MC74HC4316A D

MC74HC4316A
Quad Analog Switch/
Multiplexer/Demultiplexer
with Separate Analog and
Digital Power Supplies
http://onsemi.com
High−Performance Silicon−Gate CMOS
The MC74HC4316A utilizes silicon−gate CMOS technology to
achieve fast propagation delays, low ON resistances, and low
OFF−channel leakage current. This bilateral switch/multiplexer/
demultiplexer controls analog and digital voltages that may vary
across the full analog power−supply range (from VCC to VEE).
The HC4316A is similar in function to the metal−gate CMOS
MC14016 and MC14066, and to the High−Speed CMOS HC4066A.
Each device has four independent switches. The device control and
Enable inputs are compatible with standard CMOS outputs; with
pullup resistors, they are compatible with LSTTL outputs. The device
has been designed so that the ON resistances (RON) are much more
linear over input voltage than RON of metal−gate CMOS analog
switches. Logic−level translators are provided so that the On/Off
Control and Enable logic−level voltages need only be VCC and GND,
while the switch is passing signals ranging between VCC and VEE.
When the Enable pin (active−low) is high, all four analog switches are
turned off.
SOIC−16
D SUFFIX
CASE 751B
PIN ASSIGNMENT
XA
1
16
YA
2
15
YB
3
14
XB
B ON/OFF
CONTROL
C ON/OFF
CONTROL
ENABLE
4
13
VCC
A ON/OFF
CONTROL
D ON/OFF
CONTROL
XD
5
12
YD
6
11
YC
7
10
XC
GND
8
9
VEE
Features
•
•
•
•
•
•
•
•
•
•
Logic−Level Translator for On/Off Control and Enable Inputs
Fast Switching and Propagation Speeds
High ON/OFF Output Voltage Ratio
Diode Protection on All Inputs/Outputs
Analog Power−Supply Voltage Range (VCC − VEE) = 2.0 to 12.0 V
Digital (Control) Power−Supply Voltage Range
(VCC − GND) = 2.0 V to 6.0 V, Independent of VEE
Improved Linearity of ON Resistance
Chip Complexity: 66 FETs or 16.5 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable*
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
MARKING DIAGRAM
16
HC4316AG
AWLYWW
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
MC74HC4316ADR2G
SOIC−16
(Pb−Free)
2500/
Tape&Reel
NLV74HC4316ADR2G*
SOIC−16
(Pb−Free)
2500/
Tape&Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 9
1
Publication Order Number:
MC74HC4316A/D
MC74HC4316A
FUNCTION TABLE
Inputs
Enable
On/Off Control
State of Analog
Switch
L
L
H
H
L
X
On
Off
Off
X = Don’t Care.
XA
A ON/OFF CONTROL
XB
B ON/OFF CONTROL
XC
C ON/OFF CONTROL
XD
D ON/OFF CONTROL
ENABLE
1
15
ANALOG
SWITCH
2
ANALOG
SWITCH
3
YA
LEVEL
TRANSLATOR
4
5
YB
ANALOG
OUTPUTS/INPUTS
LEVEL
TRANSLATOR
10
6
ANALOG
SWITCH
11
ANALOG
SWITCH
12
YC
LEVEL
TRANSLATOR
13
14
PIN 16 = VCC
PIN 8 = GND
PIN 9 = VEE
GND ≥ VEE
YD
LEVEL
TRANSLATOR
7
ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD
Figure 1. Logic Diagram
PLOTTER
PROGRAMMABLE
POWER
SUPPLY
-
MINI COMPUTER
DC ANALYZER
+
VCC
DEVICE
UNDER TEST
ANALOG IN
COMMON OUT
GND
VEE
Figure 2. On Resistance Test Set−Up
http://onsemi.com
2
MC74HC4316A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
–0.5 to +7.0
–0.5 to +14.0
V
Negative DC Supply Voltage (Ref. to GND)
–7.0 to +0.5
V
Analog Input Voltage
VEE – 0.5
to VCC + 0.5
V
VCC
Positive DC Supply Voltage
VEE
VIS
Vin
DC Input Voltage (Ref. to GND)
I
(Ref. to GND)
(Ref. to VEE)
–0.5 to VCC + 0.5
V
±25
mA
500
mW
– 65 to + 150
°C
260
°C
DC Current Into or Out of Any Pin
PD
Power Dissipation in Still Air
SOIC Package*
Tstg
Storage Temperature
TL
Lead Temperature, 1 mm from Case for 10 Seconds)
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
I/O pins must be connected to a
properly terminated line or bus.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
*Derating − SOIC Package: –7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
VCC
Positive DC Supply Voltage (Ref. to GND)
2.0
6.0
V
VEE
Negative DC Supply Voltage (Ref. to GND)
–6.0
GND
V
VIS
Analog Input Voltage
VEE
VCC
V
Vin
Digital Input Voltage (Ref. to GND)
GND
VCC
V
−
1.2
V
–55
+125
°C
0
0
0
0
1000
600
500
400
ns
VIO*
Parameter
Static or Dynamic Voltage Across Switch
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Control or Enable Inputs)
(Figure 10)
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
*For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may
contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC ELECTRICAL CHARACTERISTICS Digital Section (Voltages Referenced to GND) VEE = GND Except Where Noted
Guaranteed Limit
VCC
V
–55 to
25°C
≤ 85°C
≤ 125°C
Unit
VIH
Minimum High−Level Voltage, Control
or Enable Inputs
Ron = Per Spec
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum Low−Level Voltage, Control
or Enable Inputs
Ron = Per Spec
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
Iin
Maximum Input Leakage Current,
Control or Enable Inputs
Vin = VCC or GND
VEE = –6.0 V
6.0
±0.1
±1.0
±1.0
mA
ICC
Maximum Quiescent Supply Current
(per Package)
Vin = VCC or GND
VIO = 0 V
VEE = GND
VEE = –6.0
6.0
6.0
2
4
20
40
40
160
Symbol
Parameter
Test Conditions
http://onsemi.com
3
mA
MC74HC4316A
DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to VEE)
Guaranteed Limit
VCC
V
VEE
V
–55 to
25°C
Vin = VIH
VIS = VCC to VEE
IS ≤ 2.0 mA (Figure 2)
2.0*
45
4.5
6.0
0.0
0.0
−4.5
−6.0
−
160
90
90
−
200
110
110
−
240
130
130
Vin = VIH
VIS = VCC or VEE (Endpoints)
IS ≤ 2.0 mA (Figure 2)
2.0
4.5
4.5
6.0
0.0
0.0
−4.5
−6.0
−
90
70
70
−
115
90
90
−
140
105
105
Maximum Difference in “ON”
Resistance Between Any Two
Channels in the Same Package
Vin = VIH
VIS = 1/2 (VCC − VEE)
IS ≤ 2.0 mA
2.0
4.5
4.5
6.0
0.0
0.0
–4.5
–6.0
−
20
15
15
−
25
20
20
−
30
25
25
W
Ioff
Maximum Off−Channel
Leakage Current, Any One
Channel
Vin = VIL
VIO = VCC or VEE
Switch Off (Figure 3)
6.0
–6.0
0.1
0.5
1.0
mA
Ion
Maximum On−Channel
Leakage Current, Any One
Channel
Vin = VIH
VIS = VCC or VEE
(Figure 4)
6.0
–6.0
0.1
0.5
1.0
mA
Symbol
Ron
DRon
Parameter
Maximum “ON” Resistance
Test Conditions
≤ 85°C
≤ 125°C
Unit
W
*At supply voltage (VCC − VEE) approaching 2.0 V the analog switch−on resistance becomes extremely non−linear. Therefore, for low−voltage
operation, it is recommended that these devices only be used to control digital signals.
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Control or Enable tr = tf = 6 ns, VEE = GND)
Guaranteed Limit
Symbol
tPLH,
tPHL
Parameter
Maximum Propagation Delay, Analog Input to Analog Output
(Figures 8 and 9)
VCC
V
–55 to
25°C
≤ 85°C
≤ 125°C
2.0
4.5
6.0
40
6
5
50
8
7
60
9
8
Unit
ns
tPLZ,
tPHZ
Maximum Propagation Delay, Control or Enable to Analog Output
(Figures 10 and 11)
2.0
4.5
6.0
130
40
30
160
50
40
200
60
50
ns
tPZL,
tPZH
Maximum Propagation Delay, Control or Enable to Analog Output
(Figures 10 and 11)
2.0
4.5
6.0
140
40
30
175
50
40
250
60
50
ns
−
10
10
10
pF
−
−
35
1.0
35
1.0
35
1.0
C
Maximum Capacitance
ON/OFF Control
and Enable Inputs
Control Input = GND
Analog I/O
Feedthrough
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Switch) (Figure 13)*
*Used to determine the no−load dynamic power consumption: PD = CPD VCC2 f + ICC VCC .
http://onsemi.com
4
15
pF
MC74HC4316A
ADDITIONAL APPLICATION CHARACTERISTICS (GND = 0 V)
VCC
V
VEE
V
Limit*
25°C
fin = 1 MHz Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VOS
Increase fin Frequency Until dB Meter
Reads –3 dB
RL = 50 W, CL = 10 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
150
160
160
MHz
fin Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 W, CL = 50 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
–50
–50
–50
dB
fin = 1.0 MHz, RL = 50 W, CL = 10 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
–40
–40
–40
Vin v 1 MHz Square Wave (tr = tf = 6 ns)
Adjust RL at Setup so that IS = 0 A
RL = 600 W, CL = 50 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
30
65
100
RL = 10 kW, CL = 10 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
60
130
200
fin Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 W, CL = 50 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
–70
–70
–70
fin = 1.0 MHz, RL = 50 W, CL = 10 pF
2.25
4.50
6.00
–2.25
–4.50
–6.00
–80
–80
–80
Symbol
Parameter
Test Conditions
BW
Maximum On–Channel Bandwidth
or
Minimum Frequency Response
(Figure 5)
Off–Channel Feedthrough
Isolation
(Figure 6)
−
−
−
THD
Feedthrough Noise, Control to
Switch
(Figure 7)
Crosstalk Between Any Two
Switches
(Figure 12)
Total Harmonic Distortion
(Figure 14)
fin = 1 kHz, RL = 10 kW, CL = 50 pF
THD = THDMeasured − THDSource
VIS = 4.0 VPP sine wave
VIS = 8.0 VPP sine wave
VIS = 11.0 VPP sine wave
*Limits not tested. Determined by design and verified by qualification.
http://onsemi.com
5
Unit
mVPP
dB
%
2.25
4.50
6.00
–2.25
–4.50
–6.00
0.10
0.06
0.04
MC74HC4316A
VCC
16
VEE
VCC
VCC
16
A
A
VCC
OFF
VCC
N/C
ON
O/I
VEE
VIL
VIH
7
8
9
SELECTED
CONTROL
INPUT
7
8
9
SELECTED
CONTROL
INPUT
VEE
VEE
Figure 3. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
Figure 4. Maximum On Channel Leakage Current,
Test Set−Up
VIS
VCC
VCC
16
fin
VCC
RL
16
TO dB
METER
ON
0.1 mF
VCC
RL
RL
7
8
9
SELECTED
CONTROL
INPUT
VEE
TO dB
METER
OFF
0.1 mF
CL*
RL
7
8
9
fin
CL*
SELECTED
CONTROL
INPUT
VEE
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 5. Maximum On−Channel Bandwidth
Test Set−Up
Figure 6. Off−Channel Feedthrough Isolation,
Test Set−Up
VCC
16
TEST
POINT
ON/OFF
RL
7
8
9
VEE
RL
VCC
CL*
ANALOG IN
SELECTED
CONTROL
INPUT
50%
GND
tPLH
CONTROL
ANALOG OUT
tPHL
50%
*Includes all probe and jig capacitance.
Figure 7. Feedthrough Noise, Control to Analog Out,
Test Set−Up
Figure 8. Propagation Delays, Analog In to
Analog Out
http://onsemi.com
6
MC74HC4316A
VCC
16
ANALOG I/O
tr
ANALOG O/I
TEST
POINT
ON
tf
VCC
ENABLE
50%
GND
CONTROL
50 pF*
tPZL
7
8
9
SELECTED
CONTROL
INPUT
VCC
tPLZ
HIGH
IMPEDANCE
50%
ANALOG
OUT
tPZH
tPHZ
10%
VOL
90%
VOH
50%
HIGH
IMPEDANCE
*Includes all probe and jig capacitance.
Figure 9. Propagation Delay Test Set−Up
Figure 10. Propagation Delay, ON/OFF Control
to Analog Out
VIS
1
POSITIONWHEN
TESTING tPHZ AND tPZH
2
POSITIONWHEN
TESTING tPLZ AND tPZL
1
VCC
RL
2
VCC
0.1 mF
1 kW
16
1
RL
ON
CL*
TEST
POINT
ON/OFF
2
16
fin
VCC
ANALOG I/O
50 pF*
TEST
POINT
OFF
CONTROL
OR
ENABLE
7
8
9
8
9
VEE
*Includes all probe and jig capacitance.
RL
CL*
VCC
SELECTED
CONTROL
INPUT
*Includes all probe and jig capacitance.
Figure 11. Propagation Delay Test Set−Up
Figure 12. Crosstalk Between Any Two Switches,
Test Set−Up (Adjacent Channels Used)
VCC
A
VIS
VCC
16
N/C
ON/OFF
10 mF
N/C
VOS
16
fin
ON
RL
7
8
9
VEE
SELECTED
CONTROL
INPUT
7
8
9
VEE
CONTROL
SELECTED
CONTROL
INPUT
CL*
TO
DISTORTION
METER
VCC
*Includes all probe and jig capacitance.
Figure 13. Power Dissipation Capacitance
Test Set−Up
Figure 14. Total Harmonic Distortion, Test Set−Up
http://onsemi.com
7
MC74HC4316A
APPLICATIONS INFORMATION
0
-10
FUNDAMENTAL FREQUENCY
-20
dBm
-30
-40
-50
DEVICE
-60
SOURCE
-70
-80
-90
- 100
1.0
3.0
2.0
FREQUENCY (kHz)
Figure 15. Plot, Harmonic Distortion
Therefore, using the configuration in Figure 16, a maximum
analog signal of twelve volts peak−to−peak can be
controlled.
When voltage transients above VCC and/or below VEE are
anticipated on the analog channels, external diodes (Dx) are
recommended as shown in Figure 17. These diodes should
be small signal, fast turn−on types able to absorb the
maximum anticipated current surges during clipping. An
alternate method would be to replace the Dx diodes with
MOSORBs (MOSORB® is an acronym for high current
surge protectors). MOSORBs are fast turn−on devices
ideally suited for precise dc protection with no inherent wear
out mechanism.
The Enable and Control pins should be at VCC or GND
logic levels, VCC being recognized as logic high and GND
being recognized as a logic low. Unused analog
inputs/outputs may be left floating (not connected).
However, it is advisable to tie unused analog inputs and
outputs to VCC or VEE through a low value resistor. This
minimizes crosstalk and feedthrough noise that may be
picked up by the unused I/O pins.
The maximum analog voltage swings are determined by
the supply voltages VCC and VEE. The positive peak analog
voltage should not exceed VCC. Similarly, the negative peak
analog voltage should not go below VEE. In the example
below, the difference between VCC and VEE is 12 V.
VCC
VCC = 6 V
16
+6V
ANALOG I/O
ON
ANALOG O/I
+6V
SELECTED
CONTROL
INPUT
VEE
8
16
Dx
SELECTED
CONTROL
INPUT
Dx
Dx
+6V
ON
-6 V
-6 V
VCC
VCC
Dx
VEE
ENABLE CONTROL
INPUTS
(VCC OR GND)
VEE
VEE
ENABLE CONTROL
INPUTS
(VCC OR GND)
-6 V
Figure 16.
Figure 17. Transient Suppressor Application
http://onsemi.com
8
MC74HC4316A
VCC = 5 V
+5 V
16
ANALOG
SIGNALS
16
ANALOG
SIGNALS
ANALOG
SIGNALS
ANALOG
SIGNALS
R* R* R* R* R*
HC4316A
7
5
6
14
15
TTL
HCT
BUFFER
VEE = 0
TO -6 V
5
LSTTL/
NMOS
ENABLE
AND
CONTROL 9
INPUTS
8
HC4016A
6
14
VEE = 0
TO -6 V
CONTROL
INPUTS 9
15
7
R* = 2 TO 10 kW
a. Using Pull−Up Resistors
b. Using HCT Buffer
Figure 18. LSTTL/NMOS to HCMOS Interface
VCC = 12 V
R1
12 V
POWER
SUPPLY
GND = 6 V
R2
VEE = 0 V
R1 = R2
VCC
12 VPP
ANALOG
INPUT
SIGNAL
R3
C
1 OF 4
SWITCHES
ANALOG
OUTPUT
SIGNAL
12 V
0
R4
R1 = R2
R3 = R4
VEE
Figure 19. Switching a 0−to−12 V Signal Using a
Single Power Supply (GND ≠ 0 V)
CHANNEL 4
1 OF 4
SWITCHES
CHANNEL 3
1 OF 4
SWITCHES
CHANNEL 2
1 OF 4
SWITCHES
CHANNEL 1
1 OF 4
SWITCHES
COMMON I/O
INPUT
1 OF 4
SWITCHES
+
OUTPUT
LF356 OR
EQUIVALENT
0.01 mF
1
2
3 4
CONTROL INPUTS
Figure 20. 4−Input Multiplexer
Figure 21. Sample/Hold Amplifier
http://onsemi.com
9
MC74HC4316A
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
DIM
A
B
C
D
F
G
J
K
M
P
R
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOSORB is a registered trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC74HC4316A/D