NUF2114 D

NUF2114
2 Line Audio EMI Filter with
ESD Protection
This device is a 2 line audio EMI filter array designed for speaker
applications. It offers greater than −30 dB attenuation at frequencies
from 900 MHz to 3.0 GHz. This device also offers ESD
protection−clamping transients from static discharges and ESD
protection is provided across all capacitors.
C
• Provides EMI Filtering and ESD Protection
• Integration of 10 Discretes
• Compliance with IEC61000−4−2 (Level 4)
•
•
8
C
R
4
C
30 kV (Contact)
DFN8, 2x2 mm Package
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
Human Body Model = 3B
Matching Series Impedances for Speaker Applications
This is a Pb−Free Device
5
C
(Top View)
MARKING
DIAGRAM
DFN8
CASE 506AA
Applications
•
•
•
•
•
R
1
Features
•
•
•
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1
1
Wireless Phones
MP3s
PDAs
Digital Cameras
Portable DVDs
U4MG
G
U4 = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
OUT1
8
NC
7
1
IN1
2
NC
GND
NC
6
3
NC
OUT2
5
4
IN2
(Bottom View)
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2011
October, 2011 − Rev. 0
1
Device
Package
Shipping†
NUF2114MNT1G
DFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NUF2114/D
NUF2114
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VPP
30
kV
Steady−State Power per Resistor @ 25°C
PR
180
mW
Steady−State Power per Package @ 25°C
PT
360
mW
ESD Discharge IEC61000−4−2
Contact Discharge
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
Tstg
−55 to 150
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
VRWM
−
−
12
V
IR = 1.0 mA
VBR
13.7
15.7
17.7
V
VRWM = 12 V
IR
−
−
0.1
A
IF = 40 mA
R
8.1
9.0
9.9
Cd
51
60
66
Above this frequency,
appreciable attenuation occurs
f3dB
Maximum Reverse Working Voltage
Breakdown Voltage
Leakage Current
Resistance
Capacitance per Diode (Notes 1, 3)
Cut−Off Frequency (Note 2)
1. Measured at 25°C, VR = 0 V, f = 1.0 MHz.
2. 50 source and 50 load termination.
3. Total line capacitance is 2 times the diode capacitance (Cd).
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2
50
pF
MHz
NUF2114
TYPICAL PERFORMANCE CURVES
(TA = 25°C unless otherwise specified)
0
0
−5
−10
−10
−20
(S41) dB
(S21) dB
−15
−20
−25
−30
−30
−40
−50
−60
−35
−70
−40
−45
1.0E+6
10E+6
100E+6
1.0E+9
−80
1.0E+6
10E+9
10E+6
FREQUENCY (Hz)
Figure 1. Insertion Loss Characteristics
1.0E+9
10E+9
Figure 2. Analog Cross−Talk
130
8.7
120
8.6
110
CAPACITANCE (pF)
RESISTANCE (OHMS)
100E+6
FREQUENCY (Hz)
8.5
8.4
8.3
8.2
100
90
80
70
60
50
8.1
−40
−15
10
35
60
40
−12
85
TEMPERATURE (°C)
−8
−4
0
4
8
REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Resistance over Temperature
Figure 4. Typical Line Capacitance vs. Reverse
Bias Voltage
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3
12
NUF2114
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AA
ISSUE E
D
PIN ONE
REFERENCE
2X
0.10 C
2X
A
B
ÇÇÇ
ÇÇÇ
ÇÇÇ
0.10 C
L
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÉÉÉ
ÉÉÉ
EXPOSED Cu
TOP VIEW
A
DETAIL B
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
0.08 C
(A3)
NOTE 4
SIDE VIEW
DETAIL A
A1
D2
1
4
C
8X
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
L
8
5
e/2
e
8X
1.30
PACKAGE
OUTLINE
E2
K
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.30 REF
0.25
0.35
−−−
0.10
0.90
b
8X
0.50
2.30
1
0.10 C A B
0.05 C
8X
0.30
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF2114/D