION Device Pin Pin Name EMI8041 EMI8042 EMI8043 Type In_1+ 1 1 1 I/O CMF Channel 1+ to Connector (External) In_1− 2 2 2 I/O CMF Channel 1− to Connector (External) Out_1+ 6 10 16 I/O CMF Channel 1+ to ASIC (Internal) Out_1− 5 9 15 I/O CMF Channel 1− to ASIC (Internal) In_2+ NA 4 4 I/O CMF Channel 2+ to Connector (External) In_2− NA 5 5 I/O CMF Channel 2− to Connector (External) Out_2+ NA 7 13 I/O CMF Channel 2+ to ASIC (Internal) Out_2− NA 6 12 I/O CMF Channel 2− to ASIC (Internal) In_3+ NA NA 7 I/O CMF Channel 3+ to Connector (External) In_3− NA NA 8 I/O CMF Channel 3− to Connector (External) Out_3+ NA NA 10 I/O CMF Channel 3+ to ASIC (Internal) Out_3− NA NA 9 I/O CMF Channel 3− to ASIC (Internal) VN 3,4 3, 8 3,6,14,11 GND Description Ground ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Value Unit Operating Temperature Range TOP −40 to +85 °C Storage Temperature Range TSTG −65 to +150 °C TL 260 °C ILINE 100 mA Parameter Maximum Lead Temperature for Soldering Purposes (1/8” from Case for 10 seconds) DC Current per Line Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 EMI8041, EMI8042, EMI8043 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol VRWM Parameter Test Conditions Reverse Working Voltage VBR Breakdown Voltage ILEAK Channel Leakage Current RCH Channel Resistance (Pins 1−6, 2−5) − EMI8041 (Pins 1−10, 2−9, 4−7 and 5−6) − EMI8042 (Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8043 IT = 1 mA; (Note 4) Common Mode Stop Band Attenuation VESD In-system ESD Withstand Voltage a) Contact discharge per IEC 61000-4-2 standard, Level 4 (External Pins) b) Contact discharge per IEC 61000-4-2 standard, Level 1 (Internal Pins) Max 3.3 4.0 6.0 Differential Mode Cut-off Frequency Fatten VCL Typ TA = 25°C, VIN = 3.3 V, GND = 0 V DMLOSS Differential Mode Insertion Loss f3dB Min (Note 3) Unit V 9.0 V 1.0 mA W @ 2.5 GHz 2.5 dB 50 W Source and Load Termination 5.0 GHz @ 700 MHz 15 dB (Notes 1 and 2) kV ±15 ±2 TLP Clamping Voltage Forward IPP = 8 A Forward IPP = 16 A Forward IPP = −8 A Forward IPP = −16 A 7.26 11.8 −3.5 −6.7 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded. 2. These measurements performed with no external capacitor. 3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 4. VBR is measured at pulse test current IT. www.onsemi.com 3 EMI8041, EMI8042, EMI8043 TYPICAL CHARACTERISTICS 0 0 m1 −1 −5 m2 −2 −10 m3 −15 dB (SCC21) dB (SDD21) −3 −4 −5 −6 −20 −25 −30 −7 −35 −8 −40 −9 −45 −50 −10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) FREQUENCY (Hz) Figure 2. Typical Differential Mode Attenuation vs. Frequency Figure 3. Typical Common Mode Attenuation vs. Frequency Interface Data Rate (Gb/s) Fundamental Frequency (GHz) EMI804x Insertion Loss (dB) HDMI 1.3/1.4 3.4 1.7 (m1) m1 = 1.65 USB 3.0 5.0 2.5 (m2) m2 = 2.13 HDMI 2.0 6.0 3.0 (m3) m3 = 2.41 www.onsemi.com 4 EMI8041, EMI8042, EMI8043 TRANSMISSION LINE PULSE (TLP) MEASUREMENTS Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves for the EMI804x are shown in Figure 4. L SW Attenuator 50 W Coax Cable ÷ 50 W Coax Cable IM VM 10 MQ DUT VC Oscilloscope Figure 4. Simplified Schematic of a Typical TLP System 18 −18 16 −16 14 −14 12 −12 10 −10 I (A) I (A) Figure 5. Comparison Between 8 kV IEC61000-4-2 and 8 A and 16 A TLP Waveforms 8 −8 6 −6 4 −4 2 −2 0 0 0 2 4 6 8 10 Vclamp (V) 12 14 16 18 0 −2 −4 −6 Figure 6. Positive and Negative TLP Waveforms www.onsemi.com 5 −8 −10 Vclamp (V) −12 −14 −16 −18 EMI8041, EMI8042, EMI8043 Pattern Generator (5 Gbps, PRBS31 Pattern) 50 GHz Sampling Oscilloscope ONsemi high speed test board (Rogers 4003 Material, Southwest Microwave 2.4mm Connectors) Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate Figure 8. Eye Diagram 5Gbps with and without EMI804x Eye Height (mVppd) Rise Time (ps) Fall Time (ps) Jrms (ps) Jpp (ps) Reference (No Device)-Left Figure 724 30.4 29.6 1.997 9.6 EMI804x Right Figure 405 60 60.8 3.484 16 ORDERING INFORMATION Orderable Part Number Package Shipping EMI8041MUTAG XDFN6 (Pb−Free) 3000 / Tape & Reel EMI8042MUTAG XDFN10 (Pb−Free) 3000 / Tape & Reel EMI8043MUTAG XDFN16 (Pb−Free) 3000 / Tape & Reel EMI8041BMUTAG UDFN6 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 6 EMI8041, EMI8042, EMI8043 PACKAGE DIMENSIONS UDFN6 1.6x1.35, 0.5P CASE 517DG ISSUE O PIN ONE REFERENCE 2X 2X 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. A B D ÉÉ ÉÉ E DIM A A1 b D E e L L2 TOP VIEW A 0.10 C 6X A1 DETAIL A 0.08 C C SIDE VIEW RECOMMENDED MOUNTING FOOTPRINT SEATING PLANE 0.50 PITCH DETAIL A 1 3X 0.86 3 3X 3X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.15 0.25 1.60 BSC 1.35 BSC 0.50 BSC 0.35 0.55 0.65 0.85 L2 1.55 L 6 4 6X b e 0.10 C A B BOTTOM VIEW 0.05 C 3X 0.56 NOTE 3 1 6X 0.32 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 EMI8041, EMI8042, EMI8043 PACKAGE DIMENSIONS XDFN6, 1.50x1.35, 0.5P CASE 711AY ISSUE O A B D PIN 1 REFERENCE ÇÇ ÇÇ L1 E 0.10 C 2X 2X L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. DETAIL A ALTERNATE CONSTRUCTIONS 0.10 C TOP VIEW ÉÉ ÇÇ EXPOSED Cu A DETAIL B (A3) A1 0.10 C DIM A A1 A3 b D E e L L1 L2 L3 6X MOLD CMPD DETAIL B 0.08 C C SIDE VIEW ALTERNATE CONSTRUCTION SEATING PLANE RECOMMENDED MOUNTING FOOTPRINT e DETAIL A 1 3 MILLIMETERS MIN MAX 0.40 0.50 0.00 0.05 0.15 REF 0.15 0.25 1.50 BSC 1.35 BSC 0.50 BSC 0.35 0.55 --0.15 0.65 0.85 0.15 REF 3X L 3X 0.50 PITCH L2 3X 0.86 3X L3 0.56 6 1.55 4 6X BOTTOM VIEW 1 b 0.10 M C A B 0.05 M C 0.51 NOTE 3 5X 0.32 DIMENSIONS: MILLIMETERS www.onsemi.com 8 EMI8041, EMI8042, EMI8043 PACKAGE DIMENSIONS XDFN10 2.50x1.35, 0.5P CASE 711AX ISSUE O A B D PIN ONE REFERENCE 0.10 C 2X 2X 0.10 C ÇÇÇ ÇÇÇ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. L L L1 E DETAIL A DIM A A1 A3 b D E e L L1 ALTERNATE CONSTRUCTIONS TOP VIEW DETAIL B ÉÉÉ ÇÇÇ EXPOSED Cu A (A3) 0.10 C 0.08 C MOLD CMPD MILLIMETERS MIN MAX 0.40 0.50 0.00 0.05 0.15 REF 0.15 0.25 2.50 BSC 1.35 BSC 0.50 BSC 0.40 0.60 --0.15 DETAIL B A1 SIDE VIEW C SEATING PLANE ALTERNATE CONSTRUCTION RECOMMENDED MOUNTING FOOTPRINT DETAIL A e 1 9X 8X 5 10X 0.25 0.65 L PACKAGE OUTLINE 1.55 10 6 10X BOTTOM VIEW b 1 0.10 M C A B 0.05 M C 0.47 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS www.onsemi.com 9 EMI8041, EMI8042, EMI8043 PACKAGE DIMENSIONS XDFN16 4.0x1.35, 0.5P CASE 711AZ ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X ÉÉÉÉ ÉÉÉÉ 0.10 C L L L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉÉ ÉÉÉ ÇÇÇ TOP VIEW EXPOSED Cu DETAIL B (A3) 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. A MOLD CMPD DETAIL B 16X 0.08 C A1 SIDE VIEW C SEATING PLANE ALTERNATE CONSTRUCTION MILLIMETERS MIN MAX 0.40 0.50 0.00 0.05 0.15 REF 0.15 0.25 4.00 BSC 1.35 BSC 0.50 BSC 0.40 0.60 −−− 0.15 0.20 REF RECOMMENDED SOLDERING FOOTPRINT* e/2 DETAIL A DIM A A1 A3 b D E e L L1 L2 e 16X 0.50 PITCH L 8 1 16X 0.65 1.55 L2 16 9 1 16X b 0.48 0.10 C A B BOTTOM VIEW 0.05 C 15X 0.25 DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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