EMI8041 D

EMI8041, EMI8042,
EMI8043
Product Preview
Common Mode Filter with
ESD Protection
www.onsemi.com
Functional Description
The EMI804x is a family of Common Mode Filters (CMF) with
integrated ESD protection, a first in the industry. Differential signaling
I/Os can now have both common mode filtering and ESD protection in
one package. The EMI804x protects against ESD pulses up to ±15 kV
contact per the IEC61000−4−2 standard.
The EMI804x is well−suited for protecting systems using
high−speed differential ports such as USB 3.0, HDMI 1.3/1.4/2.0;
corresponding ports in removable storage and other applications.
The EMI804x is available in a RoHS−compliant, XDFN6 for 1
Differential Pair, XDFN10 for 2 Differential Pair and XDFN16
package for 3 Differential Pair.
XDFN6
CASE 711AY
1
MARKING DIAGRAMS
WA M
G
• Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz
• Large Differential Mode Cutoff Frequency f3dB > 5 GHz
• High Common Mode Stop Band Attenuation:
W2 M
G
1
15 dB at 700 MHz, 30 dB at 2.4 GHz
Low Channel Resistance 6.0 W
Provides ESD Protection to IEC61000−4−2 Level 4, ±15 kV Contact
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
XDFN16
CASE 711AZ
UDFN6
CASE 517DG
Features
•
•
•
XDFN10
CASE 711AX
1
1
1
XXXMG
G
W3 M
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
ELECTRICAL SCHEMATICS
Applications
•
•
•
•
USB 3.0
HDMI 1.3/1.4/2.0
MHL 2.0
eSATA
EMI8042
Figure 1. EMI8041 Electrical Schematic
EMI8043
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. P2
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
EMI8041/D
EMI8041, EMI8042, EMI8043
PIN FUNCTION DESCRIPTION
Device Pin
Pin Name
EMI8041
EMI8042
EMI8043
Type
In_1+
1
1
1
I/O
CMF Channel 1+ to Connector (External)
In_1−
2
2
2
I/O
CMF Channel 1− to Connector (External)
Out_1+
6
10
16
I/O
CMF Channel 1+ to ASIC (Internal)
Out_1−
5
9
15
I/O
CMF Channel 1− to ASIC (Internal)
In_2+
NA
4
4
I/O
CMF Channel 2+ to Connector (External)
In_2−
NA
5
5
I/O
CMF Channel 2− to Connector (External)
Out_2+
NA
7
13
I/O
CMF Channel 2+ to ASIC (Internal)
Out_2−
NA
6
12
I/O
CMF Channel 2− to ASIC (Internal)
In_3+
NA
NA
7
I/O
CMF Channel 3+ to Connector (External)
In_3−
NA
NA
8
I/O
CMF Channel 3− to Connector (External)
Out_3+
NA
NA
10
I/O
CMF Channel 3+ to ASIC (Internal)
Out_3−
NA
NA
9
I/O
CMF Channel 3− to ASIC (Internal)
VN
3,4
3, 8
3,6,14,11
GND
Description
Ground
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol
Value
Unit
Operating Temperature Range
TOP
−40 to +85
°C
Storage Temperature Range
TSTG
−65 to +150
°C
TL
260
°C
ILINE
100
mA
Parameter
Maximum Lead Temperature for Soldering Purposes
(1/8” from Case for 10 seconds)
DC Current per Line
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com
2
EMI8041, EMI8042, EMI8043
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
VRWM
Parameter
Test Conditions
Reverse Working Voltage
VBR
Breakdown Voltage
ILEAK
Channel Leakage Current
RCH
Channel Resistance
(Pins 1−6, 2−5) − EMI8041
(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8042
(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8043
IT = 1 mA; (Note 4)
Common Mode Stop Band Attenuation
VESD
In-system ESD Withstand Voltage
a) Contact discharge per IEC 61000-4-2 standard, Level 4
(External Pins)
b) Contact discharge per IEC 61000-4-2 standard, Level 1
(Internal Pins)
Max
3.3
4.0
6.0
Differential Mode Cut-off Frequency
Fatten
VCL
Typ
TA = 25°C, VIN = 3.3 V, GND = 0 V
DMLOSS Differential Mode Insertion Loss
f3dB
Min
(Note 3)
Unit
V
9.0
V
1.0
mA
W
@ 2.5 GHz
2.5
dB
50 W Source and Load
Termination
5.0
GHz
@ 700 MHz
15
dB
(Notes 1 and 2)
kV
±15
±2
TLP Clamping Voltage
Forward IPP = 8 A
Forward IPP = 16 A
Forward IPP = −8 A
Forward IPP = −16 A
7.26
11.8
−3.5
−6.7
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded.
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC
or continuous peak operating voltage level.
4. VBR is measured at pulse test current IT.
www.onsemi.com
3
EMI8041, EMI8042, EMI8043
TYPICAL CHARACTERISTICS
0
0
m1
−1
−5
m2
−2
−10
m3
−15
dB (SCC21)
dB (SDD21)
−3
−4
−5
−6
−20
−25
−30
−7
−35
−8
−40
−9
−45
−50
−10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 2. Typical Differential Mode Attenuation
vs. Frequency
Figure 3. Typical Common Mode Attenuation
vs. Frequency
Interface
Data Rate (Gb/s)
Fundamental Frequency (GHz)
EMI804x Insertion Loss (dB)
HDMI 1.3/1.4
3.4
1.7 (m1)
m1 = 1.65
USB 3.0
5.0
2.5 (m2)
m2 = 2.13
HDMI 2.0
6.0
3.0 (m3)
m3 = 2.41
www.onsemi.com
4
EMI8041, EMI8042, EMI8043
TRANSMISSION LINE PULSE (TLP) MEASUREMENTS
Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a
100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in
Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s
of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV
IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at
which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves
for the EMI804x are shown in Figure 4.
L
SW
Attenuator
50 W Coax Cable
÷
50 W Coax Cable
IM
VM
10 MQ
DUT
VC
Oscilloscope
Figure 4. Simplified Schematic of a Typical TLP System
18
−18
16
−16
14
−14
12
−12
10
−10
I (A)
I (A)
Figure 5. Comparison Between 8 kV IEC61000-4-2 and 8 A and 16 A TLP Waveforms
8
−8
6
−6
4
−4
2
−2
0
0
0
2
4
6
8
10
Vclamp (V)
12
14
16
18
0
−2
−4
−6
Figure 6. Positive and Negative TLP Waveforms
www.onsemi.com
5
−8 −10
Vclamp (V)
−12
−14
−16 −18
EMI8041, EMI8042, EMI8043
Pattern Generator
(5 Gbps, PRBS31 Pattern)
50 GHz Sampling Oscilloscope
ONsemi high speed test board
(Rogers 4003 Material, Southwest
Microwave 2.4mm Connectors)
Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate
Figure 8. Eye Diagram 5Gbps with and without EMI804x
Eye Height (mVppd)
Rise Time (ps)
Fall Time (ps)
Jrms (ps)
Jpp (ps)
Reference (No Device)-Left Figure
724
30.4
29.6
1.997
9.6
EMI804x Right Figure
405
60
60.8
3.484
16
ORDERING INFORMATION
Orderable Part Number
Package
Shipping
EMI8041MUTAG
XDFN6
(Pb−Free)
3000 / Tape & Reel
EMI8042MUTAG
XDFN10
(Pb−Free)
3000 / Tape & Reel
EMI8043MUTAG
XDFN16
(Pb−Free)
3000 / Tape & Reel
EMI8041BMUTAG
UDFN6
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
www.onsemi.com
6
EMI8041, EMI8042, EMI8043
PACKAGE DIMENSIONS
UDFN6 1.6x1.35, 0.5P
CASE 517DG
ISSUE O
PIN ONE
REFERENCE
2X
2X
0.10 C
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A B
D
ÉÉ
ÉÉ
E
DIM
A
A1
b
D
E
e
L
L2
TOP VIEW
A
0.10 C
6X
A1
DETAIL A
0.08 C
C
SIDE VIEW
RECOMMENDED
MOUNTING FOOTPRINT
SEATING
PLANE
0.50
PITCH
DETAIL A
1
3X
0.86
3
3X
3X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.15
0.25
1.60 BSC
1.35 BSC
0.50 BSC
0.35
0.55
0.65
0.85
L2
1.55
L
6
4
6X
b
e
0.10 C A B
BOTTOM VIEW
0.05 C
3X
0.56
NOTE 3
1
6X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
EMI8041, EMI8042, EMI8043
PACKAGE DIMENSIONS
XDFN6, 1.50x1.35, 0.5P
CASE 711AY
ISSUE O
A B
D
PIN 1
REFERENCE
ÇÇ
ÇÇ
L1
E
0.10 C
2X
2X
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
DETAIL A
ALTERNATE
CONSTRUCTIONS
0.10 C
TOP VIEW
ÉÉ
ÇÇ
EXPOSED Cu
A
DETAIL B
(A3)
A1
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
L2
L3
6X
MOLD CMPD
DETAIL B
0.08 C
C
SIDE VIEW
ALTERNATE
CONSTRUCTION
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT
e
DETAIL A
1
3
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
1.50 BSC
1.35 BSC
0.50 BSC
0.35
0.55
--0.15
0.65
0.85
0.15 REF
3X
L
3X
0.50
PITCH
L2
3X
0.86
3X
L3
0.56
6
1.55
4
6X
BOTTOM VIEW
1
b
0.10
M
C A B
0.05
M
C
0.51
NOTE 3
5X
0.32
DIMENSIONS: MILLIMETERS
www.onsemi.com
8
EMI8041, EMI8042, EMI8043
PACKAGE DIMENSIONS
XDFN10 2.50x1.35, 0.5P
CASE 711AX
ISSUE O
A B
D
PIN ONE
REFERENCE
0.10 C
2X
2X
0.10 C
ÇÇÇ
ÇÇÇ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
L
L
L1
E
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
ALTERNATE
CONSTRUCTIONS
TOP VIEW
DETAIL B
ÉÉÉ
ÇÇÇ
EXPOSED Cu
A
(A3)
0.10 C
0.08 C
MOLD CMPD
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
2.50 BSC
1.35 BSC
0.50 BSC
0.40
0.60
--0.15
DETAIL B
A1
SIDE VIEW
C
SEATING
PLANE
ALTERNATE
CONSTRUCTION
RECOMMENDED
MOUNTING FOOTPRINT
DETAIL A
e
1
9X
8X
5
10X
0.25
0.65
L
PACKAGE
OUTLINE
1.55
10
6
10X
BOTTOM VIEW
b
1
0.10
M
C A B
0.05
M
C
0.47
NOTE 3
0.50 PITCH
DIMENSIONS: MILLIMETERS
www.onsemi.com
9
EMI8041, EMI8042, EMI8043
PACKAGE DIMENSIONS
XDFN16 4.0x1.35, 0.5P
CASE 711AZ
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉÉ
ÉÉÉÉ
0.10 C
L
L
L1
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
ÇÇÇ
TOP VIEW
EXPOSED Cu
DETAIL B
(A3)
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
MOLD CMPD
DETAIL B
16X
0.08 C
A1
SIDE VIEW
C
SEATING
PLANE
ALTERNATE
CONSTRUCTION
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
4.00 BSC
1.35 BSC
0.50 BSC
0.40
0.60
−−−
0.15
0.20 REF
RECOMMENDED
SOLDERING FOOTPRINT*
e/2
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
L2
e
16X
0.50
PITCH
L
8
1
16X
0.65
1.55
L2
16
9
1
16X
b
0.48
0.10 C A B
BOTTOM VIEW
0.05 C
15X
0.25
DIMENSIONS: MILLIMETERS
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
EMI8041/D