EMI9406 D

EMI9406
PRAETORIAN) L-C LCD and
Camera EMI Array with ESD
Protection
Functional Description
The EMI9406 is an inductor−based (L−C) EMI filter array with
ESD protection, which integrates six filters in a uDFN package with
0.40 mm pitch. Each EMI filter channel of the EMI9406 is
implemented with the component value of 1.8 pF
35 nH– 4.7 pF−35 nH– 6 pF. The cut−off frequency at −3 dB
attenuation is 300 MHz and can be used in applications where the data
rates are as high as 160 Mbps, while providing greater than −35 dB
attenuation over the 800 MHz to 2.7GHz frequency range. The parts
include ESD diodes on every I/O pin and provide a high level of
protection against electrostatic discharge (ESD). The ESD protection
diodes connected to the external filter ports are designed and
characterized to safely dissipate ESD strikes of ±14 kV, which is
beyond the maximum requirement of the IEC61000−4−2 international
standard.
This device is particularly well suited for wireless handsets, mobile
LCD modules and PDAs because of its small package format and
easy−to−use pin assignments. In particular, the EMI9406 is ideal for
EMI filtering and protecting data and control lines for the LCD display
and camera interface in mobile handsets.
The EMI9404 is housed in space saving, low profile, 0.40 mm pitch
UDFN packages in a RoHS compliant, Pb−Free format.
Features
• Six Channels of EMI Filtering with Integrated ESD Protection
• Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)
•
•
•
•
•
•
Network
±14 kV ESD Protection (IEC 61000−4−2 Level 4, contact discharge)
at External Pin
Greater than −35 dB Attenuation (typical) at 1 GHz
UDFN Pb−Free Package with 0.40 mm Lead Pitch:
6−ch. = 12−Lead UDFN
UDFN Pb−Free Package with 0.40 mm Lead Pitch:
12−lead: 2.50 mm x 1.35 mm
Increased Robustness Against Vertical Impacts During
Manufacturing Process
These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook
•
December, 2011 − Rev. 0
MARKING
DIAGRAMS
L6 MG
G
UDFN12
CASE 517BD
12
1
1
= Specific Device Code
= Month Code
= Pb−Free Package
L6
M
G
(*Note: Microdot may be in either location)
PINOUTS
Internal Pins
(Lower ESD Event)
1
2
3
4
5
6
9
8
7
GND
12
11
10
External Pins
(Higher ESD Event)
(Bottom View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
• Wireless Handsets
• Handheld PCs/PDAs
• LCD and Camera Modules
Computers, PDAs, etc.
EMI Filtering for Data Ports in Cell Phones, PDAs or
Notebook Computer
© Semiconductor Components Industries, LLC, 2011
http://onsemi.com
1
Publication Order Number:
EMI9406/D
EMI9406
Figure 1. Electrical Schematic
Table 1. PIN DESCRIPTIONS
Pin #
Name
Description
1
FILTER1
Filter + ESD Channel 1 (Internal)
2
FILTER2
Filter + ESD Channel 2 (Internal)
3
FILTER3
Filter + ESD Channel 3 (Internal)
4
FILTER4
Filter + ESD Channel 4 (Internal)
5
FILTER5
Filter + ESD Channel 5 (Internal)
6
FILTER6
Filter + ESD Channel 6 (Internal)
7
FILTER6
Filter + ESD Channel 6 (External)
8
FILTER5
Filter + ESD Channel 5 (External)
9
FILTER4
Filter + ESD Channel 4 (External)
10
FILTER3
Filter + ESD Channel 3 (External)
11
FILTER2
Filter + ESD Channel 2 (External)
12
FILTER1
Filter + ESD Channel 1 (External)
GND PAD
GND
Device Ground
SPECIFICATIONS
MAXIMUM RATINGS
Parameter
Value
Unit
–65 to +150
°C
Current per Inductor
15
mA
DC Package Power Rating
500
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
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2
Rating
Unit
–40 to +85
°C
EMI9406
ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
1.
2.
3.
4.
Parameter
LTOT
Total Channel Inductance
Conditions
Min
Typ
Max
70
RTOT
Total Channel DC Resistance
CTOT_0V
Total Channel Capacitance, 0 V bias
CTOT_2.5V
Total Channel Capacitance, 2.5 V bias
nH
45
0 V dc; 1 MHz, 30 mVrms
17.5
2.5 V dc; 1 MHz, 30 mVrms
Stand−off Voltage
ILEAK
Diode Leakage Current
VSIG
Signal Clamp Voltage Positive Clamp
Negative Clamp
ILOAD = 10 mA
ILOAD = −10 mA
5.6
−1.5
VESD
In−system ESD Withstand Voltage
a) Contact discharge per IEC 61000−4−2
standard, Level 4 (External Pins)
b) Contact discharge per IEC 61000−4−2
standard, Level 4 (Internal Pins)
c) Air discharge per IEC61000−4−2
standard, Level 4 (External Pins)
Notes 2 and 3
±14
I = 10 mA
Clamping Voltage
TLP (Note 4)
See Figures 4 through 7
fC
Cut−off frequency ZSOURCE = 50 W,
ZLOAD = 50 W
pF
pF
5.5
VIN = +3.3 V
VC
W
24
11.5
VST
Unit
V
0.1
0.5
mA
6.8
−0.8
9.0
−0.4
V
kV
±2
±16
IPP = 8 A
IPP = 16 A
IPP = −8 A
IPP = −16 A
13.7
20
−4.4
−7.6
V
345
MHz
TA = 25°C unless otherwise specified.
ESD applied to input and output pins with respect to GND, one at a time.
Unused pins are left open.
ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model.
TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns.
PERFORMANCE INFORMATION
TYPICAL FILTER PERFORMANCE
TYPICAL DIODE CAPACITANCE VS. INPUT
VOLTAGE
(TA = 25°C, DC Bias = 0 V, 50 W Environment)
Figure 3. Filter Capacitance vs. Input Voltage
(Normalized to Capacitance at 0 VDC and 25°C)
Figure 2. Typical Filter Insertion Loss
ORDERING INFORMATION
Device
EMI9406MUTAG
Pins
Marking
Package
Shipping†
12
96
UDFN12
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
CURRENT (A)
CURRENT (A)
EMI9406
VOLTAGE (V)
VOLTAGE (V)
Figure 4. Positive TLP I−V Curve
Figure 5. Negative TLP I−V Curve
Transmission Line Pulse (TLP) Measurement
detail on TLP datasheet parameters, while application note
AND9006/D provides a more complete explanation of the
use of TLP for understanding protection product
characteristics.
Transmission Line Pulse (TLP) provides current versus
voltage (I−V) curves in which each data point is obtained
from a 100 ns long rectangular pulse from a charged
transmission line. A simplified schematic of a typical TLP
system is shown in Figure 6. TLP I−V curves of ESD
protection devices accurately demonstrate the product’s
ESD capability because the 10s of amps current levels and
under 100 ns time scale match those of an ESD event. This
is illustrated in Figure 7 where an 8 kV IEC 61000−4−2
current waveform into a short is compared with TLP current
pulses at 8 A and 16 A, also into a short. A TLP I−V curve
shows the voltage at which the device turns on, as well as
how well the device clamps voltage over a range of current
levels. Typical TLP I−V curves for the EMI9404 are shown
in Figures 4 and 5 for positive and negative stress
respectively. Application note AND9007/D gives more
L
50 W Coax
Cable
S Attenuator
÷
50 W Coax
Cable
10 MW
IM
VM
DUT
VC
Oscilloscope
Figure 6. Simplified Schematic of a Typical TLP
System
Figure 7. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms
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4
EMI9406
PACKAGE DIMENSIONS
UDFN12, 2.5x1.35, 0.4P
CASE 517BD
ISSUE O
A
B
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉ
ÉÉÉ
0.10 C
L
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
TOP VIEW
EXPOSED Cu
A
DETAIL B
(A3)
0.05 C
12X
A1
0.05 C
NOTE 4
12X
A1
SIDE VIEW
6
1
K
12
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MOLD CMPD
ÇÇ
ÉÉ
A3
DETAIL B
OPTIONAL
CONSTRUCTION
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
2.50 BSC
1.90
2.10
1.35 BSC
0.30
0.50
0.40 BSC
0.15
−−−
0.20
0.30
−−−
0.05
DETAIL A
D2
L
L
7
e
RECOMMENDED
SOLDERING FOOTPRINT*
E2
PACKAGE
OUTLINE
12X
2.20
12X
0.40
b
0.10 C A B
BOTTOM VIEW
0.05 C
1.55
NOTE 3
0.50
12X
0.40
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PRAETORIAN is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
EMI9406/D