MC74LVX4066 D

MC74LVX4066
Quad Analog Switch/
Multiplexer/Demultiplexer
High−Performance Silicon−Gate CMOS
The MC74LVX4066 utilizes silicon−gate CMOS technology to
achieve fast propagation delays, low ON resistances, and low
OFF−channel leakage current. This bilateral switch/multiplexer/
demultiplexer controls analog and digital voltages that may vary
across the full power−supply range (from VCC to GND).
The LVX4066 is identical in pinout to the metal−gate CMOS
MC14066 and the high−speed CMOS HC4066A. Each device has four
independent switches. The device has been designed so that the ON
resistances (RON) are much more linear over input voltage than RON
of metal−gate CMOS analog switches.
The ON/OFF control inputs are compatible with standard CMOS
outputs; with pull−up resistors, they are compatible with LSTTL
outputs.
•
•
•
MARKING
DIAGRAMS
14
SOIC−14
D SUFFIX
CASE 751A
14
1
Fast Switching and Propagation Speeds
High ON/OFF Output Voltage Ratio
Low Crosstalk Between Switches
Diode Protection on All Inputs/Outputs
Wide Power−Supply Voltage Range (VCC − GND) = 2.0 to 6.0 Volts
Analog Input Voltage Range (VCC − GND) = 2.0 to 6.0 Volts
Improved Linearity and Lower ON Resistance over Input Voltage
than the MC14016 or MC14066
Low Noise
Chip Complexity: 44 FETs or 11 Equivalent Gates
These Devices are Pb−Free and are RoHS Compliant
LVX4066G
AWLYWW
1
14
14
Features
•
•
•
•
•
•
•
http://onsemi.com
1
TSSOP−14
DT SUFFIX
CASE 948G
1
LVX
4066
ALYWG
G
14
SOEIAJ−14
M SUFFIX
CASE 965
14
1
LVX4066
ALYWG
1
LVX4066
A
WL, L
Y
WW, W
G or G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 5
1
Publication Order Number:
MC74LVX4066/D
MC74LVX4066
LOGIC DIAGRAM
XA
1
2
YA
PIN CONNECTION (Top View)
A ON/OFF CONTROL
XB
B ON/OFF CONTROL
XC
C ON/OFF CONTROL
XD
D ON/OFF CONTROL
13
4
3
YB
ANALOG
OUTPUTS/INPUTS
5
8
9
YC
6
11
12
10
XA
1
14
YA
2
13
YB
3
12
XB
B ON/OFF
CONTROL
C ON/OFF
CONTROL
GND
4
11
VCC
A ON/OFF
CONTROL
D ON/OFF
CONTROL
XD
5
10
YD
6
9
YC
7
8
XC
YD
ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD
PIN 14 = VCC
PIN 7 = GND
FUNCTION TABLE
On/Off Control
Input
State of
Analog Switch
L
H
Off
On
ORDERING INFORMATION
Package
Shipping†
SOIC−14
(Pb−Free)
2500 Tape & Reel
MC74LVX4066DTR2G
TSSOP−14*
(Pb−Free)
2500 Tape & Reel
MC74LVX4066MG
SOEIAJ−14
(Pb−Free)
50 Units / Rail
MC74LVX4066MELG
SOEIAJ−14
(Pb−Free)
2000 Tape & Reel
Device
MC74LVX4066DR2G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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2
MC74LVX4066
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
– 0.5 to + 7.0
V
V
VCC
Positive DC Supply Voltage (Referenced to GND)
VIS
Analog Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
Vin
Digital Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Current Into or Out of ON/OFF Control Pins
± 20
mA
Is
DC Current Into or Out of Switch Pins
± 20
mA
PD
Power Dissipation in Still Air,
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
SOIC Package†
TSSOP Package†
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V CC ).
Unused outputs must be left open.
I/O pins must be connected to a
properly terminated line or bus.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Positive DC Supply Voltage (Referenced to GND)
2.0
6.0
V
VIS
Analog Input Voltage (Referenced to GND)
GND
VCC
V
Vin
Digital Input Voltage (Referenced to GND)
GND
VCC
V
VIO*
Static or Dynamic Voltage Across Switch
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time, ON/OFF Control
Inputs (Figure 10)
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
−
1.2
V
– 55
+ 85
_C
0
0
100
20
ns/V
*For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may
be drawn; i.e., the current out of the switch may contain both VCC and switch input
components. The reliability of the device will be unaffected unless the Maximum Ratings are
exceeded.
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DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND)
VCC
V
Guaranteed Limit
Symbol
Parameter
– 55 to 25_C
v 85_C
v 125_C
Unit
VIH
Minimum High−Level Voltage
ON/OFF Control Inputs (Note 1)
Ron = Per Spec
2.0
3.0
4.5
5.5
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
V
VIL
Maximum Low−Level Voltage
ON/OFF Control Inputs (Note 1)
Ron = Per Spec
2.0
3.0
4.5
5.5
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
Iin
Maximum Input Leakage Current
ON/OFF Control Inputs
Vin = VCC or GND
5.5V
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND VIO = 0 V
5.5
4.0
40
160
mA
Test Conditions
1. Specifications are for design target only. Not final specification limits.
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3
MC74LVX4066
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DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND)
Symbol
Ron
– 55 to 25_C
v 85_C
v 125_C
Unit
Vin = VIH
VIS = VCC to GND
|IS| v 10 mA (Figures 1, 2)
2.0†
3.0
4.5
5.5
−
40
25
20
−
45
30
25
−
50
35
30
W
Vin = VIH
VIS = VCC or GND
(Endpoints)
|IS| v 10 mA (Figures 1, 2)
2.0
3.0
4.5
5.5
−
30
25
20
−
35
30
25
−
40
35
30
Parameter
Test Conditions
Maximum “ON” Resistance
Guaranteed Limit
VCC
V
DRon
Maximum Difference in “ON”
Resistance Between Any Two
Channels in the Same Package
Vin = VIH
VIS = 1/2 (VCC − GND)
IS v 2.0 mA
3.0
4.5
5.5
15
10
10
20
12
12
25
15
15
W
Ioff
Maximum Off−Channel Leakage
Current, Any One Channel
Vin = VIL
VIO = VCC or GND
Switch Off (Figure 3)
5.5
0.1
0.5
1.0
mA
Ion
Maximum On−Channel Leakage
Current, Any One Channel
Vin = VIH
VIS = VCC or GND (Figure 4)
5.5
0.1
0.5
1.0
mA
†At supply voltage (VCC) approaching 2 V the analog switch−on resistance becomes extremely non−linear. Therefore, for low−voltage operation,
it is recommended that these devices only be used to control digital signals (See Figure 1a).
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AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns)
Symbol
Parameter
Guaranteed Limit
VCC
V
– 55 to 25_C
v 85_C
v 125_C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Analog Input to Analog Output
(Figures 8 and 9)
2.0
3.0
4.5
5.5
4.0
3.0
1.0
1.0
6.0
5.0
2.0
2.0
8.0
6.0
2.0
2.0
ns
tPLZ,
tPHZ
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 11)
2.0
3.0
4.5
5.5
30
20
15
15
35
25
18
18
40
30
22
20
ns
tPZL,
tPZH
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 1 1)
2.0
3.0
4.5
5.5
20
12
8.0
8.0
25
14
10
10
30
15
12
12
ns
ON/OFF Control Input
−
10
10
10
pF
Control Input = GND
Analog I/O
Feedthrough
−
−
35
1.0
35
1.0
35
1.0
C
Maximum Capacitance
Typical @ 25°C, VCC = 5.0 V
CPD
15
Power Dissipation Capacitance (Per Switch) (Figure 13)*
* Used to determine the no−load dynamic power consumption: P D = CPD VCC
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4
2f
+ ICC VCC .
pF
MC74LVX4066
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ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
VCC
V
Limit*
25_C
fin = 1 MHz Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VOS
Increase fin Frequency Until dB Meter Reads – 3 dB
RL = 50 W, CL = 10 pF
4.5
5.5
150
160
MHz
fin Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 W, CL = 50 pF
4.5
5.5
− 50
− 50
dB
fin = 1.0 MHz, RL = 50 W, CL = 10 pF
4.5
5.5
− 37
− 37
Vin v 1 MHz Square Wave (tr = tf = 6 ns)
Adjust RL at Setup so that IS = 0 A
RL = 600 W, CL = 50 pF
4.5
5.5
100
200
RL = 10 kW, CL = 10 pF
4.5
5.5
50
100
fin Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL = 600 W, CL = 50 pF
4.5
5.5
– 70
– 70
fin = 1.0 MHz, RL = 50 W, CL = 10 pF
4.5
5.5
– 80
– 80
Symbol
Parameter
Test Conditions
BW
Maximum On−Channel Bandwidth or
Minimum Frequency Response (Figure 5)
Off−Channel Feedthrough Isolation
(Figure 6)
−
−
−
THD
Feedthrough Noise, Control to Switch
(Figure 7)
Crosstalk Between Any Two Switches
(Figure 12)
Total Harmonic Distortion (Figure 14)
fin = 1 kHz, RL = 10 kW, CL = 50 pF
THD = THDMeasured − THDSource
VIS = 4.0 VPP sine wave
VIS = 5.0 VPP sine wave
*Guaranteed limits not tested. Determined by design and verified by qualification.
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5
Unit
mVPP
dB
%
4.5
5.5
0.10
0.06
MC74LVX4066
400
250
350
Is = 1mA
200
-55°C
300
Ron (Ohms)
Ron (Ohms)
25°C
150
Is = 5mA
100
Is = 9mA
250
200
85°C
150
125°C
100
50
50
0
Is = 15mA
0
0.5
1
1.5
2
0
0
2.5
0.5
1.5
1
Vin (Volts)
2
Vin (Volts)
Figure 1a. Typical On Resistance, VCC = 2.0 V, T = 25°C
Figure 1b. Typical On Resistance, VCC = 2.0 V
35
20
18
30
16
25
12
125°C
85°C
25°C
10
-55°C
14
20
Ron (Ohms)
Ron (Ohms)
2.5
125°C
85°C
25°C
-55°C
15
10
8
6
4
5
2
0
0
2
1
3
0
4
1
0
2
3
4
Vin (Volts)
Vin (Volts)
Figure 1c. Typical On Resistance, VCC = 3.0 V
Figure 1d. Typical On Resistance, VCC = 4.5 V
18
PLOTTER
16
125°C
85°C
25°C
14
Ron (Ohms)
12
10
-55°C
8
PROGRAMMABLE
POWER
SUPPLY
-
MINI COMPUTER
+
DC ANALYZER
VCC
DEVICE
UNDER TEST
6
4
2
ANALOG IN
COMMON OUT
0
0
1
2
3
4
5
6
GND
Vin (Volts)
Figure 2. On Resistance Test Set−Up
Figure 1e. Typical On Resistance, VCC = 5.5 V
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6
5
MC74LVX4066
VCC
VCC
VCC
VCC
14
GND
14
A
A
VCC
OFF
7
SELECTED
CONTROL
INPUT
VIL
7
Figure 3. Maximum Off Channel Leakage Current,
Any One Channel, Test Set−Up
VCC
VIS
14
VIH
VOS
14
ON
0.1mF
CL*
7
SELECTED
CONTROL
INPUT
Figure 4. Maximum On Channel Leakage Current,
Test Set−Up
VOS
VCC
fin
N/C
ON
GND
SELECTED
CONTROL
INPUT
fin
dB
METER
OFF
0.1mF
CL*
RL
dB
METER
SELECTED
CONTROL
INPUT
VCC
7
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 5. Maximum On−Channel Bandwidth
Test Set−Up
VCC
VCC/2
Figure 6. Off−Channel Feedthrough Isolation,
Test Set−Up
VCC/2
14
RL
RL
OFF/ON
VOS
IS
VCC
CL*
VCC
GND
Vin ≤ 1 MHz
tr = tf = 3 ns
7
ANALOG IN
SELECTED
CONTROL
INPUT
50%
GND
tPHL
tPLH
CONTROL
50%
ANALOG OUT
*Includes all probe and jig capacitance.
Figure 7. Feedthrough Noise, ON/OFF Control to
Analog Out, Test Set−Up
Figure 8. Propagation Delays, Analog In to
Analog Out
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7
MC74LVX4066
VCC
tr
tf
14
ANALOG IN
ANALOG OUT
ON
TEST
POINT
VCC
90%
50%
10%
CONTROL
GND
CL*
7
SELECTED
CONTROL
INPUT
tPZL
tPLZ
HIGH
IMPEDANCE
50%
VCC
ANALOG
OUT
tPZH
Figure 9. Propagation Delay Test Set−Up
VOH
HIGH
IMPEDANCE
VIS
VCC
2
POSITIONWHEN
TESTING tPLZ AND tPZL
14
RL
2
VCC
fin
1
0.1 mF
TEST
POINT
ON/OFF
VOS
ON
1 kW
14
2
90%
tPHZ
Figure 10. Propagation Delay, ON/OFF Control
to Analog Out
1
POSITIONWHEN
TESTING tPHZ AND tPZH
VCC
VOL
50%
*Includes all probe and jig capacitance.
1
10%
OFF
VCC OR GND
CL*
RL
RL
SELECTED
CONTROL
INPUT
SELECTED
CONTROL
INPUT
CL*
VCC/2
RL
CL*
VCC/2
7
7
VCC/2
*Includes all probe and jig capacitance.
*Includes all probe and jig capacitance.
Figure 11. Propagation Delay Test Set−Up
Figure 12. Crosstalk Between Any Two Switches,
Test Set−Up
VCC
A
VIS
VCC
14
N/C
OFF/ON
VOS
0.1 mF
N/C
fin
ON
RL
7
CL*
TO
DISTORTION
METER
VCC/2
SELECTED
CONTROL
INPUT
7
SELECTED
CONTROL
INPUT
VCC
ON/OFF CONTROL
*Includes all probe and jig capacitance.
Figure 13. Power Dissipation Capacitance
Test Set−Up
Figure 14. Total Harmonic Distortion, Test Set−Up
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8
MC74LVX4066
0
-10
FUNDAMENTAL FREQUENCY
-20
dBm
-30
-40
-50
DEVICE
-60
SOURCE
-70
-80
-90
1.0
3.0
2.0
FREQUENCY (kHz)
Figure 15. Plot, Harmonic Distortion
APPLICATION INFORMATION
The ON/OFF Control pins should be at VCC or GND logic
levels, VCC being recognized as logic high and GND being
recognized as a logic low. Unused analog inputs/outputs
may be left floating (not connected). However, it is
advisable to tie unused analog inputs and outputs to VCC or
GND through a low value resistor. This minimizes crosstalk
and feedthrough noise that may be picked−up by the unused
I/O pins.
The maximum analog voltage swings are determined by
the supply voltages VCC and GND. The positive peak analog
voltage should not exceed VCC. Similarly, the negative peak
analog voltage should not go below GND. In the example
below, the difference between VCC and GND is six volts.
Therefore, using the configuration in Figure 16, a maximum
analog signal of six volts peak−to−peak can be controlled.
When voltage transients above VCC and/or below GND
are anticipated on the analog channels, external diodes (Dx)
are recommended as shown in Figure 17. These diodes
should be small signal, fast turn−on types able to absorb the
maximum anticipated current surges during clipping. An
alternate method would be to replace the Dx diodes with
Mosorbs (Mosorb™ is an acronym for high current surge
protectors). Mosorbs are fast turn−on devices ideally suited
for precise DC protection with no inherent wear out
mechanism.
VCC
VCC = 6.0 V
+ 6.0 V
14
ANALOG I/O
ON
ANALOG O/I
Dx
+ 6.0 V
SELECTED
CONTROL
INPUT
7
16
Dx
ON
0V
0V
VCC
Dx
VCC
OTHER CONTROL
INPUTS
(VCC OR GND)
Dx
SELECTED
CONTROL
INPUT
7
Figure 16. 6.0 V Application
OTHER CONTROL
INPUTS
(VCC OR GND)
Figure 17. Transient Suppressor Application
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9
MC74LVX4066
+5 V
+5 V
14
ANALOG
SIGNALS
R*
R* R* R*
LVX4066
LSTTL/
NMOS
6
CONTROL
INPUTS
15
ANALOG
SIGNALS
LVXT4066
LSTTL/
NMOS/
ABT/
ALS
5
14
14
ANALOG
SIGNALS
ANALOG
SIGNALS
5
6
14
CONTROL
INPUTS
15
7
7
R* = 2 TO 10 kW
a. Using Pull-Up Resistors
b. Using LVXT4066
Figure 18. LSTTL/NMOS to CMOS Interface
VDD = 5 V
13
1
VCC = 2.0 TO 7.0 V
16
14
ANALOG
SIGNALS
3
LVX4066
5
7
ANALOG
SIGNALS
MC14504
2
5
9
4
6
11
6
14
CONTROL
INPUTS
10
15
7
14
8
Figure 19. TTL/NMOS−to−CMOS Level Converter
Analog Signal Peak−to−Peak Greater than 5 V
CHANNEL 4
1 OF 4
SWITCHES
CHANNEL 3
1 OF 4
SWITCHES
CHANNEL 2
1 OF 4
SWITCHES
CHANNEL 1
1 OF 4
SWITCHES
COMMON I/O
INPUT
1 OF 4
SWITCHES
+
OUTPUT
LF356 OR
EQUIVALENT
0.01 mF
1
2
3 4
CONTROL INPUTS
Figure 20. 4−Input Multiplexer
Figure 21. Sample/Hold Amplifier
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10
MC74LVX4066
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
B
M
7
1
G
−T−
0.25 (0.010)
M
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
D 14 PL
F
R X 45 _
C
SEATING
PLANE
M
S
SOLDERING FOOTPRINT
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
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11
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC74LVX4066
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
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12
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74LVX4066
PACKAGE DIMENSIONS
SOEIAJ−14
M SUFFIX
CASE 965−01
ISSUE B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
L
7
1
M_
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC74LVX4066/D