MC74LCX541 D

MC74LCX541
Low-Voltage CMOS Octal
Buffer Flow Through Pinout
With 5 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)
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The MC74LCX541 is a high performance, non−inverting octal
buffer operating from a 2.3 to 3.6 V supply. This device is similar in
function to the MC74LCX244, while providing flow through
architecture. High impedance TTL compatible inputs significantly
reduce current loading to input drivers while TTL compatible outputs
offer improved switching noise performance. A VI specification of
5.5 V allows MC74LCX541 inputs to be safely driven from 5 V
devices. The MC74LCX541 is suitable for memory address driving
and all TTL level bus oriented transceiver applications.
Current drive capability is 24 mA at the outputs. The Output Enable
(OE1. OE2) inputs, when HIGH, disables the output by placing them
in a HIGH Z condition.
SOIC−20 WB
DW SUFFIX
CASE 751D
MARKING DIAGRAMS
20
LCX541
AWLYYWWG
Features
•
•
•
•
•
•
•
•
•
•
•
•
Designed for 2.3 to 3.6 V VCC Operation
5 V Tolerant − Interface Capability With 5 V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in All Three Logic States (10 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance:
♦ Human Body Model > 2000 V
♦ Machine Model > 200 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 9
TSSOP−20
DT SUFFIX
CASE 948E
1
1
SOIC−20 WB
20
LCX
541
ALYW G
G
1
TSSOP−20
A
L, WL
Y, YY
W, WW
G or G
=
=
=
=
=
Assembly Location
Wafer Lot
Year
Work Week
Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
MC74LCX541/D
MC74LCX541
OE1
VCC
OE2
O0
O1
O2
O3
O4
O5
O6
O7
20
19
18
17
16
15
14
13
12
11
OE2
1
19
D0
D1
D2
1
2
3
4
5
6
7
8
9
10
OE1
D0
D1
D2
D3
D4
D5
D6
D7
GND
D3
D4
Figure 1. Pinout: 20−Lead (Top View)
D5
PIN NAMES
Pins
Function
OEn
Output Enable Inputs
Dn
Data Inputs
On
3−State Outputs
D6
D7
2
18
3
17
4
16
5
15
6
14
7
13
8
12
9
11
O0
O1
O2
O3
O4
O5
O6
O7
Figure 2. Logic Diagram
TRUTH TABLE
Inputs
Outputs
OE1
OE2
Dn
On
L
L
L
L
L
L
H
H
X
H
X
Z
H
X
X
Z
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State;
X = High or Low Voltage Level and Transitions are Acceptable, for ICC reasons,
DO NOT FLOAT Inputs
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
Condition
Units
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
−0.5 ≤ VO ≤ +7.0
Output in 3−State
V
−0.5 ≤ VO ≤ VCC + 0.5
(Note 1)
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output Source/Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
MSL
Moisture Sensitivity
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Output in HIGH or LOW State. IO absolute maximum rating must be observed.
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2
MC74LCX541
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
Typ
Max
2.0
1.5
3.3
3.3
3.6
3.6
Supply Voltage
Operating
Data Retention Only
Units
V
VI
Input Voltage
0
5.5
VO
Output Voltage
(HIGH or LOW State)
(3−State)
0
0
VCC
5.5
V
V
IOH
HIGH Level Output Current, VCC = 3.0 V − 3.6 V
−24
mA
IOL
LOW Level Output Current, VCC = 3.0 V − 3.6 V
24
mA
IOH
HIGH Level Output Current, VCC = 2.7 V − 3.0 V
−12
mA
IOL
LOW Level Output Current, VCC = 2.7 V − 3.0 V
12
mA
TA
Operating Free−Air Temperature
−40
+85
°C
0
10
ns/V
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
TA = −40°C to +85°C
Symbol
Characteristic
VIH
HIGH Level Input Voltage (Note 2)
VIL
LOW Level Input Voltage (Note 2)
VOH
HIGH Level Output Voltage
VOL
LOW Level Output Voltage
IOZ
3−State Output Current
IOFF
Power Off Leakage Current
Condition
Min
2.7 V ≤ VCC ≤ 3.6 V
2.0
2.7 V ≤ VCC ≤ 3.6 V
Max
V
0.8
2.7 V ≤ VCC ≤ 3.6 V; IOH = −100 mA
VCC − 0.2
VCC = 2.7 V; IOH = −12 mA
2.2
VCC = 3.0 V; IOH = −18 mA
2.4
VCC = 3.0 V; IOH = −24 mA
2.2
Units
V
V
2.7 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.7 V; IOL = 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
V
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 3.6 V, VIN = VIH or VIL,
VOUT = 0 to 5.5 V
±5
mA
VCC = 0, VIN = 5.5 V or VOUT = 5.5 V
10
mA
IIN
Input Leakage Current
VCC = 3.6 V, VIN = 5.5 V or GND
±5
mA
ICC
Quiescent Supply Current
VCC = 3.6 V, VIN = 5.5 V or GND
10
mA
2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V
500
mA
DICC
Increase in ICC per Input
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. These values of VI are used to test DC electrical characteristics only.
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3
MC74LCX541
AC ELECTRICAL CHARACTERISTICS (tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W)
Limits
TA = −40°C to +85°C
VCC = 3.0 V to 3.6 V
Symbol
Parameter
VCC = 2.7 V
Waveform
Min
Max
Max
Units
tPLH
tPHL
Propagation Delay
Input to Output
1
1.5
1.5
6.5
6.5
7.5
7.5
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
2
1.5
1.5
8.5
8.5
9.5
9.5
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
2
1.5
1.5
7.5
7.5
8.5
8.5
ns
tOSHL
tOSLH
Output−to−Output Skew (Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol
Characteristic
Condition
Min
Typ
Max
Units
VOLP
Dynamic LOW Peak Voltage (Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
VOLV
Dynamic LOW Valley Voltage (Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
0.8
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 3.3 V, VI = 0 V or VCC
7
pF
COUT
Output Capacitance
VCC = 3.3 V, VI = 0 V or VCC
8
pF
CPD
Power Dissipation Capacitance
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
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4
MC74LCX541
2.7 V
Dn
1.5 V
1.5 V
0V
tPLH
tPHL
VOH
1.5 V
On
1.5 V
VOL
WAVEFORM 1 - PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
2.7 V
1.5 V
OEn
0V
tPZH
tPHZ
VCC
VOH - 0.3 V
1.5 V
On
≈0V
tPZL
tPLZ
≈ 3.0 V
1.5 V
On
VOL + 0.3 V
GND
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 3. AC Waveforms
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
RL
Test
Switch
tPLH, tPHL
Open
tPZL, tPLZ
6V
Open Collector/Drain tPLH and tPHL
6V
tPZH, tPHZ
GND
CL = 50 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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5
6V
OPEN
GND
MC74LCX541
ORDERING INFORMATION
Package
Shipping†
MC74LCX541DWR2G
SOIC−20
(Pb−Free)
1000 Tape & Reel
NLV74LCX541DWR2G* (In Development)
SOIC−20
(Pb−Free)
1000 Tape & Reel
MC74LCX541DWG
SOIC−20
(Pb−Free)
38 Units / Rail
NLV74LCX541DWG* (In Development)
SOIC−20
(Pb−Free)
38 Units / Rail
MC74LCX541DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
NLV74LCX541DTG* (In Development)
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74LCX541DTR2G
TSSOP−20
(Pb−Free)
2500 Tape & Reel
NLV74LCX541DTR2G* (In Development)
TSSOP−20
(Pb−Free)
2500 Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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6
MC74LCX541
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
−U−
L
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC74LCX541
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE G
q
A
20
X 45 _
h
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
1
10
20X
B
B
0.25
M
T A
S
B
S
L
A
18X
e
A1
SEATING
PLANE
C
T
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
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MC74LCX541/D